KR20090032867A - Orientation angle changing lens and light emitting device comprising the same - Google Patents

Orientation angle changing lens and light emitting device comprising the same Download PDF

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KR20090032867A
KR20090032867A KR1020070098431A KR20070098431A KR20090032867A KR 20090032867 A KR20090032867 A KR 20090032867A KR 1020070098431 A KR1020070098431 A KR 1020070098431A KR 20070098431 A KR20070098431 A KR 20070098431A KR 20090032867 A KR20090032867 A KR 20090032867A
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light
light emitting
central axis
emitting device
emitting diode
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KR100947440B1 (en
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정찬성
이상철
서태원
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서울반도체 주식회사
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0009—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only
    • G02B19/0014—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only at least one surface having optical power
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/02—Simple or compound lenses with non-spherical faces
    • G02B3/04—Simple or compound lenses with non-spherical faces with continuous faces that are rotationally symmetrical but deviate from a true sphere, e.g. so called "aspheric" lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/02—Simple or compound lenses with non-spherical faces
    • G02B3/08—Simple or compound lenses with non-spherical faces with discontinuous faces, e.g. Fresnel lens
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139—Silver (Ag) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)

Abstract

An orientation angle changing lens and a light emitting device for a backlight including the same are provided to improve uniformity of a backlight source by changing an orientation angle pattern the light emitted from a light emitting diode. An orientation angle changing lens includes a light outputting surface(31) and a light inputting surface(32). The light outputting surface is radially symmetrical around the center of a central axis line. In the light outputting surface, the outside of the central axis line is a convexly curved surface. In the light outputting surface, the inside of the curved surface has a concave shape. The light inputting surface is radially symmetrical around the center of the central axis line. The light inputting surface has the concave shape. The light inputting surface has a cone shape. The vertex of the conical shape is positioned in the central axis line.

Description

지향각 변환 렌즈 및 그것을 포함하는 백라이트용 발광장치{ORIENTATION ANGLE CHANGING LENS AND LIGHT EMITTING DEVICE COMPRISING THE SAME}ORIENTATION ANGLE CHANGING LENS AND LIGHT EMITTING DEVICE COMPRISING THE SAME}

본 발명은, 발광다이오드에서 발생한 광의 지향각을 변환시키는 렌즈에 관한 것으로서, 더욱 상세하게는, 광의 지향각을 넓히도록 구성된 지향각 변환 렌즈 및 그것을 포함하는 백라이트용 발광장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lens for converting a directivity angle of light generated in a light emitting diode, and more particularly, to a directivity conversion lens configured to widen a directivity angle of light and a light emitting device for a backlight including the same.

발광다이오드(Light Emitting Diode; LED)는 전류 인가에 의해 P-N 반도체 접합(P-N junction)에서 전자와 정공이 만나 빛을 발하는 반도체 발광 장치로서, 통상, LED 칩(또는, 다이)을 포함하는 패키지 구조로 제작되며, 그와 같은 구조의 발광장치는 흔히 'LED 패키지'라 칭해진다.A light emitting diode (LED) is a semiconductor light emitting device in which electrons and holes meet and emit light at a PN junction by applying an electric current. A light emitting diode (LED) is typically a package structure including an LED chip (or a die). The light emitting device having such a structure is often referred to as an 'LED package'.

통상, LED 패키지는 LED칩을 외부로부터 보호하기 위한 봉지재를 포함한다. 또한, LED 패키지는, 전력인가를 위해, 리드프레임이 지지된 하우징을 포함하거나, 또는, 전력인가를 위한 회로 패턴이 형성된 PCB를 포함할 수 있다. 하우징을 포함하는 LED 패키지의 경우, 봉지재는 하우징에 형성된 캐비티 내에 채워지며, PCB 상에 LED칩이 실장되는 경우, 봉지재는 PCB 상에서 LED칩을 덮도록 트랜스퍼 몰딩 등에 의해 형성된다. 그 외 램프형 구조의 LED 패키지가 존재한다.Typically, the LED package includes an encapsulant for protecting the LED chip from the outside. In addition, the LED package may include a housing on which the leadframe is supported for power application, or may include a PCB on which a circuit pattern for power application is formed. In the case of the LED package including the housing, the encapsulant is filled in the cavity formed in the housing, and when the LED chip is mounted on the PCB, the encapsulant is formed by transfer molding or the like to cover the LED chip on the PCB. In addition, there is an LED package of a lamp type structure.

LED 패키지 또는 그와 유사한 기능의 발광장치는, 백라이트유닛의 광원으로 주로 이용된다. 그 중에서도, 직하형 백라이트 유닛은 복수의 LED 패키지가 LCD 패널과 같은 조명객체 아래에 일정한 간격으로 배열되도록 구성된다. 이때, 서로 이웃하는 복수의 LED 패키지들은 백색광을 구현하도록 서로 다른 색 또는 파장의 광을 방출하는 것일 수 있다.A light emitting device having an LED package or similar function is mainly used as a light source of a backlight unit. In particular, the direct type backlight unit is configured such that a plurality of LED packages are arranged at regular intervals under an illumination object such as an LCD panel. In this case, the plurality of LED packages adjacent to each other may be to emit light of different colors or wavelengths to implement white light.

위와 같은 백라이트 유닛에 있어서, 균일도 높은 광을 얻고 색편차를 줄이기 위해서는, 서로 이웃하는 LED 패키지들 사이의 광 혼합이 균일하게 이루어져야 한다. 그리고, 그와 같은 균일한 광 혼합을 위해서는, LED 패키지의 중심 외측에서의 광량 또는 광세기가 중심에서의 광량 또는 광세기보다 큰 것이 바람직하다. 예컨대, 복수의 LED 패키지가 35mm 피치 간격으로 이격된 구조의 직하형 백라이트 유닛에서, 지향각 곡선의 피크 각도(peak angle)가 67도가 되게 하고, 중심 부분의 광량 또는 광 세기가 피크 각도에서의 광량 또는 광세기의 약 40%가 되게 하면, 광의 균일도가 매우 좋아진다는 것을 본 발명자는 알게 되었다.In the backlight unit as described above, in order to obtain high uniformity of light and reduce color deviation, light mixing between neighboring LED packages should be uniform. And, for such uniform light mixing, it is preferable that the light amount or light intensity outside the center of the LED package is larger than the light amount or light intensity at the center. For example, in a direct backlight unit having a structure in which a plurality of LED packages are spaced at 35 mm pitch intervals, the peak angle of the directivity angle curve is 67 degrees, and the light amount or light intensity at the center portion is the light amount at the peak angle. Alternatively, the inventors have found that the uniformity of light becomes very good when it is about 40% of the light intensity.

따라서, 본 발명의 기술적 과제는, LED 패키지와 같은 발광다이오드의 상부에 제공되어, 지향각 곡선의 피크 각도가 중심으로부터 벗어난 외곽에 위치하도록 발광다이오드로부터 나온 광의 지향각을 변화시키는 지향각 변환 렌즈를 제공하는 것이다.Accordingly, a technical object of the present invention is to provide a direct-angle conversion lens that is provided on an upper surface of a light emitting diode such as an LED package and changes the directivity angle of light emitted from the light-emitting diode so that the peak angle of the directivity curve is located outside the center. To provide.

또한, 본 발명의 다른 기술적 과제는, 지향각 곡선의 피크 각도가 중심으로 부터 벗어난 외곽에 위치하도록 발광다이오드로부터 나온 광의 지향각을 변화시키는 지향각 변환 렌즈를 이용하여, 균일도 높고(더 나아가, 색편차를 크게 줄인) 백라이트 광원을 제공할 수 있는 발광장치를 제공하는 것이다. In addition, another technical object of the present invention is to use a divergence angle conversion lens for varying the divergence angle of the light emitted from the light emitting diode such that the peak angle of the divergence angle curve is located outside the center, thereby increasing the uniformity (more, It is to provide a light emitting device capable of providing a backlight light source (which greatly reduces the deviation).

발광다이오드의 상부에 위치하는 광의 지향각 변환 렌즈가 개시된다. 개시된 지향각 변환 렌즈는, 중심축선을 중심으로 방사상으로 대칭을 이루되, 상기 중심축선의 외측이 볼록한 곡면으로 되고, 상기 곡면 안쪽이 오목한 형상을 갖는 출광면과, 상기 중심축선을 중심으로 방사상으로 대칭을 이루며, 오목한 형상을 갖는 입광면을 포함한다. 이때, 상기 지향각 변환 렌즈는 예를 들면, 실리콘 또는 에폭시와 같은 투광성 수지로 이루어지는 것이 바람직하며, 그 내부에는 형광체가 포함될 수 있다.Disclosed is a directed angle conversion lens of light positioned above the light emitting diode. The disclosed angle conversion lens is radially symmetric about a central axis, the outer surface of the central axis becomes a convex curved surface, and an outgoing surface having a concave shape inside the curved surface, and radially around the central axis. It comprises a light incident surface which is symmetrical and has a concave shape. In this case, the orientation angle conversion lens is preferably made of a light-transmissive resin such as silicon or epoxy, and a phosphor may be included therein.

바람직하게는, 상기 입광면은 꼭지점이 상기 중심축선 상에 위치하는 원추형의 면이며, 상기 원추형의 입광면은 상기 중심축선 외측으로 벗어나 있는 출광면의 볼록한 면으로 광을 보내는데 적합하다. 이때, 상기 입광면은 상기 발광다이오드와 이격되며, 상기 입광면과 상기 발광다이오드와의 사이에는 공기층이 존재하는 것이 바람직하다. 또한, 상기 출광면은 상기 중심축에서 교차하는 한 쌍의 원성분의 회전 궤적에 의해 결정되는 것이 바람직하다.Preferably, the light incident surface is a conical surface whose vertex is located on the central axis, and the conical light incident surface is suitable for sending light to the convex surface of the light exiting surface deviating outside the central axis. In this case, the light incident surface is spaced apart from the light emitting diode, and an air layer is present between the light incident surface and the light emitting diode. In addition, the light exit surface is preferably determined by the rotational trajectory of a pair of original components intersecting at the central axis.

본 발명의 다른 측면에 따라, 발광다이오드와, 상기 발광다이오드의 상부에 설치되는 지향각 변환 렌즈를 포함하는 백라이트용 발광장치가 제공되며, 상기 지향각 변환 렌즈는, 상기 중심축선을 중심으로 방사상으로 대칭을 이루되, 상기 중 심축선의 외측이 볼록한 곡면으로 되고, 그 곡면 안쪽이 오목한 형상을 갖는 출광면과, 상기 중심축선을 중심으로 방사상으로 대칭을 이루면서 오목한 형상을 갖는 입광면을 포함한다. 상기 발광다이오드는, LED칩과, 상기 LED칩을 봉지하는 봉지재를 포함하는 LED 패키지인 것이 바람직하며, 이때, 상기 입광면은, 상기 LED 패키지의 봉지재와 이격되며, 상기 봉지재와 상기 입광면 사이에는 공기층이 존재하는 것이 바람직하다. 더 나아가서는, 상기 LED칩은 상기 중심축선과 일치하거나 상기 중심축선 주변에 위치하는 것이 바람직하다.According to another aspect of the present invention, there is provided a light emitting device for a backlight comprising a light emitting diode and a directivity conversion lens provided on the light emitting diode, wherein the direct conversion angle lens is radially around the central axis. It includes symmetrical, the outer surface of the central axis is a convex curved surface, the light emitting surface having a concave shape inside the curved surface, and a light incident surface having a concave shape while radially symmetrical about the central axis. Preferably, the light emitting diode is an LED package including an LED chip and an encapsulant encapsulating the LED chip, wherein the light incident surface is spaced apart from an encapsulant of the LED package, and the encapsulant and the mouth are separated. It is preferable that an air layer exists between the light surfaces. Furthermore, it is preferable that the LED chip coincides with or is located around the central axis.

본 발명의 실시예에 따르면, 지향각 곡선의 피크 각도가 중심으로부터 벗어난 외곽에 위치하도록 발광다이오드로부터 나온 광의 지향각 패턴을 변화시킴으로써, 더욱 균일도 높고, 더 나아가, 색편차를 크게 줄인 백라이트 광원을 제공할 수 있다. According to an embodiment of the present invention, by varying the directivity angle pattern of the light emitted from the light emitting diode such that the peak angle of the directivity curve is located outside the center, it is possible to provide a backlight light source that is more uniform and further reduces color deviation. can do.

이하, 첨부한 도면들을 참조하여 본 발명의 실시예들을 상세히 설명하기로 한다. 다음에 소개되는 실시예들은 당업자에게 본 발명의 사상이 충분히 전달될 수 있도록 하기 위해 예로서 제공되는 것이다. 따라서, 본 발명은 이하 설명되는 실시예들에 한정되지 않고 다른 형태로 구체화될 수도 있다. 그리고, 도면들에 있어서, 구성요소의 폭, 길이, 두께 등은 편의를 위하여 과장되어 표현될 수 있다. 명세서 전체에 걸쳐서 동일한 참조번호들은 동일한 구성요소들을 나타낸다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided as examples to ensure that the spirit of the present invention can be fully conveyed to those skilled in the art. Accordingly, the present invention is not limited to the embodiments described below and may be embodied in other forms. And, in the drawings, the width, length, thickness, etc. of the components may be exaggerated for convenience. Like numbers refer to like elements throughout.

도 1은 본 발명의 일 실시예에 따른 백라이트용 발광장치를 도시한 사시이 고, 도 2는 도 1에 도시된 백라이트용 발광장치의 단면도이다. 도 1 및 도 2에는, 본 발명의 특징적인 구성요소만이 도시되어 있으며, 리드프레임, 전기회로 또는 전기 배선 등과 같이 발광장치의 동작 또는 기타 다른 기능에 이용되지만, 본 발명의 사상과 직접적인 관련성이 적은 구성요소들은 도면의 간략화를 위해, 그 도시를 생략하였다.1 is a perspective view showing a backlight light emitting device according to an embodiment of the present invention, Figure 2 is a cross-sectional view of the backlight light emitting device shown in FIG. 1 and 2, only the characteristic components of the present invention are shown and used in the operation or other functions of the light emitting device such as leadframes, electrical circuits or electrical wirings, but are not directly related to the spirit of the present invention. Few components have been omitted for simplicity of the drawings.

도 1 및 도 2에 도시된 것과 같이, 본 실시예의 발광장치(1)는, LED 패키지(2)와 지향각 변환 렌즈(3)를 포함한다. 상기 지향각 변환 렌즈(3)는 상기 LED 패키지(2)의 상부에 배치되며, 예를 들면, 접착제 등에 의해 상기 LED 패키지(2)의 상면에 접합되거나 또는 기타 다른 방식으로 상기 LED 패키지(2)의 상면에 결합될 수 있다.As shown in Fig. 1 and Fig. 2, the light emitting device 1 of the present embodiment includes an LED package 2 and a direction conversion lens 3. The directivity conversion lens 3 is disposed on top of the LED package 2, and is bonded to the top surface of the LED package 2 by, for example, an adhesive or the like, or in some other way, the LED package 2. It can be coupled to the upper surface of.

도 1에 잘 도시된 것과 같이, 상기 지향각 변환 렌즈(3)는 중심 부근이 오목하고 그 주변이 볼록한 구면 또는 비구면의 곡면으로 형성된 구조이며, 이러한 구조에 대해서는 이하에서 보다 구체적으로 설명될 것이다. 바람직한 실시예에 따라, 상기 발광장치(1)는, 발광다이오드로서, LED 패키지(2)를 포함하지만, 그 LED 패키지(2) 대신에, 패키징 되지 않은 LED칩을 이용하는 것도 고려될 수 있다. As shown in FIG. 1, the directivity conversion lens 3 is a structure formed of a spherical or aspherical curved surface in which the vicinity of the center is concave and the convex is contiguous, which will be described in more detail below. According to a preferred embodiment, the light emitting device 1 includes an LED package 2 as a light emitting diode, but it may also be considered to use an unpackaged LED chip instead of the LED package 2.

도 2를 참조하면, 상기 LED 패키지(2)는, 캐비티가 상부 중앙에 형성된 하우징(21)과, 상기 캐비티 내에 형성되는 투광성 재질(예를 들면, 실리콘 또는 에폭시 재질)의 봉지재(23)를 포함한다. 상기 캐비티 내 바닥에는 LED칩(22)이 위치하며, 상기 봉지재(23)에 의해 덮여져 외부로부터 보호된다. 도시하지는 않았지만, 상기 LED칩(22)은, 예를 들면, 리드프레임 상에 실장되어 그 리드프레임으로부터 전류를 인가받아 발광 동작할 수 있다. 그리고, 도면에서는, 하나의 LED칩(22) 만이 도시되었지만, 복수개의 LED칩을 이용하는 것도 본 발명의 범위 내에 있다.Referring to FIG. 2, the LED package 2 may include a housing 21 having a cavity formed at an upper center thereof, and an encapsulant 23 made of a light transmissive material (eg, silicon or epoxy material) formed in the cavity. Include. The LED chip 22 is located at the bottom of the cavity and is covered by the encapsulant 23 and protected from the outside. Although not shown, the LED chip 22 may be mounted on, for example, a lead frame to receive light from the lead frame to emit light. In addition, although only one LED chip 22 is shown in the figure, it is also within the scope of the present invention to use a plurality of LED chips.

상기 지향각 변환 렌즈(3)는 예를 들면, 실리콘 또는 에폭시와 같은 투광성 재질로 형성된다. 또한, 상기 지향각 변환 렌즈(3)는, 입광면(31)과 출광면(32)을 구비한 채, 중심축선(y)에 대해 방사상으로 대칭인 구조로 이루어진다(도 1 참조). 이때, 상기 입광면(31)은, LED 패키지(2)로부터의 광, 즉, LED칩(22)으로부터 봉지재(23)를 거쳐 나온 광이 들어오는 면이고, 출광면(32)은 지향각 변환 렌즈(3)를 거친 광이 외부로 나가는 면이다. The direction conversion lens 3 is formed of a light transmissive material such as, for example, silicon or epoxy. In addition, the directivity conversion lens 3 has a structure that is radially symmetric with respect to the central axis y with the light incident surface 31 and the light exit surface 32 (see FIG. 1). At this time, the light incident surface 31 is a surface into which light from the LED package 2, that is, light exiting from the LED chip 22 through the encapsulant 23, enters the light exit surface 32. Light passing through the lens 3 exits to the outside.

본 발명의 실시예에서, 상기 입광면(31)은 상기 LED 패키지(22)의 봉지재(23) 상면에 대해 이격되어 있다. 따라서, 상기 입광면(31)과 상기 봉지재(23) 사이에는 공기층(4)이 존재한다. 또한, 상기 입광면(31)은, 중침축선(y)을 중심으로 방사상으로 대칭인 면이며, 도 2에 잘 도시된 것과 같이, 꼭지점이 상기 중심축선(y) 상에 위치하는 원추형의 면이다. 또한, 상기 출광면(32)은, 상기 중심축선(y)을 중심으로 방사상으로 대칭을 이루되, 상기 중심축선(y)의 외측이 볼록한 곡면으로 되고, 그 곡면 안쪽이 오목한 형상을 갖는다.In the embodiment of the present invention, the light incident surface 31 is spaced apart from the top surface of the encapsulant 23 of the LED package 22. Therefore, an air layer 4 exists between the light incident surface 31 and the encapsulant 23. Further, the light incident surface 31 is a surface symmetrically radially about the central needle axis y, and as shown in FIG. 2, a vertex is a conical surface located on the center axis line y. . In addition, the light exit surface 32 is radially symmetric about the center axis y, and the outer surface of the center axis y is a convex curved surface, and the inside of the curved surface is concave.

도 3은 상기 지향각 변환 렌즈(3)를 보다 구체적으로 설명하기 위한 도면으로서, 도 3을 참조하면, 원추형의 입광면(31)은, 렌즈(3)를 이루는 수지의 공기와의 굴절율 차이, 그리고, 자신의 경사진 각도에 의해, 광을 중심축선(y)으로부터 먼 방향으로 굴절시킨다. 그리고, 상기 굴절된 광은 주로 상기 중심축선(y)의 외측의 볼록한 곡면으로 향하게 된다. FIG. 3 is a view for explaining the directivity conversion lens 3 in more detail. Referring to FIG. 3, the conical light incident surface 31 may have a difference in refractive index with air of the resin constituting the lens 3. The light is refracted in the direction away from the central axis y by its inclined angle. And, the refracted light is mainly directed to the convex curved surface outside of the central axis y.

상기 출광면(32)은, 중심축선(y) 주변이 오목하게 형성되고 그 외측이 볼록한 곡면으로 형성됨으로써, 중심축선(y) 부근에서 보다는 외곽, 즉 볼록한 곡면에서 보다 많은 광의 방출이 이루어지도록 해준다. 이는 렌즈 중앙 부근에서의 광량 또는 광세기를 줄이고 렌즈 외곽 부근에서의 광량 도는 광 세기를 늘려서, 광의 지향각을 넓히는데 크게 기여한다. 더욱 바람직하게는, 상기 출광면(32)은, 상기 중심축선(y)에서 교차하는 한 쌍의 원성분(c1, c2)을 포함하는 곡선의 회전 궤적에 의해 결정되는 곡면이다. 한 쌍의 원성분(c1, c2)을 이용한 출광면(32)의 설계에 의해, 중앙보다는 외곽 쪽에서 광의 방출이 많은 렌즈를 쉽게 얻을 수 있다. The light exit surface 32 is formed to be concave around the central axis y and convex on the outside thereof, thereby allowing more light to be emitted at the outer side, that is, the convex curved surface than near the central axis y. . This greatly reduces the amount of light or light intensity near the center of the lens and increases the amount of light or light intensity near the outside of the lens, thereby greatly contributing to widening the directing angle of the light. More preferably, the light exit surface 32 is a curved surface determined by a rotational trajectory of a curve including a pair of original components c1 and c2 intersecting at the central axis y. By designing the light exit surface 32 using a pair of original components c1 and c2, it is possible to easily obtain a lens with a lot of light emission from the outer side rather than the center.

도 4는 전술한 지향각 변환 렌즈(3)에 의해 광의 지향각이 변화되는 양상을 보여주는 도면이며, 도 5는 상기 지향각 변환 렌즈(3)를 이용한 발광장치의 지향각 곡선 그래프이다.FIG. 4 is a diagram illustrating a direction in which light is changed by the aforementioned angle conversion lens 3, and FIG. 5 is a graph of a direction angle curve of a light emitting device using the angle conversion lens 3.

도 4 및 도 5를 참조하면, 상기 지향각 변환 렌즈(3)를 이용할 경우, 그 렌 중앙에서는 광 세기가 상대적으로 작아지는데 반해, 그 렌즈 외곽에서는 광 세기가 크게 증가함을 알 수 있다. 특히, 도 5를 참조하면, 지향각 곡선의 피크 각도(peak angle)가 67도가 되고, 중심 부분의 광 세기가 피크 각도에서의 광세기의 약 40%가 됨을 알 수 있다. 이때, 도 5에 도시된 것과 같은 지향각 곡선을 만드는 지향각 변환 렌즈를, 이웃하는 발광장치들 사이의 피치 간격이 35mm인 백라이트 유닛에 이용하는 경우, 85% 이상의 광 균일도를 얻을 수 있었다.4 and 5, it can be seen that when the direction conversion lens 3 is used, the light intensity is relatively decreased at the center of the glen, while the light intensity is greatly increased outside the lens. In particular, referring to FIG. 5, it can be seen that the peak angle of the directivity angle curve is 67 degrees, and the light intensity at the center portion is about 40% of the light intensity at the peak angle. At this time, when a directivity conversion lens for creating a directivity angle curve as shown in FIG. 5 is used for a backlight unit having a pitch interval of 35 mm between neighboring light emitting devices, light uniformity of 85% or more can be obtained.

도 1은 본 발명의 일 실시예에 따른 백라이트용 발광장치의 사시도.1 is a perspective view of a light emitting device for a backlight according to an embodiment of the present invention.

도 2는 도 1에 도시된 백라이트용 발광장치의 단면도.2 is a cross-sectional view of the light emitting device for a backlight shown in FIG.

도 3은 도 1 및 도 2에 도시된 백라이트용 발광장치의 일부인 지향각 변환 렌즈를 구체적으로 설명하기 위한 도면.FIG. 3 is a view for explaining in detail a direction conversion lens that is a part of the light emitting device for backlight shown in FIGS. 1 and 2;

도 4는 도 3에 도시된 지향각 변환 렌즈가 광의 지향각을 변환시키는 양상을 보여주는 도면.FIG. 4 is a view illustrating a direction in which the directivity conversion lens illustrated in FIG. 3 converts a directivity angle of light.

도 5는 본 발명의 실시예에 따른 백라이트용 발광장치의 지향각 곡선 그래프.5 is a directed angle curve graph of a light emitting device for a backlight according to an embodiment of the present invention.

Claims (9)

발광다이오드의 상부에 위치하는 광의 지향각 변환 렌즈에 있어서, In the directivity conversion lens of the light located above the light emitting diode, 중심축선을 중심으로 방사상으로 대칭을 이루되, 상기 중심축선의 외측이 볼록한 곡면으로 되고, 상기 곡면 안쪽이 오목한 형상을 갖는 출광면과;A light exit surface radially symmetric about a central axis, the outer surface of the center axis being a convex curved surface, and having a concave shape inside the curved surface; 상기 중심축선을 중심으로 방사상으로 대칭을 이루며, 오목한 형상을 갖는 입광면을 포함하는 것을 특징으로 하는 지향각 변환 렌즈.And a light incident surface that is radially symmetric about the central axis and has a concave shape. 청구항 1에 있어서, 상기 입광면은 꼭지점이 상기 중심축선 상에 위치하는 원추형의 면인 것을 특징으로 하는 지향각 변환 렌즈.The lens of claim 1, wherein the light incident surface is a conical surface having a vertex located on the center axis. 청구항 1에 있어서, 상기 입광면은 상기 발광다이오드와 이격되며, 상기 입광면과 상기 발광다이오드와의 사이에는 공기층이 존재하는 것을 특징으로 하는 지향 변환 렌즈.The directional conversion lens of claim 1, wherein the light incident surface is spaced apart from the light emitting diode, and an air layer is present between the light incident surface and the light emitting diode. 청구항 1에 있어서, 상기 출광면은 상기 중심축선에서 교차하는 한 쌍의 원성분의 회전 궤적에 의해 결정되는 것을 특징으로 하는 지향각 변환 렌즈.The direction angle conversion lens of claim 1, wherein the light exit surface is determined by a rotational trajectory of a pair of original components that intersect at the center axis. 발광다이오드와, 상기 발광다이오드의 상부에 설치되는 지향각 변환 렌즈를 포함하는 백라이트용 발광장치로서, 상기 지향각 변환 렌즈는,A light emitting device for a backlight comprising a light emitting diode and a directivity conversion lens provided on an upper portion of the light emitting diode, wherein the directivity conversion lens is 상기 중심축선을 중심으로 방사상으로 대칭을 이루되, 상기 중심축선의 외측이 볼록한 곡면으로 되고, 그 곡면 안쪽이 오목한 형상을 갖는 출광면과,A light exit surface radially symmetric about the central axis, the outer surface of the central axis being a convex curved surface, and the inner surface of the curved surface having a concave shape; 상기 중심축선을 중심으로 방사상으로 대칭을 이루면서 오목한 형상을 갖는 입광면을 포함하는 것을 특징으로 하는 백라이트용 발광장치.And a light incident surface having a concave shape while being radially symmetrical about the central axis. 청구항 5에 있어서, 상기 발광다이오드는, LED칩과, 상기 LED칩을 봉지하는 봉지재를 포함하는 LED 패키지인 것을 특징으로 하는 백라이트용 발광장치.The light emitting device of claim 5, wherein the light emitting diode is an LED package including an LED chip and an encapsulant for encapsulating the LED chip. 청구항 5에 있어서, 상기 입광면은 꼭지점이 상기 중심축선 상에 위치하는 원추형의 면인 것을 특징으로 하는 백라이트용 발광장치.The light emitting device of claim 5, wherein the light incident surface is a conical surface having a vertex located on the center axis. 청구항 6에 있어서, 상기 입광면은, 상기 LED 패키지의 봉지재와 이격되며, 상기 봉지재와 상기 입광면 사이에는 공기층이 존재하는 것을 특징으로 하는 백라이트용 발광장치.The light emitting device of claim 6, wherein the light incident surface is spaced apart from the encapsulant of the LED package, and an air layer is present between the encapsulant and the light incident surface. 청구항 6에 있어서, 상기 LED칩은 상기 중심축선과 일치하거나 상기 중심축선 주변에 위치하는 것을 특징으로 하는 백라이트용 발광장치.The light emitting device of claim 6, wherein the LED chip coincides with the center axis or is positioned around the center axis.
KR1020070098431A 2007-09-28 2007-09-28 Orientation angle changing lens and light emitting device comprising the same KR100947440B1 (en)

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