JP2772166B2 - LED light source device - Google Patents
LED light source deviceInfo
- Publication number
- JP2772166B2 JP2772166B2 JP3186088A JP18608891A JP2772166B2 JP 2772166 B2 JP2772166 B2 JP 2772166B2 JP 3186088 A JP3186088 A JP 3186088A JP 18608891 A JP18608891 A JP 18608891A JP 2772166 B2 JP2772166 B2 JP 2772166B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- source device
- light source
- led
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
- G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
- Led Device Packages (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は、密着型イメージセン
サ等に使用されるＬＥＤ光源装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED light source device used for a contact type image sensor or the like.
【０００２】[0002]
【従来の技術】図３は、従来のＬＥＤ光源装置を示す要
部断面図である。この密着型イメージセンサ等に使用さ
れるＬＥＤ光源装置は、底面開口の樹脂ケース５と、面
内長手方向に複数のＬＥＤチップ４をダイボンディング
及びワイヤボンディングした基板１とから成る。樹脂ケ
ース５の上面（点板）には、ＬＥＤチップ４に対応する
複数の窓孔５１が開設してある。この樹脂ケース５は、
基板１に嵌合接着され、基板１により開口底面が閉成さ
れる。そして、樹脂ケース５内には、透明樹脂６が充填
状に配備される。2. Description of the Related Art FIG. 3 is a sectional view showing a main part of a conventional LED light source device. The LED light source device used for the contact type image sensor and the like includes a resin case 5 having a bottom opening and a substrate 1 on which a plurality of LED chips 4 are die-bonded and wire-bonded in a longitudinal direction in the plane. A plurality of window holes 51 corresponding to the LED chips 4 are formed on the upper surface (dot plate) of the resin case 5. This resin case 5
The bottom surface of the opening is closed by being fitted and adhered to the substrate 1. In the resin case 5, the transparent resin 6 is provided in a filled state.
【０００３】ＬＥＤチップ４から発光した光は、透明樹
脂６を介して窓孔５１より樹脂ケース５外方向へ照射す
ると共に、樹脂ケース５の囲み壁５２で反射して窓孔５
１より外方へ照射する。The light emitted from the LED chip 4 is radiated to the outside of the resin case 5 from the window hole 51 via the transparent resin 6 and is reflected by the surrounding wall 52 of the resin case 5.
Irradiate outside from 1.
【０００４】[0004]
【発明が解決しようとする課題】上記、従来のＬＥＤ光
源装置では、ＬＥＤチップをダイボンディング及びワイ
ヤボンディングした基板の他に、光反射用樹脂ケースが
必要である許かりでなく、基板と樹脂ケースとを接着組
立てする作業を要する。更に、この組み立て作業の他
に、全く別の樹脂塗布工程（透明樹脂充填工程）が必要
である。また、複数のＬＥＤチップは、それぞれ基板長
手方向へ配列され、且つ各ＬＥＤチップは基板に対し長
手方向へワイヤボンディングされている。従って、ワイ
ヤのボンディングの関係上、各ＬＥＤチップの配列間隔
を大きくとる必要がある。つまり、樹脂ケースの収容空
間（囲い壁間の距離）を大きくする必要があり、収容空
間を大きくすると反射効率が低下する等の不利があっ
た。In the above-mentioned conventional LED light source device, a resin case for light reflection is required in addition to the substrate on which the LED chip is die-bonded and wire-bonded. The work of bonding and assembling is required. Further, in addition to this assembling work, a completely different resin application step (transparent resin filling step) is required. The plurality of LED chips are arranged in the longitudinal direction of the substrate, and each LED chip is wire-bonded to the substrate in the longitudinal direction. Therefore, due to wire bonding, it is necessary to increase the spacing between the LED chips. That is, it is necessary to increase the accommodation space of the resin case (the distance between the enclosing walls), and if the accommodation space is enlarged, there is a disadvantage that the reflection efficiency is reduced.
【０００５】この発明では、以上のような課題を解消さ
せ、光反射用樹脂ケースが不要であり、極めて簡易に製
造できる安価なＬＥＤ光源装置を提供することを目的と
する。SUMMARY OF THE INVENTION It is an object of the present invention to provide an inexpensive LED light source device which solves the above-mentioned problems, does not require a light reflecting resin case, and can be manufactured extremely easily.
【０００６】[0006]
【課題を解決するための手段及び作用】この目的を達成
させるために、この発明のＬＥＤ光源装置では、次のよ
うな構成としている。ＬＥＤ光源装置は、上面に複数の
ＬＥＤチップをダイボンディング及びワイヤボンディン
グした基板と、この基板に対し設けられ、前記ＬＥＤチ
ップを挟み、且つＬＥＤチップに近接して基板長手方向
へ盛り上げ状に配備された反射効率の高い２本の白色樹
脂部とからなることを特徴としている。In order to achieve this object, the LED light source device of the present invention has the following configuration. The LED light source device is provided on the upper surface of a substrate on which a plurality of LED chips are die-bonded and wire-bonded, and is provided on the substrate, sandwiching the LED chips, and protruding in the longitudinal direction of the substrate in proximity to the LED chips. And two white resin parts having high reflection efficiency.
【０００７】このような構成を有するＬＥＤ光源装置で
は、例えば基板の幅中央に、複数のＬＥＤチップを所定
間隔を開いて長手方向へ配列し、基板のパターンにそれ
ぞれＬＥＤチップをダイボンディング及びワイヤボンデ
ィングする。そして、２本の白色の樹脂部をＬＥＤチッ
プの両側へ接近した状態で、基板長手方向へ盛り上げ状
（断面半円形状）に形成する。ＬＥＤチップより発光し
た光は、透明樹脂部を介して上方へ照射し、また白色樹
脂部で反射した光が透明樹脂部を介して上方へ照射す
る。In the LED light source device having such a configuration, for example, a plurality of LED chips are arranged in the longitudinal direction at predetermined intervals at the center of the width of the substrate, and the LED chips are die-bonded and wire-bonded to the pattern of the substrate, respectively. I do. Then, the two white resin portions are formed in a protruding shape (semicircular cross section) in the longitudinal direction of the substrate in a state of approaching both sides of the LED chip. The light emitted from the LED chip is irradiated upward through the transparent resin part, and the light reflected by the white resin part is irradiated upward through the transparent resin part.
【０００８】かくして、基板の他に光反射用の樹脂ケー
スが不要となる許かりでなく、ＬＥＤチップに対し接近
状に白色樹脂部を形成したから、光反射距離が小さくな
る分、光反射効率が向上する。更に、製造に際し、白色
樹脂部の形成と透明樹脂部の形成とが同じ樹脂塗布工程
で実行でき、従来のように基板と樹脂ケースとの組立て
工程が省略でき、安価なＬＥＤ光源装置を提供し得る。[0008] Thus, the resin case for light reflection other than the substrate is not required, and the white resin portion is formed close to the LED chip. Is improved. Further, at the time of manufacturing, the formation of the white resin portion and the formation of the transparent resin portion can be performed in the same resin application process, and the assembling process of the substrate and the resin case can be omitted as in the related art, thereby providing an inexpensive LED light source device. obtain.
【０００９】[0009]
【実施例】図１は、この発明に係るＬＥＤ光源装置の具
体的な一実施例を示す斜視図である。FIG. 1 is a perspective view showing a specific embodiment of the LED light source device according to the present invention.
【００１０】ＬＥＤ光源装置は、基板１と、基板１上に
形成された白色樹脂部２、２と、この白色樹脂部２、２
間に跨がり状に充填配備された透明樹脂部３とからな
る。図２で示すように、基板１の面内には、複数のＬＥ
Ｄチップ４が所定間隔を開いて、基板１長手方向へ配列
してある。つまり、各ＬＥＤチップ４は、基板１のパタ
ーン部１１にダイボンディング４１され、且つＬＥＤチ
ップ４の上面が基板１のパターン部１２にワイヤボンデ
ィング４２してある。The LED light source device comprises a substrate 1, white resin portions 2, 2 formed on the substrate 1, and white resin portions 2, 2,
And a transparent resin portion 3 which is filled and arranged in a straddling manner. As shown in FIG. 2, a plurality of LEs
D chips 4 are arranged at a predetermined interval in the longitudinal direction of the substrate 1. That is, each LED chip 4 is die-bonded 41 to the pattern portion 11 of the substrate 1, and the upper surface of the LED chip 4 is wire-bonded 42 to the pattern portion 12 of the substrate 1.
【００１１】前記白色樹脂部２、２は、透明樹脂に白色
の染料を合成したもので、粘度が高く半液状のもので、
且つ凝固速度が速い樹脂が使用される。２本の白色樹脂
部２、２は、上記ＬＥＤチップ４の両側に接近して、基
板１長手方向へ盛り上げ状（断面半楕円状）に塗布さ
れ、熱処理にて凝固させて形成される。この状態におい
て、一方の白色樹脂部２は、ワイヤボンデイング４２の
ワイヤ４２ａの一部、及びパターン部１２を完全に覆っ
ており、保護するようになっている。The white resin portions 2 and 2 are made of a transparent resin synthesized with a white dye, and have a high viscosity and are semi-liquid.
A resin having a high solidification rate is used. The two white resin parts 2, 2 are applied in a protruding shape (semi-elliptical cross section) in the longitudinal direction of the substrate 1 close to both sides of the LED chip 4, and are solidified by heat treatment. In this state, the one white resin portion 2 completely covers and protects a part of the wire 42 a of the wire bonding 42 and the pattern portion 12.
【００１２】そして、前記透明樹脂部３は、２本の白色
樹脂部２、２間に渡って塗布され、ＬＥＤチップ４を完
全に被覆する。この透明樹脂部３も、樹脂塗布後に加熱
処理して凝固させて形成される。The transparent resin portion 3 is applied between the two white resin portions 2 to completely cover the LED chip 4. The transparent resin portion 3 is also formed by heat treatment and solidification after application of the resin.
【００１３】このような構成を有するＬＥＤ光源装置で
は、ＬＥＤチップ４に電流を流すと、発光する。ＬＥＤ
チップ４は、上面をワイヤボンディングしているため、
発光面積が狭くなるが、実質的には横面の発光が大き
く、発した光は白色樹脂部２、で反射し、反射した光が
透明樹脂部３と外気の境面で屈折し、ＬＥＤ上方で焦点
ができる。従って、白色樹脂部２の塗布位置を調整する
ことで、焦点の左右方向（図２において左右方向）の位
置調整ができ、焦点距離の調整も可能となる。In the LED light source device having such a configuration, when an electric current is applied to the LED chip 4, light is emitted. LED
Since the upper surface of the chip 4 is wire-bonded,
Although the light emitting area is small, the light emission is substantially large on the lateral surface, the emitted light is reflected by the white resin portion 2, and the reflected light is refracted at the boundary surface between the transparent resin portion 3 and the outside air, so that the LED is located above the LED. Focus on Therefore, by adjusting the application position of the white resin portion 2, the position of the focal point in the horizontal direction (the horizontal direction in FIG. 2) can be adjusted, and the focal length can be adjusted.
【００１４】かくして、基板１の他に光反射用の樹脂ケ
ースが不要となる許かりでなく、ＬＥＤチップ４に対し
接近状に白色樹脂部２、２を形成したから、光反射距離
が小さくなる分、光反射効率が向上する。更に、製造に
際し、白色樹脂部２の形成と透明樹脂部３の形成とが同
じ樹脂塗布工程で実行でき、従来のように基板と樹脂ケ
ースとの組立て工程が省略でき、安価なＬＥＤ光源装置
を提供し得る。Thus, the resin case for light reflection other than the substrate 1 is not required, and the white resin portions 2 and 2 are formed close to the LED chip 4, so that the light reflection distance is reduced. Light reflection efficiency is improved. Further, in manufacturing, the formation of the white resin portion 2 and the formation of the transparent resin portion 3 can be performed in the same resin coating process, and the assembly process of the substrate and the resin case can be omitted as in the related art. Can provide.
【００１５】なお、上記実施例においては、ＬＥＤ光源
装置の白色樹脂部２、２間に透明樹脂部３を形成した
が、透明樹脂部３を省略したものでも実用できる。In the above embodiment, the transparent resin portion 3 is formed between the white resin portions 2 and 2 of the LED light source device. However, the transparent resin portion 3 may be omitted for practical use.
【００１６】[0016]
【発明の効果】この発明では、以上のように、上面に複
数のＬＥＤチップをダイボンディング及びワイヤボンデ
ィングした基板に対し、反射効率の高い２本の白色樹脂
部をＬＥＤチップを挟み、且つＬＥＤチップに近接して
設けることとしたから、基板の他に従来のような光反射
用の樹脂ケースが不要となる。また、ＬＥＤチップに対
し接近状に白色透明部を形成したから、光反射距離が小
さくなる分、光反射効率が向上する。更に、製造に際
し、白色透明部の形成と透明樹脂部の形成とが同じ樹脂
塗布工程で実行でき、従来のように基板と樹脂ケースと
の組立て工程が省略でき、安価なＬＥＤ光源装置を提供
し得る等、発明目的を達成した優れた効果を有する。As described above, according to the present invention, two white resin portions having high reflection efficiency are sandwiched between the LED chip and the substrate on which the plurality of LED chips are die-bonded and wire-bonded on the upper surface. In this case, there is no need for a conventional resin case for light reflection other than the substrate. Further, since the white transparent portion is formed close to the LED chip, the light reflection distance is reduced, and the light reflection efficiency is improved. Further, at the time of manufacturing, the formation of the white transparent portion and the formation of the transparent resin portion can be performed in the same resin application step, and the assembling step of the substrate and the resin case as in the related art can be omitted, thereby providing an inexpensive LED light source device. It has an excellent effect of achieving the object of the invention, such as obtaining.
【図１】実施例ＬＥＤ光源装置を示す斜視図である。FIG. 1 is a perspective view showing an embodiment LED light source device.
【図２】実施例ＬＥＤ光源装置を示す断面図である。FIG. 2 is a sectional view showing an LED light source device according to an embodiment.
【図３】従来のＬＥＤ光源装置を示す要部断面図であ
る。FIG. 3 is a cross-sectional view of a main part showing a conventional LED light source device.
１ 基板 ２ 白色樹脂部 ３ 透明樹脂部 ４ ＬＥＤチップ DESCRIPTION OF SYMBOLS 1 Substrate 2 White resin part 3 Transparent resin part 4 LED chip
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H01L 33/00──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 6 , DB name) H01L 33/00
Claims (2)
ング及びワイヤボンディングした基板と、この基板に対
し設けられ、前記ＬＥＤチップを挟み、且つＬＥＤチッ
プに近接して基板長手方向へ盛り上げ状に配備された反
射効率の高い２本の白色樹脂部とからなるＬＥＤ光源装
置。1. A substrate having a plurality of LED chips die-bonded and wire-bonded on an upper surface, and provided on the substrate, sandwiched between the LED chips, and protruded in the longitudinal direction of the substrate in proximity to the LED chips. LED light source device comprising two white resin parts having high reflection efficiency.
間に充填状に配備された透明樹脂部を備えた請求項１記
載のＬＥＤ光源装置。2. The LED light source device according to claim 1, further comprising a transparent resin portion including the LED chip and disposed between two white resin portions so as to be filled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3186088A JP2772166B2 (en) | 1991-07-25 | 1991-07-25 | LED light source device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3186088A JP2772166B2 (en) | 1991-07-25 | 1991-07-25 | LED light source device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0529665A JPH0529665A (en) | 1993-02-05 |
| JP2772166B2 true JP2772166B2 (en) | 1998-07-02 |
Family
ID=16182163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3186088A Expired - Fee Related JP2772166B2 (en) | 1991-07-25 | 1991-07-25 | LED light source device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2772166B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006066786A (en) * | 2004-08-30 | 2006-03-09 | Seiwa Electric Mfg Co Ltd | Light emitting diode |
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| WO2022179689A1 (en) * | 2021-02-25 | 2022-09-01 | Ams-Osram International Gmbh | Component having hybrid reflector and method for producing therof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2679132B2 (en) * | 1988-07-08 | 1997-11-19 | 岩崎電気株式会社 | LED linear light source |
-
1991
- 1991-07-25 JP JP3186088A patent/JP2772166B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006066786A (en) * | 2004-08-30 | 2006-03-09 | Seiwa Electric Mfg Co Ltd | Light emitting diode |
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| JPH0529665A (en) | 1993-02-05 |
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