CN213988921U

CN213988921U - High-reflection anti-vulcanization LED support structure

Info

Publication number: CN213988921U
Application number: CN202022685936.6U
Authority: CN
Inventors: 张建敏; 王鹏辉; 肖彪
Original assignee: Shenzhen Mingge Precision Technology Co ltd
Current assignee: Shenzhen Mingge Precision Technology Co ltd
Priority date: 2020-11-19
Filing date: 2020-11-19
Publication date: 2021-08-17
Anticipated expiration: 2030-11-19

Abstract

The utility model discloses a high-reflection anti-vulcanization LED support structure, which comprises an etching sheet (3), a cutting rib (5) and an EMC plastic package material (6); the etching sheet (3) forms more than one positive electrode bonding pad (1) and more than one negative electrode bonding pad (2) through an etching process; the EMC plastic package material (6) is adhered to the etching sheet (3) through mold closing, so that a support structure with a cup is formed; the cutting ribs (5) are connected with the positive electrode bonding pad (1) and the negative electrode bonding pad (2). The utility model discloses all fill EMC plastic envelope material with the position of the single material functional area non-weld zone of LED support, improved single material cup type bottom reflection efficiency, avoided simultaneously LED support packaging to become behind the lamp pearl in the application in use cladding material by halogen element's such as S, Cl destruction, improved product life.

Description

High-reflection anti-vulcanization LED support structure

Technical Field

The utility model relates to a LED encapsulates technical field, concretely relates to anti LED supporting structure who vulcanizes of high reflection.

Background

Along with the expansion and development of LED product market, products are applied to more fields, so that consumers have higher requirements on the quality of the products, the product homogenization competition in the market is serious, the light source quality is also uneven, and the market urgently expects the remarkable comprehensive upgrade and modification of the existing LED light source technology. Especially has strict requirements on the high brightness and the sulfur resistance of products. Therefore, highly reflective sulfur-resistant LED holders have come to work in this form and trend. According to the existing high-reflection anti-vulcanization LED support structure, an EMC plastic package material is adopted at the bottom of the cup-shaped structure of the LED support to fill the area except for a welding chip, so that the reflectivity of the LED support is improved, and the condition that a coating at the bottom of the cup-shaped structure of a light source is damaged by halogen elements such as S, Cl in the external environment when an LED light source is applied and used is prevented; therefore, the current situations of poor sulfur resistance effect of the LED and insufficient brightness of a light source are solved.

Disclosure of Invention

The utility model aims to solve the technical problem that all fill EMC plastic envelope material with the position of the single material functional area non-weld zone of LED support, improved single material cup type bottom reflection efficiency, avoided simultaneously LED support encapsulation to become behind the lamp pearl in the application in use cladding material by S, Cl etc. halogen element's destruction, improved product life.

The utility model discloses anti LED supporting structure who vulcanizes of high reflection realizes through following technical scheme: the method comprises the steps of etching a sheet, cutting ribs and an EMC plastic package material;

the etching piece forms more than one positive electrode bonding pad and more than one negative electrode bonding pad through an etching process; the EMC plastic package material is adhered to the etching sheet through mold assembly, so that a support structure with a cup is formed; the cutting rib is connected with the positive electrode bonding pad and the negative electrode bonding pad.

As a preferable technical scheme, active metal substances which are used for welding the LED chip and are conductive are plated on the surfaces of the anode bonding pad and the cathode bonding pad.

According to a preferable technical scheme, a front half-etching area and a back half-etching area are formed on the etching sheet besides the positive electrode bonding pad and the negative electrode bonding pad, and EMC plastic packaging materials are adhered to the front half-etching area and the back half-etching area.

As a preferred technical scheme, the cutting ribs are made of metal materials with good heat conductivity coefficients, and the EMC plastic package material is high-temperature-resistant epoxy resin.

The utility model has the advantages that: the utility model discloses all fill EMC plastic envelope material with the position of the single material functional area non-weld zone of LED support, improved single material cup type bottom reflection efficiency, avoided simultaneously LED support packaging to become behind the lamp pearl in the application in use cladding material by halogen element's such as S, Cl destruction, improved product life.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a three-dimensional structure of the present invention;

FIG. 2 is a schematic sectional view of the present invention;

fig. 3 is a top view of the present invention;

fig. 4 is a side sectional view of the present invention.

Detailed Description

All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.

Any feature disclosed in this specification (including any accompanying claims, abstract and drawings), may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.

In the description of the present invention, it is to be understood that the terms "one end", "the other end", "the outside", "upper", "inside", "horizontal", "coaxial", "central", "end", "length", "outer end", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, in the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

The use of terms herein such as "upper," "above," "lower," "below," and the like in describing relative spatial positions is for the purpose of facilitating description to describe one element or feature's relationship to another element or feature as illustrated in the figures. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented and the spatially relative descriptors used herein interpreted accordingly.

In the present invention, unless otherwise explicitly specified or limited, the terms "set", "coupled", "connected", "penetrating", "plugging", and the like are to be understood in a broad sense, and may be, for example, fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

As shown in fig. 1-4, the LED support structure with high reflection and anti-sulfuration of the present invention comprises an etching sheet 3, a cutting rib 5 and an EMC molding compound 6;

the etching sheet 3 forms more than one positive electrode bonding pad 1 and more than one negative electrode bonding pad 2 through an etching process; the EMC plastic package material 6 is adhered to the etching sheet 3 through mold closing, so that a support structure with a cup is formed; the cutting rib 5 connects the positive electrode pad 1 and the negative electrode pad 2.

In this embodiment, the surfaces of the positive electrode bonding pad 1 and the negative electrode bonding pad 2 are plated with active metal substances which are used for welding the LED chip and are conductive, so as to better weld the LED chip.

In the embodiment, besides the positive electrode pad and the negative electrode pad, a front half-etching area (7) and a back half-etching area (4) are formed on the etching sheet (3), and the front half-etching area (7) and the back half-etching area (4) are both adhered with the EMC plastic package material (6), so that better air tightness is provided for the LED support structure.

In addition, the cutting rib 5 is made of a metal material with a good thermal conductivity coefficient, and may be any metal material with a high thermal conductivity coefficient, and the EMC molding compound 6 is not particularly limited herein, and is a high temperature resistant epoxy resin.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the creative work should be covered within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.

Claims

1. The utility model provides a LED supporting structure of high reflection anti vulcanization which characterized in that: comprises an etching sheet (3), a cutting rib (5) and an EMC plastic package material (6);

the etching sheet (3) forms more than one positive electrode bonding pad (1) and more than one negative electrode bonding pad (2) through an etching process; the EMC plastic package material (6) is adhered to the etching sheet (3) through mold assembly to form a support structure with a cup; the cutting ribs (5) are connected with the positive electrode bonding pad (1) and the negative electrode bonding pad (2).

2. The highly reflective, sulfur resistant LED mounting structure of claim 1, wherein: and the surfaces of the positive electrode bonding pad (1) and the negative electrode bonding pad (2) are plated with metal substances which are used for welding the LED chip and are conductive.

3. The highly reflective, sulfur resistant LED mounting structure of claim 1, wherein: besides the positive electrode pad and the negative electrode pad, a front half-etching area (7) and a back half-etching area (4) are formed on the etching sheet (3), and EMC plastic packaging materials (6) are adhered to the front half-etching area (7) and the back half-etching area (4).

4. The highly reflective, sulfur resistant LED mounting structure of claim 1, wherein: the cutting ribs (5) are made of metal materials with high heat conductivity coefficients, and the EMC plastic package material (6) is high-temperature-resistant epoxy resin.