JPS5887366U - light emitting diode - Google Patents

light emitting diode

Info

Publication number
JPS5887366U
JPS5887366U JP18246681U JP18246681U JPS5887366U JP S5887366 U JPS5887366 U JP S5887366U JP 18246681 U JP18246681 U JP 18246681U JP 18246681 U JP18246681 U JP 18246681U JP S5887366 U JPS5887366 U JP S5887366U
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
pellet
frame
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18246681U
Other languages
Japanese (ja)
Other versions
JPS6236311Y2 (en
Inventor
田代　嘉宣
箕輪　文雄
Original Assignee
日本インタ−ナシヨナル整流器株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本インタ−ナシヨナル整流器株式会社 filed Critical 日本インタ−ナシヨナル整流器株式会社
Priority to JP18246681U priority Critical patent/JPS5887366U/en
Publication of JPS5887366U publication Critical patent/JPS5887366U/en
Application granted granted Critical
Publication of JPS6236311Y2 publication Critical patent/JPS6236311Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、従来の発光ダイオードの構造例を示し、同図
Ａは、その側面図、同図Ｂは、その正面図、第２図は本
考案に係るダイオードの一実施例を示す側面図、第３図
は、上記ダイオードの製造方法の一例を示す部分断面図
である。 １１・・・カソードリードフレーム、１２・・・発光ペ
レット、１３・・・アノードリードフレーム、１５・・
・レンズ面、１６・・・樹脂封止、１７・・・凹部、１
Ｂ−°・・樹脂成形用型、１９・・・ホルダ。Fig. 1 shows an example of the structure of a conventional light emitting diode, Fig. A is a side view thereof, Fig. B is a front view thereof, and Fig. 2 is a side view showing an embodiment of the diode according to the present invention. , FIG. 3 is a partial cross-sectional view showing an example of a method for manufacturing the diode. 11... Cathode lead frame, 12... Light emitting pellet, 13... Anode lead frame, 15...
・Lens surface, 16...Resin sealing, 17...Concave portion, 1
B-°...Resin molding mold, 19...Holder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リードフレームの頭部表面に発光ペレットが搭載され、
かつこのペレットの主面が樹脂封止のレンズ面の光軸に
対して一定の傾斜角を有するように前記フレームを折曲
したことを特徴とする発光ダイオード。　　　　−A luminescent pellet is mounted on the head surface of the lead frame,
A light-emitting diode characterized in that the frame is bent so that the main surface of the pellet has a certain inclination angle with respect to the optical axis of the resin-sealed lens surface. −
JP18246681U 1981-12-08 1981-12-08 light emitting diode Granted JPS5887366U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18246681U JPS5887366U (en) 1981-12-08 1981-12-08 light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18246681U JPS5887366U (en) 1981-12-08 1981-12-08 light emitting diode

Publications (2)

Publication Number Publication Date
JPS5887366U true JPS5887366U (en) 1983-06-14
JPS6236311Y2 JPS6236311Y2 (en) 1987-09-16

Family

ID=29980851

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18246681U Granted JPS5887366U (en) 1981-12-08 1981-12-08 light emitting diode

Country Status (1)

Country Link
JP (1) JPS5887366U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010153800A (en) * 2008-12-24 2010-07-08 Ind Technol Res Inst Led illumination module and method of packaging the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5327769U (en) * 1976-08-18 1978-03-09

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51125743A (en) * 1974-08-06 1976-11-02 Kyowa Gas Chem Ind Co Ltd A germicide for industry

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5327769U (en) * 1976-08-18 1978-03-09

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010153800A (en) * 2008-12-24 2010-07-08 Ind Technol Res Inst Led illumination module and method of packaging the same

Also Published As

Publication number Publication date
JPS6236311Y2 (en) 1987-09-16

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