JPS6449987U - - Google Patents
Info
- Publication number
- JPS6449987U JPS6449987U JP1987143780U JP14378087U JPS6449987U JP S6449987 U JPS6449987 U JP S6449987U JP 1987143780 U JP1987143780 U JP 1987143780U JP 14378087 U JP14378087 U JP 14378087U JP S6449987 U JPS6449987 U JP S6449987U
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting diode
- emitting
- angle
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 238000002834 transmittance Methods 0.000 claims 3
- 239000000463 material Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
第１図〜第３図は本考案に係わる発光ダイオー
ド表示器を構成する発光ダイオードの一実施例を
示す平面図および断面図、第４図は発光出力の配
光を示すグラフ、第５図は第１図〜第３図の発光
ダイオードを適用した発光ダイオード表示器を示
す平面図、第６図〜第８図は本考案に係わる発光
ダイオード表示器を構成する発光ダイオードの第
２の実施例を示す平面図および断面図、第９図お
よび第１０図は上下方向および左右方向の視認限
界角度を示す説明図、第１１図および第１２図は
本考案に係わる発光ダイオード表示器を構成する
発光ダイオードの第３の実施例を示す平面図およ
び断面図、第１３図は従来の発光ダイオード表示
器を示す平面図、第１４図〜第１６図は従来の発
光ダイオード表示器を構成する発光ダイオードを
示す平面図および断面図である。
１……発光ダイオード、２……ケース、３……
充填材、４，５……発光ダイオード素子、６，７
………金属ステム、８……反射鏡、９……端子、
１０，１１……金線、１２，１３，２１……発光
出力、１４……レンズ、１５，２０，２６……角
度、１８……白つぽい部分、２２……可変情報板
、２３……ドライバ、２４，２５……視認限界角
度、２７……同一発光出力の発光角プロツト線。
1 to 3 are a plan view and a sectional view showing one embodiment of a light emitting diode constituting a light emitting diode display device according to the present invention, FIG. 4 is a graph showing the light distribution of light emission output, and FIG. A plan view showing a light emitting diode display to which the light emitting diodes of FIGS. 1 to 3 are applied, and FIGS. 6 to 8 show a second embodiment of the light emitting diode constituting the light emitting diode display according to the present invention. 9 and 10 are explanatory diagrams showing the visibility limit angles in the vertical and horizontal directions, and FIGS. 11 and 12 are light emitting diodes constituting the light emitting diode display device according to the present invention. 13 is a plan view showing a conventional light emitting diode display, and FIGS. 14 to 16 show light emitting diodes constituting the conventional light emitting diode display. FIG. 2 is a plan view and a sectional view. 1... Light emitting diode, 2... Case, 3...
Filler, 4, 5... Light emitting diode element, 6, 7
......Metal stem, 8...Reflector, 9...Terminal,
10, 11... Gold wire, 12, 13, 21... Light emitting output, 14... Lens, 15, 20, 26... Angle, 18... White part, 22... Variable information board, 23... Driver, 24, 25...Visibility limit angle, 27...Emission angle plot line of the same light emission output.
Claims (1)
に左右配設し、透明樹脂でモールドし、発光面に
レンズを形成する発光ダイオードを１個又は複数
配設した発光ダイオード表示器において、前記発
光ダイオードの透明樹脂レンズの上部または上下
部を光の透過性および反射率の低いもので遮光し
、前記発光ダイオードの発光角を所定角度とした
ことを特徴とする発光ダイオード表示器。 (2) 上部または上下部の発光面のレンズを削除
することにより発光ダイオードの発光角を所定角
度としたことを特徴とする実用新案登録請求の範
囲第１項記載の発光ダイオード表示器。 (3) 発光に寄与する部分だけにレンズを形成す
ることにより発光ダイオードの発光角を所定角度
としたことを特徴とする実用新案登録請求の範囲
第１項記載の発光ダイオード表示器。 (4) 発光ダイオードを光の透過率の低いケース
に収納し、発光に寄与する部分以外を光の透過性
および反射率が低い耐水性の樹脂で充填すること
により発光ダイオードの発光角を所定角度とした
ことを特徴とする実用新案登録請求の範囲第１項
記載の発光ダイオード表示器。[Claims for Utility Model Registration] (1) A light-emitting device in which two or more light-emitting diode elements are arranged horizontally and on the left and right, molded with transparent resin, and one or more light-emitting diodes are arranged to form a lens on the light-emitting surface. A light-emitting diode in which the light-emitting diode is characterized in that the upper or upper and lower parts of the transparent resin lens of the light-emitting diode are shielded from light with materials having low light transmittance and low reflectance, and the light-emitting angle of the light-emitting diode is set to a predetermined angle. display. (2) The light-emitting diode display device according to claim 1, which is a utility model, wherein the light-emitting angle of the light-emitting diode is set to a predetermined angle by eliminating lenses on the upper or upper and lower light-emitting surfaces. (3) The light emitting diode display device according to claim 1, which is a utility model registration, characterized in that the light emitting angle of the light emitting diode is set to a predetermined angle by forming a lens only in a portion that contributes to light emission. (4) The light emitting angle of the light emitting diode can be adjusted to a predetermined angle by housing the light emitting diode in a case with low light transmittance and filling the parts other than those that contribute to light emission with a water-resistant resin that has low light transmittance and low reflectance. A light emitting diode display device according to claim 1 of the claimed utility model registration.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987143780U JPS6449987U (en) | 1987-09-22 | 1987-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987143780U JPS6449987U (en) | 1987-09-22 | 1987-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6449987U true JPS6449987U (en) | 1989-03-28 |
Family
ID=31410908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987143780U Pending JPS6449987U (en) | 1987-09-22 | 1987-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6449987U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH033762U (en) * | 1989-06-01 | 1991-01-16 | ||
| JPH03171782A (en) * | 1989-11-30 | 1991-07-25 | Iwasaki Electric Co Ltd | Light emitting diode |
| US7347603B2 (en) | 2002-11-05 | 2008-03-25 | Matsushita Electric Industrial Co., Ltd. | Light-emitting diode |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50103297A (en) * | 1974-01-11 | 1975-08-15 |
-
1987
- 1987-09-22 JP JP1987143780U patent/JPS6449987U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50103297A (en) * | 1974-01-11 | 1975-08-15 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH033762U (en) * | 1989-06-01 | 1991-01-16 | ||
| JPH03171782A (en) * | 1989-11-30 | 1991-07-25 | Iwasaki Electric Co Ltd | Light emitting diode |
| US7347603B2 (en) | 2002-11-05 | 2008-03-25 | Matsushita Electric Industrial Co., Ltd. | Light-emitting diode |
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