JPH01239976A - Light-emitting diode - Google Patents
Light-emitting diodeInfo
- Publication number
- JPH01239976A JPH01239976A JP63068471A JP6847188A JPH01239976A JP H01239976 A JPH01239976 A JP H01239976A JP 63068471 A JP63068471 A JP 63068471A JP 6847188 A JP6847188 A JP 6847188A JP H01239976 A JPH01239976 A JP H01239976A
- Authority
- JP
- Japan
- Prior art keywords
- lens
- resin
- shaped
- light
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 5
- 239000011347 resin Substances 0.000 abstract description 25
- 229920005989 resin Polymers 0.000 abstract description 25
- 239000008188 pellet Substances 0.000 abstract description 9
- 238000000149 argon plasma sintering Methods 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005337 ground glass Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Landscapes
- Led Device Packages (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は発光ダイオードに関するものである。[Detailed description of the invention] [Industrial application field] The present invention relates to light emitting diodes.
従来の発光ダイオードは、第４図に示す様にリードフレ
ーム上に発光ダイオードペレットをマウント、ボンディ
ングし、その回りを樹脂にて被う構造をとり、樹脂部の
形状はその用途、目的に応じて、発光出力重視の場合に
は第４図（１）の様にレンズ状に装飾性２表示性を重視
する場合には第４図（２）の様に非レンズ状、ないしは
平坦状に成形されていた。Conventional light-emitting diodes have a structure in which a light-emitting diode pellet is mounted and bonded onto a lead frame, and then covered with resin, as shown in Figure 4.The shape of the resin part is determined according to its use and purpose. If emphasis is placed on light emitting output, it is molded into a lens shape as shown in Figure 4 (1).2 When emphasis is placed on display performance, it is molded into a non-lens shape or flat shape as shown in Figure 4 (2). was.
上述した様に、従来の発光ダイオードは樹脂部の形状に
より発光出力・指向特性など発光状態が決まるため、セ
ンサの光源などとして用いられる赤外発光ダイオードや
背面照光用の可視発光ダイオードの様に高発光出力を必
要とするものの場合は樹脂部をレンズ状に成形しなけれ
ばならなかった。また、装飾用の可視発光ダイオードの
場合は、その表示性や、広い視野角を必要とすることか
ら、非レンズ状、ないしは平坦状に成形しなければなら
なかった。従って、例えばリモート・コントロール（リ
モコン）送信機の様に高発光出力を要し、しかも、リモ
コン送信機の装飾性を重んじる場合、レンズ状形状の赤
外発光ダイオードの他に、装飾用の樹脂製フィルムをリ
モコン送信機発光部面面に取り付ける必要があった。ま
た、駅構内といった比較的間るい環境で使用される発光
タイオード表示器の様に、広い視野角で、しかも充分な
明るさを必要とする場合にはレンズ状形状の可視発光ダ
イオードの前面に光散乱性の樹脂製フィルムを取り付け
ねばならなかった。As mentioned above, the shape of the resin part of conventional light emitting diodes determines the light emitting state, such as the light output and directional characteristics. In the case of devices requiring light emitting output, the resin part had to be molded into a lens shape. In addition, in the case of decorative visible light emitting diodes, because of their display performance and the need for a wide viewing angle, they had to be formed into a non-lens shape or a flat shape. Therefore, for example, when a remote control transmitter requires high luminous output and the decorativeness of the remote control transmitter is important, in addition to lens-shaped infrared light emitting diodes, decorative resin-made It was necessary to attach the film to the light emitting part of the remote control transmitter. In addition, when a wide viewing angle and sufficient brightness are required, such as in light-emitting diode indicators used in relatively dim environments such as train stations, light is placed in front of a lens-shaped visible light-emitting diode. A scattering resin film had to be installed.
本発明による発光ダイオードはレンズ状部の前面、もし
くは上面にレンズ状部と同一の素材で一体に成形された
非レンズ状部または平坦部を設けるという手段を有して
いる。The light emitting diode according to the present invention has a means of providing a non-lens-shaped part or a flat part integrally formed of the same material as the lens-shaped part on the front surface or upper surface of the lens-shaped part.
以下に、第１図を用いて本発明の詳細な説明する
第１図は本発明の一実施例である樹脂成形型赤外発光ダ
イオードの断面図で、カソード側リードフレーム１上に
赤外発光ダイオードペレット２をマウントし、ボンディ
ング線３によって７ノード側リードフレーム４と電気的
に接続され、赤外光のみを透過し、可視光成分をカット
するフィルタ効果を有する樹脂５にて成形されている。The present invention will be explained in detail below using FIG. 1. FIG. 1 is a cross-sectional view of a resin molded infrared light emitting diode which is an embodiment of the present invention. A diode pellet 2 is mounted, electrically connected to the 7 node side lead frame 4 by a bonding wire 3, and molded with a resin 5 that has a filter effect that transmits only infrared light and cuts visible light components. .
樹脂部は更にレンズ状部６と平坦部７から構成され、そ
れらは一体に成形されている。更にレンズ状部６と平坦
部７との間には樹脂未完てん部８が存在する。The resin part further includes a lens-shaped part 6 and a flat part 7, which are integrally molded. Further, an unfinished resin portion 8 exists between the lens-shaped portion 6 and the flat portion 7.
第３図は、本発明の実施例２である可視発光ダイオード
の断面図である。本実施例ではレンズ状部６、及び平坦
部７が可視光透過性樹脂１０にて一体に成形されている
。また、平坦部の表面はすりカラス状に加され、光散乱
面１１となっている。この実施例では可視発光ダイオー
ドベレット９からの光はレンズ状部にて効率良く前面に
集光され、樹脂未完てん部を通り、平坦部へ届き、光散
乱面で散乱光となって外部へ取り出される。これにより
、従来、レンズ状形状可視発光ダイオードの発光部前面
に光散乱性樹脂フィルムを装着していたのと同等の広い
視野角と高い光度とを可視発光ダイオード単体で得るこ
とができる。FIG. 3 is a cross-sectional view of a visible light emitting diode according to a second embodiment of the present invention. In this embodiment, the lens-shaped portion 6 and the flat portion 7 are integrally molded from a visible light-transmitting resin 10. Further, the surface of the flat portion is shaped like a ground glass to form a light scattering surface 11. In this embodiment, the light from the visible light emitting diode pellet 9 is efficiently focused on the front surface by the lens-shaped part, passes through the unfinished resin part, reaches the flat part, becomes scattered light on the light scattering surface, and is taken out to the outside. It will be done. As a result, it is possible to obtain a wide viewing angle and high luminous intensity equivalent to the conventional method of attaching a light-scattering resin film to the front surface of the light-emitting part of a lens-shaped visible light-emitting diode with a single visible light-emitting diode.
本発明によると、レンズ状部とその前面に平坦部を有し
、しかも、その間に樹脂未完てん部が存在するといった
構造から、赤外発光ダイオードペレットからの光はレン
ズ状部にて、前面に効率良く集光され、樹脂未完てん部
を通り、平坦部にてほとんど影響を受けることなく外部
に取り出される。この際の赤外発光ダイオードペレット
からの光の外部へ取り出される効率は、従来の構成であ
るレンズ状形状赤外発光ダイオードの前面に平坦状樹脂
フィルムを取り付けた場合と、理論上、同等と見なせる
。また、赤外光透渦形可視光カット性樹脂の採用により
、内部構造は外部から見ることはできず、しかも、平坦
部をこの赤外発光ダイオードが搭載されるセット、例え
ば、リモコン送信機のデザインに合わせることができる
ので、特に樹脂フィルムなどによるカバーといった外付
部品を使用せずに赤外発光ダイオードのみでセットの発
光部を装飾性良く構成することが可能となる。更に、樹
脂未完てん部に成形に用いた樹脂とは別の光透過性素材
を充てんすれば、樹脂部と充てん素材との相対屈折率を
調節することにより、外観上同一形状でありながら、指
向特性や、発光出力をある程度、任意に調節可能といっ
た効果が期待される。According to the present invention, since the structure has a lens-shaped part and a flat part on the front surface, and an unfinished resin part exists between them, light from the infrared light emitting diode pellet is transmitted to the front surface at the lens-shaped part. The light is efficiently focused, passes through the unfinished part of the resin, and is taken out to the outside without being affected by the flat part. In this case, the efficiency with which light is extracted from the infrared light emitting diode pellet to the outside can be considered theoretically equivalent to the conventional configuration in which a flat resin film is attached to the front of a lens-shaped infrared light emitting diode. . In addition, by using an infrared light-transmitting spiral type resin that cuts visible light, the internal structure cannot be seen from the outside, and the flat part can be used to attach to a set equipped with this infrared light emitting diode, such as a remote control transmitter. Since it can be matched to the design, it is possible to configure the light emitting part of the set with good decorativeness only with infrared light emitting diodes without using external parts such as a cover made of a resin film or the like. Furthermore, if the unfinished part of the resin is filled with a light-transmitting material different from the resin used for molding, by adjusting the relative refractive index between the resin part and the filling material, the same shape can be achieved, but the orientation can be changed. It is expected that the characteristics and light emission output can be adjusted arbitrarily to some extent.
第１図は本発明の一実施例である赤外発光ダイオードの
断面図、第２図はその斜視図、第３図は実施例２である
可視発光ダイオードの断面図、第４図は従来の発光ダイ
オードの断面図である。
１・・・・・・カソード側リードフレーム、２・・・・
・・赤外発光ダイオードペレット、３・・・・・・ポン
ディング線、４・・・・・・アノード側リードフレーム
、５・・・・・・赤外光透渦形可視光カット性樹脂、６
・・・・・・レンズ状部、７・・・・・・平坦部、８・
・・・・・樹脂未完てん部、９・・・・・・可視発光ダ
イオードベレット、１０・・・・・・可視光透過性樹脂
、１１・・・・・・光散乱面。
代理人 弁理士 内 原 晋
梁 ｆ 閏
矛ノ■
“４″″・・・ ４．。FIG. 1 is a sectional view of an infrared light emitting diode according to an embodiment of the present invention, FIG. 2 is a perspective view thereof, FIG. 3 is a sectional view of a visible light emitting diode according to a second embodiment of the present invention, and FIG. FIG. 2 is a cross-sectional view of a light emitting diode. 1... Cathode side lead frame, 2...
... Infrared light emitting diode pellet, 3 ... Bonding wire, 4 ... Anode side lead frame, 5 ... Infrared light transparent spiral type visible light cutting resin, 6
... Lenticular part, 7... Flat part, 8.
... Resin unfinished portion, 9 ... Visible light emitting diode pellet, 10 ... Visible light transmitting resin, 11 ... Light scattering surface. Agent Patent Attorney Shinryo Uchihara f. “4”... 4.
Claims (1)
に非レンズ状部、ないしは平坦部を有し、しかも、レン
ジ状部、及び非レンズ状部、ないしは平坦部が同一の素
材で一体に成形されたことを特徴とする発光ダイオード
。It has a lenticular part and a non-lenticular part or flat part on the front or upper surface of the lenticular part, and the range part and the non-lenticular part or flat part are integrally molded from the same material. A light emitting diode characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63068471A JPH01239976A (en) | 1988-03-22 | 1988-03-22 | Light-emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63068471A JPH01239976A (en) | 1988-03-22 | 1988-03-22 | Light-emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01239976A true JPH01239976A (en) | 1989-09-25 |
Family
ID=13374637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63068471A Pending JPH01239976A (en) | 1988-03-22 | 1988-03-22 | Light-emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01239976A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0438068U (en) * | 1990-07-27 | 1992-03-31 | ||
| WO1993001774A1 (en) * | 1991-07-15 | 1993-02-04 | Boeckmann Alfred | Hyperthermy device |
-
1988
- 1988-03-22 JP JP63068471A patent/JPH01239976A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0438068U (en) * | 1990-07-27 | 1992-03-31 | ||
| WO1993001774A1 (en) * | 1991-07-15 | 1993-02-04 | Boeckmann Alfred | Hyperthermy device |
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