KR102071464B1 - Device for cooling of laser diode bars - Google Patents

Abstract

Laser diode bar cooling apparatus according to an embodiment, the cooling body for receiving the refrigerant; And a plurality of cooling fins protruding from the cooling body in one direction and supporting laser diodes at an end thereof, wherein the plurality of cooling fins may include flow paths for flowing the refrigerant transferred from the cooling body. Fig. 1

Description

Laser diode bar cooling unit {DEVICE FOR COOLING OF LASER DIODE BARS}

The description below relates to a laser diode bar cooling device.

The cooling technology of laser diodes and laser diode bars mainly uses heat transfer using heat sinks. Efficient arrangement of the material at the thermal junction boundary portion where the heat generating element such as a laser diode and the heat sink contact each other, and the material and structure constituting the heat sink determine heat dissipation characteristics. In addition, by using the TEC (Thermo Electric Cooler) thermoelectric element on the end of the cooling device, it was possible to maximize the cooling effect of the existing high power laser diode and radar diode. However, as the laminated structure is repeated and the light output is increased, the bottleneck phenomenon is newly introduced. In the case of a laser diode having a simple thermal bottleneck structure, a technique of lowering the thermal resistance by extending the effective heat cross-sectional area of the heat sink can be effectively applied by applying a thin graphene or the like material between the heating source and the heat sink. In addition, in order to improve the effective heat resistance of the heat sink itself, a heat dissipation improvement technique for improving heat transfer efficiency by providing a heat bypass path, or a structural design technique for optimizing the thermal resistance of a laminated structure is also proposed.

However, the existing cooling device is a technique for passive design manufacturing through simple structure optimization, and when the lamination of the heat source element and the thin heat dissipation layer is repeated, the passive heat transfer method alone reaches the heat dissipation limit that causes bottlenecks in the heat generation transfer method. can do.

The background art described above is possessed or acquired by the inventors in the process of deriving the present invention, and is not necessarily a known technology disclosed to the public before the application of the present invention.

An object of an embodiment is to provide a laser diode bar cooling apparatus that can increase the heat dissipation performance even in the limit structure of the laser diode stack through the fin-shaped heat pipe structure in consideration of the structure of the micro heating element.

Laser diode bar cooling apparatus according to an embodiment, the cooling body for receiving the refrigerant; And a plurality of cooling fins protruding from the cooling body in one direction, and supporting a laser diode bar at an end thereof, wherein the plurality of cooling fins may include a flow path for flowing the refrigerant transferred from the cooling body. .

The plurality of cooling plates may have a thin plate shape, and the plurality of cooling plates may be parallel to each other.

The laser diode bar cooling apparatus may further include a thermoelectric element attached to one side of the cooling body, and each plane including the plurality of cooling plates may be perpendicular to the thermoelectric element.

The plurality of cooling fins, one inflow passage for receiving the refrigerant from the cooling body; And a discharge passage configured to transfer the refrigerant, which has received heat from the laser diode bar, back to the cooling body.

Laser diode bar cooling apparatus according to an embodiment, a plurality of cooling units; And a thermoelectric element attached to one surface of the plurality of cooling units based on a state in which the plurality of cooling units are coupled to each other, each of the plurality of cooling units comprising: a cooling body accommodating a refrigerant; And it may include a plurality of cooling fins including a flow path for flowing the refrigerant delivered from the cooling body.

The plurality of cooling units include a first cooling body, a first connecting member protruding upward from the first cooling body, and a plurality of first cooling fins protruding from the first connecting member. Cooling unit; And a second cooling unit including a second cooling body connected to the first cooling body, and a plurality of second cooling fins protruding from the second cooling body.

The plurality of first cooling fins, the plurality of second cooling fins, and the plurality of third cooling fins may be parallel to each other.

The plurality of cooling units may include a third cooling body connected to the second cooling body, a second connecting member protruding downward from the second cooling body, and a plurality of agents protruding from the second connecting member. The apparatus may further include a third cooling unit including three cooling fins.

The second cooling body may be disposed between the first cooling body and the third cooling body.

The plurality of cooling fins may include a flow path through which the refrigerant delivered from the cooling body flows.

The diode bar cooling apparatus according to an embodiment may increase heat dissipation performance even in a limited structure of a laser diode stack through a fin-shaped heat pipe structure in consideration of a structure of a micro heating element.

The diode bar cooling apparatus according to an embodiment may improve the thermal bottleneck limit of the heat sink of the conventional passive optimization structure, thereby realizing more optical collimation characteristics by overcoming the size limitation of the laser diode stack structure.

The diode bar cooling apparatus according to an embodiment may configure a highly effective heat dissipation system that removes generated heat from the stacked heating elements by adding a forced heat transfer improvement step in a micro heating element such as a laser diode.

The diode bar cooling apparatus according to an embodiment may prevent damage to the laser diode, minimize performance degradation due to temperature, and reduce the size of the device, thereby improving the performance of the laser diode.

1 is a perspective view of a laser diode bar cooling apparatus according to an embodiment.
2 is a perspective view of a unit cooling unit according to one embodiment.
3 is a cross-sectional view of a cooling fin according to an embodiment.
4 is an exploded perspective view of a laser diode bar cooling apparatus according to an embodiment.
5 is a perspective view of a laser diode bar cooling apparatus according to one embodiment.

Hereinafter, exemplary embodiments will be described in detail with reference to the accompanying drawings. In adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are used to refer to the same components as much as possible, even if displayed on different drawings. In addition, in describing the embodiment, when it is determined that the detailed description of the related well-known configuration or function interferes with the understanding of the embodiment, the detailed description thereof will be omitted.

In addition, in describing the components of the embodiment, terms such as first, second, A, B, (a), and (b) may be used. These terms are only for distinguishing the components from other components, and the nature, order or order of the components are not limited by the terms. If a component is described as being "connected", "coupled" or "connected" to another component, that component may be directly connected or connected to that other component, but there is another component between each component. It will be understood that may be "connected", "coupled" or "connected".

Components included in any one embodiment and components including common functions will be described using the same names in other embodiments. Unless stated to the contrary, the description in any one embodiment may be applied to other embodiments, and detailed descriptions thereof will be omitted in the overlapping range.

1 is a perspective view of a laser diode bar cooling apparatus according to an embodiment, FIG. 2 is a perspective view of a unit cooling unit according to an embodiment, and FIG. 3 is a cross-sectional view of a cooling fin according to an embodiment.

1 to 3, the laser diode bar cooling apparatus 1 may include a cooling body 11, a plurality of cooling fins 12, and a thermoelectric element 15.

The cooling body 11 is a structure made of Cu. The heat generated from the LD is quickly transferred to the cooling body 11 through the cooling flow path inside the cooling fin 12 and the cooling body 11 through the thermoelectric element 15 in contact with the outer wall of the cooling body 11. The heat transferred to the outside can be released. The cooling body 11 may be formed of a material having high thermal conductivity.

The plurality of cooling fins 12 may protrude in one direction from the cooling body 11. The plurality of cooling fins 12 may directly heat exchange with the cooling body 11. In addition, the plurality of cooling fins 12 may include a single flow path for flowing the refrigerant therein. The plurality of cooling fins 12 may directly transfer heat by directly contacting the cooling body 11 or heat transfer through a refrigerant flowing along the single flow path. The plurality of cooling fins 12 may support the laser diode bar LD at an end thereof. The plurality of cooling fins 12 may absorb heat generated from the laser diode bar LD to cool the laser diode bar LD.

The plurality of cooling fins 12 may have a thin plate shape, and the plurality of cooling fins 12 may be parallel to each other. For example, the plurality of cooling fins 12 may be at regular intervals. The plurality of cooling fins 12 maintain an internal vacuum state and include a working fluid. Through vaporization and liquefaction of the working fluid, heat generated from the laser diode bar LD may be rapidly transferred to the cooling body 11.

The plurality of cooling fins 12 may transfer heat generated from one laser diode bar LD supported at each end, and do not contact the laser diode bars LD of the lower end of each cooling fin 12.

The thermoelectric element 15 may be attached to one side of the cooling body 11. Each plane including the plurality of cooling fins 12 may be orthogonal to the thermoelectric element 15. For example, when the plurality of cooling fins 12 are arranged in the vertical direction, and the vertical direction of each of the cooling fins 12 is in the vertical direction, the thermoelectric element 15 is the left surface of the cooling body 11. Or on the right side.

For example, based on FIG. 1, nine planes including nine cooling fins 12 may be orthogonal to the thermoelectric elements 15, respectively. The upper portion of the thermoelectric element 15 may be adjacent to the upper three cooling fins 12 of the nine cooling fins 12, and the center portion of the thermoelectric element 15 may be cooled by three of the nine cooling fins 12. The lower portion of the thermoelectric element 15 may be adjacent to the lower three cooling fins 12 of the nine cooling fins 12. That is, the thermoelectric element 15 may occupy a wide area of the cooling body 11. With this structure, the thermoelectric element 15 can cool the plurality of cooling fins 12 efficiently.

The laser diode bar cooling device 1 may comprise a plurality of cooling units 10a, 10b, 10c. Each cooling unit 10a, 10b, 10c may comprise a cooling body 11 and a plurality of cooling fins 12. The plurality of cooling units 10a, 10b, and 10c may be connected in a line. The plurality of cooling units 10a, 10b, and 10c may be configured according to the surrounding environment. For example, in the structure in which the laser diode bars LD should be arranged in the up and down direction, the cooling units 10a, 10b, and 10c may be arranged in the up and down direction (see FIG. 1) or arranged in the left and right direction (FIG. 1). 4).

4 is an exploded perspective view of a laser diode bar cooling apparatus according to an embodiment, and FIG. 5 is a perspective view of a laser diode bar cooling apparatus according to an embodiment.

4 and 5, the laser diode bar cooling apparatus 2 may include a plurality of cooling units 20a, 20b, and 20c and a thermoelectric element 15.

Each of the plurality of cooling units 20a, 20b, and 20c may include a cooling body accommodating a refrigerant and a flow path for flowing the refrigerant delivered from the cooling body. For example, the plurality of cooling units 20a may include a first cooling unit 20a, a second cooling unit 20b, and a third cooling unit 20c.

The 1st cooling unit 20a protrudes from the 1st cooling body 21a, the 1st connection member 23a which protrudes upward from the 1st cooling body 21a, and the 1st connection member 23a. It may include a plurality of first cooling fins (22a). The plurality of first cooling fins 22a may be provided with flow passages for flowing a fluid transferred from the first cooling body 21a through the first connection member 23a.

The second cooling unit 20b may include a second cooling body 21b and a plurality of second cooling fins 22b protruding from the second cooling body 21b.

The 3rd cooling unit 20c protrudes from the 3rd cooling body 21c, the 2nd connection member 23c protruding downward from the 3rd cooling body 21c, and the 2nd connection member 23c. It may include a plurality of third cooling fins (22c). The plurality of third cooling fins 22c may be provided with flow passages for flowing a fluid transferred from the third cooling body 21c through the second connection member 23c.

The second cooling body 21b may be disposed between the first cooling body 21a and the third cooling body 21c. The plurality of first cooling fins 22a, the second cooling fins 22b, and the third cooling fins 22c may be parallel to each other. That is, the plurality of cooling bodies 21a, 21b, 21c can be arranged in the left-right direction while the plurality of cooling fins 22a, 22b, 22c are arranged in the vertical direction.

The thermoelectric element 25 may be disposed on an upper surface or a lower surface of the plurality of cooling bodies 21a, 21b, and 21c. The thermoelectric element 25 may be disposed over the plurality of cooling bodies 21a, 21b, 21c. For example, the portion of the thermoelectric element 25 disposed on the first cooling body 21a cools the first cooling body 21a, thereby causing the laser diode bar LD to be disposed on the first cooling fin 22a. ) Can be cooled more efficiently.

Although embodiments have been described with reference to the accompanying drawings as described above, various modifications and variations are possible to those skilled in the art from the above description. For example, the described techniques may be performed in a different order than the described method, and / or components of the described structure, apparatus, etc. may be combined or combined in a different form than the described method, or may be combined with other components or equivalents. Appropriate results can be achieved even if they are replaced or substituted.

Claims (10)

A plurality of cooling units; And
A thermoelectric element attached to one surface of the plurality of cooling units based on a state in which the plurality of cooling units are coupled to each other,
Each of the plurality of cooling units,
A cooling body containing a refrigerant; And
A plurality of cooling fins for supporting a laser diode bar, said plurality of cooling fins including flow paths for flowing a refrigerant delivered from said cooling body,
The refrigerant flowing through the flow paths of the plurality of cooling fins passes under the laser diode bar,
The plurality of cooling units,
A first cooling unit including a first cooling body, a first connection member protruding upward from the first cooling body, and a plurality of first cooling fins protruding from the first connection member; And
A second cooling unit including a second cooling body connected to the first cooling body and a plurality of second cooling fins protruding from the second cooling body;
Laser diode bar cooling device comprising a.
The method of claim 1,
And the plurality of first cooling fins, the plurality of second cooling fins, and the plurality of third cooling fins are parallel to each other.
The method of claim 1,
The plurality of cooling units,
A third cooling body connected to the second cooling body, a second connecting member protruding downward from the second cooling body, and a plurality of third cooling fins protruding from the second connecting member. A laser diode bar cooling device further comprising a cooling unit.
The method of claim 3, wherein
And the second cooling body is disposed between the first and third cooling bodies.
The method of claim 1,
The plurality of cooling fins is a laser diode bar cooling device including a flow path through which the refrigerant delivered from the cooling body flows. delete delete delete delete delete

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