JPH0529665A - Led light source device - Google Patents

Abstract

PURPOSE:To offer LED light source device not requiring a resin case for photoreflection, being extremely simple to manufacture and inexpensive. CONSTITUTION:The LED light source device consists of a substrate 1 in which a plurality of LED chips 4 are die-bonded and wire-bonded on the top, two pieces of resin pants 2, 2, which are provided on this substrate 1 and risingly arranged in the longitudinal direction to the substrate while sandwiching LED chips 4 and adjacent to the LED chips 4 and a transparent resin part 5 including the LED chips 4 and being fillingly arranged between two resin parts 2, 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED light source device used for a contact type image sensor or the like.

[0002]

2. Description of the Related Art FIG. 3 is a cross-sectional view of a main part of a conventional LED light source device. The LED light source device used for the contact type image sensor or the like includes a resin case 5 having an opening on the bottom surface and a substrate 1 on which a plurality of LED chips 4 are die-bonded and wire-bonded in the in-plane longitudinal direction. A plurality of window holes 51 corresponding to the LED chips 4 are formed on the upper surface (dot plate) of the resin case 5. This resin case 5
It is fitted and bonded to the substrate 1, and the substrate 1 closes the bottom surface of the opening. Then, in the resin case 5, the transparent resin 6 is arranged in a filled state.

The light emitted from the LED chip 4 is radiated to the outside of the resin case 5 through the window 51 through the transparent resin 6, and is reflected by the surrounding wall 52 of the resin case 5 to be reflected by the window 5.
Irradiate outward from 1.

[0004]

In the above-described conventional LED light source device, a light reflection resin case is necessary in addition to the substrate on which the LED chip is die-bonded and wire-bonded. The work of bonding and assembling and is required. In addition to this assembling work, a completely different resin coating process (transparent resin filling process) is required. The plurality of LED chips are arranged in the longitudinal direction of the substrate, and the LED chips are wire-bonded to the substrate in the longitudinal direction. Therefore, it is necessary to increase the arrangement interval of the LED chips due to the wire bonding. That is, it is necessary to increase the accommodation space (distance between the surrounding walls) of the resin case, and there is a disadvantage that the reflection efficiency decreases when the accommodation space is increased.

An object of the present invention is to solve the above problems and to provide an inexpensive LED light source device that does not require a resin case for light reflection and can be manufactured extremely easily.

[0006]

In order to achieve this object, the LED light source device of the present invention has the following structure. The LED light source device is provided on a substrate on the upper surface of which a plurality of LED chips are die-bonded and wire-bonded, and is provided for the substrate. It is characterized by comprising two resin parts having high reflection efficiency.

In the LED light source device having such a structure, for example, a plurality of LED chips are arranged in the longitudinal direction at predetermined intervals in the center of the width of the substrate, and the LED chips are respectively die-bonded and wire-bonded to the pattern of the substrate. To do. Then, the two white resin portions are formed in a raised shape (semicircular cross section) in the longitudinal direction of the substrate while being close to both sides of the LED chip. The light emitted from the LED chip is emitted upward through the transparent resin portion, and the light reflected by the white resin portion is emitted upward through the transparent resin portion.

Thus, the resin case for light reflection other than the substrate is not required, and the white resin portion is formed close to the LED chip. Therefore, the light reflection distance is reduced and the light reflection efficiency is reduced. Is improved. Further, in manufacturing, the formation of the white resin portion and the formation of the transparent resin portion can be performed in the same resin coating step, the assembly step of the substrate and the resin case can be omitted as in the conventional case, and an inexpensive LED light source device is provided. obtain.

[0009]

1 is a perspective view showing a concrete embodiment of an LED light source device according to the present invention.

The LED light source device includes a substrate 1, white resin portions 2 and 2 formed on the substrate 1, and the white resin portions 2 and 2.
It is composed of a transparent resin portion 3 which is filled and arranged in a straddle shape. As shown in FIG. 2, a plurality of LEs are provided in the plane of the substrate 1.
The D chips 4 are arranged in the longitudinal direction of the substrate 1 with a predetermined space therebetween. That is, each LED chip 4 is die-bonded 41 to the pattern portion 11 of the substrate 1, and the upper surface of the LED chip 4 is wire-bonded 42 to the pattern portion 12 of the substrate 1.

The white resin portions 2 and 2 are composed of a transparent resin and a white dye, and have a high viscosity and are semi-liquid.
A resin having a fast solidification rate is used. The two white resin portions 2 and 2 are formed so as to approach both sides of the LED chip 4 and to be applied in a swelling shape (semi-elliptical cross section) in the longitudinal direction of the substrate 1 and to be solidified by heat treatment. In this state, the one white resin portion 2 completely covers and protects a part of the wire 42a of the wire bonding 42 and the pattern portion 12.

The transparent resin part 3 is applied between the two white resin parts 2 and 2 to completely cover the LED chip 4. The transparent resin portion 3 is also formed by heat treatment and solidification after coating the resin.

In the LED light source device having such a structure, when a current is applied to the LED chip 4, it emits light. LED
Since the top surface of the chip 4 is wire-bonded,
Although the light emitting area is narrowed, the lateral light emission is substantially large, the emitted light is reflected by the white resin portion 2, and the reflected light is refracted at the boundary surface between the transparent resin portion 3 and the outside air. You can focus on it. Therefore, by adjusting the application position of the white resin portion 2, it is possible to adjust the position of the focus in the left-right direction (left-right direction in FIG. 2) and also adjust the focal length.

Thus, the resin case for light reflection other than the substrate 1 is not required, and the white resin portions 2, 2 are formed close to the LED chip 4, so that the light reflection distance is reduced. Therefore, the light reflection efficiency is improved. Further, in manufacturing, the formation of the white resin portion 2 and the formation of the transparent resin portion 3 can be performed in the same resin application step, and the conventional assembly step of the substrate and the resin case can be omitted, and an inexpensive LED light source device can be provided. Can be provided.

Although the transparent resin portion 3 is formed between the white resin portions 2 and 2 of the LED light source device in the above embodiment, the transparent resin portion 3 may be omitted for practical use.

[0016]

As described above, according to the present invention, two resin portions having high reflection efficiency are sandwiched between the LED chip and the LED chip, and the LED chip is sandwiched between the two resin parts which are die-bonded and wire-bonded on the upper surface. Since they are provided close to each other, it is not necessary to use a conventional resin case for light reflection other than the substrate. In addition, since the white resin portion is formed close to the LED chip, the light reflection distance is reduced, so that the light reflection efficiency is improved. Further, in manufacturing, the formation of the white resin portion and the formation of the transparent resin portion can be performed in the same resin coating step, the assembly step of the substrate and the resin case can be omitted as in the conventional case, and an inexpensive LED light source device is provided. It has an excellent effect of achieving the object of the invention.

[Brief description of drawings]

FIG. 1 is a perspective view showing an LED light source device according to an embodiment.

FIG. 2 is a cross-sectional view showing an example LED light source device.

FIG. 3 is a cross-sectional view of an essential part showing a conventional LED light source device.

[Explanation of symbols]

1 substrate 2 White resin part 3 Transparent resin part 4 LED chip

Claims (2)

[Claims] 1. A substrate on the upper surface of which a plurality of LED chips are die-bonded and wire-bonded, and a substrate provided on the substrate, sandwiching the LED chips, and arranged close to the LED chips in a swelling shape in the longitudinal direction of the substrate. An LED light source device including two resin parts having high reflection efficiency. 2. The LED light source device according to claim 1, further comprising a transparent resin portion provided in a filling state between two resin portions including the LED chip.