JPH0983018A - Light emitting diode unit - Google Patents
Light emitting diode unitInfo
- Publication number
- JPH0983018A JPH0983018A JP7232972A JP23297295A JPH0983018A JP H0983018 A JPH0983018 A JP H0983018A JP 7232972 A JP7232972 A JP 7232972A JP 23297295 A JP23297295 A JP 23297295A JP H0983018 A JPH0983018 A JP H0983018A
- Authority
- JP
- Japan
- Prior art keywords
- lens
- emitting diode
- light emitting
- light
- diode unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 239000004840 adhesive resin Substances 0.000 claims description 2
- 229920006223 adhesive resin Polymers 0.000 claims description 2
- 230000004907 flux Effects 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920006015 heat resistant resin Polymers 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 241000283080 Proboscidea <mammal> Species 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、発光ダイオードユ
ニットに関し、特に、基板面等への面実装に好適な高輝
度の発光ダイオードユニットに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode unit, and more particularly to a high brightness light emitting diode unit suitable for surface mounting on a substrate surface or the like.
【0002】[0002]
【従来の技術】これまで一般に広く利用されている発光
ダイオード(LED)は公知のように半導体によって形
成されており、微小なサイズで材料によって決まる波長
の可視光を放射し、かつ、低電圧で動作するなどの特性
を有している。そこで、かかるLEDはフォトトランジ
スタなどの受光素子と組合せてフォトカプラとして使用
される外、各種電子機器等でもディスプレイ素子として
用いられ、また、光ファイバ通信の発光素子としても利
用されつつある。2. Description of the Related Art Light emitting diodes (LEDs), which have been widely used so far, are formed of semiconductors, as is well known, and emit a visible light of a wavelength determined by a material with a minute size and at a low voltage. It has characteristics such as operating. Therefore, such an LED is used as a photocoupler in combination with a light receiving element such as a phototransistor, is also used as a display element in various electronic devices, and is being used as a light emitting element for optical fiber communication.
【0003】[0003]
【発明が解決しようとする課題】ところで、これ迄の基
板実装型(サーフェスマウントタイプ)のLEDユニッ
トの場合、例えばヒューレットパッカード社(アメリ
カ)製のものなど実装し易いようにパッケージ型に形成
されたリードフレーム上にLEDを電気的に接合した
上、周囲を透明エポキシ樹脂等で一体成形してユニット
を作成するようにしているため、非拡散型とはいうもの
のLEDからの光が周囲部に散光し易く、光度ないし輝
度が高められないために日光など他の光の影響を受け、
表示素子として使用される場合は目視しにくく、また、
光学的検知素子に組込まれるような場合、誤検知の虞も
ある。By the way, in the case of the board mounting type (surface mounting type) LED unit up to now, for example, those manufactured by Hewlett-Packard Company (USA) are formed in a package type so as to be easily mounted. Since the LED is electrically bonded on the lead frame and the surroundings are integrally molded with transparent epoxy resin etc. to create a unit, the light from the LED, which is a non-diffusion type, is scattered to the surrounding area. It is easy to do, and because the brightness or brightness is not increased, it is affected by other light such as sunlight,
When used as a display element, it is difficult to see,
When incorporated in an optical detection element, there is a risk of false detection.
【0004】本発明は、上記従来の問題に着目し、第1
の目的は、集光レンズとLEDとの間の距離を用途に応
じて自在に設定可能な基板実装型に好適の発光ダイオー
ドユニットを提供することにある。The present invention focuses on the above-mentioned conventional problems, and
It is an object of the invention to provide a light emitting diode unit suitable for a substrate mounting type in which the distance between the condenser lens and the LED can be freely set according to the application.
【0005】更に本発明の第2の目的は、製造が容易で
しかも光を効率良く集約して一方向に出力させることの
できる基板実装型に好適な発光ダイオードユニットを提
供することにある。A second object of the present invention is to provide a light emitting diode unit suitable for a substrate mounting type which is easy to manufacture and can efficiently collect light and output it in one direction.
【0006】[0006]
【課題を解決するための手段】かかる目的を達成するた
めに、本発明の形態は、リードフレームに保持された発
光ダイオードと、前記リードフレームを保持するユニッ
トベースと、一端側が前記ユニットベースに接合される
環状のレンズ支持体と、該レンズ支持体の中央部に前記
発光ダイオードを囲むように周設され前記発光ダイオー
ドからの出射光を反射する反射壁部と、該反射壁部と前
記ユニットベースとによって囲まれた透光領域を塞ぐよ
うに前記レンズ支持体の他端側に配置される集光レンズ
と、該集光レンズを前記レンズ支持体に固定するレンズ
固定手段とを具えたことを特徴とするものである。In order to achieve the above object, according to an embodiment of the present invention, a light emitting diode held by a lead frame, a unit base holding the lead frame, and one end side of the unit base are joined to the unit base. A ring-shaped lens support, a reflection wall provided around the center of the lens support so as to surround the light-emitting diode and reflecting light emitted from the light-emitting diode, the reflection wall and the unit base. A condensing lens arranged on the other end side of the lens support so as to close a light-transmitting area surrounded by and a lens fixing means for fixing the condensing lens to the lens support. It is a feature.
【0007】本発明によれば、発光ダイオードからの出
力光が透光領域を透過する際、その一部は透光領域を囲
む反射壁により反射されて、ほぼ集光レンズ方向に向け
られると共に透光領域の有する屈折率の影響を受けて集
光レンズに入射する。かくして発光ダイオードからの出
射光を集束する形で外部に放散させることなく集光レン
ズに入射させ、この入射した光を集光レンズの有する特
性に応じて外部に出射させることができるもので、出射
光の平行光束化あるいは集束によりその光度ないし輝度
を高める効果が得られるのみならず、用途に応じて出射
光を集散自在に設定することができ、生産コストの低減
にも貢献できる。According to the present invention, when the output light from the light emitting diode passes through the light transmitting region, a part of the light is reflected by the reflection wall surrounding the light transmitting region, and is directed toward the condenser lens and transmitted. The light enters the condenser lens under the influence of the refractive index of the light region. In this way, the light emitted from the light emitting diode can be made to enter the condenser lens without being diffused to the outside, and the incident light can be emitted to the outside according to the characteristics of the condenser lens. Not only is the effect of increasing the luminous intensity or brightness obtained by collimating or converging the emitted light, but also the emitted light can be set to be freely diversified according to the application, which also contributes to the reduction of the production cost.
【0008】[0008]
【発明の実施の形態】以下に、図面に基づいて本発明の
実施例を詳細かつ具体的に説明する。Embodiments of the present invention will be described below in detail with reference to the drawings.
【0009】まず、本発明の第1の形態による実施例と
して、球レンズ付き発光ダイオード(LED)ユニット
の構成について図1を参照しつつ説明する。この図に示
すように、LEDユニット1は球レンズ2とLED3
と、その支持体4とで主要部が構成される。すなわち、
支持体4はLED3にバイアス電圧を供給するための導
電体によるリードフレーム5を含め耐熱樹脂例えばポリ
アミド系樹脂ないし液晶ポリマーによって一体成形され
るもので、6はLED3を取囲むようにしてその周囲に
設けられたコーン型の鏡面仕上げされた反射壁である。
なお、反射壁6には反射効率を高めるために金属膜など
によるメッキ処理が施されてもよいが、本実施例では支
持体4成形用の耐熱樹脂として不透明白色のものを用い
ることでその成形時に反射壁6の面を高い反射率を有す
るものとすることができる。First, as a first embodiment of the present invention, a structure of a light emitting diode (LED) unit with a spherical lens will be described with reference to FIG. As shown in this figure, the LED unit 1 includes a spherical lens 2 and an LED 3
And the supporting body 4 constitute a main part. That is,
The support 4 is integrally molded of a heat resistant resin such as a polyamide resin or a liquid crystal polymer including a lead frame 5 made of a conductor for supplying a bias voltage to the LED 3, and 6 is provided around the LED 3 so as to surround the LED 3. It is a cone-shaped reflective wall with a mirror finish.
The reflective wall 6 may be plated with a metal film or the like in order to enhance the reflection efficiency, but in the present embodiment, an opaque white resin is used as the heat-resistant resin for molding the support 4 so that the molding is performed. At times, the surface of the reflective wall 6 can have a high reflectance.
【0010】以下では、支持体4のLED3周りに反射
壁6が形成される上半部分をリフレクタ部(レンズ支持
体)4Aと呼び、下半部分をユニットベースと呼ぶこと
とする。このほぼコーン型をなす反射壁6の周囲面は円
錐台状ないし回転放物面状等、要はLED3からの出射
光のできるだけ多くを球レンズ2に向けて反射させると
共に球レンズ2からの透過光が所望の配光特性が得られ
るように設定されればよい。なお、本実施例ではリフレ
クタ部の4Aの球レンズ2を受ける反射壁6の上縁周囲
部を球レンズ2の球面形状に合わせ、球レンズ2を受け
易くしたが、必ずしも上縁周囲部をそのような形状とし
なくともよく、要は球レンズ2の中心からLED3まで
の距離Rが所定の設定値となるように位置決めされる限
り、例えば前記上縁で球レンズ2を受けるようにしても
よい。In the following, the upper half of the support 4 on which the reflection wall 6 is formed around the LED 3 is referred to as a reflector portion (lens support) 4A, and the lower half is referred to as a unit base. The peripheral surface of the reflection wall 6 having a substantially cone shape is in the shape of a truncated cone or a paraboloid of revolution, that is, as much as possible of the light emitted from the LED 3 is reflected toward the spherical lens 2 and transmitted from the spherical lens 2. The light may be set so that the desired light distribution characteristic is obtained. In the present embodiment, the upper edge peripheral portion of the reflection wall 6 that receives the spherical lens 2 of 4A of the reflector portion is matched with the spherical shape of the spherical lens 2 to make it easier to receive the spherical lens 2. However, the upper edge peripheral portion is not necessarily the same. The shape does not have to be such a shape, and in short, as long as the distance R from the center of the spherical lens 2 to the LED 3 is positioned so as to be a predetermined set value, for example, the spherical lens 2 may be received at the upper edge. .
【0011】一方、球レンズ2はガラスないしはポリエ
ーテルサルフォン(英国ICI社製)あるいはアートン
(日本合成ゴム社製)等の耐熱性透光樹脂により所定の
半径rが得られるように形成される。更に図1におい
て、7は反射壁6によって囲繞されるLED3上部の透
光領域であり、本実施例では球レンズ2を所定の位置に
取付けるべく透光領域7に透光性の耐熱エポキシ樹脂を
所定量充填し、透光領域7に気泡が残らないようにして
球レンズ2をリフレクタ部4Aに接合した。なお、球レ
ンズ2が安定した状態でリフレクタ部4Aに接合される
限り、必らずしも透光領域7に透光性樹脂、例えばエポ
キシ樹脂を充填する必要はなく、透光領域7が透光可能
なように保たれる限り、単なる空気層であってもよい
し、マッチングオイルなどを充填してもよいことはいう
までもない。On the other hand, the spherical lens 2 is formed of glass or polyether sulfone (manufactured by ICI, UK) or Arton (manufactured by Japan Synthetic Rubber Co., Ltd.) or the like so as to obtain a predetermined radius r. . Further, in FIG. 1, reference numeral 7 denotes a light-transmitting region above the LED 3 surrounded by the reflecting wall 6. In this embodiment, a light-transmitting heat-resistant epoxy resin is attached to the light-transmitting region 7 in order to mount the ball lens 2 at a predetermined position. The spherical lens 2 was bonded to the reflector portion 4A so that a predetermined amount was filled and no bubbles remained in the light transmitting region 7. As long as the spherical lens 2 is bonded to the reflector portion 4A in a stable state, it is not always necessary to fill the translucent region 7 with a translucent resin, for example, an epoxy resin, and the translucent region 7 is transparent. It goes without saying that a mere air layer may be used or matching oil or the like may be filled as long as it is kept lightable.
【0012】以上のような構成になるレンズ付きLED
素子1では、LED3から球レンズ2の球心0までの距
離Rを球レンズ2の半径より大に保つと共に球レンズ2
の有する屈折率nR ,透光領域7内の物質の屈折率nC
と上記の距離Rおよび反射壁6の形状を適切に組合せる
ことで、球レンズ2を介して空中に放射されるLED3
からの光束をほぼ平行光束にしたり、あるいは集光させ
たり散光させることができ、用途に適したLED素子と
することができる。なお、反射壁6の形状としては、先
にも述べたように自在に設定可能であるが、例えば、反
射壁6の形状を図2に示すように円錐面状6A(左側)
あるいは回転放物面状6B(右側)とした時には、これ
らの反射壁6Aあるいは6Bを介してLED3からの反
射光を球レンズ2に導き、矢印で示すようにLED3と
球レンズ2の球心とを結ぶ光軸に沿って進行する光成分
が多くなり、この方向からの視野に対してLED3から
の出力光を強める効果が得られる。LED with lens having the above-mentioned structure
In the element 1, the distance R from the LED 3 to the spherical center 0 of the spherical lens 2 is kept larger than the radius of the spherical lens 2 and the spherical lens 2
Has a refractive index n R , and the refractive index n C of the substance in the transparent region 7
By appropriately combining the distance R and the shape of the reflection wall 6 with each other, the LED 3 radiated into the air through the spherical lens 2
It is possible to make the light flux from the light flux into a substantially parallel light flux, or to condense or diffuse the light flux, so that an LED element suitable for the application can be obtained. The shape of the reflection wall 6 can be set freely as described above. For example, the shape of the reflection wall 6 is a conical surface 6A (left side) as shown in FIG.
Alternatively, when the parabolic shape 6B (right side) is used, the reflected light from the LED 3 is guided to the spherical lens 2 through the reflection wall 6A or 6B, and the LED 3 and the spherical center of the spherical lens 2 are connected to each other as indicated by the arrow. The number of light components traveling along the optical axis connecting the two is increased, and the effect of strengthening the output light from the LED 3 can be obtained with respect to the visual field from this direction.
【0013】本実施例の特徴は、上述したように集散自
在にレンズ付きLEDユニット1の設計選択が可能であ
ることと共に球レンズ2が真球度の高い球体として製造
可能であることから、レンズ付きLEDユニット1の作
成工程において球レンズ2の位置決め取付を極めて容易
としたことにある。すなわち、取付けの際、球レンズ2
を自在な姿勢により反射壁6の開口端によって位置決め
されるため、その光軸を所定の方向に保持することがで
きる。The feature of the present embodiment is that, as described above, the design of the LED unit 1 with a lens can be freely selected and collected, and the spherical lens 2 can be manufactured as a sphere having a high sphericity. It is to make the positioning and attachment of the ball lens 2 extremely easy in the process of producing the attached LED unit 1. That is, when mounting the ball lens 2
Is positioned by the opening end of the reflection wall 6 in a free posture, so that its optical axis can be held in a predetermined direction.
【0014】続いて、本発明の第2の形態による実施例
を以下の図を参照しつつ説明する。Next, an embodiment according to the second mode of the present invention will be described with reference to the following drawings.
【0015】図3はその一実施例による構成を示す。こ
こで、12は本実施例による半球型の平凸レンズであ
る。この平凸レンズ12は例えばガラスないしポリエー
テルサルフォンあるいはアートン等の耐熱性透明樹脂に
より所定の半径rが得られるように形成されるもので、
本例の場合の平凸レンズ12は半球体より幾分大きい目
に形成されている。12Aはその平坦面であり、LED
3からの光は透光領域7を介してこの平坦面12Aから
平凸レンズ12に入射する。なお、この平凸レンズ12
は例えば透光領域7に充填される透光性のエポキシ樹脂
によりその平坦面12Aの外周縁部がリフレクタ部4A
の上面4Bに当接状態で接合されるもので、8はリフレ
クタ部4Aの上面周囲部あるいは四隅部の対象位置に設
けられているレンズ位置決め枠である。レンズ位置決め
枠8はリフレクタ部4Aを含む支持体4の樹脂による成
形時に一体成形されることが望ましく、レンズ位置決め
枠8の内側はレンズ12の形状に合わせて成形される。FIG. 3 shows a configuration according to the embodiment. Here, 12 is a hemispherical plano-convex lens according to the present embodiment. The plano-convex lens 12 is formed of a heat-resistant transparent resin such as glass or polyether sulfone or Arton so as to obtain a predetermined radius r.
In the case of this example, the plano-convex lens 12 is formed in a slightly larger eye than a hemisphere. 12A is the flat surface of the LED
The light from 3 enters the plano-convex lens 12 from this flat surface 12A via the transparent region 7. The plano-convex lens 12
Is made of, for example, a translucent epoxy resin filled in the translucent region 7 so that the outer peripheral edge portion of the flat surface 12A is the reflector portion 4A.
The lens positioning frame 8 is joined to the upper surface 4B of the above in a contact state, and 8 is provided at the target position of the peripheral portion or the four corners of the reflector portion 4A. It is desirable that the lens positioning frame 8 is integrally molded when the support 4 including the reflector portion 4A is molded with resin, and the inside of the lens positioning frame 8 is molded according to the shape of the lens 12.
【0016】図4は第2の形態による他の実施例で、本
例の場合はレンズ位置決め枠8をリフレクタ部上面4B
の四隅部対象位置に設けたこと以外は上記の実施例と変
わらない。本発明の第2の形態による実施例によれば、
レンズ球心0からLED3迄の距離Rを平凸レンズ12
の半径rに関係なく設定することが可能となる。なお、
この平凸レンズ12を必ずしも半球より大きくする必要
はなく、半球若しくは半球より薄目とした厚さのレンズ
とすることも可能であり、平凸レンズ12および透光領
域7に封入される部材の屈折率、反射壁6の形状等につ
いて設定時の選択の自由度を第1の形態の場合に比して
増すことができる。FIG. 4 shows another embodiment according to the second embodiment. In this embodiment, the lens positioning frame 8 is attached to the reflector upper surface 4B.
It is the same as the above embodiment except that it is provided at the target positions of the four corners. According to an embodiment according to the second aspect of the invention,
The distance R from the lens center 0 to the LED 3 is the plano-convex lens 12
Can be set regardless of the radius r of. In addition,
The plano-convex lens 12 does not necessarily have to be larger than the hemisphere, and can be a hemisphere or a lens having a thickness smaller than that of the hemisphere. The degree of freedom in selection of the shape of the reflection wall 6 and the like can be increased as compared with the case of the first embodiment.
【0017】図5は本発明の第2の形態による更に他の
実施例を示す。本例によるレンズ22は図5に示すよう
に、集光レンズとして機能するレンズ部22Aとレンズ
部22Aを支持体4のリフレクタ部上面4Bに位置決め
固定するためのフランジ部22Bとを一体とした形で耐
熱性透光樹脂により構成する。22Cはフランジ部22
Bの予め穿設した位置決め孔である。このような位置決
め孔22Cにリフレクタ部上面4Bから突設したピン部
4Cをレンズ12の接合固定時に嵌め合わすことで、正
確かつ、容易にレンズ22を支持体4に固定することが
できる。但し、かかる位置決めの孔22Cとピン部4C
との嵌合によらない位置決め手段であってもよい。な
お、図5の(C)に示す9はレンズ22の固定時に透光
領域7から溢出する接着樹脂を逃すための逃し溝であ
り、逃し溝9に溢出した樹脂の固化によりレンズ22の
レンズ台部22Bを一層強固確実に支持体4上に接合さ
せることが可能となる。FIG. 5 shows still another embodiment according to the second aspect of the present invention. As shown in FIG. 5, the lens 22 according to the present embodiment has a lens portion 22A functioning as a condenser lens and a flange portion 22B for fixing the lens portion 22A to the reflector portion upper surface 4B of the support body 4 in an integrated form. It is made of heat-resistant transparent resin. 22C is a flange portion 22
It is the positioning hole of B previously drilled. By fitting the pin portion 4C protruding from the reflector portion upper surface 4B into the positioning hole 22C when the lens 12 is bonded and fixed, the lens 22 can be accurately and easily fixed to the support body 4. However, the positioning hole 22C and the pin portion 4C
It may be a positioning means that does not depend on fitting with. Reference numeral 9 shown in FIG. 5C is a relief groove for releasing the adhesive resin overflowing from the light transmitting area 7 when the lens 22 is fixed, and the lens base of the lens 22 is solidified by the resin overflowing the escape groove 9. The portion 22B can be bonded to the support 4 more firmly and securely.
【0018】本実施例によれば、微小なレンズ22の形
状を成型金型により統一した同一形状にすることがで
き、しかもそのレンズ部22Aの形状を集光、散光に応
じて自在に設定することが可能となる。According to this embodiment, the shape of the minute lens 22 can be made uniform by a molding die, and the shape of the lens portion 22A can be freely set according to the light condensing and the light scattering. It becomes possible.
【0019】なお、以上に述べた実施例ではレンズを主
として集光のために設けるものとして説明してきたが、
LED素子の使用状態に応じて散光角度を限定するなど
光束に限られた範囲での方向性を持たせるように、レン
ズの種類とLEDとの間の相対位置および反射壁面の形
状を自在に設定することができるという各形態に共通の
利点が得られるものである。In the above-mentioned embodiments, the lens is mainly provided to collect light.
The relative position between the lens and the LED and the shape of the reflective wall surface are freely set so that the light flux has directivity within a limited range, such as limiting the angle of scattering according to the usage state of the LED element. That is, the common advantages of the respective configurations can be obtained.
【0020】[0020]
【発明の効果】以上説明してきたように、本発明によれ
ば、リードフレームに保持された発光ダイオードと、前
記リードフレームを保持するユニットベースと、一端側
が前記ユニットベースに接合される環状のレンズ支持体
と、該レンズ支持体の中央部に前記発光ダイオードを囲
むように周設され前記発光ダイオードからの出射光を反
射する反射壁部と、該反射壁部と前記ユニットベースと
によって囲まれた透光領域を塞ぐように前記レンズ支持
体の他端側に配置される集光レンズと、該集光レンズを
前記レンズ支持体に固定するレンズ固定手段とを具えた
ことで、光の集散にかかわる配光性を自在に設定して用
途向きに作成することが可能となり、特に安定した光軸
のまわりの集光性を高めることが可能となり、しかも組
立が容易で廉価に製造することができる。As described above, according to the present invention, a light emitting diode held by a lead frame, a unit base holding the lead frame, and an annular lens whose one end side is joined to the unit base. It is surrounded by a support body, a reflection wall portion that surrounds the light emitting diode in the center of the lens support body and reflects light emitted from the light emitting diode, and the reflection wall portion and the unit base. By providing a condenser lens arranged on the other end side of the lens support so as to block the light-transmitting region and a lens fixing means for fixing the condenser lens to the lens support, it is possible to condense light. It is possible to freely set the related light distribution and create it for the purpose of use, and it is possible to enhance the stable focusing property around the optical axis, and the assembly is easy and inexpensive. It is possible to elephants.
【図1】本発明の第1の形態による構成例を示す断面図
である。FIG. 1 is a sectional view showing a configuration example according to a first embodiment of the present invention.
【図2】本発明の第1の形態による光の屈折経路例を断
面によって示す説明図である。FIG. 2 is an explanatory view showing an example of a refraction path of light according to the first embodiment of the present invention by a cross section.
【図3】本発明の第2の形態による構成例を示す断面図
である。FIG. 3 is a sectional view showing a configuration example according to a second mode of the present invention.
【図4】本発明の第2の形態による他の構成例をレンズ
と支持体とに分離して示す斜視図である。FIG. 4 is a perspective view showing another configuration example in which a lens and a support are separated according to a second embodiment of the present invention.
【図5】本発明の第2の形態による更に他の構成例を上
面図(A)、側面図(B)および(A)のA−A線断面
図(C)によって示す説明図である。FIG. 5 is an explanatory view showing still another configuration example according to the second mode of the present invention by a top view (A), a side view (B) and a sectional view (C) taken along the line AA in (A).
0 球心 1 発光ダイオード(LED)ユニット 2 球レンズ 3 LED 4 支持体 4A リフレクタ部 4B 上面 4C ピン部 5 リードフレーム 6,6A,6B 反射壁 7 透光領域 8 レンズ位置決め枠 12 半球型の平凸レンズ 12A 平坦面(取付面) 22 (成形)レンズ 22A レンズ部 22B フランジ部 22C 位置決め孔 nR ,nC 屈折率0 ball center 1 light emitting diode (LED) unit 2 ball lens 3 LED 4 support 4A reflector part 4B upper surface 4C pin part 5 lead frame 6, 6A, 6B reflective wall 7 light transmissive area 8 lens positioning frame 12 hemispherical plano-convex lens 12A Flat surface (mounting surface) 22 (Molding) Lens 22A Lens part 22B Flange part 22C Positioning hole n R , n C Refractive index
Claims (10)
ードと、 前記リードフレームを保持するユニットベースと、 一端側が前記ユニットベースに接合される環状のレンズ
支持体と、 該レンズ支持体の中央部に前記発光ダイオードを囲むよ
うに周設され前記発光ダイオードからの出射光を反射す
る反射壁部と、 該反射壁部と前記ユニットベースとによって囲まれた透
光領域を塞ぐように前記レンズ支持体の他端側に配置さ
れる集光レンズと、 該集光レンズを前記レンズ支持体に固定するレンズ固定
手段とを具えたことを特徴とする発光ダイオードユニッ
ト。1. A light emitting diode held by a lead frame, a unit base holding the lead frame, an annular lens support having one end side joined to the unit base, and a central part of the lens support. A reflective wall portion surrounding the light emitting diode and configured to reflect light emitted from the light emitting diode; and a lens support member other than the lens support member so as to close a light transmissive region surrounded by the reflective wall portion and the unit base. A light emitting diode unit, comprising: a condenser lens disposed on an end side, and a lens fixing means for fixing the condenser lens to the lens support.
スと前記レンズ支持体とが一体成形されていることを特
徴とする請求項1に記載の発光ダイオードユニット。2. The light emitting diode unit according to claim 1, wherein the lead frame, the unit base, and the lens support are integrally molded.
充填される透光性接着樹脂であることを特徴とする請求
項1または2に記載の発光ダイオードユニット。3. The light emitting diode unit according to claim 1, wherein the lens fixing means is a translucent adhesive resin filled in the translucent region.
面を鏡面に仕上げた不透明白色樹脂にて形成されている
ことを特徴とする請求項1ないし3のいずれかの項に記
載の発光ダイオードユニット。4. The light emission according to claim 1, wherein the lens support is made of an opaque white resin in which a wall surface of the reflection wall portion is mirror-finished. Diode unit.
を特徴とする請求項1ないし4のいずれかの項に記載の
発光ダイオードユニット。5. The light emitting diode unit according to claim 1, wherein the condenser lens is a spherical lens.
とを特徴とする請求項1ないし4のいずれかの項に記載
の発光ダイオードユニット。6. The light emitting diode unit according to claim 1, wherein the condenser lens is a plano-convex lens.
大径となっていることを特徴とする請求項1ないし6の
いずれかの項に記載の発光ダイオードユニット。7. The light emitting diode unit according to claim 1, wherein the reflection wall portion has a larger diameter toward the condenser lens side.
ンズの位置決め手段をさらに具えたことを特徴とする請
求項1ないし7のいずれかの項に記載の発光ダイオード
ユニット。8. The light emitting diode unit according to claim 1, further comprising positioning means for positioning the condenser lens on the other end surface of the lens support.
成したことを特徴とする請求項6に記載の発光ダイオー
ドユニット。9. The light emitting diode unit according to claim 6, wherein a flange portion is formed on the outer periphery of the plano-convex lens.
率と、前記発光ダイオードから前記平凸レンズの平坦面
までの距離および前記透光領域の屈折率との組合せによ
り、前記平凸レンズからの出射光を集散自在に設定可能
とすることを特徴とする請求項6ないし9のいずれかの
項に記載の発光ダイオードユニット。10. The light emitted from the plano-convex lens is determined by a combination of the convex surface shape and refractive index of the plano-convex lens, the distance from the light emitting diode to the flat surface of the plano-convex lens, and the refractive index of the translucent region. The light emitting diode unit according to any one of claims 6 to 9, wherein the light emitting diode unit is set so as to be able to be collected and dispersed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7232972A JPH0983018A (en) | 1995-09-11 | 1995-09-11 | Light emitting diode unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7232972A JPH0983018A (en) | 1995-09-11 | 1995-09-11 | Light emitting diode unit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0983018A true JPH0983018A (en) | 1997-03-28 |
Family
ID=16947775
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7232972A Pending JPH0983018A (en) | 1995-09-11 | 1995-09-11 | Light emitting diode unit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0983018A (en) |
Cited By (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999031737A1 (en) | 1997-12-15 | 1999-06-24 | Osram Opto Semiconductors Gmbh & Co. Ohg | Surface-mounted optoelectronic component and method for producing same |
JP2002543594A (en) * | 1999-04-22 | 2002-12-17 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | LED light source with lens |
JP2005109289A (en) * | 2003-10-01 | 2005-04-21 | Nichia Chem Ind Ltd | Light-emitting device |
US6924514B2 (en) | 2002-02-19 | 2005-08-02 | Nichia Corporation | Light-emitting device and process for producing thereof |
WO2005027233A3 (en) * | 2003-09-09 | 2005-09-09 | Cree Inc | Solid metal block mounting substrates for semiconductor light emitting devices, and oxidizing methods for fabricating same |
WO2005119707A2 (en) * | 2004-06-04 | 2005-12-15 | Cree, Inc. | Power light emitting die package with reflecting lens and the method of making the same |
JP2005538550A (en) * | 2002-09-04 | 2005-12-15 | クリー インコーポレイテッド | Power surface mounted light emitting die package |
JP2006013127A (en) * | 2004-06-25 | 2006-01-12 | Sony Corp | Light source and display |
JP2006145924A (en) * | 2004-11-22 | 2006-06-08 | Nikon Corp | Optical module |
US7078734B2 (en) * | 2003-06-06 | 2006-07-18 | Stanley Electric Co., Ltd. | Optical semiconductor device |
JP2006196529A (en) * | 2005-01-11 | 2006-07-27 | Nichia Chem Ind Ltd | Light emitting device |
JP2006269778A (en) * | 2005-03-24 | 2006-10-05 | Nichia Chem Ind Ltd | Optical device |
JP2006313896A (en) * | 2005-05-02 | 2006-11-16 | Samsung Electro Mech Co Ltd | Light emitting element package |
WO2006134635A1 (en) * | 2005-06-14 | 2006-12-21 | Rohm Co., Ltd. | Light emitting device |
JP2007036133A (en) * | 2005-07-29 | 2007-02-08 | Stanley Electric Co Ltd | Surface mounted semiconductor device |
JP2007059618A (en) * | 2005-08-24 | 2007-03-08 | Matsushita Electric Works Ltd | Led light fixture |
WO2007036193A1 (en) * | 2005-09-30 | 2007-04-05 | Osram Opto Semiconductors Gmbh | Radiation-emitting element and method for producing a radiation-emitting element |
US7208725B2 (en) | 1998-11-25 | 2007-04-24 | Rohm And Haas Electronic Materials Llc | Optoelectronic component with encapsulant |
US7214116B2 (en) | 2001-10-09 | 2007-05-08 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light-emitting diode and method for its production |
JP2007116138A (en) * | 2005-09-22 | 2007-05-10 | Lexedis Lighting Gmbh | Light emitting device |
JP2007531317A (en) * | 2004-03-31 | 2007-11-01 | クリー インコーポレイテッド | Semiconductor light emitting device having light emitting conversion element and packaging method thereof |
JP2008502160A (en) * | 2004-06-04 | 2008-01-24 | クリー インコーポレイテッド | Power light emitting die package having a reflective lens and method of manufacturing |
EP1396891A3 (en) * | 2002-09-05 | 2008-05-07 | Nichia Corporation | Semiconductor device and optical device using the same |
JP2008124500A (en) * | 2005-07-25 | 2008-05-29 | Matsushita Electric Works Ltd | Light-emitting device |
US7427806B2 (en) | 2003-01-30 | 2008-09-23 | Oram Gmbh | Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component |
US7455461B2 (en) | 2000-05-12 | 2008-11-25 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for the production thereof |
US7775685B2 (en) | 2003-05-27 | 2010-08-17 | Cree, Inc. | Power surface mount light emitting die package |
JP2010182746A (en) * | 2009-02-03 | 2010-08-19 | Showa Denko Kk | Light-emitting device, and light-emitting module and electrical device including the light-emitting device |
JP2011507238A (en) * | 2007-12-14 | 2011-03-03 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Apparatus comprising at least one optoelectronic semiconductor element |
JP2011146523A (en) * | 2010-01-14 | 2011-07-28 | Panasonic Electric Works Co Ltd | Light emitting device |
KR20110109409A (en) * | 2010-03-31 | 2011-10-06 | 서울반도체 주식회사 | Led lens and light emitting device having the same |
JP2012134564A (en) * | 2004-09-10 | 2012-07-12 | Seoul Semiconductor Co Ltd | Light emitting element and manufacturing method of the same |
US8227821B2 (en) | 2004-09-22 | 2012-07-24 | Osram Opto Semiconductors Gmbh | Housing for an optoelectronic component, optoelectronic component and method for the production of an optoelectronic component |
JP2012532441A (en) * | 2009-07-03 | 2012-12-13 | ソウル セミコンダクター カンパニー リミテッド | Light emitting diode package |
WO2013084842A1 (en) * | 2011-12-06 | 2013-06-13 | Kato Nobukazu | Led package and production method for led package |
WO2014007240A1 (en) * | 2012-07-06 | 2014-01-09 | シャープ株式会社 | Light emitting apparatus and method for manufacturing light emitting apparatus |
JP2014011364A (en) * | 2012-06-29 | 2014-01-20 | Hoya Candeo Optronics株式会社 | Led module |
KR101386846B1 (en) * | 2003-10-22 | 2014-04-17 | 크리, 인코포레이티드 | Power surface mount light emitting die package |
US8834000B2 (en) | 2011-09-01 | 2014-09-16 | Samsung Display Co., Ltd. | Light-source unit, back-light unit having the same, and display device having the same |
US8975646B2 (en) | 2004-05-31 | 2015-03-10 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor component and housing base for such a component |
US9054279B2 (en) | 2007-01-11 | 2015-06-09 | Osram Opto Semiconductors Gmbh | Optoelectronic component disposed in a recess of a housing and electrical componenet disposed in the housing |
US9142734B2 (en) | 2003-02-26 | 2015-09-22 | Cree, Inc. | Composite white light source and method for fabricating |
USRE45796E1 (en) | 2004-12-23 | 2015-11-10 | Cree, Inc. | Light emitting diode arrays for direct backlighting of liquid crystal displays |
EP2856507A4 (en) * | 2012-05-29 | 2016-01-27 | Essence Solar Solutions Ltd | Frame holder for an optical element |
JP2016019001A (en) * | 2014-07-08 | 2016-02-01 | エルジー イノテック カンパニー リミテッド | Light emitting element package |
JP2016019000A (en) * | 2014-07-08 | 2016-02-01 | エルジー イノテック カンパニー リミテッド | Light emitting element package |
US9431589B2 (en) | 2007-12-14 | 2016-08-30 | Cree, Inc. | Textured encapsulant surface in LED packages |
WO2017061844A1 (en) * | 2015-10-08 | 2017-04-13 | 주식회사 세미콘라이트 | Semiconductor light-emitting device |
KR20170055459A (en) * | 2015-10-08 | 2017-05-19 | 주식회사 세미콘라이트 | Semiconductor light emitting device |
US9666772B2 (en) | 2003-04-30 | 2017-05-30 | Cree, Inc. | High powered light emitter packages with compact optics |
JP2018092964A (en) * | 2016-11-30 | 2018-06-14 | 日亜化学工業株式会社 | Package manufacturing method, package, and light-emitting device |
US10008648B2 (en) | 2015-10-08 | 2018-06-26 | Semicon Light Co., Ltd. | Semiconductor light emitting device |
US10615324B2 (en) | 2013-06-14 | 2020-04-07 | Cree Huizhou Solid State Lighting Company Limited | Tiny 6 pin side view surface mount LED |
EP2503216B1 (en) * | 2009-11-17 | 2021-04-14 | Enplas Corporation | Surface light-emitting unit and display device provided with the same |
-
1995
- 1995-09-11 JP JP7232972A patent/JPH0983018A/en active Pending
Cited By (88)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6946714B2 (en) | 1997-12-15 | 2005-09-20 | Osram Gmbh | Surface mounting optoelectronic component and method for producing same |
EP1042819B1 (en) * | 1997-12-15 | 2018-01-24 | OSRAM Opto Semiconductors GmbH | Surface-mounted optoelectronic component and method for producing same |
US7675132B2 (en) | 1997-12-15 | 2010-03-09 | Osram Gmbh | Surface mounting optoelectronic component and method for producing same |
WO1999031737A1 (en) | 1997-12-15 | 1999-06-24 | Osram Opto Semiconductors Gmbh & Co. Ohg | Surface-mounted optoelectronic component and method for producing same |
US7348550B2 (en) | 1998-11-25 | 2008-03-25 | Rohm And Haas Electronic Materials Llc | Optoelectronic component with front to side surface electrical conductor |
US7781727B2 (en) | 1998-11-25 | 2010-08-24 | Nuvotronics, Llc | Optoelectronic component comprising an encapsulant |
US7355166B2 (en) | 1998-11-25 | 2008-04-08 | Rohm And Haas Electronic Materials Llc | Optoelectronic component having electrical connection and formation method thereof |
US7208725B2 (en) | 1998-11-25 | 2007-04-24 | Rohm And Haas Electronic Materials Llc | Optoelectronic component with encapsulant |
US7594840B2 (en) | 1999-04-22 | 2009-09-29 | Osram Gmbh | Method of encapsulating LED light source with embedded lens component |
US7126273B2 (en) | 1999-04-22 | 2006-10-24 | Osram Gmbh | LED light source with lens |
JP2002543594A (en) * | 1999-04-22 | 2002-12-17 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | LED light source with lens |
US7455461B2 (en) | 2000-05-12 | 2008-11-25 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for the production thereof |
US7214116B2 (en) | 2001-10-09 | 2007-05-08 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light-emitting diode and method for its production |
US6924514B2 (en) | 2002-02-19 | 2005-08-02 | Nichia Corporation | Light-emitting device and process for producing thereof |
JP2011129948A (en) * | 2002-09-04 | 2011-06-30 | Cree Inc | Power surface mount light emitting die package |
JP2011129950A (en) * | 2002-09-04 | 2011-06-30 | Cree Inc | Power surface mount light emitting die package |
JP2011129947A (en) * | 2002-09-04 | 2011-06-30 | Cree Inc | Power surface mount light emitting die package |
JP4731906B2 (en) * | 2002-09-04 | 2011-07-27 | クリー インコーポレイテッド | Power surface mounted light emitting die package |
JP2011129945A (en) * | 2002-09-04 | 2011-06-30 | Cree Inc | Power surface mount light emitting die package |
JP2005538550A (en) * | 2002-09-04 | 2005-12-15 | クリー インコーポレイテッド | Power surface mounted light emitting die package |
JP2011129949A (en) * | 2002-09-04 | 2011-06-30 | Cree Inc | Power surface mount light emitting die package |
JP2011129946A (en) * | 2002-09-04 | 2011-06-30 | Cree Inc | Power surface mount light emitting die package |
JP2011139087A (en) * | 2002-09-04 | 2011-07-14 | Cree Inc | Power surface mount light emitting die package |
EP2273570A1 (en) * | 2002-09-05 | 2011-01-12 | Nichia Corporation | Semiconductor device |
EP1396891A3 (en) * | 2002-09-05 | 2008-05-07 | Nichia Corporation | Semiconductor device and optical device using the same |
US7427806B2 (en) | 2003-01-30 | 2008-09-23 | Oram Gmbh | Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component |
US9142734B2 (en) | 2003-02-26 | 2015-09-22 | Cree, Inc. | Composite white light source and method for fabricating |
US9666772B2 (en) | 2003-04-30 | 2017-05-30 | Cree, Inc. | High powered light emitter packages with compact optics |
US7775685B2 (en) | 2003-05-27 | 2010-08-17 | Cree, Inc. | Power surface mount light emitting die package |
US7078734B2 (en) * | 2003-06-06 | 2006-07-18 | Stanley Electric Co., Ltd. | Optical semiconductor device |
US7645643B2 (en) | 2003-06-06 | 2010-01-12 | Stanley Electric Co., Ltd. | Optical semiconductor device method |
US7183587B2 (en) | 2003-09-09 | 2007-02-27 | Cree, Inc. | Solid metal block mounting substrates for semiconductor light emitting devices |
WO2005027233A3 (en) * | 2003-09-09 | 2005-09-09 | Cree Inc | Solid metal block mounting substrates for semiconductor light emitting devices, and oxidizing methods for fabricating same |
JP2005109289A (en) * | 2003-10-01 | 2005-04-21 | Nichia Chem Ind Ltd | Light-emitting device |
KR101386846B1 (en) * | 2003-10-22 | 2014-04-17 | 크리, 인코포레이티드 | Power surface mount light emitting die package |
JP2007531317A (en) * | 2004-03-31 | 2007-11-01 | クリー インコーポレイテッド | Semiconductor light emitting device having light emitting conversion element and packaging method thereof |
US8039859B2 (en) | 2004-03-31 | 2011-10-18 | Cree, Inc. | Semiconductor light emitting devices including an optically transmissive element |
US8975646B2 (en) | 2004-05-31 | 2015-03-10 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor component and housing base for such a component |
EP2287928A2 (en) * | 2004-06-04 | 2011-02-23 | Cree, Inc. | Power light emitting die package with reflecting lens and the method of making the same |
WO2005119707A3 (en) * | 2004-06-04 | 2006-06-01 | Cree Inc | Power light emitting die package with reflecting lens and the method of making the same |
EP2075856A2 (en) * | 2004-06-04 | 2009-07-01 | Cree, Inc. | Power Light Emitting Die Package With Reflecting Lens And The Method Of Making The Same |
US7456499B2 (en) | 2004-06-04 | 2008-11-25 | Cree, Inc. | Power light emitting die package with reflecting lens and the method of making the same |
US8932886B2 (en) | 2004-06-04 | 2015-01-13 | Cree, Inc. | Power light emitting die package with reflecting lens and the method of making the same |
EP2287928A3 (en) * | 2004-06-04 | 2011-03-02 | Cree, Inc. | Power light emitting die package with reflecting lens and the method of making the same |
JP2008502160A (en) * | 2004-06-04 | 2008-01-24 | クリー インコーポレイテッド | Power light emitting die package having a reflective lens and method of manufacturing |
US8446004B2 (en) | 2004-06-04 | 2013-05-21 | Cree, Inc. | Power light emitting die package with reflecting lens and the method of making the same |
WO2005119707A2 (en) * | 2004-06-04 | 2005-12-15 | Cree, Inc. | Power light emitting die package with reflecting lens and the method of making the same |
EP2075856A3 (en) * | 2004-06-04 | 2009-07-08 | Cree, Inc. | Power Light Emitting Die Package With Reflecting Lens And The Method Of Making The Same |
JP2006013127A (en) * | 2004-06-25 | 2006-01-12 | Sony Corp | Light source and display |
JP2012134564A (en) * | 2004-09-10 | 2012-07-12 | Seoul Semiconductor Co Ltd | Light emitting element and manufacturing method of the same |
US8227821B2 (en) | 2004-09-22 | 2012-07-24 | Osram Opto Semiconductors Gmbh | Housing for an optoelectronic component, optoelectronic component and method for the production of an optoelectronic component |
JP2006145924A (en) * | 2004-11-22 | 2006-06-08 | Nikon Corp | Optical module |
USRE45796E1 (en) | 2004-12-23 | 2015-11-10 | Cree, Inc. | Light emitting diode arrays for direct backlighting of liquid crystal displays |
JP2006196529A (en) * | 2005-01-11 | 2006-07-27 | Nichia Chem Ind Ltd | Light emitting device |
JP2006269778A (en) * | 2005-03-24 | 2006-10-05 | Nichia Chem Ind Ltd | Optical device |
JP2006313896A (en) * | 2005-05-02 | 2006-11-16 | Samsung Electro Mech Co Ltd | Light emitting element package |
US8678619B2 (en) | 2005-06-14 | 2014-03-25 | Rohm Co., Ltd. | Light emitting device |
WO2006134635A1 (en) * | 2005-06-14 | 2006-12-21 | Rohm Co., Ltd. | Light emitting device |
JP2008124500A (en) * | 2005-07-25 | 2008-05-29 | Matsushita Electric Works Ltd | Light-emitting device |
JP2007036133A (en) * | 2005-07-29 | 2007-02-08 | Stanley Electric Co Ltd | Surface mounted semiconductor device |
JP4739851B2 (en) * | 2005-07-29 | 2011-08-03 | スタンレー電気株式会社 | Surface mount semiconductor device |
JP2007059618A (en) * | 2005-08-24 | 2007-03-08 | Matsushita Electric Works Ltd | Led light fixture |
JP4696780B2 (en) * | 2005-08-24 | 2011-06-08 | パナソニック電工株式会社 | LED lighting fixtures |
JP2007116138A (en) * | 2005-09-22 | 2007-05-10 | Lexedis Lighting Gmbh | Light emitting device |
WO2007036193A1 (en) * | 2005-09-30 | 2007-04-05 | Osram Opto Semiconductors Gmbh | Radiation-emitting element and method for producing a radiation-emitting element |
US9054279B2 (en) | 2007-01-11 | 2015-06-09 | Osram Opto Semiconductors Gmbh | Optoelectronic component disposed in a recess of a housing and electrical componenet disposed in the housing |
JP2011507238A (en) * | 2007-12-14 | 2011-03-03 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Apparatus comprising at least one optoelectronic semiconductor element |
US9431589B2 (en) | 2007-12-14 | 2016-08-30 | Cree, Inc. | Textured encapsulant surface in LED packages |
US8994047B2 (en) | 2007-12-14 | 2015-03-31 | Osram Opto Semiconductors Gmbh | Arrangement comprising at least one optoelectronics semiconductor component |
JP2010182746A (en) * | 2009-02-03 | 2010-08-19 | Showa Denko Kk | Light-emitting device, and light-emitting module and electrical device including the light-emitting device |
JP2012532441A (en) * | 2009-07-03 | 2012-12-13 | ソウル セミコンダクター カンパニー リミテッド | Light emitting diode package |
EP2503216B1 (en) * | 2009-11-17 | 2021-04-14 | Enplas Corporation | Surface light-emitting unit and display device provided with the same |
JP2011146523A (en) * | 2010-01-14 | 2011-07-28 | Panasonic Electric Works Co Ltd | Light emitting device |
KR20110109409A (en) * | 2010-03-31 | 2011-10-06 | 서울반도체 주식회사 | Led lens and light emitting device having the same |
US8834000B2 (en) | 2011-09-01 | 2014-09-16 | Samsung Display Co., Ltd. | Light-source unit, back-light unit having the same, and display device having the same |
WO2013084842A1 (en) * | 2011-12-06 | 2013-06-13 | Kato Nobukazu | Led package and production method for led package |
US9917224B2 (en) | 2012-05-29 | 2018-03-13 | Essence Solar Solutions Ltd. | Photovoltaic module assembly |
EP2856507A4 (en) * | 2012-05-29 | 2016-01-27 | Essence Solar Solutions Ltd | Frame holder for an optical element |
US9825194B2 (en) | 2012-05-29 | 2017-11-21 | Essence Solar Solutions Ltd. | Self aligning soldering |
JP2014011364A (en) * | 2012-06-29 | 2014-01-20 | Hoya Candeo Optronics株式会社 | Led module |
WO2014007240A1 (en) * | 2012-07-06 | 2014-01-09 | シャープ株式会社 | Light emitting apparatus and method for manufacturing light emitting apparatus |
US10615324B2 (en) | 2013-06-14 | 2020-04-07 | Cree Huizhou Solid State Lighting Company Limited | Tiny 6 pin side view surface mount LED |
JP2016019000A (en) * | 2014-07-08 | 2016-02-01 | エルジー イノテック カンパニー リミテッド | Light emitting element package |
JP2016019001A (en) * | 2014-07-08 | 2016-02-01 | エルジー イノテック カンパニー リミテッド | Light emitting element package |
KR20170055459A (en) * | 2015-10-08 | 2017-05-19 | 주식회사 세미콘라이트 | Semiconductor light emitting device |
WO2017061844A1 (en) * | 2015-10-08 | 2017-04-13 | 주식회사 세미콘라이트 | Semiconductor light-emitting device |
US10008648B2 (en) | 2015-10-08 | 2018-06-26 | Semicon Light Co., Ltd. | Semiconductor light emitting device |
JP2018092964A (en) * | 2016-11-30 | 2018-06-14 | 日亜化学工業株式会社 | Package manufacturing method, package, and light-emitting device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0983018A (en) | Light emitting diode unit | |
JP5150047B2 (en) | Lighting package | |
US7473937B2 (en) | Side-emission type LED package | |
CN1965417B (en) | Led spotlight having funnel-shaped lens | |
KR100616598B1 (en) | Light emitting diode lens and backlight module having the same | |
US7431480B2 (en) | Optical element, compound optical element, and illuminating apparatus | |
US8368093B2 (en) | LED unit | |
JP2006099117A5 (en) | ||
US20100165635A1 (en) | Led unit | |
JP2009510731A (en) | Lighting device | |
JP4976218B2 (en) | Light emitting unit | |
US8269243B2 (en) | LED unit | |
US20070114549A1 (en) | Light-emitting diode | |
KR20020067533A (en) | Optical device and apparatus comprising the optical device | |
JP2002094129A (en) | Optical device and apparatus using the same | |
US9465205B2 (en) | Optical lens and backlight module incorporating the same | |
JP6089107B2 (en) | Lighting device and wide light distribution lens | |
US7332747B2 (en) | Light-emitting diode for decoration | |
US20050135113A1 (en) | Optical projection device of a colored lighting module | |
JPH08222098A (en) | Proximity switch | |
US20090135605A1 (en) | Led unit | |
JP2004356512A (en) | Led lamp | |
KR20060115564A (en) | Illumination package | |
TWI441362B (en) | Lighting module and lighting device thereof | |
JP4330716B2 (en) | Floodlight device |