JPH0525256Y2 - - Google Patents
Info
- Publication number
- JPH0525256Y2 JPH0525256Y2 JP1989001017U JP101789U JPH0525256Y2 JP H0525256 Y2 JPH0525256 Y2 JP H0525256Y2 JP 1989001017 U JP1989001017 U JP 1989001017U JP 101789 U JP101789 U JP 101789U JP H0525256 Y2 JPH0525256 Y2 JP H0525256Y2
- Authority
- JP
- Japan
- Prior art keywords
- reflector
- lead frame
- led
- resin
- cup
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 23
- 229920005989 resin Polymers 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
【考案の詳細な説明】
＜産業上の利用分野＞
本考案は、反射器の底部にLEDチツプが配置
され、LEDチツプと反射面とが光透過性樹脂に
よりモールドされた構造のLED表示素子に関す
る。[Detailed description of the invention] <Industrial application field> The present invention relates to an LED display element having a structure in which an LED chip is placed at the bottom of a reflector, and the LED chip and the reflective surface are molded with a light-transmitting resin. .
＜従来の技術＞
第４図はこの種のLED表示素子の構造を示し
ている。図において、１０１は反射器、１０２は
LEDチツプ、１０３，１０４，１０５はリード
フレーム、１０６は透明樹脂、１０７は金線であ
る。<Prior Art> FIG. 4 shows the structure of this type of LED display element. In the figure, 101 is a reflector, 102 is a reflector, and 102 is a reflector.
LED chips, 103, 104, 105 are lead frames, 106 is transparent resin, and 107 is gold wire.
２個のLEDチツプ１０２がカツプ状の反射器
１０１の底面部に搭載されている。反射器１０１
は、LEDチツプ１０２の横方向の発光を図中上
方向へ反射し、上方向の輝度を高める役目をも
つ。反射器１０１は、リードフレーム１０４と一
体的に形成されている。LEDチツプ１０２、反
射器１０１を含むリードフレーム１０４、両側の
リードフレーム１０３，１０５、金線１０７は、
透明樹脂１０６によりモールドされている。透明
樹脂１０６は、その頭部が球面状であり、レンズ
としての機能を果たす。 Two LED chips 102 are mounted on the bottom of a cup-shaped reflector 101. Reflector 101
has the role of reflecting the lateral light emitted from the LED chip 102 upward in the figure and increasing the brightness in the upward direction. The reflector 101 is integrally formed with the lead frame 104. The LED chip 102, the lead frame 104 including the reflector 101, the lead frames 103 and 105 on both sides, and the gold wire 107 are as follows:
It is molded with transparent resin 106. The transparent resin 106 has a spherical head and functions as a lens.
反射器１０１はリードフレーム１０４の端部に
連続して形成されているが、このような反射器が
連続したリードフレームを作成する方法として、
従来、金属板をプレス加工により所望の形状に打
抜き、その先端部分を第５図に示すようにヘツダ
ー１０８で押圧することにより、第６図に示すよ
うなカツプ状に成形し、その後、カツプの内面に
銀メツキなどにより反射面を形成する。 The reflector 101 is formed continuously at the end of the lead frame 104, but as a method for creating a lead frame with continuous reflectors,
Conventionally, a metal plate is punched into a desired shape by press working, and the tip thereof is pressed with a header 108 as shown in FIG. 5 to form a cup shape as shown in FIG. A reflective surface is formed on the inner surface by silver plating.
＜考案が解決しようとする課題＞
しかしながら、上記方法においては下記のよう
な問題があつた。<Problems to be solved by the invention> However, the above method had the following problems.
一般にLED表示素子は小さく、しかもリード
フレームの形状が複雑であることから、金属板か
らプレス打抜き加工によつて所望の形状を得る場
合、板厚が厚くなると加工ができない。従来、加
工が可能な板厚は、0.5mm程度が限度であつた。 In general, LED display elements are small and the shape of the lead frame is complicated, so if a desired shape is obtained by press punching from a metal plate, the thicker the plate, the more difficult the process will be. Conventionally, the maximum thickness that could be processed was approximately 0.5 mm.
このようにリードフレームの板厚が薄いため、
その先端をヘツダー加工によつてカツプ状に成形
するのは容易ではなく、大きなカツプを成形する
ことができない。したがつて、カツプの底面部に
多くのLEDチツプを搭載することができず、
LED表示素子の輝度が低いという問題があつた。 Because the lead frame is thin like this,
It is not easy to form the tip into a cup shape by header processing, and it is not possible to form a large cup. Therefore, it is not possible to mount many LED chips on the bottom of the cup.
There was a problem that the brightness of the LED display element was low.
また、カツプの内面はLED発光の反射面とし
て作用するが、この反射面の広さ、深さあるいは
曲面率を適切に定めることにより、正面への光の
取り出し効率を高めることができる。しかし、大
きなカツプが得られないため、これらを任意に選
択することができないという問題があつた。 Furthermore, the inner surface of the cup acts as a reflective surface for LED light emission, and by appropriately determining the width, depth, or curvature of this reflective surface, the efficiency of light extraction to the front can be increased. However, since large cups cannot be obtained, there is a problem in that these cannot be arbitrarily selected.
本考案は上記事情に鑑みてなされたものであ
り、その目的は、任意の大きさ及び形状の反射器
をリードフレームと一体的に形成できるようにし
たLED表示素子を提供することである。 The present invention has been made in view of the above circumstances, and its purpose is to provide an LED display element in which a reflector of any size and shape can be integrally formed with a lead frame.
＜課題を解決するための手段＞
上記目的を達成するために、本考案は、リード
フレームと一体的である反射器の底面部にLED
チツプが搭載され、反射器とLEDチツプとが透
明樹脂によりモールドされた構造のLED表示素
子において、反射器が金属であるリードフレーム
の端部とアウトサート方式を用いた樹脂成形によ
り一体化された構造であることを特徴としてい
る。<Means for solving the problem> In order to achieve the above object, the present invention provides an LED on the bottom of the reflector that is integrated with the lead frame.
In an LED display element with a structure in which a chip is mounted and a reflector and LED chip are molded with transparent resin, the reflector is integrated with the end of a metal lead frame by resin molding using the outsert method. It is characterized by its structure.
＜作用＞
本考案においては、反射器は樹脂成形によつて
作成されたものであり、さらにその樹脂成形にお
いてアウトサート方式を用いて反射器がリードフ
レームと一体化されている。したがつて、リード
フレームの厚さ等によつて制限されることがな
く、反射器を大きくすることができる。<Function> In the present invention, the reflector is made by resin molding, and the reflector is integrated with the lead frame using an outsert method in the resin molding. Therefore, the size of the reflector can be increased without being limited by the thickness of the lead frame.
＜実施例＞
第１図は本実施例のLED表示素子の断面構造
を示している。図において、１は反射器、２，
３，４はリードフレーム、５はLEDチツプ、６
は金線、７は透明樹脂である。<Example> FIG. 1 shows a cross-sectional structure of an LED display element of this example. In the figure, 1 is a reflector, 2,
3 and 4 are lead frames, 5 is LED chips, 6
7 is gold wire, and 7 is transparent resin.
カツプ状の反射器１は、リードフレーム２と一
体化されている。この反射器１は、材質が樹脂で
あり、金型を用いたアウトサート方式により金属
であるリードフレーム２の端部と一体化して成形
されている。反射器１は、その内面が反射面を構
成している。 A cup-shaped reflector 1 is integrated with a lead frame 2. The reflector 1 is made of resin and is molded integrally with the end of a metal lead frame 2 by an outsert method using a mold. The inner surface of the reflector 1 constitutes a reflective surface.
複数個のLEDチツプ５は、リードフレーム２
の上端の平面２ａ上に搭載されている。この平面
２ａは、反射器１の底面を構成している。リード
フレーム２の両側には、ポストリードとしての役
割をもつリードフレーム３，４が配置されてい
る。金線６は、反射器１の切欠部１ａを通り、
LEDチツプ５とリードフレーム３，４とを電気
的に接続している。 A plurality of LED chips 5 are connected to a lead frame 2.
It is mounted on the flat surface 2a at the upper end of. This plane 2a constitutes the bottom surface of the reflector 1. Lead frames 3 and 4, which serve as post leads, are arranged on both sides of the lead frame 2. The gold wire 6 passes through the notch 1a of the reflector 1,
The LED chip 5 and lead frames 3 and 4 are electrically connected.
以上の反射器１、リードフレーム２，３，４、
LEDチツプ５並びに金線６は、透明樹脂７によ
りモールドされている。透明樹脂７の上面は球面
であり、この透明樹脂７はレンズの役割を果た
す。 The above reflector 1, lead frames 2, 3, 4,
The LED chip 5 and gold wire 6 are molded with transparent resin 7. The upper surface of the transparent resin 7 is a spherical surface, and this transparent resin 7 plays the role of a lens.
このLED表示素子は、反射器１の内面にて
LEDチツプ５からの横方向の光束を全反射し、
反射光を透明樹脂７の頭部へ集光させ、さらに、
透明樹脂７のレンズ作用によつてLED表示素子
主軸面での発光輝度を増加させている。 This LED display element is located on the inner surface of reflector 1.
Totally reflects the lateral luminous flux from the LED chip 5,
The reflected light is focused on the head of the transparent resin 7, and further,
The lens action of the transparent resin 7 increases the luminance of light emitted from the main axis plane of the LED display element.
第２図はリードフレーム２の構造を示してい
る。このリードフレーム２は、銅合金板からプレ
ス打抜き法により製造される段階までは従来と同
様である。しかし、その先端にカツプを形成する
のではなく、ヘツダー押圧により単純な平面２ａ
を形成するのみである。この場合、カツプ状に成
形する部分が平面部分に利用できるため、平面２
ａはかなり大きな面積のものが成形できる。 FIG. 2 shows the structure of the lead frame 2. This lead frame 2 is the same as the conventional one up to the stage where it is manufactured from a copper alloy plate by a press punching method. However, rather than forming a cup at the tip, a simple flat surface 2a is formed by pressing the header.
It only forms . In this case, since the part to be formed into a cup shape can be used as a flat part, the flat part 2
A can be molded with a fairly large area.
このリードフレーム２に反射器１を一体化する
場合、まず、リードフレーム２の平面２ａを含む
先端部を金型の樹脂成形されるカツプの底となる
位置に嵌め込む。その後、金型に樹脂を圧入する
と、カツプ状の反射器１が成形されると同時に、
反射器１の底がリードフレーム２の先端部にアウ
トサートし、リードフレーム２と反射器１との一
体化が完成する。 When integrating the reflector 1 into this lead frame 2, first, the tip end portion of the lead frame 2 including the flat surface 2a is fitted into a position that will become the bottom of a resin-molded cup in a mold. After that, when resin is press-fitted into the mold, the cup-shaped reflector 1 is formed and at the same time,
The bottom of the reflector 1 is outsert to the tip of the lead frame 2, and the integration of the lead frame 2 and the reflector 1 is completed.
反射器１は、以上のように樹脂成形によつて作
成される。したがつて、その大きさや形状は任意
のものが作成できる。リードフレーム２の平面２
ａの面積が大きく、且つ、反射器１が大きいと、
この反射器１の底面に多くのLEDチツプを配置
できることになる。また、反射面の広さ、深さあ
るいは曲面率等を任意に定めることもできる。反
射器１の樹脂材料としては、白色のものがその機
能上好ましく、また、LEDの発熱を考慮すると、
耐熱性をもつものが好ましい。 The reflector 1 is created by resin molding as described above. Therefore, any size or shape can be created. Plane 2 of lead frame 2
If the area of a is large and the reflector 1 is large,
Many LED chips can be placed on the bottom of this reflector 1. Furthermore, the width, depth, curvature, etc. of the reflective surface can be arbitrarily determined. As the resin material for the reflector 1, it is preferable to use a white material in terms of its function, and considering the heat generated by the LED,
Those having heat resistance are preferable.
第３図は他の実施例を示しており、ポストリー
ドとしての役目をもつリードフレーム１０，１１
が反射器８を貫通し、カツプの内部に突出してい
る。したがつて、このリードフレーム１０，１１
とLEDチツプ１２と接続する金線１３を通すた
めの切欠きを反射器に設ける必要がない。この場
合、反射器８は、３本のリードフレーム９，１
０，１１にアウトサートして樹脂成形される。 FIG. 3 shows another embodiment, in which lead frames 10 and 11 serve as post leads.
passes through the reflector 8 and projects into the interior of the cup. Therefore, these lead frames 10, 11
There is no need to provide a cutout in the reflector for passing the gold wire 13 connected to the LED chip 12. In this case, the reflector 8 consists of three lead frames 9, 1
Outsert to 0,11 and resin molded.
＜考案の効果＞
以上説明したように本考案においては、反射器
をアウトサート方式を用いた樹脂成形によりリー
ドフレームと一体化した構造であるので、反射器
をリードフレームの厚さとは無関係に大きくする
ことができる。したがつて、反射器の底面に多く
のLEDを配置することができ、LED表示素子の
輝度を高めることができる。また、任意の形状の
反射器を作成できるので、反射面の広さ、深さ、
曲面率を適切に定めることができる。さらに、反
射器が絶縁体であるため、ワイヤボンデイングの
際に金線が反射器に接触することを気にしないで
作業を行うことができ、作業の能率が向上する。<Effects of the invention> As explained above, in this invention, the reflector is integrated with the lead frame by resin molding using the outsert method, so the reflector can be made larger regardless of the thickness of the lead frame. can do. Therefore, many LEDs can be placed on the bottom of the reflector, and the brightness of the LED display element can be increased. In addition, reflectors of any shape can be created, so the width and depth of the reflective surface can be adjusted.
The curvature ratio can be determined appropriately. Furthermore, since the reflector is an insulator, wire bonding can be performed without worrying about the gold wire coming into contact with the reflector, improving work efficiency.
第１図と第３図は本考案実施例の断面構造を示
す図、第２図は本考案実施例のリードフレームの
構造を示す図、第４図は従来例の斜視構造を示す
図、第５図と第６図は従来例の製造方法を説明す
る図である。
１，８……反射器、２，３，４，９，１０，１
１……リードフレーム、６，１３……金線、７，
１４……透明樹脂。
1 and 3 are views showing the cross-sectional structure of the embodiment of the present invention, FIG. 2 is a view showing the structure of the lead frame of the embodiment of the invention, and FIG. 4 is a view showing the perspective structure of the conventional example. 5 and 6 are diagrams for explaining a conventional manufacturing method. 1, 8...Reflector, 2, 3, 4, 9, 10, 1
1... Lead frame, 6, 13... Gold wire, 7,
14...Transparent resin.
Claims (1)
にLEDチツプが搭載され、上記反射器とLEDチ
ツプとが透明樹脂によりモールドされた構造の
LED表示素子において、上記反射器が金属であ
るリードフレームの端部とアウトサート方式を用
いた樹脂成形により一体化された構造であること
を特徴とするLED表示素子。 The LED chip is mounted on the bottom of the reflector that is integrated with the lead frame, and the reflector and LED chip are molded with transparent resin.
An LED display element characterized in that the reflector is integrated with an end of a metal lead frame by resin molding using an outsert method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989001017U JPH0525256Y2 (en) | 1989-01-09 | 1989-01-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989001017U JPH0525256Y2 (en) | 1989-01-09 | 1989-01-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0292954U JPH0292954U (en) | 1990-07-24 |
| JPH0525256Y2 true JPH0525256Y2 (en) | 1993-06-25 |
Family
ID=31200537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989001017U Expired - Lifetime JPH0525256Y2 (en) | 1989-01-09 | 1989-01-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0525256Y2 (en) |
-
1989
- 1989-01-09 JP JP1989001017U patent/JPH0525256Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0292954U (en) | 1990-07-24 |
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