JP2004087812A - Light emitting device - Google Patents

Light emitting device Download PDF

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Publication number
JP2004087812A
JP2004087812A JP2002247069A JP2002247069A JP2004087812A JP 2004087812 A JP2004087812 A JP 2004087812A JP 2002247069 A JP2002247069 A JP 2002247069A JP 2002247069 A JP2002247069 A JP 2002247069A JP 2004087812 A JP2004087812 A JP 2004087812A
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Prior art keywords
light emitting
resin
light
emitting chip
substrate
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Pending
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JP2002247069A
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Japanese (ja)
Inventor
Hisami Kawaguchi
Tatsuya Motoike
川口  久美
本池  達也
Original Assignee
Sanyo Electric Co Ltd
Tottori Sanyo Electric Co Ltd
三洋電機株式会社
鳥取三洋電機株式会社
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Abstract

PROBLEM TO BE SOLVED: To widen the directivity when allowing the light emitted from a light-emitting chip to be subjected to wavelength conversion for emitting.
SOLUTION: The light-emitting chip 2 is mounted onto one side of a flat substrate 1, a mold resin 6 where a wavelength conversion material is mixed is cured around the periphery of the light-emitting chip, and a translucent resin 8 is provided around the mold resin, thus allowing the light emitted from the light-emitting chip to be subjected to wavelength conversion by the wavelength conversion material.
COPYRIGHT: (C)2004,JPO

Description

【0001】 [0001]
【発明の属する技術分野】 BACKGROUND OF THE INVENTION
本発明は、発光チップの外側に波長変換材を設けて、例えば白色光を得るようにした発光体に関する。 The present invention is provided with a wavelength converting material on the outside of the light emitting chip, a light emitting body that example to obtain a white light.
【0002】 [0002]
【従来の技術】 BACKGROUND OF THE INVENTION
発光チップの外側に波長変換材を用いて発光波長を変換し、例えば白色や青色等の所望の発光色を得るようにしたものは特開平7−99345号公報や特開平10−56208号公報に代表される先行技術文献に開示されている。 Using the wavelength converting material on the outside of the light emitting chip to convert the emission wavelength, for example white or a desired Hei 7-99345 and JP 10-56208 Patent Publication that to obtain a luminescent color such as blue It disclosed in the prior art represented.
【0003】 [0003]
上述の先行技術文献は、リードフレームにカップを設け、このカップ内に発光チップを載置すると共に、発光チップ全体を発光波長を他の波長に変換する波長変換材を含有した樹脂により包囲しカップ内に充填したもので、発光チップから放出する発光をカップにより発光観測面側に反射させるものである。 Prior art documents described above, surrounds the cup provided on the lead frame, thereby placing the light-emitting chip in the cup, the resin containing the wavelength converting material for converting the entire light-emitting chip emission wavelength to another wavelength cup which was filled within, but to reflect the light emission observing surface side by the light emitting cups that emitted from the light emitting chip.
【0004】 [0004]
【発明が解決しようとする課題】 [Problems that the Invention is to Solve
前述の構成では、波長変換材によって発光チップを包囲するため、波長変換効率が良くなるものの波長を変換した後の発光の指向性が狭く用途が限定された。 In the above configuration, for enclosing the light emitting chip by the wavelength conversion member, the directivity of the emission after converting the wavelength of which wavelength conversion efficiency is improved are limited narrow applications.
【0005】 [0005]
又、カップ内に波長変換材を混入した樹脂を充填することから、樹脂領域が小さく波長変換材の混入量が少なくなり、この変換材を混入した樹脂の完成品としての混入量の変動割合が大きくなり、その結果、波長変換後の色調にバラツキを生じやすくなるという欠点がある。 Further, since the filling mixed resin wavelength conversion material in the cup, the less mixing amount of the resin region smaller wavelength conversion material, the fluctuation ratio of the mixing amount of the finished product of the resin mixed with the conversion material increased and, as a result, there is a disadvantage that tends to cause variations in color tone after wavelength conversion.
【0006】 [0006]
波長変換材の混入量が少ないと(微量)、量の変動割合が大きくなりやすい具体的な説明について、波長変換材を混入した樹脂はカップに充填するため、カップの容積はもともと小さく、このカップの中に入り込んだ樹脂内に存在する波長変換材の量も少なくなるものであり、この結果、変換後の波長が異なり色調にバラツキを生じる欠点がある。 A mixed amount of the wavelength conversion material is small (trace), the variation rate is large tends DETAILED DESCRIPTION amounts are mixed resin wavelength conversion material for filling the cup, the volume of the cup originally small, the cup are those also reduced the amount of wavelength converting material present in the resin that has entered into, as a result, there is a disadvantage occurring variations in color tone different wavelength after conversion.
【0007】 [0007]
即ち、カップ内に充填する樹脂内に混入させる波長変換材の量を十分に確保できない。 In other words, it can not be sufficiently secured amount of wavelength converting material to be mixed into the resin to be filled into the cup.
【0008】 [0008]
本発明は、波長変換後の発光の指向性を広くし、且つ色調にバラツキがないようにしたものである。 The present invention broadly the directivity of light emission after the wavelength conversion is and that as there is no variation in color tone.
【0009】 [0009]
【課題を解決するための手段】 In order to solve the problems]
本発明は、平板状の基板と、この基板の一側面に取り付けた発光チップと、この発光チップの周囲に硬化させ波長変換材を混入したモールド樹脂と、このモールド樹脂の周囲に設けた透光性樹脂とから構成したものである。 The present invention includes a flat substrate, a light emitting chip mounted on one side of the substrate, and the mold resin mixed wavelength conversion material is cured around the light emitting chip, the light-transmitting provided around the mold resin those constructed from a sexual resin.
【0010】 [0010]
また、前記発光チップに近い基板の一側面には第1撥油性皮膜を配置すると共に、この第1撥油性皮膜の位置より前記発光チップから離れた位置に第2撥油性皮膜を配置し、前記モールド樹脂は第1撥油性皮膜によって半円形状を形成し、前記透光性樹脂は第2撥油性皮膜によって半円形状を形成したものである。 Also, with the one side surface of the substrate closer to the light emitting chip is disposed a first oil repellent film, the second oil repellent coating is arranged at a position away from the light emitting chip from the position of the first oil repellency film, wherein molding resin semicircular formed by the first oil repellent film, the transparent resin is obtained by forming a semi-circular shape by the second oil repellent film.
【0011】 [0011]
そして、前記基板には配線パターンを形成し、この配線パターンと前記発光チップとをワイヤボンディングを行い、ワイヤーを前記第1撥油性皮膜と発光チップ間の領域に設けてモールド樹脂により囲ったものである。 Then, it said substrate forming a wiring pattern, an this wiring pattern and the light emitting chip performs wire bonding, which was surrounded by a mold resin is provided a wire in a region between the light emitting chip and the first oil repellent film is there.
【0012】 [0012]
さらに、平板状の基板と、この基板の一側面に取り付けた発光チップと、この発光チップの周囲に硬化させた屈折率の異なる第1透光性樹脂と、この第1透光性樹脂の周囲に硬化させ波長変換材を混入したモールド樹脂と、このモールド樹脂の周囲に設けた第2透光性樹脂とから構成したものである。 Furthermore, a flat substrate, a light emitting chip mounted on one side of the substrate, a first light-transmissive resin having a different refractive index cured around the light emitting chip, the periphery of the first light-transmissive resin and the mold resin mixed wavelength conversion material is cured to a, which is constituted from the second light-transmissive resin provided around the mold resin.
【0013】 [0013]
【発明の実施の形態】 DETAILED DESCRIPTION OF THE INVENTION
本発明の実施例を図面に基づいて説明する。 It is described with reference to embodiments of the present invention with reference to the drawings. 図1は本発明の発光素子の完成後の断面図、図2は同じく製造過程を示す工程図、図3は同じく応用例を示す断面図である。 Figure 1 is a sectional view of the completed light-emitting device of the present invention, FIG. 2 is a process diagram also showing a manufacturing process, FIG. 3 is a sectional view similarly showing an application example. (1)はその一側面に共通電極と個別電極よりなる配線パターン(図示せず)を形成した平板状の基板、(2)(2)…は前記基板の共通電極と個別電極間に取り付けられワイヤボンディング(3)によって電極と接続した化合物半導体よりなる発光チップ、(4)は前記発光チップ(2)に近い位置となる基板の一側面にスクリーン印刷等によって配置したシリコンやフッ素ポリマーを主成分とする第1撥油性皮膜で、図示していないが平面形状は完全な円形である。 (1) is flat plate-like substrate formed with wiring patterns (not shown) consisting of the common electrode and the individual electrode on one side thereof, (2) (2) ... is mounted between the common electrode and the individual electrode of the substrate principal component wire bonding (3) consists of a compound semiconductor which is connected to the electrode by the light-emitting chip, a (4) is silicon or fluorine polymer which are arranged by screen printing or the like on one side of the substrate to be located closer to the light emitting chip (2) the first oil repellent film and, although not shown the planar shape is a complete circle. (5)は前記第1撥油性皮膜(4)の位置よりも発光チップから離れた位置に配置した第1撥油性皮膜と同じシリコンよりなる第2撥油性皮膜で同様に完全な円形である。 (5) is the same perfect circle in the second oil repellent film made of the same silicon as the first oil repellent film which is located away from the light emitting chip than the position of the first oil repellent film (4).
【0014】 [0014]
(6)は波長変換材(図示できない)を混入し前記発光チップ(2)の周囲に硬化させたモールド樹脂で、第1撥油性皮膜(4)と発光チップ(2)との間にある領域(7)に設ける。 (6) in the molding resin is cured around the wavelength conversion material wherein the light-emitting chips mixed with (can not be shown) (2), a region that is between the first oil repellent film (4) and the light emitting chip (2) provided (7).
【0015】 [0015]
(8)は前記モールド樹脂(6)の周囲に設けた透光性樹脂である。 (8) is a translucent resin provided around the molding resin (6).
【0016】 [0016]
つづいて図2に示す工程図を見ながら説明する。 Be described while watching the process diagram shown in FIG. 2 followed. 予め基板(1)の一側面に所定数の発光チップ(2)を載置して取り付け、このチップと配線パターンとをワイヤボンディング(3)により接続すると共に、スクリーン印刷等によりチップに近い位置とこの位置より若干離れた位置に第1撥油性皮膜(4)と第2撥油性皮膜(5)を配置する(図2(イ)) Mounting is placed a predetermined number of light-emitting chips (2) on one side of the pre-substrate (1), the this chip and the wiring pattern as well as connected by wire bonding (3), and the position close to the chip by screen printing or the like in this position a little away from the place the first oil repellency film and (4) a second oil repellent coating (5) (Fig. 2 (b))
次に波長変換材を混入したモールド樹脂(6)を発光チップ(2)を包囲しながらワイヤ(9)を囲んで硬化させる。 Then it is cured to surround the wire (9) with a mold resin (6) obtained by mixing the wavelength converting material surrounds the light emitting chip (2). この際、モールド樹脂(6)はその周縁が第1撥油性皮膜(4)によって外側に広がるのを阻止し半円形状に形成される。 At this time, the mold resin (6) whose periphery is formed in a semicircular shape prevents the spread outwardly by the first oil repellent film (4). (図2(ロ)) (Figure 2 (b))
この第1撥油性皮膜の作用を詳記すると、モールド樹脂(6)により発光チップ(2)をモールドした場合に、第1撥油性皮膜により接触角度(n−ヘキサデカン)が大きくなりこの皮膜を越えて流れ出るのを防止する。 Beyond When Shoki the operation of the first oil repellency film, when molding the light emitting chip (2) by molding resin (6), the first oil repellent film contact angle (n- hexadecane) increases the film to prevent the flow out Te.
【0017】 [0017]
つづいて、モールド樹脂(6)の周囲に透明な透光性樹脂(8)を塗布して硬化させるわけであるが、この場合も前述のモールド樹脂(6)の硬化と同様に、その周縁が第2撥油性皮膜(5)によって外側に広がるのを阻止し半円形状に形成される。 Subsequently, although not cured by applying a transparent light-transmitting resin (8) around the molding resin (6), similar to the curing of the case described above of the molding resin (6), its peripheral edge is formed on the blocking and semicircular from spreading outward by the second oil repellent coating (5). そして、最終的な完成品は図1に示すように各樹脂が安定した形状となる。 The final finished product is each of the resin as shown in FIG. 1 a stable shape.
【0018】 [0018]
図3は別な実施例を示すもので、発光チップ(2)の周囲に屈折率の異なる第1透光性樹脂(10)を硬化し、ついで波長変換材を混入したモールド樹脂を第1透光性樹脂の周囲に塗布し第1撥油性皮膜(4)によって外側に広がるのを阻止した状態で硬化させ、その後、第2透光性樹脂(8)をモールド樹脂(6)の周囲に塗布し第2撥油性皮膜(5)によって外側に広がるのを阻止した状態で硬化させて工程を完了する。 Figure 3 shows another embodiment, by curing the different first light transmitting resin (10) having a refractive index around the light emitting chip (2), then the contaminating mold resin wavelength conversion member first magnetic cured in a state that prevents the spread outwardly by the first oil repellent coating was applied to the periphery of the optical resin (4), then applying a second translucent resin (8) around the molding resin (6) cured in a state that prevents the spread outwardly by the second oil repellent film (5) to complete the process.
【0019】 [0019]
前述の第1透光性樹脂は、発光チップ(2)内部の屈折率により近い屈折率を選定したものである。 The first light-transmissive resin described above is obtained by selecting a refractive index close to the light emitting chip (2) inside the refractive index.
【0020】 [0020]
【発明の効果】 【Effect of the invention】
以上の様に本発明は、平板状の基板の一側面に取り付けた発光チップの周囲に波長変換材を混入したモールド樹脂を硬化させ、このモールド樹脂の周囲に透光性樹脂を設けたものであるから、波長変換材によって得られた、例えば白色光を広い指向性の光源を得ることが可能となる。 The present invention as described above, the plate-like light-emitting chip mounted on one side of the substrate molding resin mixed wavelength converting material around the cured, which was provided with a translucent resin around the mold resin some because, obtained by the wavelength conversion material, it is possible to obtain, for example, wide directivity of the light source white light.
【0021】 [0021]
また、波長変換材を混入したモールド樹脂をカップ内に充填するものとは異なり、モールド樹脂と透光性樹脂を平板状の基板に取り付けた発光チップの外側に順次硬化させるものであるから、広範囲の領域に硬化でき、その結果、カップや枠等の影響されるものがなく広指向性となる。 Further, unlike filling contaminating mold resin wavelength conversion material in the cup, the mold resin and the transparent resin because those are sequentially cured outside of the light-emitting chip mounted on a flat substrate, a wide range It can cure in the region, which is influenced such cups and the frame is wide directivity without.
【0022】 [0022]
そして、モールド樹脂は第1撥油性樹脂により、透光性樹脂は第2撥油性樹脂により、それぞれが半円形状に形成され所望の形状を得ることができ、その形状が安定し複数個の発光チップを用いるアレイの様な場合には色調が揃った光源を得ることができる。 Then, a mold resin is first oil repellent resin, the translucent resin and the second oil-repellent resin, each can be formed in a semicircular shape to obtain a desired shape, the shape is stable plurality of light emitting it is possible to obtain the color tone are aligned source in the case such as arrays using chips.
【0023】 [0023]
さらに、発光チップの外側に屈折率の異なる第1透光性樹脂を設け、その外側に波長変換材を混入したモールド樹脂を設け、その外側に第2透光性樹脂を設けたものであるから、屈折率の作用により光の取り出しをその屈折率に応じて変更できると共に、第1透光性樹脂の屈折率と波長変換材の組み合わせにより様々な波長の光を取り出すことができる。 Furthermore, the different first translucent resin having a refractive index on the outside of the light-emitting chips provided, contaminating mold resin wavelength conversion material on its outside is provided, because on its outside is provided with a second light-transmissive resin , the light extraction may vary depending on the refractive index by the action of the refractive index, it is possible to extract light of different wavelengths by a combination of refractive index and the wavelength conversion member of the first light-transmissive resin.
【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS
【図1】本発明の発光体の断面図である。 1 is a cross-sectional view of a light emitting element of the present invention.
【図2】(イ)、(ロ)は同じく製造過程を示す工程図である。 Figure 2 (a), (b) is a same process diagram showing the manufacturing process.
【図3】同じく他の応用例を示す断面図である。 3 is a sectional view showing the other applications.
【符号の説明】 DESCRIPTION OF SYMBOLS
1 基板2 発光チップ3 ワイヤボンディング4 第1撥油性皮膜5 第2撥油性皮膜6 モールド樹脂7 領域8 透光性樹脂(第2透光性樹脂) 1 substrate 2 emitting chip 3 wire bonding 4 first oil repellent film 5 second oil repellent film 6 molding resin 7 area 8 translucent resin (second translucent resin)
9 ワイヤー10 第1透光性樹脂 9 Wire 10 first light-transmissive resin

Claims (4)

  1. 平板状の基板と、この基板の一側面に取り付けた発光チップと、この発光チップの周囲に硬化させ波長変換材を混入したモールド樹脂と、このモールド樹脂の周囲に設けた透光性樹脂とから構成したことを特徴とする発光体。 From a flat substrate, a light emitting chip mounted on one side of the substrate, and the mold resin mixed wavelength conversion material is cured around the light emitting chip, a translucent resin provided around the mold resin emitters, characterized in that the configuration was.
  2. 前記発光チップに近い基板の一側面には第1撥油性皮膜を配置すると共に、この第1撥油性皮膜の位置より前記発光チップから離れた位置に第2撥油性皮膜を配置し、前記モールド樹脂は第1撥油性皮膜によって半円形状を形成し、前記透光性樹脂は第2撥油性皮膜によって半円形状を形成したことを特徴とする請求項1に記載の発光体。 With placing the first oil repellency coating on one side of the substrate closer to the light emitting chip, the second oil repellent coating is arranged at a position away from the light emitting chip from the position of the first oil repellency film, the mold resin the light-emitting body according to claim 1 semicircular formed by the first oil repellent film, the transparent resin, characterized in that the formation of the semi-circular shape by the second oil repellent coating.
  3. 前記基板には配線パターンを形成し、この配線パターンと前記発光チップとをワイヤボンディングを行い、ワイヤーを前記第1撥油性皮膜と発光チップ間の領域に設けてモールド樹脂により囲ったことを特徴とする請求項2に記載の発光体。 Wherein the substrate to form a wiring pattern, and characterized in that the the wiring pattern and the light emitting chip performs wire bonding, surrounded by the mold resin is provided a wire in a region between the light emitting chip and the first oil repellent film the light-emitting body according to claim 2.
  4. 平板状の基板と、この基板の一側面に取り付けた発光チップと、この発光チップの周囲に硬化させた屈折率の異なる第1透光性樹脂と、この第1透光性樹脂の周囲に硬化させ波長変換材を混入したモールド樹脂と、このモールド樹脂の周囲に設けた第2透光性樹脂とから構成したことを特徴する発光体。 A flat substrate, a light emitting chip mounted on one side of the substrate, a first light-transmissive resin having a different refractive index cured around the light emitting chip, curing around the first light-transmissive resin and the mold resin mixed wavelength conversion material is, the light emitting body characterized by being configured from a second translucent resin provided around the mold resin.
JP2002247069A 2002-08-27 2002-08-27 Light emitting device Pending JP2004087812A (en)

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JP2006229055A (en) * 2005-02-18 2006-08-31 Nichia Chem Ind Ltd Light-emitting device
JP2006310856A (en) * 2005-04-27 2006-11-09 Samsung Electro Mech Co Ltd Lcd backlight unit using light-emitting diode
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