TWM519254U - Backlight module - Google Patents
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Abstract
Description
本新型創作是有關於一種背光模組,且特別是有關於一種以發光二極體作為光源的背光模組。The present invention relates to a backlight module, and more particularly to a backlight module using a light-emitting diode as a light source.
目前已將發光二極體應用於顯示器的背光模組中,也就是以發光二極體作為背光模組的光源。然而,由於發光二極體點光源具有很強的指向性,要使發光二極體所發出的光能夠均勻混光以構成一個均勻的面光源,設置在這些發光二極體上方的擴散片往往需與這些發光二極體維持足夠的距離。如此一來,將導致燈箱無法進一步薄化,意即背光模組整體的厚度無法再減少,進而影響顯示器薄化的發展。At present, the light-emitting diode has been applied to the backlight module of the display, that is, the light-emitting diode is used as the light source of the backlight module. However, since the light-emitting diode point source has strong directivity, the light emitted by the light-emitting diode can be uniformly mixed to form a uniform surface light source, and the diffusion sheet disposed above the light-emitting diodes is often A sufficient distance from these light-emitting diodes is required. As a result, the light box cannot be further thinned, which means that the overall thickness of the backlight module can no longer be reduced, thereby affecting the development of thinning of the display.
此外,由於發光二極體所發出的光束具有一發散角,因此相鄰兩發光二極體之間會有一個暗區,而這些暗區將會導致背光模組所提供的面光源的出光均勻度下降。為了解決上述的問題,業界提出了增加發光二極體的使用個數,縮短相鄰兩發光二極體之間的間距以降低暗區的面積。然而,上述的方式確實可有效降低暗區的面積,但是卻提高了背光模組的生產成本。因此,如何有效地提升背光模組的出光均度以及降低生產成本,已成為當前亟待解決的問題。In addition, since the light beam emitted by the light emitting diode has a divergence angle, there is a dark area between the adjacent two light emitting diodes, and these dark areas will cause the surface light source provided by the backlight module to have uniform light output. Degree drops. In order to solve the above problems, the industry has proposed to increase the number of use of the light-emitting diodes, and to shorten the spacing between adjacent two light-emitting diodes to reduce the area of the dark regions. However, the above method can effectively reduce the area of the dark area, but it increases the production cost of the backlight module. Therefore, how to effectively improve the light output uniformity of the backlight module and reduce the production cost has become an urgent problem to be solved.
本新型創作提供一種背光模組,其可減少發光二極體封裝結構的使用數量,可降低成本並且具有較佳的出光均勻度。The novel creation provides a backlight module, which can reduce the number of use of the LED package structure, reduce the cost and have better light uniformity.
本新型創作的背光模組,其包括一燈箱、至少一燈條以及至少一光學膜片。燈箱具有一底部以及一相對於底部的出光側。燈條配置於燈箱的底部,其中燈條包括一基板、多個發光二極體封裝結構以及多個透鏡。發光二極體封裝結構配置於基板上。透鏡配置於基板上且分別對應發光二極體封裝結構設置。光學膜片配置於燈箱的出光側。The backlight module of the present invention comprises a light box, at least one light bar and at least one optical film. The light box has a bottom and a light exiting side relative to the bottom. The light bar is disposed at the bottom of the light box, wherein the light bar comprises a substrate, a plurality of light emitting diode package structures and a plurality of lenses. The light emitting diode package structure is disposed on the substrate. The lenses are disposed on the substrate and are respectively disposed corresponding to the LED package structure. The optical film is disposed on the light exit side of the light box.
在本新型創作的一實施例中,上述的基板包括一電路板或鋁基板。In an embodiment of the present invention, the substrate includes a circuit board or an aluminum substrate.
在本新型創作的一實施例中,上述的每一發光二極體封裝結構包括:一承載基板、一發光二極體晶片、一波長轉換層、一透明膠層以及一樹脂膠體層。承載基板具有彼此相對的一上表面與一下表面、多個配置於上表面上的第一接墊以及多個配置於下表面上的第二接墊。發光二極體晶片覆晶於承載基板上,且具有彼此相對的一主動表面與一背面、一連接主動表面與背面的側表面以及多個配置於主動表面上的電極接墊,其中發光二極體晶片透過電極接墊與第一接墊電性連接。波長轉換層配置於發光二極體晶片的背面上,且沿著發光二極體晶片的側表面延伸配置於承載基板的上表面上。透明膠層配置於波長轉換層上。樹脂膠體層配置於承載基板上且包覆透明膠層的一周圍表面。In an embodiment of the present invention, each of the light emitting diode package structures includes a carrier substrate, a light emitting diode chip, a wavelength conversion layer, a transparent adhesive layer, and a resin colloid layer. The carrier substrate has an upper surface and a lower surface opposite to each other, a plurality of first pads disposed on the upper surface, and a plurality of second pads disposed on the lower surface. The light emitting diode chip is flipped on the carrier substrate, and has an active surface and a back surface opposite to each other, a side surface connecting the active surface and the back surface, and a plurality of electrode pads disposed on the active surface, wherein the light emitting diode The body wafer is electrically connected to the first pad through the electrode pads. The wavelength conversion layer is disposed on the back surface of the light emitting diode wafer and is disposed on the upper surface of the carrier substrate along a side surface of the light emitting diode wafer. The transparent adhesive layer is disposed on the wavelength conversion layer. The resin colloid layer is disposed on the carrier substrate and covers a surrounding surface of the transparent adhesive layer.
在本新型創作的一實施例中,上述的承載基板的材質包括陶瓷、氧化鋁、氮化鋁。In an embodiment of the present invention, the material of the carrier substrate includes ceramic, aluminum oxide, and aluminum nitride.
在本新型創作的一實施例中,上述的波長轉換層包括一黃色螢光粉膠層、一紅色螢光粉膠層、一綠色螢光粉膠層、一藍色螢光粉膠層或一釔鋁石榴石螢光粉膠層。In an embodiment of the present invention, the wavelength conversion layer comprises a yellow phosphor powder layer, a red phosphor powder layer, a green phosphor powder layer, a blue phosphor powder layer or a Yttrium aluminum garnet fluorite powder layer.
在本新型創作的一實施例中,上述的透明膠層的材質包括環氧樹脂、矽膠。In an embodiment of the present invention, the material of the transparent adhesive layer comprises epoxy resin and silicone rubber.
在本新型創作的一實施例中,上述的樹脂膠體層包括一環氧樹脂層、一矽樹脂層或一白膠層。In an embodiment of the present invention, the resin colloid layer comprises an epoxy resin layer, a tantalum resin layer or a white rubber layer.
在本新型創作的一實施例中,上述的每一發光二極體封裝結構包括:一發光二極體晶片、一波長轉換膠片以及一樹脂膠體層。發光二極體晶片覆晶於燈條的基板上,且具有彼此相對的一主動表面與一背面、一連接主動表面與背面的側表面以及多個配置於主動表面上的電極接墊,其中發光二極體晶片透過電性接墊與基板電性連接。波長轉換膠片配置於發光二極體晶片的背面上,其中波長轉換膠片延伸至發光二極體晶片的側表面之外。樹脂膠體層包覆波長轉換膠片的一周圍表面,且沿著發光二極體晶片的側表面設置。In an embodiment of the present invention, each of the light emitting diode package structures includes: a light emitting diode chip, a wavelength conversion film, and a resin colloid layer. The light emitting diode chip is flipped on the substrate of the light bar, and has an active surface and a back surface opposite to each other, a side surface connecting the active surface and the back surface, and a plurality of electrode pads disposed on the active surface, wherein the light is emitted The diode chip is electrically connected to the substrate through an electrical pad. The wavelength converting film is disposed on the back surface of the light emitting diode wafer, wherein the wavelength converting film extends beyond the side surface of the light emitting diode wafer. The resin colloid layer coats a peripheral surface of the wavelength conversion film and is disposed along a side surface of the light emitting diode wafer.
在本新型創作的一實施例中,上述的波長轉換膠片包括一黃色螢光粉膠片、一紅色螢光粉膠片、一綠色螢光粉膠片、一藍色螢光粉膠片或一釔鋁石榴石螢光粉膠片。In an embodiment of the present invention, the wavelength conversion film comprises a yellow fluorescent powder film, a red fluorescent powder film, a green fluorescent powder film, a blue fluorescent powder film or a yttrium aluminum garnet fluorescent film. Powder film.
在本新型創作的一實施例中,上述的樹脂膠體層包括一環氧樹脂層、一矽樹脂層或一白膠層。In an embodiment of the present invention, the resin colloid layer comprises an epoxy resin layer, a tantalum resin layer or a white rubber layer.
在本新型創作的一實施例中,上述的每一透鏡具有一透鏡部,而透鏡部具有一入光面以及一出光面,且入光面的曲率半徑大於出光面的曲率半徑。In an embodiment of the present invention, each of the lenses has a lens portion, and the lens portion has a light incident surface and a light exit surface, and the radius of curvature of the light incident surface is greater than the radius of curvature of the light exit surface.
在本新型創作的一實施例中,上述的每一透鏡更具有多個支撐部,配置於透鏡部與燈條的基板之間。In an embodiment of the present invention, each of the lenses further has a plurality of supporting portions disposed between the lens portion and the substrate of the light bar.
在本新型創作的一實施例中,上述的光學膜片為一擴散片。In an embodiment of the present invention, the optical film is a diffusion sheet.
在本新型創作的一實施例中,上述的至少一光學膜片為二擴散片以及一稜鏡片,且稜鏡片位於擴散片之間。In an embodiment of the present invention, the at least one optical film is a two-diffusion sheet and a cymbal sheet, and the cymbal sheet is located between the diffusion sheets.
在本新型創作的一實施例中,上述的至少一光學膜片為三擴散片以及一稜鏡片,且稜鏡片位於任兩擴散片之間。In an embodiment of the present invention, the at least one optical film is a three-diffusion sheet and a cymbal sheet, and the cymbal sheet is located between any two diffusion sheets.
在本新型創作的一實施例中,上述的每一發光二極體封裝結構具有一照明半徑R,而燈條的基板的一上表面到光學膜片的一底表面具有一光學距離OD,且透鏡的一1/2發散角度為θ,則R/OD=tan(θ)。In an embodiment of the present invention, each of the light emitting diode packages has an illumination radius R, and an upper surface of the substrate of the light bar has an optical distance OD to a bottom surface of the optical film, and A 1/2 divergence angle of the lens is θ, then R/OD = tan(θ).
在本新型創作的一實施例中,上述的相鄰兩發光二極體封裝結構的中間點之間的一距離P,一最佳值常數E介於1.7至2.3之間,則R=E*P。In an embodiment of the present invention, a distance P between the intermediate points of the adjacent two LED packages is an optimum value constant E between 1.7 and 2.3, then R=E* P.
在本新型創作的一實施例中,上述的發光二極體封裝結構呈等間距的間隔排列。In an embodiment of the present invention, the above-mentioned light emitting diode package structures are arranged at equal intervals.
在本新型創作的一實施例中,上述的發光二極體封裝結構呈不等間距的間隔排列。In an embodiment of the present invention, the above-mentioned light emitting diode package structure is arranged at an unequal interval.
在本新型創作的一實施例中,上述的相鄰兩發光二極體封裝結構的中間點之間的一距離P,則0.9P<P<1.1P。In an embodiment of the present invention, a distance P between the intermediate points of the adjacent two LED packages is 0.9P<P<1.1P.
基於上述,由於本新型創作的發光二極體封裝結構與透鏡對應設置,因此發光二極體封裝結構所發出的光束可被均勻分散,即可將相鄰兩發光二極體封裝結構之間的間距拉大,藉此可有效減少發光二極體封裝結構的使用個數,因而可有效降低背光模組的生產成本,以及提高背光模組的出光均勻度。Based on the above, since the light-emitting diode package structure created by the present invention is disposed corresponding to the lens, the light beam emitted by the light-emitting diode package structure can be uniformly dispersed, that is, between adjacent two light-emitting diode package structures. The pitch is increased, thereby effectively reducing the number of used LED package structures, thereby effectively reducing the production cost of the backlight module and improving the uniformity of the backlight module.
為讓本新型創作的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will become more apparent and understood from the following description.
圖1繪示為本新型創作的一實施例的一種背光模組的示意圖。請參考圖1,在本實施例中,背光模組100a包括一燈箱110、至少一燈條120以及至少一光學膜片130a。燈箱110具有一底部112以及一相對於底部112的出光側114。燈條120配置於燈箱110的底部112,其中燈條120包括一基板122、多個發光二極體封裝結構124a以及多個透鏡126。發光二極體封裝結構124a配置於基板122上。透鏡126配置於基板122上且分別對應發光二極體封裝結構124a設置。光學膜片130a配置於燈箱110的出光側114。此處,光學膜片130a例如是一擴散片,但並不以此為限。FIG. 1 is a schematic diagram of a backlight module according to an embodiment of the present invention. Referring to FIG. 1 , in the embodiment, the backlight module 100 a includes a light box 110 , at least one light bar 120 , and at least one optical film 130 a . The light box 110 has a bottom portion 112 and a light exiting side 114 relative to the bottom portion 112. The light bar 120 is disposed at the bottom 112 of the light box 110. The light bar 120 includes a substrate 122, a plurality of light emitting diode package structures 124a, and a plurality of lenses 126. The LED package structure 124a is disposed on the substrate 122. The lens 126 is disposed on the substrate 122 and disposed corresponding to the LED package structure 124a. The optical film 130a is disposed on the light exiting side 114 of the light box 110. Here, the optical film 130a is, for example, a diffusion sheet, but is not limited thereto.
詳細來說,燈條120的基板122例如是一電路板或鋁基板,而發光二極體封裝結構124a例如是呈等間距的間隔排列於基板122上。如圖2A所示,本實施例的每一發光二極體封裝結構124a包括一承載基板124a1、一發光二極體晶片124a2、一波長轉換層124a3、一透明膠層124a4以及一樹脂膠體層124a5。承載基板124a1具有彼此相對的一上表面125a1與一下表面125a2、多個配置於上表面125a1上的第一接墊125a3以及多個配置於下表面125a2上的第二接墊125a4,第一接墊125a3透過形成於承載基板124a1中的導電通孔(圖未示)或沿著承載基板124a1表面向下延伸的金屬層(圖未示)而與第二接墊125a4電性連接。發光二極體晶片124a2覆晶於承載基板124a1上,且具有彼此相對的一主動表面127a1與一背面127a2、一連接主動表面127a1與背面127a2的側表面127a3以及多個配置於主動表面127a1上的電極接墊127a4,其中發光二極體晶片124a2透過電極接墊127a4與承載基板124a1的第一接墊125a3電性連接,而發光二極體封裝結構124a則透過第二接墊125a4與燈條120的基板122電性連接。波長轉換層124a3配置於發光二極體晶片124a2的背面127a2上,且沿著發光二極體晶片124a2的側表面127a3延伸配置於承載基板124a1的上表面125a1上。透明膠層124a4配於波長轉換層124a3上,且與波長轉換層124a3共形設置。樹脂膠體層124a5配置於承載基板124a1上且包覆透明膠層124a4的一周圍表面129a1。In detail, the substrate 122 of the light bar 120 is, for example, a circuit board or an aluminum substrate, and the light emitting diode package structures 124a are arranged on the substrate 122 at equal intervals, for example. As shown in FIG. 2A, each of the LED package structures 124a of the present embodiment includes a carrier substrate 124a1, a light emitting diode wafer 124a2, a wavelength conversion layer 124a3, a transparent adhesive layer 124a4, and a resin colloid layer 124a5. . The carrier substrate 124a1 has an upper surface 125a1 and a lower surface 125a2 opposite to each other, a plurality of first pads 125a3 disposed on the upper surface 125a1, and a plurality of second pads 125a4 disposed on the lower surface 125a2. The first pads The 125a3 is electrically connected to the second pad 125a4 through a conductive via (not shown) formed in the carrier substrate 124a1 or a metal layer (not shown) extending downward along the surface of the carrier substrate 124a1. The LED wafer 124a2 is flipped on the carrier substrate 124a1, and has an active surface 127a1 and a back surface 127a2 opposite to each other, a side surface 127a3 connecting the active surface 127a1 and the back surface 127a2, and a plurality of disposed on the active surface 127a1. The electrode pad 127a4 is electrically connected to the first pad 125a3 of the carrier substrate 124a1 through the electrode pad 127a4, and the LED package 124a is transmitted through the second pad 125a4 and the light bar 120. The substrate 122 is electrically connected. The wavelength conversion layer 124a3 is disposed on the rear surface 127a2 of the light emitting diode wafer 124a2, and is disposed on the upper surface 125a1 of the carrier substrate 124a1 along the side surface 127a3 of the light emitting diode wafer 124a2. The transparent adhesive layer 124a4 is disposed on the wavelength conversion layer 124a3 and conformally disposed with the wavelength conversion layer 124a3. The resin colloid layer 124a5 is disposed on the carrier substrate 124a1 and covers a peripheral surface 129a1 of the transparent adhesive layer 124a4.
更具體來說,本實施例的發光二極體封裝結構124a的承載基板124a1的材質例如是陶瓷、氧化鋁、氮化鋁。發光二極體晶片124a2以覆晶接合的方式至承載基板124a1上。如圖2A所示,發光二極體晶片124a2的電極接墊127a4透過錫膏128a而銲接至承載基板124a1的第一接墊125a3上。波長轉換層124a3與透明膠層124a4則是透過依序噴塗的方式配置於發光二極體晶片124a2的背面127a2上,其中波長轉換層124a3例如是一黃色螢光粉膠層、一紅色螢光粉膠層、一綠色螢光粉膠層、一藍色螢光粉膠層或一釔鋁石榴石螢光粉膠層,而透明膠層124a4的材質例如是環氧樹脂、矽膠。如圖2A所示,波長轉換層124a3完全覆蓋發光二極體晶片124a2的側表面127a3且延伸覆蓋於電極接墊127a4的邊緣與第一接墊125a3的邊緣,而透明膠層124a4完全覆蓋波長轉換層124a3且延伸至承載基板124a1的上表面125a1。樹脂膠體層124a5則是透過點膠的方式形成於透明膠層124a4的周圍表面129a1上,以包覆透明膠層124a4的周圍表面129a1,並暴露出透明膠層124a4的一頂表面129a2。同時,樹脂膠體層124a5的亦會填滿第一接墊125a3之間的間隙以及電極接墊127a4之間的間隙。此處,樹脂膠體層124a5的邊緣與承載基板124a1的邊緣實質上切齊,但並不以此為限。樹脂膠體層124a5例如是一環氧樹脂層、一矽樹脂層或一白膠層,其設置的目的在於:擋住發光二極體晶片124a2的側向光,並使發光二極體晶片124a2所發出的光束光色均勻。More specifically, the material of the carrier substrate 124a1 of the LED package structure 124a of the present embodiment is, for example, ceramic, aluminum oxide, or aluminum nitride. The LED wafer 124a2 is flip-chip bonded to the carrier substrate 124a1. As shown in FIG. 2A, the electrode pads 127a4 of the LED wafer 124a2 are soldered to the first pads 125a3 of the carrier substrate 124a1 through the solder paste 128a. The wavelength conversion layer 124a3 and the transparent adhesive layer 124a4 are disposed on the back surface 127a2 of the LED wafer 124a2 by sequential spraying. The wavelength conversion layer 124a3 is, for example, a yellow phosphor powder layer and a red phosphor powder. The rubber layer, a green fluorescent powder layer, a blue phosphor powder layer or a layer of aluminum garnet phosphor powder, and the material of the transparent layer 124a4 is epoxy resin or silicone rubber. As shown in FIG. 2A, the wavelength conversion layer 124a3 completely covers the side surface 127a3 of the LED wafer 124a2 and extends over the edge of the electrode pad 127a4 and the edge of the first pad 125a3, while the transparent adhesive layer 124a4 completely covers the wavelength conversion. The layer 124a3 extends to the upper surface 125a1 of the carrier substrate 124a1. The resin colloid layer 124a5 is formed on the peripheral surface 129a1 of the transparent adhesive layer 124a4 by dispensing to cover the peripheral surface 129a1 of the transparent adhesive layer 124a4, and exposes a top surface 129a2 of the transparent adhesive layer 124a4. At the same time, the resin colloid layer 124a5 also fills the gap between the first pads 125a3 and the gap between the electrode pads 127a4. Here, the edge of the resin colloid layer 124a5 is substantially aligned with the edge of the carrier substrate 124a1, but is not limited thereto. The resin colloid layer 124a5 is, for example, an epoxy resin layer, a resin layer or a white rubber layer, which is disposed to block the lateral light of the LED array 124a2 and to emit the LED chip 124a2. The beam of light is uniform in color.
於另一實施例中,請同時參考圖1與圖2B,為了更進一步降低成本,每一發光二極體封裝結構124b亦可是由一發光二極體晶片124b1、一波長轉換膠片124b2以及一樹脂膠體層124b3所組成。發光二極體晶片124b1覆晶於燈條120的基板122上,且具有彼此相對的一主動表面125b1與一背面125b2、一連接主動表面125b1與背面125b2的側表面125b3以及多個配置於主動表面125b1上的電極接墊125b4,其中發光二極體晶片124b1透過電極接墊125b4與基板122電性連接。波長轉換膠片124b2配置於發光二極體晶片124b1的背面125b2上,其中波長轉換膠片124b2延伸至發光二極體晶片124b1的側表面125b3之外。意即,波長轉換膠片124b2的邊長大於發光二極體晶片124b1的邊長。此處,波長轉換膠片124b2例如是一黃色螢光粉膠片、一紅色螢光粉膠片、一綠色螢光粉膠片、一藍色螢光粉膠片或一釔鋁石榴石螢光粉膠片。樹脂膠體層124b3透過點膠的方式以包覆波長轉換膠片124b2的一周圍表面127b1,並沿著發光二極體晶片124b1的側表面125b3設置,且暴露出波長轉換膠片124b2的一頂表面127b2。如圖2B所示,樹脂膠體層124b3與發光二極體晶片124b1的側表面125b3之間有一封裝膠層128b,其中封裝膠層128b完全覆蓋發光二極體晶片124b1的側表面125b3,且樹脂膠體層124b3沿著封裝膠層128b而延伸覆蓋於波長轉換膠片124b2的周圍表面127b1。。樹脂膠體層124b3例如是一環氧樹脂層、一矽樹脂層或一白膠層。In another embodiment, referring to FIG. 1 and FIG. 2B simultaneously, in order to further reduce the cost, each of the LED package structures 124b may also be a light-emitting diode wafer 124b1, a wavelength conversion film 124b2, and a resin. The colloid layer 124b3 is composed of. The LED chip 124b1 is flipped on the substrate 122 of the light bar 120, and has an active surface 125b1 and a back surface 125b2 opposite to each other, a side surface 125b3 connecting the active surface 125b1 and the back surface 125b2, and a plurality of surfaces disposed on the active surface. The electrode pad 125b4 on the 125b1, wherein the LED chip 124b1 is electrically connected to the substrate 122 through the electrode pad 125b4. The wavelength conversion film 124b2 is disposed on the back surface 125b2 of the light emitting diode wafer 124b1, wherein the wavelength conversion film 124b2 extends beyond the side surface 125b3 of the light emitting diode wafer 124b1. That is, the side length of the wavelength conversion film 124b2 is larger than the side length of the light emitting diode wafer 124b1. Here, the wavelength conversion film 124b2 is, for example, a yellow fluorescent powder film, a red fluorescent powder film, a green fluorescent powder film, a blue fluorescent powder film or a yttrium aluminum garnet fluorescent film. The resin colloid layer 124b3 is dispensed to cover a peripheral surface 127b1 of the wavelength conversion film 124b2, and is disposed along the side surface 125b3 of the LED wafer 124b1, and exposes a top surface 127b2 of the wavelength conversion film 124b2. As shown in FIG. 2B, an encapsulant layer 128b is interposed between the resin colloid layer 124b3 and the side surface 125b3 of the LED wafer 124b1, wherein the encapsulant layer 128b completely covers the side surface 125b3 of the LED wafer 124b1, and the resin colloid The layer 124b3 extends over the encapsulation layer 128b to cover the peripheral surface 127b1 of the wavelength conversion film 124b2. . The resin colloid layer 124b3 is, for example, an epoxy resin layer, a tantalum resin layer or a white rubber layer.
請再參考圖1,本實施例的每一透鏡126具有一透鏡部126a,而透鏡部126a具有一出光面126a1以及一入光面126a2,其中出光面126a1的曲率半徑小於入光面126a2的曲率半徑,且透鏡126a的中心部分的外表面向光源方向產生凹陷,使得通過透鏡126a中心部分的剖面的外圍輪廓形成兩個波峰,而兩個波峰的交會點就是凹陷的低點,而該凹陷的低點對準光源。此外,每一透鏡126更可選擇性地具有多個支撐部126b,其中支撐部126b配置於透鏡部126a與燈條120的基板122之間。如圖1所示,本實施例的發光二極體封裝結構124a並沒有直接接觸透鏡126,而是透過透鏡126的支撐部126b與透鏡部126a之間具有一空隙S。特別是,本實施例的透鏡126與發光二極體封裝結構124a對應設置,其目的在於:可將發光二極體封裝結構124a所發出的光束均勻分散。Referring to FIG. 1, each lens 126 of the embodiment has a lens portion 126a, and the lens portion 126a has a light emitting surface 126a1 and a light incident surface 126a2. The radius of curvature of the light emitting surface 126a1 is smaller than the curvature of the light incident surface 126a2. The radius, and the outer surface of the central portion of the lens 126a is recessed toward the direction of the light source such that the peripheral contour of the cross section through the central portion of the lens 126a forms two peaks, and the intersection of the two peaks is the low point of the depression, and the depression is low Point the light source. In addition, each lens 126 can further have a plurality of support portions 126b, wherein the support portion 126b is disposed between the lens portion 126a and the substrate 122 of the light bar 120. As shown in FIG. 1, the LED package structure 124a of the present embodiment does not directly contact the lens 126, but has a gap S between the support portion 126b of the lens 126 and the lens portion 126a. In particular, the lens 126 of the present embodiment is disposed corresponding to the LED package structure 124a, and the purpose thereof is to uniformly disperse the light beam emitted by the LED package structure 124a.
更具體來說,請參考圖3,其中圖3中曲線L1表示為習知沒有設置透鏡的發光二極體封裝結構其歸一化光強度與發散角度的關係曲線,而曲線L2表示為本實例有設置的透鏡126的發光二極體封裝結構124a其歸一化光強度與發散角度的關係曲線。相較於曲線L1,曲線L2的發散角度分佈較廣,即正負75度,且規一化光強度也分佈的很平均,即平均約為0.3。如此一來,可將相鄰兩發光二極體封裝結構124a之間的間距拉大,藉此可有效減少發光二極體封裝結構124a的使用個數,因而可有效降低背光模組100a的生產成本,且可提高背光模組100a的出光均勻度。More specifically, please refer to FIG. 3 , where the curve L1 in FIG. 3 is a relationship between the normalized light intensity and the divergence angle of the light-emitting diode package structure in which the lens is not provided, and the curve L2 is represented as an example. The light-emitting diode package structure 124a of the lens 126 is provided with a normalized light intensity versus divergence angle. Compared with the curve L1, the divergence angle of the curve L2 is widely distributed, that is, plus or minus 75 degrees, and the normalized light intensity is also distributed evenly, that is, the average is about 0.3. In this way, the spacing between the adjacent two LED package structures 124a can be increased, thereby effectively reducing the number of the LED package structures 124a, thereby effectively reducing the production of the backlight module 100a. The cost and the uniformity of light emission of the backlight module 100a can be improved.
較佳地,請再參考圖1,每一發光二極體封裝結構124a具有一照明半徑R,而燈條120的基板122的一上表面122a到光學膜片130a的一底表面132a具有一光學距離OD,且透鏡126的一1/2發散角度為θ,則R/OD=tan(θ)。此處,相鄰兩發光二極體封裝結構124a的中間點之間的一距離P,一最佳值常數E介於1.7至2.3之間,則R=E*P。也就是說,在相同地光學距離OD下,透鏡126的發散角度越大,則距離P越大,其代表發光二極體封裝結構124a所需的個數減少,可有效降低背光模組100a的生產成本。另一方面,在相同距離P下,透鏡126的發散角度越大,則光學距離OD越小,其代表燈箱110的厚度越薄,可有效提高背光模組100a的競爭力。簡言之,使用者可透過上面的關係式,來改變光學距離OD或是距離P,以得到所需的背光模組100a的功效。Preferably, referring to FIG. 1, each of the LED package structures 124a has an illumination radius R, and an upper surface 122a of the substrate 122 of the light bar 120 has an optical surface to a bottom surface 132a of the optical film 130a. The distance OD, and a 1/2 divergence angle of the lens 126 is θ, then R/OD = tan(θ). Here, a distance P between the intermediate points of the adjacent two LED package structures 124a, an optimum value constant E is between 1.7 and 2.3, then R = E * P. That is to say, under the same optical distance OD, the larger the divergence angle of the lens 126 is, the larger the distance P is, and the number of the required light-emitting diode package structure 124a is reduced, which can effectively reduce the backlight module 100a. Cost of production. On the other hand, at the same distance P, the larger the divergence angle of the lens 126 is, the smaller the optical distance OD is. The thinner the thickness of the light box 110 is, the more effective the backlight module 100a can be. In short, the user can change the optical distance OD or the distance P through the above relationship to obtain the desired function of the backlight module 100a.
值得一提的是,上述所定義的最佳值常數E,其目的在於:調整距離P,使背光模組100a所提供的面光源看起來更為均勻。另外,若距離P太大,可能會面臨發光二極體封裝結構124a所發出的光束的亮度不夠亮,此時可藉由增加發光二極體晶片124a2 (請參考圖2A) 的供電瓦數來增加亮度,而這也是覆晶式的發光二極體晶片124a2的優勢。It is worth mentioning that the optimal value constant E defined above is aimed at adjusting the distance P to make the surface light source provided by the backlight module 100a look more uniform. In addition, if the distance P is too large, the brightness of the light beam emitted by the LED package structure 124a may be insufficiently bright. In this case, the number of power supply watts of the LED array 124a2 (refer to FIG. 2A) may be increased. The brightness is increased, which is also an advantage of the flip-chip light-emitting diode wafer 124a2.
當然,本實施例並不限定發光二極體封裝結構124a的排列方式。請參考圖4,在本實施例中,背光模組 100b與圖1的背光模組100a相似,惟二者主要差異之處在於:本實施例的背光模組100b中的發光二極體封裝結構124c1、124c2、124c3、124c4、124c5具體化呈不等間距的間隔排列於基板122上,其中發光二極體封裝結構124c1、124c2、124c3、124c4、124c5的結構可與發光二極體封裝結構124a或發光二極體封裝結構124b相同,於此並不加以限制。較佳地,0.9P<P<1.1P。如圖4所示,發光二極體封裝結構124c3與發光二極體封裝結構124c2之間的距離P1,或者是,發光二極體封裝結構124c3與發光二極體封裝結構124c4之間的距離P1,是大於發光二極體封裝結構124c1與發光二極體封裝結構124c2之間的距離P2,或者是發光二極體封裝結構124c4與發光二極體封裝結構124c5之間的距離P2。舉例來說,距離P1例如是1.1P,而距離P2例如是0.9P,其中距離P表示為當發光二極體封裝結構124a呈等間距的間隔排列時,相鄰兩發光二極體封裝結構124a的中間點之間的距離。Of course, this embodiment does not limit the arrangement of the LED package structures 124a. Referring to FIG. 4, in the embodiment, the backlight module 100b is similar to the backlight module 100a of FIG. 1, but the main difference is that the LED module of the backlight module 100b of the embodiment has a light-emitting diode package structure. 124c1, 124c2, 124c3, 124c4, and 124c5 are arranged on the substrate 122 at unequal intervals, wherein the structure of the LED package structures 124c1, 124c2, 124c3, 124c4, and 124c5 and the LED package structure 124a Or the LED package structure 124b is the same, and is not limited herein. Preferably, 0.9P < P < 1.1P. As shown in FIG. 4, the distance P1 between the LED package structure 124c3 and the LED package structure 124c2, or the distance P1 between the LED package structure 124c3 and the LED package structure 124c4. It is greater than the distance P2 between the LED package structure 124c1 and the LED package structure 124c2, or the distance P2 between the LED package structure 124c4 and the LED package structure 124c5. For example, the distance P1 is, for example, 1.1P, and the distance P2 is, for example, 0.9P, wherein the distance P is expressed as when the light emitting diode package structures 124a are arranged at equal intervals, the adjacent two light emitting diode package structures 124a. The distance between the middle points.
本實施例的背光模組100b,其發光二極體封裝結構124c1、124c2、124c3、124c4、124c5具體化呈不等間距的間隔排列於基板122上,因此可將燈箱110中央重疊的亮度拉寬,以降低燈箱110中央的光強度,以補足燈箱110邊緣的暗區,進而使得背光模組100b可提供均勻度較佳地面光源。上述所述的背光模組100a、100b例如是廣告的燈箱。In the backlight module 100b of the present embodiment, the LED packages 124c1, 124c2, 124c3, 124c4, and 124c5 are arranged on the substrate 122 at unequal intervals, thereby widening the brightness of the center of the light box 110. In order to reduce the light intensity in the center of the light box 110 to complement the dark area at the edge of the light box 110, the backlight module 100b can provide a uniform ground light source. The backlight modules 100a and 100b described above are, for example, advertising light boxes.
此外,本實施例並不限定光學膜片130a的個數與種類。請參考圖5,在本實施例中,背光模組 100c與圖1的背光模組100a相似,惟二者主要差異之處在於:本實施例的光學膜片具體化有三片,其分別是二擴散片130c1、130c3以及一稜鏡片130c2,其中稜鏡片130c2位於擴散片130c1、130c3之間。或者是,請參考圖6,在本實施例中,背光模組 100d與圖1的背光模組100a相似,惟二者主要差異之處在於:本實施例的光學膜片具體化有四片,其分別是三擴散片130d1、130d3、130d4以及一稜鏡片130d2,其中稜鏡片130d2位於擴散片130d1、130d3之間,但並不以此為限。上述所述的背光模組100c、100d例如是電視的背光模組。Further, the present embodiment does not limit the number and type of the optical sheets 130a. Referring to FIG. 5, in the present embodiment, the backlight module 100c is similar to the backlight module 100a of FIG. 1, but the main difference between the two is that the optical film of the embodiment has three slices, which are respectively two. The diffusion sheets 130c1, 130c3 and a cymbal sheet 130c2 are disposed between the diffusion sheets 130c1, 130c3. Alternatively, please refer to FIG. 6. In this embodiment, the backlight module 100d is similar to the backlight module 100a of FIG. 1, but the main difference between the two is that the optical film of the embodiment has four pieces. The three diffusion sheets 130d1, 130d3, and 130d4 are respectively disposed between the diffusion sheets 130d1 and 130d3, but are not limited thereto. The backlight modules 100c and 100d described above are, for example, backlight modules of televisions.
另外,本實施例並不限定透鏡126的入光面126a2的曲率半徑。請同時參考圖7A與圖7B,其中圖7A為圖1中的發光二極體封裝結構124a與透鏡部126a,而圖7B中的發光二極體封裝結構124a與圖7A中發光二極體封裝結構124a相同,其主要差異在於:圖7B中的透鏡部126a’ 的入光面126a2’ 的曲率半徑小於圖7A中的透鏡部126a的入光面126a2的曲率半徑。由圖7A與圖7B中可清楚地得知,圖7A中透鏡部126a的入光面126a2 的曲率半徑較大,因此發光二極體封裝結構124a所發出的光束較為發散,而圖7B中透鏡部126a’的入光面126a2’ 的曲率半徑較小,因此發光二極體封裝結構124a所發出的光束較為集中。簡言之,使用者可依據所需效果而自行選擇透鏡部126a、126a’的入光面126a2、126a2’ 的曲率半徑,於此並不加以限制。In addition, this embodiment does not limit the radius of curvature of the light incident surface 126a2 of the lens 126. Please refer to FIG. 7A and FIG. 7B simultaneously, wherein FIG. 7A is the LED package structure 124a and the lens portion 126a of FIG. 1, and the LED package structure 124a of FIG. 7B and the LED package of FIG. 7A. The structure 124a is the same, and the main difference is that the radius of curvature of the light incident surface 126a2' of the lens portion 126a' in Fig. 7B is smaller than the radius of curvature of the light incident surface 126a2 of the lens portion 126a in Fig. 7A. As can be clearly seen from FIG. 7A and FIG. 7B, the radius of curvature of the light incident surface 126a2 of the lens portion 126a in FIG. 7A is relatively large, so that the light beam emitted by the light emitting diode package structure 124a is relatively divergent, and the lens in FIG. 7B is relatively dense. The light incident surface 126a2' of the portion 126a' has a small radius of curvature, so that the light beam emitted by the light emitting diode package structure 124a is concentrated. In short, the user can select the radius of curvature of the light incident surfaces 126a2, 126a2' of the lens portions 126a, 126a' according to the desired effect, and is not limited thereto.
綜上所述,本新型創作的發光二極體封裝結構與透鏡對應設置,因此發光二極體封裝結構所發出的光束可被均勻分散,即可將相鄰兩發光二極體封裝結構之間的間距拉大,藉此可有效減少發光二極體封裝結構的使用個數,因而可有效降低背光模組的生產成本,以及提高背光模組的出光均勻度。In summary, the LED package structure created by the present invention is disposed corresponding to the lens, so that the light beam emitted by the LED package structure can be uniformly dispersed, and the adjacent two LED packages can be arranged between the two LED packages. The pitch is increased, thereby effectively reducing the number of use of the LED package structure, thereby effectively reducing the production cost of the backlight module and improving the uniformity of the backlight module.
雖然本新型創作已以實施例揭露如上,然其並非用以限定本新型創作,任何所屬技術領域中具有通常知識者,在不脫離本新型創作的精神和範圍內,當可作些許的更動與潤飾,故本新型創作的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the novel creation, and any person skilled in the art can make some changes without departing from the spirit and scope of the novel creation. Retouching, the scope of protection of this new creation is subject to the definition of the scope of the patent application attached.
100a、100b、100c、100d‧‧‧背光模組
110‧‧‧燈箱
112‧‧‧底部
114‧‧‧出光側
120‧‧‧燈條
122‧‧‧基板
122a‧‧‧上表面
124a、124b、124c1、124c2、124c3、124c4、124c5‧‧‧發光二極體封裝結構
124a1‧‧‧承載基板
124a2、124b1‧‧‧發光二極體晶片
124a3‧‧‧波長轉換層
124a4‧‧‧透明膠層
124a5、124b3‧‧‧樹脂膠體層
124b2‧‧‧波長轉換膠片
125a1‧‧‧上表面
125a2‧‧‧下表面
125a3‧‧‧第一接墊
125a4‧‧‧第二接墊
126‧‧‧透鏡
126a、126a’‧‧‧透鏡部
126a1‧‧‧出光面
126a2、126a2’‧‧‧入光面
126b‧‧‧支撐部
127a1、125b1‧‧‧主動表面
127a2、125b2‧‧‧背表面
127a3、125b3‧‧‧側表面
127a4、125b4‧‧‧電極接墊
128a‧‧‧錫膏
128b‧‧‧封裝膠層
129a1、127b1‧‧‧周圍表面
129a2、127b2‧‧‧頂表面
130a‧‧‧光學膜片
130c1、130c3、130d1、130d3、130d4‧‧‧擴散片
130c1、130d2‧‧‧稜鏡片
132a‧‧‧底表面
L1、L2‧‧‧曲線
P、P1、P2‧‧‧距離
R‧‧‧照明半徑
S‧‧‧空隙
OD‧‧‧光學距離
θ‧‧‧1/2發散角度100a, 100b, 100c, 100d‧‧‧ backlight module
110‧‧‧Lightbox
112‧‧‧ bottom
114‧‧‧Lighting side
120‧‧‧light strips
122‧‧‧Substrate
122a‧‧‧ upper surface
124a, 124b, 124c1, 124c2, 124c3, 124c4, 124c5‧‧‧Light emitting diode package structure
124a1‧‧‧bearing substrate
124a2, 124b1‧‧‧Light Emitter Wafer
124a3‧‧‧wavelength conversion layer
124a4‧‧‧Transparent rubber layer
124a5, 124b3‧‧‧ resin colloid layer
124b2‧‧‧ wavelength conversion film
125a1‧‧‧ upper surface
125a2‧‧‧ lower surface
125a3‧‧‧first mat
125a4‧‧‧second mat
126‧‧‧ lens
126a, 126a'‧‧‧ lens section
126a1‧‧‧Glossy surface
126a2, 126a2'‧‧‧ into the glossy surface
126b‧‧‧Support
127a1, 125b1‧‧‧ active surface
127a2, 125b2‧‧‧ back surface
127a3, 125b3‧‧‧ side surface
127a4, 125b4‧‧‧ electrode pads
128a‧‧‧ solder paste
128b‧‧‧Package layer
129a1, 127b1‧‧‧ surrounding surface
129a2, 127b2‧‧‧ top surface
130a‧‧‧Optical diaphragm
130c1, 130c3, 130d1, 130d3, 130d4‧‧‧ diffuser
130c1, 130d2‧‧‧ pictures
132a‧‧‧ bottom surface
L1, L2‧‧‧ curve
P, P1, P2‧‧‧ distance
R‧‧‧Lighting radius
S‧‧‧ gap
OD‧‧‧ optical distance θ‧‧‧1/2 divergence angle
圖1繪示為本新型創作的一實施例的一種背光模組的示意圖。 圖2A繪示為圖1中的一個發光二極體封裝結構的放大示意圖。 圖2B繪示為另一實施例中的一個發光二極體封裝結構的放大示意圖。 圖3繪示為圖1中的一個發光二極體封裝結構對應一個透鏡設置後的歸一化光強度與發散角度的關係曲線圖。 圖4繪示為本新型創作的另一實施例的一種背光模組的示意圖。 圖5繪示為本新型創作的另一實施例的一種背光模組的示意圖。 圖6繪示為本新型創作的另一實施例的一種背光模組的示意圖。 圖7A與圖7B繪示為透鏡的入光面具有不同的曲率半徑與發光二極體封裝結構所發出的光束的光線路徑的示意圖。FIG. 1 is a schematic diagram of a backlight module according to an embodiment of the present invention. FIG. 2A is an enlarged schematic view showing a light emitting diode package structure of FIG. 1. FIG. 2B is an enlarged schematic view showing a light emitting diode package structure in another embodiment. 3 is a graph showing the relationship between the normalized light intensity and the divergence angle of a light-emitting diode package structure of FIG. 1 corresponding to a lens. FIG. 4 is a schematic diagram of a backlight module according to another embodiment of the present invention. FIG. 5 is a schematic diagram of a backlight module according to another embodiment of the present invention. FIG. 6 is a schematic diagram of a backlight module according to another embodiment of the present invention. 7A and FIG. 7B are schematic diagrams showing light paths of the light incident surface of the lens having different radii of curvature and light beams emitted by the light emitting diode package structure.
100a‧‧‧背光模組 100a‧‧‧Backlight module
110‧‧‧燈箱 110‧‧‧Lightbox
112‧‧‧底部 112‧‧‧ bottom
114‧‧‧出光側 114‧‧‧Lighting side
120‧‧‧燈條 120‧‧‧light strips
122‧‧‧基板 122‧‧‧Substrate
122a‧‧‧上表面 122a‧‧‧ upper surface
124a‧‧‧發光二極體封裝結構 124a‧‧‧Light Emitting Diode Structure
126‧‧‧透鏡 126‧‧‧ lens
126a‧‧‧透鏡部 126a‧‧‧Lens Department
126a1‧‧‧入光面 126a1‧‧‧Into the glossy surface
126a2‧‧‧出光面 126a2‧‧‧Glossy surface
126b‧‧‧支撐部 126b‧‧‧Support
130a‧‧‧光學膜片 130a‧‧‧Optical diaphragm
132a‧‧‧底表面 132a‧‧‧ bottom surface
P‧‧‧距離 P‧‧‧ distance
R‧‧‧照明半徑 R‧‧‧Lighting radius
S‧‧‧空隙 S‧‧‧ gap
OD‧‧‧光學距離 OD‧‧‧ optical distance
θ‧‧‧1/2發散角度 Θ‧‧‧1/2 divergence angle
Claims (20)
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TWI677645B (en) * | 2019-01-23 | 2019-11-21 | 奇景光電股份有限公司 | Illumination device |
US10831034B2 (en) | 2019-01-18 | 2020-11-10 | Himax Technologies Limited | Illumination device |
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US10831034B2 (en) | 2019-01-18 | 2020-11-10 | Himax Technologies Limited | Illumination device |
TWI677645B (en) * | 2019-01-23 | 2019-11-21 | 奇景光電股份有限公司 | Illumination device |
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