JP2951099B2 - Light emitting diode - Google Patents

Light emitting diode

Info

Publication number
JP2951099B2
JP2951099B2 JP6881992A JP6881992A JP2951099B2 JP 2951099 B2 JP2951099 B2 JP 2951099B2 JP 6881992 A JP6881992 A JP 6881992A JP 6881992 A JP6881992 A JP 6881992A JP 2951099 B2 JP2951099 B2 JP 2951099B2
Authority
JP
Japan
Prior art keywords
axis
light emitting
light
emitting diode
axis direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP6881992A
Other languages
Japanese (ja)
Other versions
JPH05275751A (en
Inventor
宏基 石長
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP6881992A priority Critical patent/JP2951099B2/en
Publication of JPH05275751A publication Critical patent/JPH05275751A/en
Application granted granted Critical
Publication of JP2951099B2 publication Critical patent/JP2951099B2/en
Anticipated expiration legal-status Critical
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Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Led Device Packages (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【産業上の利用分野】本発明は、発光素子の部分を、透
明の合成樹脂製のレンズ状モールド部にてパッケージし
て成る発光ダイオードに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode in which a light emitting element is packaged in a lens-shaped molded portion made of a transparent synthetic resin.

【０００２】[0002]

【従来の技術】従来、この種の発光ダイオードは、例え
ば、実開昭６０−５１２１号公報等に記載され、且つ、
図１０〜図１２に示すように、二本一対のリード端子
１，２のうち一方のリード端子１の先端部に、カップ部
３を設けて、このカップ部３内に発光素子４をダイボン
ディングし、この発光素子４と他方のリード端子２の先
端部との間を金属線５にてワイヤーボンディングしたの
ち、前記両リード端子１，２の先端の部分を、先端部に
レンズ７を備えた透明合成樹脂製のモールド部６にてパ
ッケージする構成にしている。2. Description of the Related Art Conventionally, a light emitting diode of this type has been disclosed in, for example, Japanese Utility Model Application Laid-Open No. Sho 60-5121, and
As shown in FIGS. 10 to 12, a cup 3 is provided at the tip of one of the two lead terminals 1 and 2, and the light emitting element 4 is die-bonded in the cup 3. Then, after the light emitting element 4 and the tip of the other lead terminal 2 were wire-bonded with a metal wire 5, the tips of the two lead terminals 1 and 2 were provided with a lens 7 at the tip. It is configured to be packaged in a transparent synthetic resin mold section 6.

【０００３】[0003]

【発明が解決しようとする課題】しかし、従来における
発光ダイオードは、モールド部６を、円形断面に形成す
ると共に、レンズ７の表面を球形に形成して、当該モー
ルド部６における軸線上に、前記発光素子４を位置する
ことにより、換言すると、発光素子４を、モールド部６
におけるレンズ７の光軸上に位置することにより、発光
素子４からの光を、レンズ７からモールド部６における
軸線に沿って発射するように構成しているため、図１３
に示すＸ軸を含む面における光の指向特性曲線Ａｘと、
図１４に示すＹ軸を含む面における光の指向特性曲線Ａ
ｙとが同じになることにより、Ｘ軸を含む面における光
の広がり角度と、Ｙ軸を含む面における光の広がり角度
とが同じになる。However, in the conventional light emitting diode, the mold 6 is formed in a circular cross section and the surface of the lens 7 is formed in a spherical shape. By positioning the light emitting element 4, in other words, the light emitting element 4 is
13 is located on the optical axis of the lens 7, the light from the light emitting element 4 is emitted from the lens 7 along the axis of the mold section 6.
A directivity characteristic curve Ax of light on a plane including the X axis shown in FIG.
Directivity characteristic curve A of light on a plane including the Y axis shown in FIG.
When y is the same, the light spread angle on the plane including the X axis is the same as the light spread angle on the plane including the Y axis.

【０００４】従って、この発光ダイオードの多数個を、
パネル基板に対して縦方向及び横方向に適宜ピッチの間
隔で並べて取付けることによって、その全体として文字
又は図形等を表示する光表示パネルを構成する場合に
は、各発光ダイオードにおいてＸ軸を含む面における光
の広がり角度とＹ軸を含む面における光の広がり角度と
が同じであることにより、各発光ダイオードにおける間
隔ピッチを、縦方向及び横方向のいずれの方向に対して
も狭くするようにしなければならず、パネル基板におけ
る単位面積当たりに使用する発光ダイオードの個数が多
くなるから、光表示パネルの価格が大幅にアップすると
共に、消費電力が増大すると言う問題があった。Accordingly, a large number of these light emitting diodes are
When an optical display panel that displays characters or figures as a whole by mounting the panel on a panel substrate at appropriate intervals in the vertical and horizontal directions is used, the surface including the X axis in each light emitting diode is used. Is the same as the light divergence angle in the plane including the Y axis, the interval pitch in each light emitting diode must be narrowed in both the vertical and horizontal directions. In addition, since the number of light emitting diodes used per unit area on the panel substrate increases, there has been a problem that the price of the optical display panel is significantly increased and the power consumption is increased.

【０００５】本発明は、Ｘ軸及びＹ軸のうちいずれか一
方の軸を含む面における光の広がり角度を大きくするこ
とによって、前記の問題を解消することを技術的課題と
するものである。An object of the present invention is to solve the above problem by increasing the spread angle of light on a plane including one of the X axis and the Y axis.

【０００６】[0006]

【課題を解決するための手段】この技術的課題を達成す
るため本発明は、「少なくとも二本のリード端子と、一
方のリード端子の先端にダイボンディングされると共に
他方のリード端子の先端との間をワイヤーボンディング
された発光素子と、前記両リード端子の先端の部分をパ
ッケージする合成樹脂製のレンズ状モールド部とから成
る発光ダイオードにおいて、前記モールド部における断
面を、互いに直交するＸ軸方向及びＹ軸方向のうち前記
各リード端子の整列方向であるＸ軸方向を短径とし、Ｙ
軸方向を長径とする楕円形に形成し、更に、このモール
ド部におけるレンズの表面を楕円球面に形成する。」と
言う構成にした。SUMMARY OF THE INVENTION To achieve this technical object, the present invention provides a method for manufacturing a semiconductor device, comprising the steps of: "forming at least two lead terminals with one end of the lead terminal and die-bonding the other end. In a light-emitting diode comprising a light-emitting element wire-bonded between the two and a lens-shaped molded part made of synthetic resin for packaging the tip portions of the two lead terminals, the cross-section in the molded part is defined by the X-axis direction orthogonal to each other and wherein among the Y-axis direction
The X-axis direction, which is the alignment direction of each lead terminal, is defined as the minor axis, and Y
The lens is formed in an elliptical shape whose major axis is in the axial direction, and the surface of the lens in this mold portion is formed in an elliptical spherical surface. ".

【０００７】[0007]

【作 用】このように、モールド部における断面を、
楕円形に形成し、このモールド部におけるレンズの表面
を、楕円球面に形成すると、レンズの表面における曲率
のうち一方の軸方向に沿っての曲率は、他方の軸方向に
沿っての曲率よりも大きくなることにより、前記一方の
軸を含む面における光の指向特性曲線は、他方の軸を含
む面における光の指向特性曲線よりも横に広がった形状
になるから、前記一方の軸を含む面における光の広がり
角度を大きくすることができるのである。[Operation] As described above, the cross section of the mold section is
If it is formed in an elliptical shape, and the surface of the lens in this mold portion is formed as an ellipsoidal spherical surface, the curvature along one axial direction among the curvatures on the lens surface is smaller than the curvature along the other axial direction. By increasing, the directional characteristic curve of light on the plane including the one axis has a shape wider than the directional characteristic curve of light on the plane including the other axis. It is possible to increase the angle of spread of light at the point.

【０００８】[0008]

【発明の効果】このように、本発明によると、Ｘ軸を含
む面における光の広がり角度及びＹ軸を含む面における
光の広がり角度のうち一方の広がり角度を大きくするこ
とができることにより、この発光ダイオードの複数個を
パネル基板に対して取付けることによって、その全体と
して文字又は図形等を表示する光表示パネルを構成する
場合、発光ダイオードの縦方向の間隔ピッチ及び横方向
の間隔ピッチのちいずれか一方の間隔ピッチを、一方の
軸を含むにおける光の広がり角度を大きくできる分だけ
広くすることができるから、光パネル基板における単位
面積当たりに使用する発光ダイオードの個数を少なくで
きて、光表示パネルの価格と消費電力とを低減できる効
果を有する。As described above, according to the present invention, one of the spread angle of the light on the plane including the X axis and the spread angle of the light on the plane including the Y axis can be increased. When a plurality of light emitting diodes are attached to a panel substrate to constitute an optical display panel that displays characters or graphics as a whole, one of the vertical pitch and the horizontal pitch of the light emitting diodes is used. Since one interval pitch can be increased as much as the light spread angle including one axis can be increased, the number of light emitting diodes used per unit area on the optical panel substrate can be reduced, and the light display panel can be reduced. This has the effect of reducing the price and power consumption of the device.

【０００９】[0009]

【実施例】以下、本発明の実施例を図面について説明す
る。Embodiments of the present invention will be described below with reference to the drawings.

【００１０】図１〜図３は、第１の実施例を示し、この
図において符号１０で示す発光ダイオードは、二本一対
のリード端子１１，１２のうち一方のリード端子１１の
先端部に、カップ部１３を設けて、このカップ部１３内
に発光素子１４をダイボンディングし、この発光素子１
４と他方のリード端子１２の先端部との間を金属線１５
にてワイヤーボンディングしたのち、前記両リード端子
１１，１２の先端の部分を、先端部にレンズ１７を備え
た透明合成樹脂製のモールド部１６にてパッケージした
構成になっている。FIGS. 1 to 3 show a first embodiment, in which a light-emitting diode indicated by reference numeral 10 is provided at the tip of one of the two lead terminals 11 and 12. A cup portion 13 is provided, and a light emitting element 14 is die-bonded in the cup portion 13 to form a light emitting element 1.
4 and the tip of the other lead terminal 12
After the wire bonding, the ends of the two lead terminals 11 and 12 are packaged in a transparent synthetic resin mold 16 having a lens 17 at the end.

【００１１】この発光ダイオード１０におけるモールド
部１６の断面を、例えば、図１に実線で示すように、当
該モールド部１６の中心を通って前記二本のリード端子
１１，１２の方向に延びるＸ軸方向を長径Ｄ1 とし、モ
ールド部１６の中心を通って前記Ｘ軸方向と直角に延び
るＹ軸方向を短径Ｄ2 とする楕円形に形成する一方、前
記モールド部１６におけるレンズ１７の表面を、前記と
同様に、Ｘ軸方向を長径としＹ軸方向を短径とする楕円
球形面に形成するのであるが、本発明においては、図１
に二点鎖線で示すように、前記モールド部１６における
断面を、互いに直交するＸ軸方向及びＹ軸方向のうち前
記各リード端子１１，１２の整列方向であるＸ軸方向を
短径Ｄ 2 とし、Ｙ軸方向を長径Ｄ 1 とする楕円形に形成
するのである。As shown by a solid line in FIG. 1 , for example, a cross section of the mold section 16 of the light emitting diode 10 is an X-axis extending in the direction of the two lead terminals 11 and 12 through the center of the mold section 16. the direction and major axis D 1, while forming a Y-axis direction through the center of the mold portion 16 extending at right angles to the X-axis direction ellipse to the minor axis D 2, the surface of the lens 17 in the mold portion 16 In the same manner as described above, it is formed on an elliptical spherical surface having a major axis in the X-axis direction and a minor axis in the Y-axis direction .
As shown by a two-dot chain line in FIG.
The cross section is the front of the X-axis direction and the Y-axis direction
The X-axis direction which is the alignment direction of the lead terminals 11 and 12 is
A minor diameter D 2, an elliptical shape in which the Y axis direction is the major axis D 1
You do it .

【００１２】このように構成すると、レンズ１７の表面
における曲率のうちＸ軸方向に沿っての曲率は大きく、
Ｙ軸方向に沿っての曲率は小さくなることにより、前記
Ｘ軸を含む面における光の指向特性曲線Ａｘは、図４に
示すようになる一方、Ｙ軸を含む面における光の指向特
性曲線Ａｙは、図５に示すようになる。With this configuration, the curvature along the X-axis direction among the curvatures on the surface of the lens 17 is large,
As the curvature along the Y-axis direction decreases, the light directivity characteristic curve Ax on the plane including the X axis becomes as shown in FIG. Is as shown in FIG.

【００１３】すなわち、Ｘ軸を含む面における光の指向
特性曲線Ａｘは、Ｙ軸を含む面における光の指向特性曲
線Ａｙよりも横に広がった形状になるから、前記Ｘ軸を
含む面における光の広がり角度を大きくすることができ
るのである。That is, the directional characteristic curve Ax of light on the plane including the X axis has a shape that is wider than the directional characteristic curve Ay of light on the plane including the Y axis. The spread angle of the can be increased.

【００１４】従って、この発光ダイオード１０の複数個
を、パネル基板に対して縦方向（Ｙ軸方向）及び横方向
（Ｘ軸方向）に沿って適宜ピッチの間隔で並べて取付け
ることによって、その全体として文字又は図形等を表示
する光表示パネルを構成する場合、各発光ダイオード１
０の横方向（Ｘ軸方向）の間隔ピッチを、当該Ｘ軸を含
むにおける光の広がり角度を大きくできる分だけ広くす
ることができるから、光パネル基板における単位面積当
たりに使用する発光ダイオードの個数を少なくできるの
である。Therefore, by mounting a plurality of the light emitting diodes 10 on the panel substrate at appropriate intervals along the vertical direction (Y-axis direction) and the horizontal direction (X-axis direction), the entirety of the light-emitting diodes 10 is obtained. When configuring an optical display panel for displaying characters or figures, each light emitting diode 1
Since the interval pitch in the horizontal direction (X-axis direction) of 0 can be increased as much as the spread angle of light including the X-axis can be increased, the number of light emitting diodes used per unit area in the optical panel substrate Can be reduced.

【００１５】図６〜図８は、第２の実施例を示すもので
ある。FIGS. 6 to 8 show a second embodiment.

【００１６】このものは、前記と同様に、二本のリード
端子１１ａ，１２ａと、一方のリード端子１１ａの先端
にダイボンディングされると共に他方のリード端子の先
端との間をワイヤーボンディングされた発光素子１３ａ
と、前記両リード端子１１ａ，１２ａの先端の部分をパ
ッケージする透明合成樹脂製のレンズ１７ａ付きモール
ド部１６ａとから成り、前記モールド部１６ａの断面
を、例えば、図６に実線で示すように、当該モールド部
１６ａの中心を通るＸ軸方向を長径Ｄ１とし、モールド
１６ａの中心を通って前記Ｘ軸方向と直角に延びるＹ軸
方向を短径Ｄ２とする楕円形に形成する一方、前記モー
ルド部１６ａにおけるレンズ１７ａの表面を、前記と同
様に、Ｘ軸方向を長径としＹ軸方向を短径とする楕円球
形面に形成した発光ダイオード１０ａにおいて、前記発
光素子１３ａを、モールド部１６ａにおける中心からＹ
軸方向に適宜寸法（ｅ）だけずらせた偏芯部位に配設す
ると言う構成にしたものである。As described above, similarly to the above, a light emitting device is provided in which two lead terminals 11a and 12a are die-bonded to the tip of one lead terminal 11a and wire-bonded to the tip of the other lead terminal. Element 13a
And a molded portion 16a with a lens 17a made of a transparent synthetic resin for packaging the leading end portions of the lead terminals 11a and 12a . A cross section of the molded portion 16a is, for example, as shown by a solid line in FIG. The mold part
The X-axis direction passing through the center of 16a is defined as the major axis D1, and the mold is formed.
While forming the Y-axis direction extending perpendicular to the X-axis direction ellipse to the minor axis D2 through the center of the 16a, the lens surface 17a of the mold portion 16a, similar to the above, the X-axis direction In the light-emitting diode 10a formed on an elliptical spherical surface having a long diameter and a short diameter in the Y-axis direction, the light-emitting element 13a is moved from the center of the mold portion 16a to the Y-axis.
It is configured to be disposed at an eccentric portion that is appropriately shifted in the axial direction by the dimension (e).

【００１７】この場合においても、本発明は、図６に二
点鎖線で示すように、前記モールド部１６ａにおける断
面を、互いに直交するＸ軸方向及びＹ軸方向のうち前記
各リード端子１１ａ，１２ａの整列方向であるＸ軸方向
を短径とし、Ｙ軸方向を長径とする楕円形に形成するの
である。In this case as well, the present invention is similar to FIG .
As indicated by the dashed line, the break in the mold portion 16a is performed.
The surface is formed in the X-axis direction and the Y-axis direction
X-axis direction which is the alignment direction of each lead terminal 11a, 12a
Is defined as an ellipse with the minor axis as the major axis and the Y axis as the major axis.
It is .

【００１８】このように、発光素子１３ａを、モールド
部１６ａにおける中心から適宜寸法（ｅ）だけずらせた
偏芯部位に配設することにより、発光源である発光素子
１３ａがレンズ１７ａにおける中心軸線からずれること
により、光の指向特性曲線Ａｙは、図９に示すように、
モールド部１５の軸線に対して適宜角度（θ）だけ傾斜
することになる。As described above, by disposing the light emitting element 13a at an eccentric portion which is appropriately displaced from the center of the mold portion 16a by the dimension (e), the light emitting element 13a, which is a light emitting source, is positioned from the center axis of the lens 17a . As a result, the directional characteristic curve Ay of the light is shifted as shown in FIG.
It will be appropriately inclined by an angle (θ) with respect to the axis of the mold portion 15.

【００１９】すなわち、発光素子１３ａからの光を、
Ｘ，Ｙ両軸方向のうち一方の軸方向については、この軸
に対して横方向に広がった状態にする一方、他方の軸方
向については、モールド部１６ａの軸線に対して適宜角
度に傾斜した状態にして発射することができるのであ
る。That is, the light from the light emitting element 13a is
In one of the X and Y axial directions, one of the axial directions is spread in the lateral direction with respect to this axis , while in the other axial direction, the axial direction of the mold portion 16a is appropriately adjusted. It can be fired at an angle.

【００２０】なお、発光素子１３ａを偏芯する方向は、
前記実線で示す実施例のように、Ｙ軸方向に偏芯するこ
とに代えて、Ｘ軸方向に偏芯したりするようにしたり、
或いは、Ｘ軸方向とＹ軸方向の両方について偏芯するよ
うに構成しても良いのである。The direction of eccentricity of the light emitting element 13a is as follows.
As in the embodiment shown by the solid line, instead of eccentricity in the Y-axis direction, or eccentricity in the X-axis direction,
Alternatively, it may be configured to be eccentric in both the X-axis direction and the Y-axis direction.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の第１実施例による発光ダイオードの平
面図である。FIG. 1 is a plan view of a light emitting diode according to a first embodiment of the present invention.

【図２】図１のII−II視断面図である。FIG. 2 is a sectional view taken along line II-II of FIG.

【図３】図１のIII −III 視断面図である。FIG. 3 is a sectional view taken along line III-III of FIG.

【図４】第１実施例の発光ダイオードにおいて、Ｘ軸を
含む面における光の指向特性曲線を示す図である。FIG. 4 is a diagram showing a directional characteristic curve of light on a plane including the X axis in the light emitting diode of the first embodiment.

【図５】第１実施例の発光ダイオードにおいて、Ｙ軸を
含む面における光の指向特性曲線を示す図である。FIG. 5 is a diagram showing a directional characteristic curve of light on a plane including the Y axis in the light emitting diode of the first embodiment.

【図６】本発明の第２実施例による発光ダイオードの平
面図である。FIG. 6 is a plan view of a light emitting diode according to a second embodiment of the present invention.

【図７】図６のVII −VII 視断面図である。FIG. 7 is a sectional view taken along the line VII-VII in FIG. 6;

【図８】図６のVIII−VIII視断面図である。8 is a sectional view taken along line VIII-VIII of FIG.

【図９】第２実施例の発光ダイオードにおいて、Ｙ軸を
含む面における光の指向特性曲線を示す図である。FIG. 9 is a diagram showing a directional characteristic curve of light on a plane including the Y axis in the light emitting diode of the second embodiment.

【図１０】従来における発光ダイオードの平面図であ
る。FIG. 10 is a plan view of a conventional light emitting diode.

【図１１】図１０のXI−XI視断面図である。FIG. 11 is a sectional view taken along line XI-XI of FIG. 10;

【図１２】図１０のXII −XII 視断面図である。12 is a sectional view taken along the line XII-XII in FIG.

【図１３】従来の発光ダイオードにおいて、Ｘ軸を含む
面における光の指向特性曲線を示す図である。FIG. 13 is a diagram showing a directivity characteristic curve of light on a plane including the X axis in a conventional light emitting diode.

【図１４】従来の発光ダイオードにおいて、Ｙ軸を含む
面における光の指向特性曲線を示す図である。FIG. 14 is a diagram showing a directional characteristic curve of light on a plane including the Y axis in a conventional light emitting diode.

【符号の説明】[Explanation of symbols]

１０，１０ａ 発光ダイオード １１，１１ａ 一方のリード端子 １２，１２ａ 他方のリード端子 １４，１４ａ 発光素子 １６，１６ａ モールド部 １７，１７ａ レンズ 10, 10a Light emitting diode 11, 11a One lead terminal 12, 12a The other lead terminal 14, 14a Light emitting element 16, 16a Molded part 17, 17a Lens

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】少なくとも二本のリード端子と、一方のリ
ード端子の先端にダイボンディングされると共に他方の
リード端子の先端との間をワイヤーボンディングされた
発光素子と、前記両リード端子の先端の部分をパッケー
ジする合成樹脂製のレンズ状モールド部とから成る発光
ダイオードにおいて、前記モールド部における断面を、
互いに直交するＸ軸方向及びＹ軸方向のうち前記各リー
ド端子の整列方向であるＸ軸方向を短径とし、Ｙ軸方向
を長径とする楕円形に形成し、更に、このモールド部に
おけるレンズの表面を楕円球面に形成したことを特徴と
する発光ダイオード。A light emitting element which is die-bonded to at least two lead terminals and die-bonded to the tip of one of the lead terminals and wire-bonded to the tip of the other lead terminal; In a light-emitting diode comprising a synthetic resin lens-shaped mold part for packaging a part, a cross section in the mold part,
Each Li of X-axis and Y-axis directions perpendicular to each other
The X-axis direction, which is the alignment direction of the lead terminals, is taken as the minor axis, and the Y-axis direction
Is formed in an elliptical shape having a major axis, and the surface of the lens in the mold portion is formed in an elliptical spherical surface.
JP6881992A 1992-03-26 1992-03-26 Light emitting diode Expired - Lifetime JP2951099B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6881992A JP2951099B2 (en) 1992-03-26 1992-03-26 Light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6881992A JP2951099B2 (en) 1992-03-26 1992-03-26 Light emitting diode

Publications (2)

Publication Number Publication Date
JPH05275751A JPH05275751A (en) 1993-10-22
JP2951099B2 true JP2951099B2 (en) 1999-09-20

Family

ID=13384710

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6881992A Expired - Lifetime JP2951099B2 (en) 1992-03-26 1992-03-26 Light emitting diode

Country Status (1)

Country Link
JP (1) JP2951099B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3813509B2 (en) * 2001-12-28 2006-08-23 株式会社東芝 Lens-integrated light emitting device and aviation obstacle light
JP5384871B2 (en) * 2008-08-07 2014-01-08 ローム株式会社 LED module
JP5265395B2 (en) * 2009-01-23 2013-08-14 スタンレー電気株式会社 Image forming apparatus
JP2011204433A (en) * 2010-03-25 2011-10-13 Toshiba Lighting & Technology Corp Airplane warning light

Also Published As

Publication number Publication date
JPH05275751A (en) 1993-10-22

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