JP2004087812A - Light emitting device - Google Patents

Light emitting device Download PDF

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Publication number
JP2004087812A
JP2004087812A JP2002247069A JP2002247069A JP2004087812A JP 2004087812 A JP2004087812 A JP 2004087812A JP 2002247069 A JP2002247069 A JP 2002247069A JP 2002247069 A JP2002247069 A JP 2002247069A JP 2004087812 A JP2004087812 A JP 2004087812A
Authority
JP
Japan
Prior art keywords
light
emitting chip
resin
oil
repellent film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002247069A
Other languages
Japanese (ja)
Inventor
Hisami Kawaguchi
Tatsuya Motoike
川口  久美
本池  達也
Original Assignee
Sanyo Electric Co Ltd
Tottori Sanyo Electric Co Ltd
三洋電機株式会社
鳥取三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd, Tottori Sanyo Electric Co Ltd, 三洋電機株式会社, 鳥取三洋電機株式会社 filed Critical Sanyo Electric Co Ltd
Priority to JP2002247069A priority Critical patent/JP2004087812A/en
Publication of JP2004087812A publication Critical patent/JP2004087812A/en
Application status is Pending legal-status Critical

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Abstract

<P>PROBLEM TO BE SOLVED: To widen the directivity when allowing the light emitted from a light-emitting chip to be subjected to wavelength conversion for emitting. <P>SOLUTION: The light-emitting chip 2 is mounted onto one side of a flat substrate 1, a mold resin 6 where a wavelength conversion material is mixed is cured around the periphery of the light-emitting chip, and a translucent resin 8 is provided around the mold resin, thus allowing the light emitted from the light-emitting chip to be subjected to wavelength conversion by the wavelength conversion material. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a luminous body provided with a wavelength conversion material outside a light emitting chip to obtain, for example, white light.
[0002]
[Prior art]
Japanese Patent Application Laid-Open Nos. Hei 7-99345 and Hei 10-56208 disclose a method of converting the emission wavelength using a wavelength conversion material on the outside of the light emitting chip to obtain a desired emission color such as white or blue. It is disclosed in typical prior art documents.
[0003]
The above-mentioned prior art document discloses that a cup is provided on a lead frame, a light emitting chip is placed in the cup, and the entire light emitting chip is surrounded by a resin containing a wavelength conversion material for converting a light emission wavelength to another wavelength. The light emitted from the light emitting chip is reflected by the cup toward the light emission observation surface.
[0004]
[Problems to be solved by the invention]
In the configuration described above, since the light emitting chip is surrounded by the wavelength conversion material, the wavelength conversion efficiency is improved, but the directivity of light emission after converting the wavelength is narrow, and the application is limited.
[0005]
In addition, since the resin filled with the wavelength conversion material is filled in the cup, the resin region is small and the amount of the wavelength conversion material mixed is small, and the mixing ratio of the resin mixed with the conversion material as a finished product is small. As a result, there is a disadvantage that the color tone after wavelength conversion tends to vary.
[0006]
If the mixing amount of the wavelength conversion material is small (trace amount), the variation ratio of the amount tends to be large. A specific explanation is that the resin mixed with the wavelength conversion material is filled into the cup, so the cup volume is originally small. The amount of the wavelength conversion material present in the resin that has entered the inside is also reduced, and as a result, there is a disadvantage that the wavelength after conversion is different and the color tone varies.
[0007]
That is, it is not possible to ensure a sufficient amount of the wavelength conversion material to be mixed in the resin filled in the cup.
[0008]
According to the present invention, the directivity of light emission after wavelength conversion is widened, and there is no variation in color tone.
[0009]
[Means for Solving the Problems]
The present invention relates to a flat substrate, a light emitting chip mounted on one side of the substrate, a mold resin cured around the light emitting chip and mixed with a wavelength conversion material, and a light transmission provided around the mold resin. And a conductive resin.
[0010]
In addition, a first oil-repellent film is disposed on one side surface of the substrate near the light-emitting chip, and a second oil-repellent film is disposed at a position farther from the light-emitting chip than the position of the first oil-repellent film. The mold resin is formed in a semicircular shape by the first oil-repellent film, and the translucent resin is formed in a semicircular shape by the second oil-repellent film.
[0011]
Then, a wiring pattern is formed on the substrate, wire bonding is performed between the wiring pattern and the light emitting chip, and a wire is provided in a region between the first oil-repellent film and the light emitting chip and is surrounded by a mold resin. is there.
[0012]
Further, a flat substrate, a light emitting chip attached to one side surface of the substrate, a first light transmissive resin having a different refractive index cured around the light emitting chip, and a periphery of the first light transmissive resin. And a second translucent resin provided around the mold resin.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a sectional view showing a completed light emitting device of the present invention, FIG. 2 is a process diagram showing a manufacturing process, and FIG. 3 is a sectional view showing an application example. (1) is a flat substrate having a wiring pattern (not shown) composed of a common electrode and an individual electrode formed on one side thereof, and (2) (2)... Are mounted between the common electrode and the individual electrode of the substrate. A light emitting chip made of a compound semiconductor connected to an electrode by wire bonding (3). (4) is mainly composed of silicon or a fluoropolymer disposed on one side surface of a substrate near the light emitting chip (2) by screen printing or the like. The first oil-repellent film has a perfect circular shape (not shown). (5) is a second oil-repellent film made of the same silicon as the first oil-repellent film disposed at a position farther from the light-emitting chip than the position of the first oil-repellent film (4), and is also completely circular.
[0014]
(6) is a mold resin mixed with a wavelength conversion material (not shown) and cured around the light emitting chip (2), and is a region between the first oil repellent film (4) and the light emitting chip (2). Provided in (7).
[0015]
(8) is a translucent resin provided around the mold resin (6).
[0016]
Next, the process will be described with reference to the process chart shown in FIG. A predetermined number of light emitting chips (2) are placed and mounted on one side of the substrate (1) in advance, and the chips are connected to the wiring pattern by wire bonding (3). The first oil-repellent film (4) and the second oil-repellent film (5) are arranged at a position slightly away from this position (FIG. 2A).
Next, the mold resin (6) mixed with the wavelength conversion material is cured by surrounding the wire (9) while surrounding the light emitting chip (2). At this time, the mold resin (6) is prevented from spreading outward by the first oil-repellent film (4) and is formed in a semicircular shape. (Fig. 2 (b))
The action of the first oil-repellent film will be described in detail. When the light emitting chip (2) is molded with the mold resin (6), the contact angle (n-hexadecane) is increased due to the first oil-repellent film, and the first oil-repellent film exceeds the film. To prevent it from flowing out.
[0017]
Subsequently, a transparent translucent resin (8) is applied around the mold resin (6) and cured, but also in this case, similarly to the curing of the mold resin (6) described above, the periphery thereof is The second oil-repellent coating (5) prevents the resin from spreading outward and is formed in a semicircular shape. And, as shown in FIG. 1, the final completed product has a stable shape in each resin.
[0018]
FIG. 3 shows another embodiment, in which a first light-transmitting resin (10) having a different refractive index is cured around a light-emitting chip (2), and then a mold resin mixed with a wavelength conversion material is first-transparent. It is applied around the light-sensitive resin and cured while being prevented from spreading outward by the first oil-repellent film (4). Thereafter, the second light-transmitting resin (8) is applied around the mold resin (6). Then, the second oil-repellent film (5) is cured while being prevented from spreading outward, thereby completing the process.
[0019]
The above-mentioned first translucent resin has a refractive index closer to the refractive index inside the light emitting chip (2).
[0020]
【The invention's effect】
As described above, the present invention cures a mold resin mixed with a wavelength conversion material around a light emitting chip attached to one side surface of a flat substrate, and provides a translucent resin around the mold resin. Therefore, it is possible to obtain a light source having a wide directivity, for example, white light obtained by the wavelength conversion material.
[0021]
Also, unlike the case where the mold resin mixed with the wavelength conversion material is filled into the cup, the mold resin and the translucent resin are sequentially cured on the outside of the light emitting chip mounted on the flat substrate. , And as a result, there is no influence of the cup, the frame, and the like, and wide directivity is obtained.
[0022]
The mold resin is formed of the first oil-repellent resin, and the light-transmitting resin is formed of the second oil-repellent resin in a semicircular shape to obtain a desired shape. In the case of an array using chips, a light source having a uniform color tone can be obtained.
[0023]
Further, the first light-transmitting resin having a different refractive index is provided outside the light emitting chip, the mold resin mixed with the wavelength conversion material is provided outside the first light-transmitting resin, and the second light-transmitting resin is provided outside the first resin. In addition, the light extraction can be changed according to the refractive index by the action of the refractive index, and light of various wavelengths can be extracted by a combination of the refractive index of the first translucent resin and the wavelength conversion material.
[Brief description of the drawings]
FIG. 1 is a sectional view of a luminous body of the present invention.
FIGS. 2A and 2B are process diagrams showing the same manufacturing process.
FIG. 3 is a sectional view showing another application example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Substrate 2 Light emitting chip 3 Wire bonding 4 First oil-repellent film 5 Second oil-repellent film 6 Mold resin 7 Area 8 Translucent resin (second translucent resin)
9 Wire 10 First translucent resin

Claims (4)

  1. A flat substrate, a light emitting chip mounted on one side of the substrate, a mold resin cured around the light emitting chip and mixed with a wavelength conversion material, and a light transmitting resin provided around the mold resin. A luminous body characterized by comprising.
  2. A first oil-repellent film is disposed on one side surface of the substrate near the light-emitting chip, and a second oil-repellent film is disposed at a position farther from the light-emitting chip than the position of the first oil-repellent film. The luminous body according to claim 1, wherein a semicircular shape is formed by a first oil-repellent film, and the translucent resin is formed by a second oil-repellent film.
  3. A wiring pattern is formed on the substrate, the wiring pattern is wire-bonded to the light emitting chip, and a wire is provided in a region between the first oil-repellent film and the light emitting chip and is surrounded by a mold resin. The luminous body according to claim 2, wherein
  4. A flat substrate, a light-emitting chip mounted on one side of the substrate, a first light-transmitting resin having a different refractive index cured around the light-emitting chip, and a light-curing resin around the first light-transmitting resin. A luminous body comprising: a mold resin mixed with a wavelength conversion material; and a second translucent resin provided around the mold resin.
JP2002247069A 2002-08-27 2002-08-27 Light emitting device Pending JP2004087812A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002247069A JP2004087812A (en) 2002-08-27 2002-08-27 Light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002247069A JP2004087812A (en) 2002-08-27 2002-08-27 Light emitting device

Publications (1)

Publication Number Publication Date
JP2004087812A true JP2004087812A (en) 2004-03-18

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Country Status (1)

Country Link
JP (1) JP2004087812A (en)

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JP2006229055A (en) * 2005-02-18 2006-08-31 Nichia Chem Ind Ltd Light-emitting device
JP2006310856A (en) * 2005-04-27 2006-11-09 Samsung Electro Mech Co Ltd Lcd backlight unit using light-emitting diode
JP2007123891A (en) * 2005-10-27 2007-05-17 Lg Innotek Co Ltd Light emitting diode package and method for manufacturing the same
JP2007165811A (en) * 2005-12-16 2007-06-28 Nichia Chem Ind Ltd Light emitting device
JP2007258204A (en) * 2006-03-20 2007-10-04 Rohm Co Ltd Optical communication module
WO2008018336A1 (en) * 2006-08-07 2008-02-14 Sony Chemical & Information Device Corporation Luminescent element module
JP2008047851A (en) * 2006-07-18 2008-02-28 Nichia Chem Ind Ltd Linear light emitting device and surface light emitting device using it
KR100809263B1 (en) * 2006-07-10 2008-02-29 삼성전기주식회사 Direct backlight having surface light source
JP2008159705A (en) * 2006-12-21 2008-07-10 Matsushita Electric Works Ltd Light-emitting device
JP2008288409A (en) * 2007-05-18 2008-11-27 Toshiba Corp Light-emitting device, and manufacturing method thereof
WO2010021346A1 (en) * 2008-08-20 2010-02-25 三菱化学株式会社 Semiconductor light emitting device and method for manufacturing the same
JP2010050235A (en) * 2008-08-20 2010-03-04 Mitsubishi Chemicals Corp Semiconductor light emitting device, and method for manufacturing the same
JP2010050236A (en) * 2008-08-20 2010-03-04 Mitsubishi Chemicals Corp Semiconductor light emitting device, and method for manufacturing the same
KR100964812B1 (en) 2008-09-29 2010-06-22 주식회사 에피밸리 Semiconductor light emitting device package
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US7834375B2 (en) 2005-08-04 2010-11-16 Cree, Inc. Submounts for semiconductor light emitting devices and methods of forming packaged light emitting devices including dispensed encapsulants
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KR20110139453A (en) * 2010-06-23 2011-12-29 엘지이노텍 주식회사 Light emitting apparatus and lighting system
US8294165B2 (en) 2006-03-30 2012-10-23 Kabushiki Kaisha Toshiba Semiconductor light-emitting device
KR101199216B1 (en) * 2011-12-09 2012-11-07 엘지이노텍 주식회사 Package of light emitting diode
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WO2013136900A1 (en) * 2012-03-16 2013-09-19 シャープ株式会社 Light-emitting device
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JP2014120571A (en) * 2012-12-14 2014-06-30 Stanley Electric Co Ltd Semiconductor light-emitting device, and method of manufacturing the same
JP2014140050A (en) * 2014-02-26 2014-07-31 Sharp Corp Light emitting device
JP2014157976A (en) * 2013-02-18 2014-08-28 Stanley Electric Co Ltd Semiconductor light-emitting device
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US9231023B2 (en) 2009-11-13 2016-01-05 Sharp Kabushiki Kaisha Light-emitting device having a plurality of concentric light transmitting areas
EP2008315B1 (en) * 2006-04-04 2016-07-20 Cree, Inc. Uniform emission led package
US9401461B2 (en) 2007-07-11 2016-07-26 Cree, Inc. LED chip design for white conversion
US9705059B2 (en) 2004-12-17 2017-07-11 Lg Innotek Co., Ltd Light emitting package having a guiding member guiding an optical member
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