JP2004087812A - Light emitting device - Google Patents

Light emitting device Download PDF

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Publication number
JP2004087812A
JP2004087812A JP2002247069A JP2002247069A JP2004087812A JP 2004087812 A JP2004087812 A JP 2004087812A JP 2002247069 A JP2002247069 A JP 2002247069A JP 2002247069 A JP2002247069 A JP 2002247069A JP 2004087812 A JP2004087812 A JP 2004087812A
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JP
Japan
Prior art keywords
light
emitting chip
resin
oil
repellent film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002247069A
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Japanese (ja)
Inventor
Hisami Kawaguchi
川口　　久美
Tatsuya Motoike
本池　　達也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Tottori Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Tottori Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP2002247069A priority Critical patent/JP2004087812A/en
Publication of JP2004087812A publication Critical patent/JP2004087812A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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Abstract

<P>PROBLEM TO BE SOLVED: To widen the directivity when allowing the light emitted from a light-emitting chip to be subjected to wavelength conversion for emitting. <P>SOLUTION: The light-emitting chip 2 is mounted onto one side of a flat substrate 1, a mold resin 6 where a wavelength conversion material is mixed is cured around the periphery of the light-emitting chip, and a translucent resin 8 is provided around the mold resin, thus allowing the light emitted from the light-emitting chip to be subjected to wavelength conversion by the wavelength conversion material. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は、発光チップの外側に波長変換材を設けて、例えば白色光を得るようにした発光体に関する。
【０００２】
【従来の技術】
発光チップの外側に波長変換材を用いて発光波長を変換し、例えば白色や青色等の所望の発光色を得るようにしたものは特開平７−９９３４５号公報や特開平１０−５６２０８号公報に代表される先行技術文献に開示されている。
【０００３】
上述の先行技術文献は、リードフレームにカップを設け、このカップ内に発光チップを載置すると共に、発光チップ全体を発光波長を他の波長に変換する波長変換材を含有した樹脂により包囲しカップ内に充填したもので、発光チップから放出する発光をカップにより発光観測面側に反射させるものである。
【０００４】
【発明が解決しようとする課題】
前述の構成では、波長変換材によって発光チップを包囲するため、波長変換効率が良くなるものの波長を変換した後の発光の指向性が狭く用途が限定された。
【０００５】
又、カップ内に波長変換材を混入した樹脂を充填することから、樹脂領域が小さく波長変換材の混入量が少なくなり、この変換材を混入した樹脂の完成品としての混入量の変動割合が大きくなり、その結果、波長変換後の色調にバラツキを生じやすくなるという欠点がある。
【０００６】
波長変換材の混入量が少ないと（微量）、量の変動割合が大きくなりやすい具体的な説明について、波長変換材を混入した樹脂はカップに充填するため、カップの容積はもともと小さく、このカップの中に入り込んだ樹脂内に存在する波長変換材の量も少なくなるものであり、この結果、変換後の波長が異なり色調にバラツキを生じる欠点がある。
【０００７】
即ち、カップ内に充填する樹脂内に混入させる波長変換材の量を十分に確保できない。
【０００８】
本発明は、波長変換後の発光の指向性を広くし、且つ色調にバラツキがないようにしたものである。
【０００９】
【課題を解決するための手段】
本発明は、平板状の基板と、この基板の一側面に取り付けた発光チップと、この発光チップの周囲に硬化させ波長変換材を混入したモールド樹脂と、このモールド樹脂の周囲に設けた透光性樹脂とから構成したものである。
【００１０】
また、前記発光チップに近い基板の一側面には第１撥油性皮膜を配置すると共に、この第１撥油性皮膜の位置より前記発光チップから離れた位置に第２撥油性皮膜を配置し、前記モールド樹脂は第１撥油性皮膜によって半円形状を形成し、前記透光性樹脂は第２撥油性皮膜によって半円形状を形成したものである。
【００１１】
そして、前記基板には配線パターンを形成し、この配線パターンと前記発光チップとをワイヤボンディングを行い、ワイヤーを前記第１撥油性皮膜と発光チップ間の領域に設けてモールド樹脂により囲ったものである。
【００１２】
さらに、平板状の基板と、この基板の一側面に取り付けた発光チップと、この発光チップの周囲に硬化させた屈折率の異なる第１透光性樹脂と、この第１透光性樹脂の周囲に硬化させ波長変換材を混入したモールド樹脂と、このモールド樹脂の周囲に設けた第２透光性樹脂とから構成したものである。
【００１３】
【発明の実施の形態】
本発明の実施例を図面に基づいて説明する。図１は本発明の発光素子の完成後の断面図、図２は同じく製造過程を示す工程図、図３は同じく応用例を示す断面図である。（１）はその一側面に共通電極と個別電極よりなる配線パターン（図示せず）を形成した平板状の基板、（２）（２）…は前記基板の共通電極と個別電極間に取り付けられワイヤボンディング（３）によって電極と接続した化合物半導体よりなる発光チップ、（４）は前記発光チップ（２）に近い位置となる基板の一側面にスクリーン印刷等によって配置したシリコンやフッ素ポリマーを主成分とする第１撥油性皮膜で、図示していないが平面形状は完全な円形である。（５）は前記第１撥油性皮膜（４）の位置よりも発光チップから離れた位置に配置した第１撥油性皮膜と同じシリコンよりなる第２撥油性皮膜で同様に完全な円形である。
【００１４】
（６）は波長変換材（図示できない）を混入し前記発光チップ（２）の周囲に硬化させたモールド樹脂で、第１撥油性皮膜（４）と発光チップ（２）との間にある領域（７）に設ける。
【００１５】
（８）は前記モールド樹脂（６）の周囲に設けた透光性樹脂である。
【００１６】
つづいて図２に示す工程図を見ながら説明する。予め基板（１）の一側面に所定数の発光チップ（２）を載置して取り付け、このチップと配線パターンとをワイヤボンディング（３）により接続すると共に、スクリーン印刷等によりチップに近い位置とこの位置より若干離れた位置に第１撥油性皮膜（４）と第２撥油性皮膜（５）を配置する（図２（イ））
次に波長変換材を混入したモールド樹脂（６）を発光チップ（２）を包囲しながらワイヤ（９）を囲んで硬化させる。この際、モールド樹脂（６）はその周縁が第１撥油性皮膜（４）によって外側に広がるのを阻止し半円形状に形成される。（図２（ロ））
この第１撥油性皮膜の作用を詳記すると、モールド樹脂（６）により発光チップ（２）をモールドした場合に、第１撥油性皮膜により接触角度（ｎ−ヘキサデカン）が大きくなりこの皮膜を越えて流れ出るのを防止する。
【００１７】
つづいて、モールド樹脂（６）の周囲に透明な透光性樹脂（８）を塗布して硬化させるわけであるが、この場合も前述のモールド樹脂（６）の硬化と同様に、その周縁が第２撥油性皮膜（５）によって外側に広がるのを阻止し半円形状に形成される。そして、最終的な完成品は図１に示すように各樹脂が安定した形状となる。
【００１８】
図３は別な実施例を示すもので、発光チップ（２）の周囲に屈折率の異なる第１透光性樹脂（１０）を硬化し、ついで波長変換材を混入したモールド樹脂を第１透光性樹脂の周囲に塗布し第１撥油性皮膜（４）によって外側に広がるのを阻止した状態で硬化させ、その後、第２透光性樹脂（８）をモールド樹脂（６）の周囲に塗布し第２撥油性皮膜（５）によって外側に広がるのを阻止した状態で硬化させて工程を完了する。
【００１９】
前述の第１透光性樹脂は、発光チップ（２）内部の屈折率により近い屈折率を選定したものである。
【００２０】
【発明の効果】
以上の様に本発明は、平板状の基板の一側面に取り付けた発光チップの周囲に波長変換材を混入したモールド樹脂を硬化させ、このモールド樹脂の周囲に透光性樹脂を設けたものであるから、波長変換材によって得られた、例えば白色光を広い指向性の光源を得ることが可能となる。
【００２１】
また、波長変換材を混入したモールド樹脂をカップ内に充填するものとは異なり、モールド樹脂と透光性樹脂を平板状の基板に取り付けた発光チップの外側に順次硬化させるものであるから、広範囲の領域に硬化でき、その結果、カップや枠等の影響されるものがなく広指向性となる。
【００２２】
そして、モールド樹脂は第１撥油性樹脂により、透光性樹脂は第２撥油性樹脂により、それぞれが半円形状に形成され所望の形状を得ることができ、その形状が安定し複数個の発光チップを用いるアレイの様な場合には色調が揃った光源を得ることができる。
【００２３】
さらに、発光チップの外側に屈折率の異なる第１透光性樹脂を設け、その外側に波長変換材を混入したモールド樹脂を設け、その外側に第２透光性樹脂を設けたものであるから、屈折率の作用により光の取り出しをその屈折率に応じて変更できると共に、第１透光性樹脂の屈折率と波長変換材の組み合わせにより様々な波長の光を取り出すことができる。
【図面の簡単な説明】
【図１】本発明の発光体の断面図である。
【図２】（イ）、（ロ）は同じく製造過程を示す工程図である。
【図３】同じく他の応用例を示す断面図である。
【符号の説明】
１　基板
２　発光チップ
３　ワイヤボンディング
４　第１撥油性皮膜
５　第２撥油性皮膜
６　モールド樹脂
７　領域
８　透光性樹脂（第２透光性樹脂）
９　ワイヤー
１０　第１透光性樹脂[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a luminous body provided with a wavelength conversion material outside a light emitting chip to obtain, for example, white light.
[0002]
[Prior art]
Japanese Patent Application Laid-Open Nos. Hei 7-99345 and Hei 10-56208 disclose a method of converting the emission wavelength using a wavelength conversion material on the outside of the light emitting chip to obtain a desired emission color such as white or blue. It is disclosed in typical prior art documents.
[0003]
The above-mentioned prior art document discloses that a cup is provided on a lead frame, a light emitting chip is placed in the cup, and the entire light emitting chip is surrounded by a resin containing a wavelength conversion material for converting a light emission wavelength to another wavelength. The light emitted from the light emitting chip is reflected by the cup toward the light emission observation surface.
[0004]
[Problems to be solved by the invention]
In the configuration described above, since the light emitting chip is surrounded by the wavelength conversion material, the wavelength conversion efficiency is improved, but the directivity of light emission after converting the wavelength is narrow, and the application is limited.
[0005]
In addition, since the resin filled with the wavelength conversion material is filled in the cup, the resin region is small and the amount of the wavelength conversion material mixed is small, and the mixing ratio of the resin mixed with the conversion material as a finished product is small. As a result, there is a disadvantage that the color tone after wavelength conversion tends to vary.
[0006]
If the mixing amount of the wavelength conversion material is small (trace amount), the variation ratio of the amount tends to be large. A specific explanation is that the resin mixed with the wavelength conversion material is filled into the cup, so the cup volume is originally small. The amount of the wavelength conversion material present in the resin that has entered the inside is also reduced, and as a result, there is a disadvantage that the wavelength after conversion is different and the color tone varies.
[0007]
That is, it is not possible to ensure a sufficient amount of the wavelength conversion material to be mixed in the resin filled in the cup.
[0008]
According to the present invention, the directivity of light emission after wavelength conversion is widened, and there is no variation in color tone.
[0009]
[Means for Solving the Problems]
The present invention relates to a flat substrate, a light emitting chip mounted on one side of the substrate, a mold resin cured around the light emitting chip and mixed with a wavelength conversion material, and a light transmission provided around the mold resin. And a conductive resin.
[0010]
In addition, a first oil-repellent film is disposed on one side surface of the substrate near the light-emitting chip, and a second oil-repellent film is disposed at a position farther from the light-emitting chip than the position of the first oil-repellent film. The mold resin is formed in a semicircular shape by the first oil-repellent film, and the translucent resin is formed in a semicircular shape by the second oil-repellent film.
[0011]
Then, a wiring pattern is formed on the substrate, wire bonding is performed between the wiring pattern and the light emitting chip, and a wire is provided in a region between the first oil-repellent film and the light emitting chip and is surrounded by a mold resin. is there.
[0012]
Further, a flat substrate, a light emitting chip attached to one side surface of the substrate, a first light transmissive resin having a different refractive index cured around the light emitting chip, and a periphery of the first light transmissive resin. And a second translucent resin provided around the mold resin.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a sectional view showing a completed light emitting device of the present invention, FIG. 2 is a process diagram showing a manufacturing process, and FIG. 3 is a sectional view showing an application example. (1) is a flat substrate having a wiring pattern (not shown) composed of a common electrode and an individual electrode formed on one side thereof, and (2) (2)... Are mounted between the common electrode and the individual electrode of the substrate. A light emitting chip made of a compound semiconductor connected to an electrode by wire bonding (3). (4) is mainly composed of silicon or a fluoropolymer disposed on one side surface of a substrate near the light emitting chip (2) by screen printing or the like. The first oil-repellent film has a perfect circular shape (not shown). (5) is a second oil-repellent film made of the same silicon as the first oil-repellent film disposed at a position farther from the light-emitting chip than the position of the first oil-repellent film (4), and is also completely circular.
[0014]
(6) is a mold resin mixed with a wavelength conversion material (not shown) and cured around the light emitting chip (2), and is a region between the first oil repellent film (4) and the light emitting chip (2). Provided in (7).
[0015]
(8) is a translucent resin provided around the mold resin (6).
[0016]
Next, the process will be described with reference to the process chart shown in FIG. A predetermined number of light emitting chips (2) are placed and mounted on one side of the substrate (1) in advance, and the chips are connected to the wiring pattern by wire bonding (3). The first oil-repellent film (4) and the second oil-repellent film (5) are arranged at a position slightly away from this position (FIG. 2A).
Next, the mold resin (6) mixed with the wavelength conversion material is cured by surrounding the wire (9) while surrounding the light emitting chip (2). At this time, the mold resin (6) is prevented from spreading outward by the first oil-repellent film (4) and is formed in a semicircular shape. (Fig. 2 (b))
The action of the first oil-repellent film will be described in detail. When the light emitting chip (2) is molded with the mold resin (6), the contact angle (n-hexadecane) is increased due to the first oil-repellent film, and the first oil-repellent film exceeds the film. To prevent it from flowing out.
[0017]
Subsequently, a transparent translucent resin (8) is applied around the mold resin (6) and cured, but also in this case, similarly to the curing of the mold resin (6) described above, the periphery thereof is The second oil-repellent coating (5) prevents the resin from spreading outward and is formed in a semicircular shape. And, as shown in FIG. 1, the final completed product has a stable shape in each resin.
[0018]
FIG. 3 shows another embodiment, in which a first light-transmitting resin (10) having a different refractive index is cured around a light-emitting chip (2), and then a mold resin mixed with a wavelength conversion material is first-transparent. It is applied around the light-sensitive resin and cured while being prevented from spreading outward by the first oil-repellent film (4). Thereafter, the second light-transmitting resin (8) is applied around the mold resin (6). Then, the second oil-repellent film (5) is cured while being prevented from spreading outward, thereby completing the process.
[0019]
The above-mentioned first translucent resin has a refractive index closer to the refractive index inside the light emitting chip (2).
[0020]
【The invention's effect】
As described above, the present invention cures a mold resin mixed with a wavelength conversion material around a light emitting chip attached to one side surface of a flat substrate, and provides a translucent resin around the mold resin. Therefore, it is possible to obtain a light source having a wide directivity, for example, white light obtained by the wavelength conversion material.
[0021]
Also, unlike the case where the mold resin mixed with the wavelength conversion material is filled into the cup, the mold resin and the translucent resin are sequentially cured on the outside of the light emitting chip mounted on the flat substrate. , And as a result, there is no influence of the cup, the frame, and the like, and wide directivity is obtained.
[0022]
The mold resin is formed of the first oil-repellent resin, and the light-transmitting resin is formed of the second oil-repellent resin in a semicircular shape to obtain a desired shape. In the case of an array using chips, a light source having a uniform color tone can be obtained.
[0023]
Further, the first light-transmitting resin having a different refractive index is provided outside the light emitting chip, the mold resin mixed with the wavelength conversion material is provided outside the first light-transmitting resin, and the second light-transmitting resin is provided outside the first resin. In addition, the light extraction can be changed according to the refractive index by the action of the refractive index, and light of various wavelengths can be extracted by a combination of the refractive index of the first translucent resin and the wavelength conversion material.
[Brief description of the drawings]
FIG. 1 is a sectional view of a luminous body of the present invention.
FIGS. 2A and 2B are process diagrams showing the same manufacturing process.
FIG. 3 is a sectional view showing another application example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Substrate 2 Light emitting chip 3 Wire bonding 4 First oil-repellent film 5 Second oil-repellent film 6 Mold resin 7 Area 8 Translucent resin (second translucent resin)
9 Wire 10 First translucent resin

Claims (4)

平板状の基板と、この基板の一側面に取り付けた発光チップと、この発光チップの周囲に硬化させ波長変換材を混入したモールド樹脂と、このモールド樹脂の周囲に設けた透光性樹脂とから構成したことを特徴とする発光体。A flat substrate, a light emitting chip mounted on one side of the substrate, a mold resin cured around the light emitting chip and mixed with a wavelength conversion material, and a light transmitting resin provided around the mold resin. A luminous body characterized by comprising. 前記発光チップに近い基板の一側面には第１撥油性皮膜を配置すると共に、この第１撥油性皮膜の位置より前記発光チップから離れた位置に第２撥油性皮膜を配置し、前記モールド樹脂は第１撥油性皮膜によって半円形状を形成し、前記透光性樹脂は第２撥油性皮膜によって半円形状を形成したことを特徴とする請求項１に記載の発光体。A first oil-repellent film is disposed on one side surface of the substrate near the light-emitting chip, and a second oil-repellent film is disposed at a position farther from the light-emitting chip than the position of the first oil-repellent film. The luminous body according to claim 1, wherein a semicircular shape is formed by a first oil-repellent film, and the translucent resin is formed by a second oil-repellent film. 前記基板には配線パターンを形成し、この配線パターンと前記発光チップとをワイヤボンディングを行い、ワイヤーを前記第１撥油性皮膜と発光チップ間の領域に設けてモールド樹脂により囲ったことを特徴とする請求項２に記載の発光体。A wiring pattern is formed on the substrate, the wiring pattern is wire-bonded to the light emitting chip, and a wire is provided in a region between the first oil-repellent film and the light emitting chip and is surrounded by a mold resin. The luminous body according to claim 2, wherein 平板状の基板と、この基板の一側面に取り付けた発光チップと、この発光チップの周囲に硬化させた屈折率の異なる第１透光性樹脂と、この第１透光性樹脂の周囲に硬化させ波長変換材を混入したモールド樹脂と、このモールド樹脂の周囲に設けた第２透光性樹脂とから構成したことを特徴する発光体。A flat substrate, a light-emitting chip mounted on one side of the substrate, a first light-transmitting resin having a different refractive index cured around the light-emitting chip, and a light-curing resin around the first light-transmitting resin. A luminous body comprising: a mold resin mixed with a wavelength conversion material; and a second translucent resin provided around the mold resin.
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