CN115533291A - Welding method of slab laser gain medium module - Google Patents

Welding method of slab laser gain medium module Download PDF

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Publication number
CN115533291A
CN115533291A CN202211116640.XA CN202211116640A CN115533291A CN 115533291 A CN115533291 A CN 115533291A CN 202211116640 A CN202211116640 A CN 202211116640A CN 115533291 A CN115533291 A CN 115533291A
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welding
diamond
gain medium
transition piece
laser gain
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Inventor
陈露
王超
赵鸿
李宁
唐晓军
刘磊
吕坤鹏
王钢
王文涛
边圣伟
贾佑权
刘睿绮
邓宇
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CETC 11 Research Institute
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CETC 11 Research Institute
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Priority to CN202211116640.XA priority Critical patent/CN115533291A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/14—Preventing or minimising gas access, or using protective gases or vacuum during welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/24—Preliminary treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/26—Auxiliary equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/0405—Conductive cooling, e.g. by heat sinks or thermo-electric elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/0407—Liquid cooling, e.g. by water
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/042—Arrangements for thermal management for solid state lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/06—Construction or shape of active medium
    • H01S3/0602—Crystal lasers or glass lasers
    • H01S3/0604—Crystal lasers or glass lasers in the form of a plate or disc

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention provides a welding method of a slab laser gain medium module, which comprises the following steps: preprocessing related materials; arranging a first diamond welding transition piece on one side of the first heat sink, and carrying out welding treatment to form a first welding body; and arranging the lath laser gain medium between one side of the first welding body close to the first diamond welding transition piece and one side of the second welding body close to the second diamond welding transition piece, and performing welding treatment. According to the invention, the diamond transition sheet with good thermal conductivity is added between the lath laser gain medium and the welding layer of the heat sink by adopting a cold pressure welding pretreatment method, so that the heat dissipation performance of the laser gain medium during working is improved, the thermal stress of the welding layer of the laser gain medium and the heat sink is reduced, and the beam quality and the reliability of the lath laser gain medium module are improved.

Description

Welding method of slab laser gain medium module
Technical Field
The invention relates to the technical field of a gain medium module packaging process of a solid laser, in particular to a welding method of a slab laser gain medium module.
Background
Under the condition of high power, thermal focusing, thermal birefringence and thermal depolarization effects can be generated in the solid laser gain medium, so that the output power of the laser is reduced, and the quality of a light beam is degraded. The slab gain medium laser adopts zigzag light path transmission, which can eliminate thermal wavefront distortion and greatly improve the output power of the solid laser. However, the beam quality of the slab gain medium laser is poor under the influence of factors such as the spatial resolution of the deformable mirror, the response bandwidth and the like, and in order to solve the problem, the heat effect problem of the slab gain medium module needs to be improved. By improving the welding method of the slab laser gain medium module, the heat dissipation efficiency of the laser gain medium is improved, the welding stress is reduced, and the beam quality of the slab laser gain medium is improved.
Disclosure of Invention
The invention aims to solve the technical problem of poor beam quality of a slab gain medium laser caused by the thermal effect of a slab gain medium module. In view of the above, the present invention provides a method for welding a slab laser gain medium module.
The technical scheme adopted by the invention is that the welding method of the slab laser gain medium module comprises the following steps: sequentially carrying out pretreatment before welding on the slab laser gain medium, the first heat sink, the second heat sink, the first diamond welding transition piece and the second diamond welding transition piece; arranging the first diamond welding transition piece on one side of the first heat sink, performing welding treatment to form a first welding body, and arranging the second diamond welding transition piece on one side of the second heat sink, and performing welding treatment to form a second welding body; and arranging the lath laser gain medium between one side of the first welding body close to the first diamond welding transition piece and one side of the second welding body close to the second diamond welding transition piece, and performing welding treatment.
In one embodiment, the pre-treatment before welding is sequentially performed on the slab laser gain medium, the first heat sink, the second heat sink, the first diamond welding transition piece and the second diamond welding transition piece, and includes: plating a titanium film and a gold film on the two surfaces of the first diamond welding transition piece and the second diamond welding transition piece in sequence; sequentially plating an optical film, a titanium film and a gold film on two surfaces of the slab laser gain medium; and sequentially plating a gold film and an indium film on the welding surface of the first heat sink and the second heat sink, wherein the first heat sink and the second heat sink are red copper heat sinks with microchannel water cooling structures inside.
In one embodiment, the disposing the first diamond bonding pad on one side of the first heat sink and performing a bonding process to form a first bonded body and the disposing the second diamond bonding pad on one side of the second heat sink and performing a bonding process to form a second bonded body includes: placing the first diamond welding transition piece and the first heat sink into a vacuum diffusion furnace, vacuumizing the vacuum diffusion furnace before welding, wherein the vacuum degree is 1 multiplied by 10 -3 ～4×10 -4 Pa, pressurizing during welding, setting the pressure to be 500-2000 lb and the time to be 10-30 h, and taking the first welding body out of the vacuum diffusion furnace after the welding is finished; and plating an indium film on the surface of the first welding body on one side of the first diamond welding transition piece. Placing the second diamond welding transition piece and the second heat sink into a vacuum diffusion furnace, vacuumizing the vacuum diffusion furnace before welding, wherein the vacuum degree is 1 multiplied by 10 -3 ～4×10 -4 Pa, pressurizing during welding, setting the pressure to be 500-2000 lb and the time to be 10-30 h, and taking the second welding body out of the vacuum diffusion furnace after the welding is finished; and plating an indium film on the surface of the second welding body on one side of the second diamond welding transition piece.
In one embodiment, the disposing the slab laser gain medium between a side of the first bonding body proximate the first diamond bonding transition piece and a side of the second bonding body proximate the second diamond bonding transition piece and performing a bonding process includes: the first welding body with the upward first diamond welding transition piece, the lath laser gain medium and the second welding body with the downward second diamond welding transition piece are sequentially placed from bottom to top; putting the current device into a vacuum welding furnace, vacuumizing the vacuum welding furnace to 1 multiplied by 10 before welding -3 ～3×10 -4 Pa, the welding temperature is 200-260 ℃, the heating is stopped after the heat preservation is carried out for 10-30 minutes, the device is cooled to the room temperature in a vacuum state, the current device is taken out of the vacuum furnace, and the welding of the device is finishedThe process.
In one embodiment, the slab laser gain medium comprises: nd doped 3+ Slab laser crystal of, doped with Nd 3+ Slab laser ceramics of Yb doped 3+ Slab laser crystal of Yb-doped 3+ The slab of (2) laser ceramic.
In one embodiment, the opposing bonding faces of the first heatsink, the second heatsink, the slab laser gain medium, the first diamond-bonded transition piece, and the second diamond-bonded transition piece are required to achieve: cleanliness is less than or equal to 0.1mg/cm 2 The planeness is less than or equal to 0.5 lambda, lambda =632.8nm, and the fineness is less than or equal to 40/20.
In one embodiment, the first diamond sheet bonding transition piece and the second diamond sheet bonding transition piece have a thickness of 0.1 to 2mm; and the welding length of the first diamond sheet welding transition piece and the second diamond sheet welding transition piece is the same as the welding length of the lath laser gain medium, and the welding width is 2mm larger than the welding width of the lath laser gain medium.
In one embodiment, the optical film on the surface of the slab laser gain medium is a silicon dioxide film with the thickness of 2-5 μm; the thickness of the titanium film is 100-500 nm, and the thickness of the gold film is 300-800 nm; the size of the slab laser gain medium is as follows: the length is 10-300 mm, the width is 10-60 mm, and the thickness is 1-5 mm.
In one embodiment, the first and second heat sinks have a gold film thickness of 300 to 500nm and an indium film thickness of 10 to 200 μm.
In one embodiment, the first and second diamond sheet bonding transition pieces have a titanium film thickness of 100 to 500nm, a gold film thickness of 300 to 800nm, and an indium film thickness of 10 to 200 μm.
By adopting the technical scheme, the invention at least has the following advantages:
the welding method of the lath laser gain medium module aims at the low-stress packaging method of the lath laser gain medium, and adds the diamond transition sheet with good heat conductivity between the lath laser gain medium and the welding layer of the heat sink by adopting a cold pressure welding pretreatment method, so that the heat dissipation performance of the laser gain medium during working is improved, the thermal stress of the welding layer of the laser gain medium and the heat sink is reduced, and the beam quality and the reliability of the lath laser gain medium module are improved.
Drawings
FIG. 1 is a flow chart of a method of welding slab laser gain medium modules according to an embodiment of the invention;
FIG. 2 is a schematic diagram of a slab laser gain medium module according to an embodiment of the present invention;
fig. 3 is a schematic diagram of an electronic device according to an embodiment of the invention.
Reference numerals
1-a first heat sink, 2-a first welding layer, 3-a first diamond welding transition piece, 4-a second welding layer, 5-a lath laser gain medium, 6-a third welding layer, 7-a second diamond welding transition piece, 8-a fourth welding layer and 9-a second heat sink.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined purposes, the present invention is described in detail below with reference to the accompanying drawings and preferred embodiments.
The description of the method flow in the present specification and the steps of the flow chart in the drawings of the present specification are not necessarily strictly performed by the step numbers, and the execution order of the method steps may be changed. Moreover, certain steps may be omitted, multiple steps may be combined into one step execution, and/or a step may be broken down into multiple step executions.
In a first embodiment of the present invention, a method for welding a slab laser gain medium module, as shown in fig. 1, includes the following steps:
s1, preprocessing is carried out on the plate strip laser gain medium, the first heat sink, the second heat sink, the first diamond welding transition piece and the second diamond welding transition piece in sequence before welding.
S2, arranging a first diamond welding transition piece on one side of a first heat sink, carrying out welding treatment to form a first welding body, and arranging a second diamond welding transition piece on one side of a second heat sink, carrying out welding treatment to form a second welding body;
and S3, arranging the lath laser gain medium between one side of the first welding body close to the first diamond welding transition piece and one side of the second welding body close to the second diamond welding transition piece, and performing welding treatment.
The present embodiment will be described in detail step by step.
S1, preprocessing is carried out on the plate strip laser gain medium, the first heat sink, the second heat sink, the first diamond welding transition piece and the second diamond welding transition piece in sequence before welding.
In this embodiment, the two surfaces of the first diamond welding transition piece and the second diamond welding transition piece are sequentially plated with a titanium film and a gold film.
In this embodiment, the optical film, the titanium film, and the gold film are sequentially plated on both surfaces of the slab laser gain medium.
In this embodiment, the soldering surfaces of the first heat sink and the second heat sink are plated with the gold film and the indium film in sequence.
The first heat sink and the second heat sink are red copper heat sinks with micro-channel water cooling structures inside.
Specifically, the optical film on the surface of the slab laser gain medium is a silicon dioxide film, and the thickness of the optical film is 2-5 microns; the thickness of the titanium film is 100-500 nm, and the thickness of the gold film is 300-800 nm; the dimensions of the slab laser gain medium are: the length is 10-300 mm, the width is 10-60 mm, and the thickness is 1-5 mm.
Specifically, the thickness of the gold film of the first heat sink and the second heat sink is 300-500 nm, and the thickness of the indium film is 10-200 μm.
Specifically, the thickness of the titanium film of the first diamond piece welding transition piece and the thickness of the second first diamond piece welding transition piece are 100-500 nm, and the thickness of the gold film is 300-800 nm.
In addition, in some possible embodiments of the present embodiment, the slab laser gain medium may be Nd-doped 3+ Slab laser crystal of, nd-doped 3+ Of (2)Stripe laser ceramics, doped Yb 3+ Slab laser crystal of Yb-doped 3+ The slats of (a) are laser ceramic.
And S2, arranging the first diamond welding transition piece on one side of the first heat sink, performing welding treatment to form a first welding body, and arranging the second diamond welding transition piece on one side of the second heat sink, and performing welding treatment to form a second welding body.
In this embodiment, the first diamond welding transition piece and the first heat sink are placed in a vacuum diffusion furnace, and the vacuum diffusion furnace is vacuumized before welding, wherein the vacuum degree is 1 × 10 -3 ～4×10 -4 Pa, pressurizing during welding, setting the pressure to be 500-2000 lb and the time to be 10-30 h, and taking the obtained first welding body out of the vacuum diffusion furnace after welding. And after the welding treatment is finished, plating an indium film on the surface of the first diamond welding transition piece side of the first welding body.
Placing the second diamond welding transition piece and the second heat sink into a vacuum diffusion furnace, vacuumizing the vacuum diffusion furnace before welding, wherein the vacuum degree is 1 multiplied by 10 -3 ～4×10 -4 Pa, pressurizing during welding, setting the pressure to be 500-2000 lb and the time to be 10-30 h, and taking the second welding body out of the vacuum diffusion furnace after the welding is finished;
and after the welding treatment is finished, plating an indium film on the surface of the second diamond welding transition piece side of the second welding body.
In this example, the thickness of the indium film was 10 to 200. Mu.m.
It should be noted that, the above-mentioned welding process of first manufacturing the first welded body and then performing the second welded body is only an example, and in practical applications, the welding process of the first welded body and the second welded body may be performed simultaneously, or the welding process of the second welded body is performed first and then the welding process of the first welded body is performed, which is not limited herein.
And S3, arranging the lath laser gain medium between one side of the first welding body close to the first diamond welding transition piece and one side of the second welding body close to the second diamond welding transition piece, and performing welding treatment.
In this embodiment, a first welding body with an upward first diamond welding transition piece, a slab laser gain medium, and a second welding body with a downward second diamond welding transition piece are sequentially placed from bottom to top.
In a similar way, the second welding body with the upward second diamond welding transition sheet, the lath laser gain medium and the first welding body with the downward first diamond welding transition sheet can also be sequentially arranged from bottom to top.
Putting the current device into a vacuum welding furnace, vacuumizing the vacuum welding furnace to 1 multiplied by 10 before welding -3 ～3×10 - 4 Pa, the welding temperature is 200-260 ℃, the heating is stopped after the heat preservation is carried out for 10-30 minutes, the device is cooled to the room temperature in the vacuum state, and the current device is taken out of the vacuum furnace, so that the welding process of the device is finished.
In this embodiment, the relative welding surfaces of the first heat sink, the second heat sink, the slab laser gain medium, the first diamond welding transition piece, and the second diamond welding transition piece need to meet the following requirements: cleanliness is less than or equal to 0.1mg/cm 2 The planeness is less than or equal to 0.5 lambda, lambda =632.8nm, and the fineness is less than or equal to 40/20.
In the embodiment, the thicknesses of the first diamond sheet welding transition piece and the second diamond sheet welding transition piece are 0.1-2 mm; and the welding length of the first diamond piece welding transition piece and the second diamond piece welding transition piece is the same as that of the lath laser gain medium, and the welding width is 2mm larger than that of the lath laser gain medium.
Compared with the prior art, the low-stress welding method for the slab laser gain medium provided by the embodiment is directed at a low-stress packaging method for the slab laser gain medium, and the diamond transition piece with good thermal conductivity is added between the slab laser gain medium and the welding layer of the heat sink by adopting a cold pressure welding pretreatment method, so that the heat dissipation performance of the laser gain medium during working is improved, the thermal stress of the welding layer of the laser gain medium and the heat sink is reduced, and the beam quality and the reliability of the slab laser gain medium module are improved.
A second embodiment of the present invention, which is corresponding to the first embodiment, introduces a slab laser gain medium module, as shown in fig. 2, including the following components:
the device comprises a first heat sink 1, a first welding layer 2, a first diamond welding transition piece 3, a second welding layer 4, a batten laser gain medium 5, a third welding layer 6, a second diamond welding transition piece 7, a fourth welding layer 8 and a second heat sink 9.
The slab laser gain medium module provided in this embodiment is prepared and formed by the low stress welding method of the slab laser gain medium of the first embodiment, and is based on the same design concept as the first embodiment, and will not be described herein again.
A third embodiment of the invention, with reference to fig. 3, an electronic device, which may be understood as a physical device, comprises a slab laser gain medium module as described in the second embodiment.
A fourth embodiment of the present invention is described in an application example of the present invention on the basis of the above embodiments.
The slab laser gain medium 5 is Nd: YAG slab laser ceramic, the size is 140mm multiplied by 20mm multiplied by 2mm, the optical film thickness of the Nd. The first diamond bonding transition piece 3 and the second diamond bonding transition piece 7 each have a size of 134mm × 22mm × 10 μm, and have a titanium film thickness of 100nm and a gold film thickness of 300nm on the surface. The first heat sink 1 and the second heat sink 9 have a gold film thickness of 800nm and indium films of 134mm × 22mm × 0.8mm.
The first heat sink 1 and the first diamond welding transition piece 3 with the upward welding surfaces are sequentially arranged from bottom to top, and a first welding body is obtained through welding.
Putting the first welding body into a vacuum diffusion furnace, vacuumizing the vacuum diffusion furnace before welding until the vacuum degree is 4 multiplied by 10 -4 Pa, pressurizing the first welding body with the pressure set as 2000lb for 20h, and taking the first welding body out of the vacuum diffusion furnace after the pressure welding is finished; and plating an indium film on the surface of the first diamond welding transition piece 3 of the first welding body.
And a second heat sink 9 with an upward welding surface and a second diamond welding transition sheet 7 are sequentially arranged from bottom to top, and a second welding body is obtained by welding.
Putting the second welding body into a vacuum diffusion furnace, vacuumizing the vacuum diffusion furnace before welding until the vacuum degree is 4 multiplied by 10 -4 Pa, pressurizing the second welding body, setting the pressure to be 2000lb, setting the pressurizing time to be 20h, and taking the second welding body out of the vacuum diffusion furnace after the pressure welding is finished; and plating an indium film on the surface of the second diamond welding transition piece 7 of the second welding body.
A first welding body with an upward welding surface, a slab laser gain medium 5 and a second welding body with a downward welding surface are sequentially arranged from bottom to top; putting the above components into a vacuum welding furnace, and vacuumizing the vacuum welding furnace to 3 × 10 before welding -4 Pa, the welding temperature is 220 ℃, the heating power supply is turned off after the heat preservation is carried out for 10 minutes, the device is cooled to the room temperature in the vacuum state, the device is taken out of the vacuum furnace, and the welding process is finished.
The fifth embodiment of the present invention is an application example of the present invention, which is based on the above-described embodiments.
The slab laser gain medium 5 is Nd: YAG slab laser ceramic, the size is 68mm multiplied by 10mm multiplied by 2mm, the optical film thickness of the Nd. The first diamond bonding transition piece 3 and the second diamond bonding transition piece 7 each have a size of 62mm × 10mm × 10 μm, and have a titanium film thickness of 100nm and a gold film thickness of 300nm on the surface. The first heat sink 1 and the second heat sink 9 have a gold film thickness of 300nm and indium films of 62mm × 10mm × 0.5mm.
The first heat sink 1 and the first diamond welding transition piece 3 with the upward welding surfaces are sequentially arranged from bottom to top, and a first welding body is obtained through welding.
Putting the first welding body into a vacuum diffusion furnace, vacuumizing the vacuum diffusion furnace before welding until the vacuum degree is 4 multiplied by 10 -4 Pa, pressurizing the first welding body with the pressure set to be 500lb for 10h, and taking the first welding body out of the vacuum diffusion furnace after the pressure welding is finished; and plating an indium film on the surface of the first diamond welding transition piece 3 of the first welding body.
And a second heat sink 9 with an upward welding surface and a second diamond welding transition sheet 7 are sequentially arranged from bottom to top, and a second welding body is obtained by welding.
Placing the second welding body into a vacuum diffusion furnace, vacuumizing the vacuum diffusion furnace before welding until the vacuum degree is 4 multiplied by 10 -4 Pa, pressurizing the second welding body, setting the pressure to be 500lb and the pressurizing time to be 10h, and taking the second welding body out of the vacuum diffusion furnace after the pressure welding is finished; and plating an indium film on the surface of the second diamond welding transition piece 7 of the second welding body.
A first welding body with an upward welding surface, a lath laser gain medium 5 and a second welding body with a downward welding surface are sequentially arranged from bottom to top; putting the above components into a vacuum welding furnace, vacuumizing the furnace to 3 × 10 -4 Pa, the welding temperature is 200 ℃, after the heat preservation is carried out for 10 minutes, the heating power supply is turned off, the device is cooled to the room temperature in the vacuum state, the device is taken out of the vacuum furnace, and the welding process is finished.
In summary, compared with the prior art, the invention has at least the following beneficial effects:
1) The invention aims at the low-stress packaging method of the slab laser gain medium, and adds the diamond transition sheet with good heat conductivity between the slab laser gain medium and the welding layer of the heat sink by adopting a cold pressure welding pretreatment method, thereby improving the heat dissipation of the laser gain medium during working, reducing the thermal stress of the welding layer of the laser gain medium and the heat sink, and improving the beam quality and reliability of the slab laser gain medium module.
2) The method is simple to operate and easy to realize.
While the present invention has been described in connection with the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims (10)

1. A welding method of a slab laser gain medium module is characterized by comprising the following steps:
the method comprises the following steps that pretreatment before welding is sequentially carried out on a plate strip laser gain medium, a first heat sink, a second heat sink, a first diamond welding transition piece and a second diamond welding transition piece;
arranging the first diamond welding transition piece on one side of the first heat sink, performing welding treatment to form a first welding body, and arranging the second diamond welding transition piece on one side of the second heat sink, and performing welding treatment to form a second welding body;
and arranging the lath laser gain medium between one side of the first welding body close to the first diamond welding transition piece and one side of the second welding body close to the second diamond welding transition piece, and performing welding treatment.
2. The method of welding a slab laser gain medium module of claim 1, wherein the pre-treating of the slab laser gain medium, the first heatsink, the second heatsink, the first diamond bonded transition piece, and the second diamond bonded transition piece prior to welding comprises:
plating a titanium film and a gold film on the two surfaces of the first diamond welding transition piece and the second diamond welding transition piece in sequence;
sequentially plating an optical film, a titanium film and a gold film on two surfaces of the lath laser gain medium;
and sequentially plating a gold film and an indium film on the welding surfaces of the first heat sink and the second heat sink, wherein the first heat sink and the second heat sink are red copper heat sinks with micro-channel water cooling structures inside.
3. The method of welding a slab laser gain medium module as set forth in claim 2, wherein the step of disposing the first diamond bonding pad on one side of the first heat sink and performing a welding process to form a first welded body and the step of disposing the second diamond bonding pad on one side of the second heat sink and performing a welding process to form a second welded body comprises:
placing the first diamond welding transition piece and the first heat sink into a vacuum diffusion furnace, vacuumizing the vacuum diffusion furnace before welding, wherein the vacuum degree is 1 multiplied by 10 -3 ～4×10 -4 Pa, pressurizing during welding, setting the pressure to be 500-2000 lb and the time to be 10-30 h, and taking the first welding body out of the vacuum diffusion furnace after the welding is finished;
plating an indium film on the surface of the first welding body on one side of the first diamond welding transition piece;
placing the second diamond welding transition piece and the second heat sink into a vacuum diffusion furnace, vacuumizing the vacuum diffusion furnace before welding, wherein the vacuum degree is 1 multiplied by 10 -3 ～4×10 -4 Pa, pressurizing during welding, setting the pressure to be 500-2000 lb and the time to be 10-30 h, and taking the second welding body out of the vacuum diffusion furnace after the welding is finished;
and plating an indium film on the surface of the second welding body on one side of the second diamond welding transition piece.
4. The method of welding a slab laser gain medium module as defined in claim 1, wherein said disposing the slab laser gain medium between a side of the first bonding body adjacent the first diamond-bonded transition piece and a side of the second bonding body adjacent the second diamond-bonded transition piece and performing a welding process comprises:
the first welding body with the upward first diamond welding transition piece, the lath laser gain medium and the second welding body with the downward second diamond welding transition piece are sequentially placed from bottom to top;
putting the current device into a vacuum welding furnace, and vacuumizing the vacuum welding furnace to 1 multiplied by 10 before welding -3 ～3×10 -4 Pa, the welding temperature is 200-260 ℃, the heating is stopped after the heat preservation is carried out for 10-30 minutes, the device is cooled to the room temperature in the vacuum state, and the current device is taken out of the vacuum furnace, so that the welding process of the device is finished.
5. According to claim1, the method for welding slab laser gain medium modules, wherein the slab laser gain medium module comprises: nd doped 3+ Slab laser crystal of, doped with Nd 3+ The slab laser ceramic, the slab laser crystal doped with Yb < 3+ >, and the slab laser ceramic doped with Yb < 3+ >.
6. The method of welding slab laser gain medium modules as claimed in claim 1, comprising: the relative welding surfaces of the first heat sink, the second heat sink, the lath laser gain medium, the first diamond welding transition piece and the second diamond welding transition piece are required to reach the following conditions: cleanliness is less than or equal to 0.1mg/cm 2 The planeness is less than or equal to 0.5 lambda, lambda =632.8nm, and the fineness is less than or equal to 40/20.
7. The method of welding a slab laser gain medium module as defined in claim 1, wherein the first diamond table welded transition piece and the second diamond table welded transition piece have a thickness of 0.1-2 mm; and the welding length of the first diamond piece welding transition piece and the second diamond piece welding transition piece is the same as that of the lath laser gain medium, and the welding width is 2mm larger than that of the lath laser gain medium.
8. The method for welding slab laser gain medium modules as claimed in claim 2, wherein the optical film on the surface of the slab laser gain medium is a silicon dioxide film with a thickness of 2-5 μm; the thickness of the titanium film is 100-500 nm, and the thickness of the gold film is 300-800 nm; the size of the slab laser gain medium is as follows: the length is 10-300 mm, the width is 10-60 mm, and the thickness is 1-5 mm.
9. The method of soldering a slab laser gain medium module as set forth in claim 2, wherein the gold film thickness of the first and second heat sinks is 300 to 500nm, and the indium film thickness is 10 to 200 μm.
10. The method of welding a slab laser gain medium module as defined in claim 3, wherein the titanium film thickness of the first and second diamond table welding transition pieces is 100 to 500nm, the gold film thickness is 300 to 800nm, and the indium film thickness is 10 to 200 μm.
CN202211116640.XA 2022-09-14 2022-09-14 Welding method of slab laser gain medium module Pending CN115533291A (en)

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