JP2008041968A - Light emitting element module - Google Patents

Light emitting element module Download PDF

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Publication number
JP2008041968A
JP2008041968A JP2006215120A JP2006215120A JP2008041968A JP 2008041968 A JP2008041968 A JP 2008041968A JP 2006215120 A JP2006215120 A JP 2006215120A JP 2006215120 A JP2006215120 A JP 2006215120A JP 2008041968 A JP2008041968 A JP 2008041968A
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sealing
resin
light emitting
module
sealing resin
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JP5250949B2 (en
Inventor
Koki Hatsuda
Hiroshi Sagawa
弘毅 初田
博司 寒川
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Sony Chemical & Information Device Corp
ソニーケミカル&インフォメーションデバイス株式会社
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3025Electromagnetic shielding
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/54Encapsulations having a particular shape
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

<P>PROBLEM TO BE SOLVED: To improve light picking up efficiency from a light emitting element by preventing reflection in an interface between a first sealer and a second sealer in a light emitting element module which consists of the first sealer which directly seals a light emitting element such as an LED and the second sealer which seals its outside. <P>SOLUTION: In a light emitting element module 40, the first sealer 31 and the second sealer 32 are laminated one by one in a light emitting element (LED bare chip 20) on a base 1. Blurring treatment is carried out in an interface 33 between the first sealer 31 and the second sealer 32. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a light emitting element module in which a light emitting element is sealed with a resin on a substrate and a method for manufacturing the same.

  Light emitting elements such as light emitting diodes (LEDs) have features such as low power consumption, small size, and light weight, and those sealed with resin are used in various display lamps, etc. As LEDs have been developed and their brightness has been increased, their application to backlight light sources, illumination light sources, signal lights, etc. for liquid crystal display panels is rapidly progressing, and applications for automobile headlights are also being developed. .

  Conventionally, a bisphenol A glycidyl ether type epoxy resin having a refractive index of 1.53 to 1.57 has been used as an LED sealing material. However, as the brightness of LEDs increases and the temperature during LED operation increases and the encapsulant is exposed to high temperature and high intensity light, the conventional encapsulant made of epoxy resin is resistant to heat and light. There is a problem that the property (particularly, light resistance to UV and blue light) becomes insufficient and discoloration occurs, and the luminance of the LED decreases with time. To solve this problem, highly transparent epoxy resins have been developed, but sufficient heat resistance and light resistance have not yet been obtained.

  On the other hand, a gel type silicone resin is used for high-brightness LEDs. According to this silicone resin, heat resistance and light resistance are improved as compared with an epoxy resin, and further, deterioration of the chip due to thermal stress can be avoided by being a gel type. However, the gel type silicone resin has a stickiness on the surface after curing, is liable to be dusty and dusty, and is susceptible to scratches on the surface, and there is a problem in using it as a surface layer.

  On the other hand, in a light emitting element module in which the light emitting element is resin-sealed, the light emitted from the light emitting element is prevented from being totally reflected at the interface between the sealing resin and air, and the light extraction efficiency is increased. The outer shape is a dome shape, and a lens function is imparted to the sealing material. For example, a dome-shaped sealing material is formed by an injection molding method using a transparent resin such as a cyclic olefin copolymer, a gel type silicone resin is injected therein, and an LED chip is fixed in a cavity inside the sealing material. The thing is proposed (patent document 1).

  In addition, the LED bare chip is fixed to the concave portion of the base, and a gel type silicone resin is applied and cured on the LED bare chip. On the other hand, an epoxy resin is filled in a mold that is hollowed out in a dome shape. A method of inserting an LED sealed with a resin so as to cover it and curing an epoxy resin in a mold is known (Patent Document 2).

JP 2000-150968 A JP 2003-31848 A

  In the above-described prior art, the sealing material has two layers, and the second sealing material (outside) is made of a material having no tack and high hardness, so that the surface is easily sticky and scratched. It solves the problem peculiar to silicone resin that it is easy.

  However, in any of the above-described methods, the light emitted from the LED is reflected at the interface between the sealing material that directly seals the LED bare chip and the sealing material that is molded into a dome shape, thereby ensuring the light extraction efficiency. It cannot be increased.

  In order to solve such problems of the prior art, the present invention provides a light emitting element module comprising a first sealing material for directly sealing a light emitting element such as an LED and a second sealing material for sealing the outside thereof. In (1), the reflection at the interface between the first sealing material and the second sealing material is prevented, the light extraction efficiency from the light emitting element is improved, and (2) bubbles are present in the sealing material. Further, it is intended to make it possible to easily and compactly manufacture a light emitting element module whose sealing material has a lens function without using a mold.

  In producing a light emitting element module in which light emitting elements such as LEDs are sequentially sealed with a first sealing material and a second sealing material, the first sealing resin is formed on the light emitting elements. The material and the second sealing resin material are sequentially applied, and in a state where they are not completely cured, the interface between both the sealing resin materials is subjected to a blurring treatment, and thereafter, these are cured to obtain a light emitting element module. By doing so, since the refractive index continuously changes at the blurred interface between the first sealing material and the second sealing material, the interface between the first sealing material and the second sealing material In this method, it is possible to improve the light extraction efficiency, and according to this method, it is possible to remove bubbles by vacuum defoaming, and furthermore, by subjecting the substrate on which the light emitting element is mounted to an oil repellent treatment , Sealing resin material into dome shape without using formwork Can form, it found that a lens function can be imparted to the sealing material, thereby completing the present invention.

  That is, the present invention is a light emitting element module in which a first sealing material and a second sealing material are sequentially laminated on a light emitting element on a substrate, and the first sealing material and the second sealing material are stacked. Provided is a light emitting element module in which an interface with a material is subjected to a blurring process.

  In the present invention, the light emitting element is mounted on the base, and the first sealing resin material that is an uncured material of the first sealing material and the uncured material of the second sealing material are mounted thereon. A certain second sealing resin material is sequentially applied and annealed at room temperature to 120 ° C. for several minutes to several hours to blur the interface between the first sealing resin material and the second sealing resin material, and thereafter A method for manufacturing a light-emitting element module is provided in which a first sealing resin material and a second sealing resin material are completely cured.

  According to the light emitting element module of the present invention, the blurring process is applied to the interface between the first sealing material and the second sealing material that seals the light emitting element. The refractive index of the sealing material and the second sealing material are continuously changed, and light emitted from the light emitting element is prevented from being reflected at the interface between the first sealing material and the second sealing material. it can. Therefore, the light extraction efficiency of the light emitting element module can be improved.

  Moreover, according to the manufacturing method of the light emitting element module of this invention, the interface of a 1st sealing material and a 2nd sealing material can be blurred reliably and easily.

  Furthermore, according to this manufacturing method, the first sealing resin material, which is an uncured material of the first sealing material, is injected between the cured second material and the substrate of the light emitting element. Without applying the first sealing resin material and the second sealing resin material in sequence, the first sealing resin material and the second sealing resin material are cured, so that even if air bubbles are generated in the first sealing resin material, Air bubbles can be easily removed by performing vacuum defoaming before the material is cured.

  In addition, on the surface of the substrate, annular convex portions are respectively provided in a region surrounding the peripheral portion of the first sealing material and a region surrounding the peripheral portion of the second sealing material, and an oil repellent is provided in the region surrounding the light emitting element. If the treatment is performed, the sealing resin material can be formed into a dome shape without using a mold, and the light extraction efficiency of the light emitting element module can be further improved by a simple manufacturing method. Become.

  Hereinafter, the present invention will be described in detail with reference to the drawings. In each figure, the same numerals indicate the same or equivalent components.

  FIG. 1 is a cross-sectional view of an LED module 40 which is an embodiment of the light emitting element module of the present invention. In this LED module 40, a first sealing material 31 and a second sealing material 32 are sequentially laminated on the LED bare chip 20 bonded and fixed to the base 1. And the second sealing material 32 are characterized by being subjected to a blurring process. Here, the interface 33 is subjected to the blurring process means that there is no clear interface between the first sealing material 31 and the second sealing material 32, that is, the first sealing material. This means that the refractive index continuously changes at the blurred interface between 31 and the second sealing material. By the blurring process of the interface 33, the light emitted from the LED bare chip 20 is prevented from being reflected by the interface 33 between the first sealing material 31 and the second sealing material 32, and more light is emitted from the LED module. 40 can be taken out. In the figure, reference numeral 7 denotes a lead electrode connected to the electrode terminal of the LED bare chip 20.

  As a manufacturing method of the LED module 40, for example, the LED bare chip 20 is first mounted by bonding and fixing to the substrate 1, and then the first sealing material is uncured on the LED bare chip 20. The first sealing resin material is applied to cover the LED bare chip 20, and then the second sealing material is formed on the first sealing resin material without completely curing the first sealing resin material. An uncured second sealing resin material is applied, followed by annealing to blur the interface between the first sealing resin material and the second sealing resin material, and then the first sealing The resin material and the second sealing resin material are completely cured to obtain the LED module 40.

  Here, there is no restriction | limiting in particular as the base | substrate 1, The injection molding body of engineering plastics, such as ABS resin and polyphthalamide conventionally used as a base | substrate of LED, can be used. A lead electrode and a heat sink can be built in the molded body. Further, as the substrate 1, a rigid substrate or a flexible substrate can be used instead of such a molded body.

  On the surface of the substrate 1, it is preferable to form the annular convex portion 2 in a region surrounding the peripheral edge of the first sealing material 31 and the peripheral edge of the second sealing material 32. Thereby, it is possible to prevent the first sealing resin material and the second sealing resin material from flowing and spreading on the surface of the substrate 1. The specific shape of the annular protrusion 2 is, for example, as a double stepped shape having a first vertical surface 2 a and a second vertical surface 2 b erected with respect to the bottom surface of the substrate 1 as shown in FIG. Alternatively, as shown in FIG. 2, a double stepped shape having a first inclined surface 2c and a second inclined surface 2d standing with respect to the bottom surface of the substrate 1 may be used. As shown in FIG. Alternatively, the rectangular annular protrusions 2e and 2f may be provided adjacent to each other in a double manner, or the triangular or rectangular annular protrusions 2g and 2h may be provided in a double manner with a gap as shown in FIG. Good. Moreover, as shown in FIG. 5, you may provide the cyclic | annular convex part 2i which has a single slope. Especially, as the annular convex part 2, it is preferable to form a single slope as shown in FIG. 5 from a simple structure.

  Also, an oil repellent treatment layer 3 is provided in advance in the region surrounding the LED mounting portion on the surface of the substrate 1 before application of the first sealing resin material and the second sealing resin material, and the interfacial tension on the substrate surface Is preferably reduced. Thereby, it can prevent that these sealing resin materials flow and spread on the surface of the base 1. In particular, as shown in FIG. 6, this oil-repellent treatment is essential when using a substrate 1 that is flat and does not have an annular convex portion. Furthermore, it becomes possible to form the 1st sealing material 31 and the 2nd sealing material 32 in a dome shape (namely, shield shape to hemisphere), respectively, without using a formwork.

  The oil repellent treatment layer 3 can be provided by applying an oil repellent having a low surface tension to the surface of the substrate 1 and forming a film thereof. Here, as the oil repellent, a fluororesin is preferable, and a coating of the oil repellent can be easily formed by diluting the resin with a solvent, coating and drying.

  As a typical example of the fluororesin, a homopolymer of perfluoroalkyl acrylate or methacrylate (alkyl group having 6 to 9 carbon atoms) can be given. This homopolymer is used after being dissolved in a fluorinated solvent. As the oil repellent, a copolymer such as perfluoroalkyl acrylate and lauryl acrylate can also be used. This copolymer can be diluted using a general-purpose solvent such as toluene or methyl ethyl ketone.

  In addition, although the application | coating area | region of the lube repellant on the surface of the base | substrate 1 can be made into the area | region surrounding the LED mounting part also including the cyclic | annular convex part 2, it does not apply | coat to the LED mounting part. When an oil repellent is applied to the LED mounting site, it is difficult to bond and fix the LED bare chip to the LED mounting portion. Moreover, since it will apply | coat to the surface of the LED bare chip 20, the light extraction efficiency will worsen because the refractive index of an oil repellent agent is low.

  As the first sealing resin material, the hardened material (that is, the first sealing material 31) is preferably not hard, and more specifically, the Shore A hardness is preferably 70 or less. Thereby, in the LED module 40, the thermal stress which arises between the LED bare chip 20 and the 1st sealing material 31 can be relieve | moderated, and it becomes possible to extend the light emission lifetime of the LED bare chip 20 significantly. There is no restriction | limiting in particular about the minimum of the hardness of the 1st sealing material 31, A soft gel form may be sufficient.

  The viscosity of the first sealing resin material is preferably 50 Pa · S or less at 25 ° C., more preferably 10 Pa · S or less. This makes it difficult for bubbles to be generated when the first sealing resin material is applied onto the LED bare chip 20, and even when bubbles are generated, the bubbles can be effectively removed by vacuum defoaming or the like. Can do.

  The refractive index of the first sealing material 31 that is a cured product of the first sealing resin material is the refractive index of the substrate of the LED bare chip (1.76 in the case of a sapphire substrate) and the second from the viewpoint of light extraction efficiency. The refractive index of the sealing material 32 is preferably 1.40 to 1.76. Therefore, as the refractive index of the first sealing resin material that is an uncured product, it is preferable to use a material having a refractive index lower by 0.01 to 0.03 than this. This is because the refractive index usually increases by 0.01 to 0.03 by curing.

  In view of the above-mentioned hardness, viscosity, and refractive index, examples of suitable resins for the first sealing resin material include silicone resins, acrylic resins, methacrylic resins, urethane resins, and epoxy resins. Silicone resin, acrylic resin, and methacrylic resin are preferable.

  Moreover, additives, such as an antifoamer, a polymerization inhibitor, and a polymerization initiator, can be added to the first sealing resin material as necessary.

  As a method for applying the first sealing resin material onto the LED bare chip 20, it is preferable to use a syringe, a dispenser, or the like, for example, and arrange it in a dome shape.

  After apply | coating the 1st sealing resin material on the LED bare chip 20, a defoaming process is performed as needed. That is, even when a low-viscosity resin is used as the first sealing resin material and an antifoaming agent is further added, the stepped portion of the LED bare chip 20 itself, the periphery of the joint between the LED bare chip 20 and the base 1, the LED It is difficult to completely eliminate the generation of bubbles around the joint between the bare chip 20 and the electrode, around the bonding wire, and the like. Therefore, bubbles generated in the sealing resin or on the surface thereof are removed by defoaming treatment.

  As the defoaming treatment, vacuum defoaming is preferable from the viewpoint of the defoaming effect. The vacuum defoaming is a process of expanding and rupturing bubbles by applying a first sealing resin material and then applying a vacuum in a vacuum chamber or the like. In the present invention, when the first sealing resin material is applied onto the LED bare chip 20, the first sealing resin material is a cured product of the second sealing resin material (second sealing material 32). Therefore, vacuum deaeration can be easily performed.

  In the case where the first sealing material 31 and the second sealing material 32 are each formed into a dome shape, the first sealing resin material is a low-viscosity resin material having a viscosity of 5 Pa · S (25 ° C.) or less. When is used, it is preferable that the first sealing resin material is applied onto the LED bare chip 20 and then semi-cured. By semi-curing, it becomes easy to make the application shape after applying the second sealing resin material on the first sealing resin material into a dome shape. Moreover, since most of the shrinkage that occurs when the resin is cured is completed by this semi-curing, it is possible to minimize the occurrence of stress strain when the resin is completely cured later.

  This semi-curing is carried out by curing at a lower temperature than the main curing, curing with a small UV irradiation amount, shortening the curing time, etc. The degree of semi-curing is preferably such that the fluidity is lost.

  On the other hand, the second sealing material 32 is formed to have an exterior function and a lens function. One of the important characteristics for the lens function is to maximize the light extraction efficiency. Therefore, the second sealing material 32 is preferably formed in a dome shape, particularly a hemispherical shape.

  In order to form a hemisphere without using a mold, the second sealing resin material preferably has a viscosity (25 ° C.) of 0.1 to 1000 Pa · S. If the viscosity of the second sealing resin material is lower than this, the second sealing resin material is applied onto the first sealing resin material, depending on the application shape of the first sealing resin material. At this time, the second sealing resin material tends to flow and does not easily become hemispherical.

  Since the second sealing resin material is formed into a hemispherical shape, the peripheral portion of the second sealing resin material is formed on the surface of the base 1 as in the case where the first sealing resin material is formed into a dome shape. It is preferable to provide the annular convex portion 2b so as to surround it, and it is preferable to perform an oil repellent treatment. Note that the oil-repellent treatment is not necessarily performed on both the peripheral portion of the first sealing resin material and the peripheral portion of the second sealing resin material. For example, as shown in FIG. You may give only to the peripheral part of this sealing resin material. In addition, when the viscosity of the sealing resin material is high and the spread during application is small, the oil repellent treatment may be omitted completely.

  The refractive index of the second sealing material 32 increases the light extraction efficiency of the LED module 40, so that the difference between the refractive index of the first sealing material 31 and the refractive index of the second sealing material 32 is different. It is preferable to design so that it may become small, and specifically, it is preferable to set it within 0.035. If the difference in refractive index between the two sealing materials is large, reflection or refraction occurs at the interface between them, and there arises a problem that the radiation characteristics as designed cannot be obtained or the light extraction efficiency is lowered.

  The refractive index of the second sealing material 32 may be smaller or larger than the refractive index of the first sealing material 31. Therefore, more specifically, the refractive index of the second sealing material 32 is set to 1.395 to 1.465 when the refractive index of the first sealing material 31 is 1.43, for example. It is preferable.

  As the exterior function of the second sealing material 32, it is necessary to have a rigidity that does not deform under normal use conditions after the second sealing material is cured. For example, the Shore A hardness is 30 or more. It is preferable that it is 50 or more. Further, the surface is dry touch, and it is required that dust or the like is not easily attached.

  Preferred examples of the resin component of the second sealing material resin material forming the second sealing material 32 include silicone resin, acrylic resin, methacrylic resin, urethane resin, epoxy resin, and cyclic olefin resin. In particular, acrylic resin, methacrylic resin, and epoxy resin are preferable.

  However, as the second sealing resin material, it is necessary to use a material whose interface with the first sealing resin material is sufficiently blurred by annealing. Therefore, a material that satisfies at least one of the following conditions is selected as the first sealing resin material and the second sealing resin material.

(1) One or more components included in the first sealing resin material and one or more components included in the second sealing resin material are compatible with each other.
(2) One or more components contained in the first sealing resin material and one or more components contained in the second sealing resin material form a chemical bond.
(3) At least one of the first sealing resin material and the second sealing resin material contains a compatibilizing agent. Here, as the compatibilizing agent, (a) a graft polymer, a block polymer, a copolymer comprising component A compatible with the first sealing resin material and component B compatible with the second sealing resin material (B) surfactants, (c) silane coupling agents, and the like.

  On the other hand, when the first sealing resin material and the second sealing resin material are completely incompatible (for example, a silicone resin and an epoxy resin), the first sealing resin material and the second sealing resin are used. When the curing system of the stopping resin material does not react with each other (for example, when the silicone resin is cured by hydrosilylation and the epoxy resin is cured with an acid anhydride), and when no compatibilizer is added, the first The interface between the sealing material and the second sealing material cannot be sufficiently blurred by annealing.

  Annealing is performed after laminating the first sealing resin material and the second sealing resin material and before curing them. This blurs the interface between the first sealing resin material and the second sealing resin material, eliminates a sudden change in refractive index, prevents reflection at these interfaces, and improves the light extraction efficiency. It is possible to raise.

  It is important that the annealing be performed under conditions where the first sealing resin and the second sealing resin are not completely cured. Usually, it is carried out at room temperature to 120 ° C. for several minutes to several hours, more preferably at 40 to 80 ° C. for 10 minutes to 1 hour, and particularly when radical curing is performed, for example, a lower temperature of 60 ° C. or lower. Perform at the temperature setting.

  The complete curing of the first sealing resin material and the second sealing resin material performed after annealing can be performed by UV curing, thermal radical curing, photooxidation curing, hydrosilylation curing, or the like. A curing method that generates a gas or a solvent is not preferable.

  The degree of blurring of the interface between the first sealing material and the second sealing material after complete curing can be evaluated as follows. The light emitting element module is cut along the AB plane and the A′-B ′ plane as shown in FIG. 11 to produce the evaluation module 50, and as shown in FIG. The light is projected so that the incident angle θ with respect to the second sealing material 32 and the interface 33 with respect to 31 is 60 °. The incident light L0 is divided into transmitted light L1 and reflected light L2 at the interface 33, and the amount of light of the reflected light L2 is measured. Here, in order to prevent reflection of the incident light L0 on the cut surface, the cut surface is formed to be perpendicular to the incident light L0.

  When the interface 33 is not present at all, the reflected light L2 is not generated, but the more the interface 33 is clearly present, the greater the amount of the reflected light L2. Therefore, when the light amount of the light L2 reflected by the interface 33 with respect to the light amount of the incident light L0 is 5% or less, the interface 33 between the first sealing material 31 and the second sealing material 32 is sufficient. Assess that you are blurred.

  As described above, in the present invention, since the difference in refractive index between the first sealing material and the second sealing material is preferably as small as 0.035 or less, the total reflection is obtained when the incident angle θ is 60 °. Does not occur. In addition, since the interface between the first sealing material and the second sealing material is blurred, specific numerical values and magnitude relationships of the difference in refractive index between the first sealing material and the second sealing material Regardless, the amount of reflected light L2 relative to the amount of incident light L0 is 5% or less.

  The light emitting element module of the present invention can take various modes. For example, the base body 1 and the LED bare chip 20 may not be directly joined, and the base body 1 and the LED bare chip 20 may be indirectly joined via a circuit board made of silicon or the like separately. In this case, the LED bare chip 20 and the circuit board are subjected to bump bonding such as flip chip, and the circuit board and the base body 1 are bonded to gold.

  If there is a gap between the substrate 1 and the LED bare chip 20, the gap may be filled with the first sealing material 31, but an underfill sealing resin is prepared separately for underfill. You may fill with sealing resin. The properties of the underfill sealing resin are preferably high thermal conductivity and heat resistance. As such a resin, for example, a silicone resin filled with alumina powder can be used.

  Further, a reflection plate may be appropriately provided on the surface of the substrate 1, and a plurality of LED bare chips may be arranged and sealed.

  As the light emitting element, an EL element or the like can be provided in addition to the LED.

  Hereinafter, based on an Example, this invention is demonstrated in detail.

Example 1
(1) Preparation of first sealing resin material
9,9-bis (4- (2-acryloxyethoxy) phenyl) fluorene (Osaka Gas Chemical Co., Ltd., BPEF-A) 25 parts by weight and phenoxyethyl acrylate 75 parts by weight were added to this, and a polymerization initiator (Ciba-Geigy) was added. Specialty Chemicals, Darocur 1173) 1 part by weight was added to make a first sealing resin material.

The obtained first sealing resin material has a viscosity of 60 mPa · S (25 ° C.) and a refractive index of 1.539, and is cured by irradiating it with a halogen lamp (integrated light amount 1 J / cm 2 ). Had a Shore A hardness of 70.

(2) Preparation of second sealing resin material
9,9-bis (4- (2-acryloxyethoxy) phenyl) fluorene (Osaka Gas Chemical Co., Ltd., BPEF-A) 50 parts by weight and isobornyl acrylate 50 parts by weight were blended, and a polymerization initiator ( 1 part by weight of Ciba-Geigy Specialty Chemicals, Darocur 1173) was added to make a second sealing resin material.

The obtained second sealing resin material has a viscosity of 450 mPa · S (25 ° C.) and a refractive index of 1.541, and is cured by irradiating it with a halogen lamp (integrated light amount 1 J / cm 2 ). Had a Shore A hardness of 97.

(3) Manufacture of LED module As shown to FIG. 8A-FIG. 8F, LED module 41 which resin-sealed LED was obtained.

  That is, by cutting out the ABS resin, a base 1A of 6 mm × 6 mm × 2 mm (thickness) is obtained, a hole having a diameter of 2 mm is formed in the central portion of the base, and a hole having a diameter of 2 mm and a thickness of 1. A 5 mm copper cylinder 4 was fitted (FIG. 8A). Next, triangular grooves 5a and 5b having a width of 0.75 mm and a depth of 0.3 mm are dug in a ring shape on the upper surface of the base 1A, and a groove 6 having a width of 0.75 mm and a depth of 0.3 mm is further dug ( 8B), an electrode 7a was fitted in the groove 6 (FIG. 8C).

  And the green LED bare chip 20 of 1.00 mm square was adhere | attached on the copper cylinder 4 with the conductive adhesive, and the LED bare chip 20 and the electrode 7a were connected by the wire bonding of the gold wire 21. FIG.

Next, the substrate 1A, the first encapsulation resin material 31 0 via syringe to the inside of the groove 5a Serve (Figure 8D), removing air bubbles by vacuum degassing, the first encapsulation resin material 31 again 0 And UV-irradiated 0.1 J to be semi-cured. Immediately thereafter, spread a second encapsulation resin material material 32 0 to the groove 5b of the outer over the first encapsulation resin material 31 0 (Fig. 8E), first by annealing of 60 ° C. 10 minutes encapsulation resin material 31 0 and the second blurred interface 33 0 in the sealing resin material 32 0, subsequently a first sealing resin material 31 0 by irradiating UV at 1J second encapsulation resin material 32 0 was completely cured to obtain an LED module 41 (FIG. 8F).

  When the presence or absence of bubbles in the first sealing material 31 and the second sealing material 32 of the LED module 41 was examined with an optical microscope, no bubbles were recognized.

  Further, when the total amount of light extracted was measured by measuring the total amount of light using an integrating sphere, it was 2.5 times that of the bare chip.

Comparative Example 1
In Example 1, after the dished the second encapsulation resin material material 32 0 on the first encapsulation resin material 31 0, without annealing, was immediately completely cure both the encapsulation resin material Except for the above, an LED module was produced in the same manner as in Example 1.

  When the total amount of light extracted from this LED module was examined in the same manner as in Example 1, it was 1.95 times that of the bare chip.

Example 2
(1) Preparation of first sealing resin material
9,9-bis (4- (2-acryloxyethoxy) phenyl) fluorene (Osaka Gas Chemical Co., BPEF-A) 12.5 parts by weight and paracumylphenoxyethyl acrylate (Toagosei Co., Aronix M110) 12.5 Part by weight and 75 parts by weight of phenoxyethyl acrylate were blended, and 1 part by weight of a polymerization initiator (Ciba Geigy Specialty Chemicals, Darocur 1173) was added thereto to form a first sealing resin material.

The obtained first sealing resin material has a viscosity of 50 mPa · S (25 ° C.) and a refractive index of 1.531, and is cured by irradiating it with a halogen lamp (integrated light amount 1 J / cm 2 ). Had a Shore A hardness of 65.

(2) Preparation of second sealing resin material
9,9-bis (4- (2-acryloxyethoxy) phenyl) fluorene (Osaka Gas Chemical Co., BPEF-A) 45 parts by weight, paracumylphenoxy acrylate (Toagosei Co., Aronix M110) 45 parts by weight and trimethylol 10 parts by weight of propane triacrylate was blended, and 1 part by weight of a polymerization initiator (Ciba Geigy Specialty Chemicals, Darocur 1173) was added thereto to obtain a second sealing resin material.

The obtained second sealing resin material has a viscosity of 5000 mPa · S (25 ° C.) and a refractive index of 1.565, and is cured by irradiating it with a halogen lamp (integrated light amount 1 J / cm 2 ). Had a Shore A hardness of 97.

(3) Manufacture of LED Module As shown in FIGS. 9A to 9G, an LED module 42 in which the LED bare chip 20 was resin-sealed was obtained.

  That is, one side of the double-sided flexible substrate 1B made of polyimide was etched to form a circuit unit (4 mm × 4 mm) shown in FIG. 9A. Here, reference numerals 7b and 7c are electrodes, and the central electrode 7b is connected to the back electrode 7d through a through hole.

  Next, the reflective surface 8 was formed around the electrode 7b by vapor deposition of silver (FIG. 9B), and the oil repellent (3M Company, EGC-1720) 3 was coated around the reflective surface 8 (FIG. 9C). .

  Next, the blue LED bare chip 20 having both electrodes on one side was mounted on the etched surface of the flexible substrate 1B by etching and connected to the electrodes 7b and 7c (FIG. 9D).

Next, Serve using a syringe to the first encapsulation resin material 31 0 directly above the flexible substrate 1B whose diameter becomes 3 mm (Fig. 9E), removing air bubbles by vacuum degassing, the UV 0 Semi-cured by 1J irradiation. Immediately thereafter, the second sealing resin material 32 0 on the first encapsulation resin material 31 0, Serve as its diameter is 3.75 mm (FIG. 9F), perform annealing 60 ° C. 10 minutes , we continue to completely cure the first sealing resin material 31 0 and the second encapsulation resin material 32 0 irradiated with UV for 1 J, to afford the LED module 42 (FIG. 9G).

  When the presence or absence of bubbles in the first sealing material 31 and the second sealing material 32 of the LED module 42 was examined with an optical microscope, no bubbles were recognized.

  Further, when the total amount of light extracted was measured by measuring the total light amount using an integrating sphere, it was 1.75 times that of the bare chip.

Comparative Example 2
In Example 2, except the second encapsulation resin material 32 0 After dished on the first encapsulation resin material 31 0, without performing annealing, in which immediately completely cure both the encapsulation resin material Produced an LED module in the same manner as in Example 2.

  When the total amount of light extracted from this LED module was examined by measuring the total amount of light with an integrating sphere, it was 1.65 times that of the bare chip.

Example 3
A flexible circuit board 1 </ b> C in which 12 circuit units similar to Example 2 were arranged in a total of 12 vertically and 4 horizontally was manufactured. As shown in FIG. 10, the LED bare chip 20 is mounted in each circuit unit, the first sealing resin material and the second sealing resin material are sequentially arranged, annealed, and cured. An arrayed LED module 43 was produced.

  The total light extraction amount of each LED in the LED module 43 was 1.75 times on average with respect to the bare chip.

  The method for producing a light emitting element module according to the present invention is useful as a resin sealing method for light emitting elements such as LEDs, semiconductor lasers, EL elements and the like. Used in various fields such as optical communication.

It is sectional drawing of an LED module. It is sectional drawing of an LED module. It is sectional drawing of an LED module. It is sectional drawing of an LED module. It is sectional drawing of an LED module. It is sectional drawing of an LED module. It is sectional drawing of an LED module. FIG. 6 is a plan view and a cross-sectional view of the LED module of Example 1 during the manufacturing process. FIG. 6 is a plan view and a cross-sectional view of the LED module of Example 1 during the manufacturing process. FIG. 6 is a plan view and a cross-sectional view of the LED module of Example 1 during the manufacturing process. FIG. 6 is a cross-sectional view of the LED module of Example 1 during the manufacturing process. FIG. 6 is a cross-sectional view of the LED module of Example 1 during the manufacturing process. FIG. 6 is a cross-sectional view of the LED module of Example 1 during the manufacturing process. FIG. 7 is a plan view and a cross-sectional view of the LED module of Example 2 during the manufacturing process. FIG. 10 is a plan view of the LED module of Example 2 during the manufacturing process. FIG. 10 is a plan view of the LED module of Example 2 during the manufacturing process. FIG. 7 is a plan view and a cross-sectional view of the LED module of Example 2 during the manufacturing process. FIG. 7 is a plan view and a cross-sectional view of the LED module of Example 2 during the manufacturing process. FIG. 7 is a plan view and a cross-sectional view of the LED module of Example 2 during the manufacturing process. FIG. 7 is a plan view and a cross-sectional view of the LED module of Example 2 during the manufacturing process. 6 is a plan view of an LED module of Example 3. FIG. It is sectional drawing of the module for evaluation. It is explanatory drawing of the evaluation method of the grade of the blurring of an interface.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate 1A Base 1B Flexible substrate 2 Annular convex part 3 Oil-repellent treatment layer or oil-repellent agent 4 Copper cylinder 5a, 5b Triangular groove 6 Groove 7 Electrode 7a Electrode 7b Electrode 7c Electrode 7d Back surface electrode 8 Reflecting surface 20 LED or LED bare chip 21 Gold wire 31 1st sealing material 31 0 1st sealing resin material 32 2nd sealing material 32 0 2nd sealing resin material 33 Interface of 1st sealing material and 2nd sealing material 33 0 the first encapsulation resin material and a surface 40, 41, 42, 43 LED modules 50 evaluation module of the second encapsulation resin material

Claims (11)

  1.   A light-emitting element module in which a first sealing material and a second sealing material are sequentially stacked on a light-emitting element on a substrate, and blurring at an interface between the first sealing material and the second sealing material A light emitting device module that has been processed.
  2.   An annular convex portion is provided on each of the region surrounding the periphery of the first sealing material on the surface of the substrate and the region surrounding the periphery of the second sealing material, and the first sealing material and the second sealing material are provided. The light emitting element module according to claim 1, wherein the light emission surface of the stopper is formed in a dome shape.
  3.   The light emitting element module according to claim 2, wherein the annular convex portion is formed of a double inclined surface or a vertical surface.
  4.   The light emitting element module according to claim 1, wherein the Shore A hardness of the first sealing material is 70 or less, and the Shore A hardness of the second sealing material is 50 or more.
  5.   The light emitting element module according to any one of claims 1 to 4, wherein a difference in refractive index between the first sealing material and the second sealing material is within 0.035.
  6.   A light emitting element is mounted on a substrate, and a first sealing resin material that is an uncured material of the first sealing material and a second sealing material that is an uncured material of the second sealing material are mounted thereon. By sequentially applying resin materials and annealing at room temperature to 120 ° C. for several minutes to several hours, the interface between the first sealing resin material and the second sealing resin material is blurred, and then the first sealing is performed. A method for manufacturing a light emitting element module, wherein a resin material and a second sealing resin material are completely cured.
  7.   The method for manufacturing a light emitting element module according to claim 6, wherein the base has annular convex portions in a region surrounding the peripheral portion of the first sealing material and a region surrounding the peripheral portion of the second sealing material.
  8.   The method for manufacturing a light emitting element module according to claim 7, wherein the annular convex portion is a double inclined surface or a vertical surface.
  9.   The light emitting element module according to any one of claims 6 to 8, wherein an oil-repellent treatment is performed on a region surrounding the light emitting element on the surface of the substrate, and then the first sealing resin material and the second sealing resin material are sequentially applied. Manufacturing method.
  10.   The viscosity (25 ° C.) of the first sealing resin material is 50 Pa · S or less, the Shore A hardness of the cured product is 70 or less, and the viscosity (25 ° C.) of the second sealing resin material is 0.1 to 0.1 The method for producing a light-emitting element module according to claim 6, wherein the cured product has a Shore A hardness of 50 or more.
  11. The method for manufacturing a light emitting element module according to any one of claims 6 to 9, wherein a difference in refractive index between the first sealing resin material and the second sealing resin material is 0.035 or less.

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