KR20120053412A - Led pakage and backlight unit including the same - Google Patents

Abstract

PURPOSE: An LED package and a backlight unit including the same are provided to increase an amount of light emitted in the side of the LED package by dispersing light from a vertical direction to a horizontal direction. CONSTITUTION: A lead frame is connected to a power source. A wire electrically connects an LED device to a lead frame. A body(110) receives the LED device and the lead frame. An optical diffusion film(180) disperses light to the side of an LED package(100). An opening unit(180a) is interposed between the light optical films.

Description

LED package and backlight unit including the same {LED PAKAGE AND BACKLIGHT UNIT INCLUDING THE SAME}

The present invention relates to an LED package, and more particularly, to an LED package for converting a directivity angle of light extracted from an LED package having a semiconductor light emitting diode device (LED) as a light source, and a backlight unit including the same.

A light emitting diode (LED), which is a semiconductor light emitting device, emits light energy of various wavelengths by bonding an n-type semiconductor, which is a majority carrier with electrons, and a p-type semiconductor, which is a majority carrier with holes, and applying an electrical signal thereto. Element. The above-mentioned LED is a high efficiency, low power device, and has the advantages of miniaturization, thinning, and light weight, long life, no preheating time, and very fast turn on / off speed, which makes it possible to use lighting devices such as incandescent lamps and fluorescent lamps. In addition, as it is utilized in the backlight module of a large area liquid crystal display (LCD), it is attracting more attention.

The LED device is packaged with a mold such as plastic to protect the device from an impact from the outside, to efficiently extract light, and to have a heat dissipation function.

LED package types include lamp type, surface mount device type (SMD type), and chip on board (COB). In particular, the SMD-type package is formed by die-bonding on a ceramic substrate and then molded with an epoxy resin, and thus has better heat dissipation than other structures. The SMD-type package has a top view method depending on the direction of light emission. And a side view package.

1 is a view schematically showing the structure of a conventional top view type SMD type LED package.

As shown in the drawing, the conventional top view type SMD type LED package 10 includes an LED device 20 for emitting light, a main body 30 on which the LED device 20 is seated, and a lead frame 32 connected to a power source. ), A wire 34 electrically connecting the LED element 20 and the lead frame 32 to supply power to the LED element 20, and filled and discharged in the LED element 20 and the main body 30. It includes an encapsulant 40 for extracting light.

According to this structure, when the power is supplied through the lead frame 32, the LED element 20 emits light, and the light passes through the encapsulant 40 is extracted to the front of the LED package 10. However, some of the light emitted from the LED device 20 is totally reflected by the density difference between the encapsulant 40 and the air layer on the LED package is prevented from being emitted to the outside. In addition, since the LED element 20 is provided inside the main body 30, the light emitted by the LED element 20 is blocked by the inner wall of the main body 30.

Therefore, when the light emitted from the LED package 10 uses the above-described LED package for the direct type backlight unit and the edge type backlight unit, the distribution of the emitted light is determined for each LED package 10. ) Is biased toward the center of the area where the LCD package is driven, so that the area corresponding to the position where the LED package is disposed on the screen appears brighter than other areas, and it becomes difficult to realize a uniform surface light source.

This causes a decrease in the quality of the entire image displayed by the liquid crystal display. In order to solve this problem, a method of adding an optical sheet provided in the backlight unit has been proposed, but there are disadvantages such as an increase in production cost according to the addition of the optical sheet.

The present invention has been made to solve the above-mentioned disadvantages, by concentrating the light emitted through the LED package used in the backlight unit of the conventional liquid crystal display in the lateral direction of the LED package, thereby providing a uniform surface light source of the backlight unit An object of the present invention is to provide an LED package that can be implemented and a backlight unit including the same.

In order to achieve the above object, the LED package according to a preferred embodiment of the present invention, the lamp structure for emitting light to the front and a plurality of thin films (thin film) having different refractive index on the front of the lamp structure It includes a light diffusing film for increasing the side-direction angle of the light emitted through the stacked fine pattern.

The lamp structure, the LED device; A lead frame connected to a power source; A wire electrically connecting the LED element and the lead frame; A main body in which the LED element and the lead frame are mounted inwardly; And an encapsulant for molding the LED element.

The plurality of thin film is characterized in that at least the lower thin film is higher in refractive index than the upper thin film.

The plurality of thin films is characterized in that at least the lower thin film has a lower refractive index than the encapsulant.

The plurality of thin film is characterized in that the film of the same material each having a different thickness.

The light diffusing film is characterized in that intersecting with the opening therebetween.

The light diffusing film is arranged in a line with an opening interposed therebetween, wherein the neighboring rows are arranged to alternate between the light diffusing film and the opening.

When the LED device is a red light emitting device that emits red light, a cyan fluorescent layer made of a green fluorescent material and a blue fluorescent material inside the lead frame; In the case of a green light emitting device that emits green light, a red blue fluorescent layer made of a red phosphor and a blue phosphor inside the lead frame; Alternatively, the blue light emitting device emitting blue light may further include any one of a red green fluorescent layer made of a red fluorescent material and a green fluorescent material inside the lead frame.

The LED device, the substrate; An n-type GaN layer formed on the substrate and having an electrode in a partial region; An active layer formed on the n-type GaN layer; A p-type GaN layer formed on the active layer; And a transparent electrode layer formed on the p-type GaN layer.

The LED device is characterized in that the forward type or flip type (filp type).

The encapsulating agent is characterized in that the epoxy or silicon-based compound.

In order to achieve the above object, the LED package according to a preferred embodiment of the present invention includes a lamp structure for emitting light to the front, and the embossed layer is arranged on the front surface of the lamp structure a plurality of projections are hemispherical in cross section. .

The lamp structure, the LED device; A lead frame connected to a power source; A wire electrically connecting the LED element and the lead frame; A main body in which the LED element and the lead frame are mounted inwardly; And an encapsulant for molding the LED device, wherein the embossing layer is formed of the same material as the encapsulant.

As the backlight unit for providing light to the liquid crystal panel for the above object,

A light diffusing film for increasing the side-direction angle of the light emitted through a fine pattern formed by stacking a lamp structure for emitting light to the front and a plurality of thin films having different refractive indices on the front of the lamp structure LED package comprising a; And,

It characterized in that it comprises an optical mechanism member for transmitting the light emitted by the LED package to the liquid crystal panel through optical conversion.

The optical device member may include a lamp substrate on which one or more LED packages are bonded; A lamp housing in which the lamp substrate is mounted; A light guide plate disposed to face a side surface of the opening of the lamp housing to guide the light emitted from the LED package and output the light upward; A diffusion sheet provided on an upper portion of the light guide plate to diffuse the light emitted to the entire area of the liquid crystal panel; And a prism sheet provided at an upper portion of the diffusion sheet to emit the diffused light to the front side.

According to a preferred embodiment of the present invention, the light emitted by the LED element is emitted in a vertical direction by converting the refractive angle through a light diffusion film in which a plurality of thin film films having different refractive indices attached on the LED package are laminated. The amount of light emitted from the side surface of the LED package may be increased by dispersing the light in a horizontal direction. Accordingly, the directivity angle of the light emitted from each LED package is further extended to the side, thereby concentrating on the area where the conventional LED package is located, thereby improving luminance difference on the screen, thereby achieving a uniform surface light source.

Furthermore, it is possible to improve the screen quality of the liquid crystal display device having a backlight unit composed of the LED package of the present invention.

1 is a view schematically showing the structure of a conventional top view type SMD type LED package.
FIG. 2A illustrates a structure of an LED package including a fine pattern according to the first embodiment of the present invention.
Figure 2b is a view showing the structure of the LED package before the attachment of the fine pattern.
FIG. 2C is a diagram illustrating a structure of an LED package including a fine pattern according to a second embodiment of the present invention.
3 is a view showing the structure of the LED device of the present invention.
4A illustrates a cross-sectional view of an LED package according to an embodiment of the present invention.
FIG. 4B is a view schematically showing the direction of light when driving the LED package shown in FIG. 4A.
5 is a view showing an LED package according to a third embodiment of the present invention.
FIG. 6 is a graph illustrating a directing angle of light emitted from an LED package and a conventional LED package according to an exemplary embodiment of the present invention.
7 is an exploded perspective view illustrating a structure of a backlight unit including an LED package according to an exemplary embodiment of the present invention, and a liquid crystal display module having the same.

Hereinafter, an LED package and a manufacturing method thereof according to a preferred embodiment of the present invention will be described with reference to the drawings.

FIG. 2A illustrates a structure of an LED package including a micropattern according to a first embodiment of the present invention, and FIG. 2B illustrates a structure of an LED package before attachment of the micropattern.

As shown, the LED package 100 according to the first embodiment of the present invention includes a main body 110, the LED element 120, the lead frame 130, the wire 140 and the encapsulant 150 It includes a lamp structure and the light diffusion film 180 formed of a plurality of fine patterns.

In detail, the main body 110 is to be mounted inside the LED device 120, it may be formed of a resin-based, ceramic-based, or silicon-based material, the efficiency of the light emitted by the LED device 120 It increases and protects the LED element 120 from the heat radiation function and the external impact lamp. Although not shown, a reflector may be further included on the inner wall of the main body 110 to further increase the light efficiency.

The LED element 120 is formed by growing a gallium nitride (GaN) thin film or the like on a substrate such as sapphire. As shown in FIG. 3, an electron and a buffer layer 122 and a pn junction are formed on the substrate 121. An active layer 126 formed between the n-type gallium nitride (GaN) layer 123, the p-type gallium nitride (GaN) layer 125, and the gallium nitride (GaN) layers 123 and 125 that supply holes to emit light ), A transparent electrode 127 for ohmic contact, and a semiconductor pad 124 electrically connected to the n-type gallium nitride (GaN) layer 123 and the p-type gallium nitride (GaN) layer 127. 128 is sequentially stacked. According to the intention of the LED package designer, a plurality of such LED elements 120 may be mounted on the main body 110, and may be mounted in a forward direction as shown in the drawing, and the substrate portion of the LED elements 120 may be disposed on the upper portion thereof. It may be mounted in a flip-type that is mounted so as to face. When the flip LED device 120 is applied to the LED package, the wire 140 may be omitted and the electrode of the LED device 120 may be directly bonded on the lead frame 130. The above-described flip type LED device 120 is characterized by an increase in light extraction efficiency, an increase in heat emission, an increase in reliability, and an increase in process cost compared to the forward type.

In addition, the active layer of the LED device 120 may be a multiple quantum well structure (MQW), it is possible to control the composition and thickness of the well layer and the barrier layer to obtain the wavelength of the required band.

Referring again to FIGS. 2A through 2B, the lead frame 130 is for supplying power to the n-type gallium nitride layer and the p-type gallium nitride layer of the LED device 120, and part of the lead frame 130 is inside the main body 110. It is exposed to and electrically connected to this portion and the wire 140 is bonded to both semiconductor pads of the LED device 120. In addition, a portion exposed to the outside of the main body 110 is electrically connected to a power supply means that is an external device.

As described above, the wire 140 is for electrically connecting the LED device 120 and the lead frame 130 and may be one of gold, aluminum, and copper. As the bonding method of the wire 140, a thermocompression bonding method using a heat and pressure is applied at a temperature of 300 ° C. or higher in the case of a gold wire, and an ultrasonic bonding method may be applied to an aluminum wire.

The encapsulant 150 is formed in a form in which the LED element 120 is mounted and bonded to the inside of the main body 110 and covers the upper portion, and is typically subjected to a compounding step, a mixing step, a discharging step, and a curing step. Is produced. The encapsulant 150 physically protects the components mounted inwardly of the main body 110 and serves to diffuse the light emitted from the LED device 120 to the front. The encapsulant 150 is UV-resistant, heat-resistant epoxy (epoxy) is used, in addition to the epoxy may be replaced with silicon (silicon).

The light diffusing film 180 is provided above the encapsulant 150 and serves to disperse the direction of light extracted through the encapsulant 150 to the side of the LED package. The pattern is formed.

In detail, the light diffusing film 180 is formed to intersect in a lattice form with an opening 180a interposed therebetween. The light diffusing film 180 has a structure in which one or more thin film films having different refractive indices are stacked to disperse light incident from the encapsulant 150 to the side.

Here, the plurality of thin films constituting the light diffusion film 180 is preferably configured such that the refractive index of the encapsulant 150 gradually decreases toward the outside, at least the refractive index of the encapsulant 150 is lower, Refractive index is higher than in air.

Therefore, the light emitted from the LED element 120 is reflected on the inner wall of the main body 110 or vertically passes through the encapsulant 150 to reach the light diffusion film 180, the light is a plurality of fine films As the light diffusing film 180 passes through the medium having a lower refractive index, the angle of refraction of the light is gradually increased so that the light is directed toward the side surface of the LED package at the interface between the microfilm and the air.

According to the above structure, the LED package according to the first embodiment of the present invention can increase the amount of light emitted in the side direction by converting the light in the vertical direction emitted from the LED element in the horizontal direction.

Hereinafter, the structure of the LED package according to the second embodiment of the present invention with reference to the drawings. In the second embodiment of the present invention, the configuration of the lamp structure is the same, except that the shape of the fine pattern, that is, the positions of the light diffusion film and the opening are different.

FIG. 2C is a diagram illustrating a structure of an LED package including a fine pattern according to a second embodiment of the present invention.

As shown, the light diffusion film 280 is provided on the main body 110, the LED device is mounted, and serves to disperse the direction of light extracted through the encapsulant to the side of the LED package. Many fine patterns are formed.

The light diffusing film 280 is formed in a check shape with a plurality of openings 280a therebetween in the horizontal and vertical directions. In detail, the light diffusion films 280 are arranged in a line with the openings 280a interposed therebetween, and the neighboring rows of the light diffusion films 280 are alternately disposed.

The light diffusing film also has a structure in which one or more thin film films having different refractive indices are stacked to disperse light incident from the encapsulant to the side.

4A is a diagram illustrating a cross-sectional view of an LED package according to an exemplary embodiment of the present invention, and FIG. 4B is a diagram schematically illustrating the direction of light when driving the LED package illustrated in FIG. 4A.

As shown, the LED package 100 of the present invention is a lamp structure including a main body 110, LED device 120, lead frame 130, wire 140, encapsulant 150, and light diffusion Film 180.

The LED package 100 is electrically connected to the lead frame 130 through which the LED element 120 mounted inside the main body 110 is connected to an external power source through the wire 140 and to the inside of the main body 110. An encapsulant 150 molding the LED device 120 and a light diffusion film 180 having a fine pattern in which a plurality of thin films 181 to 183 are stacked on the encapsulant 150.

According to this structure, the LED package 100 emits light from the active layer of the LED device 120 when power is applied through the electrode 130 exposed to the outside of the main body 110. Accordingly, some of the light passes through the encapsulant 150 and is reflected through the side walls and the bottom surface of the main body 110, and most of the light L proceeds to the upper portion of the main body 110 to the light diffusion film 180. Incident. When the light L incident on the light diffusion film 180 reaches the lower first thin film 181 in contact with the encapsulant 150, the refractive index between the encapsulant 150 and the first thin film 181 is reduced. In accordance with the difference of the refraction angle is increased, in addition to the light (L ₁ ) emitted to the front of the LED package 100, the light (L ₂ ) emitted to the side is increased.

Here, the light diffusion film 180 is composed of at least one thin film (181 to 183) as shown, each of the thin film has a different refractive index (n ₁ , n ₂ , n ₃ ). In particular, the thin films 181 to 183 have a relatively low refractive index toward the lower, that is, the first thin film 181 in contact with the encapsulant 150 toward the third thin film 183 in contact with the upper air. (N ₁ <n ₂ <n ₃ ).

This is due to the refractive characteristics of the light, and the light has a characteristic of changing the direction of travel at the interface of the medium as it progresses from one medium to another, which satisfies Snell's law (1).

According to Equation 1 above, the light traveling from the medium having a large refractive index to the medium has a large refractive angle. Therefore, the refractive index n1 of the first thin film 181 disposed at the lowermost part of the light diffusing film 180 should be smaller than the refractive index of the encapsulant 150 provided under the light diffusing film 180.

The above-described thin films may be formed to have different refractive indices by forming different thicknesses using the same material, or may be implemented with different materials having the same thickness.

According to this structure, the LED package of the present invention concentrates the direction of light emitted from the LED device from the front to the side to increase the side direction angle of the light. Hereinafter, an LED package according to another embodiment of the present invention will be described with reference to the drawings.

5 is a view showing an LED package according to a third embodiment of the present invention.

As shown, the LED package 100 according to another embodiment of the present invention is a main body 110, a wire 140 for connecting the LED element 120 mounted to the inside of the main body 110 with an external power source, Lamp structure including an encapsulant 150 for molding the LED element 120 into the main body 110, and a plurality of hemispherical shapes to replace the above-described light diffusion film 380 to the upper portion of the encapsulant 150 is An embossing layer 380 disposed.

As described above, the embossed layer 380 has a hemispherical cross section, and may be formed of the same material as the encapsulant 150. It can be formed by pressing to form an integral form, or by attaching the embossed film produced in a separate process.

According to this structure, when the light L emitted when the LED device 220 is driven passes through the encapsulant 150 and passes through the embossing layer 380, the difference in refractive index between the embossing layer 380 and the air, According to the outer convex curved surface of the embossing layer 380, more light is emitted in the lateral direction of the LED package. This converts the amount of light or light intensity near the center of the LED package into the amount of light or light intensity near the periphery to increase the amount of side light emission.

FIG. 6 is a graph illustrating a direction angle and component distribution of light emitted from an LED package according to an exemplary embodiment of the present invention. FIG.

As shown, in the conventional LED package, the light emitted within a predetermined range is evenly distributed to some extent, but the light emitted by the LED package of the present invention is particularly concentrated at near 60 ° and -60 ° angles (S). Extracted.

According to the above-described structure, the LED package of the present invention is formed in a horizontal direction by focusing the light emitted from the transparent electrode by the diffusion film to the side.

Hereinafter, a structure of a backlight unit of a liquid crystal display including an LED package according to an embodiment of the present invention will be described with reference to the drawings.

7 is an exploded perspective view illustrating a structure of a backlight unit including an LED package according to an exemplary embodiment of the present invention, and a liquid crystal display module having the same.

As illustrated, the liquid crystal display device module of the present invention includes a backlight unit 450 including a liquid crystal panel 410 and an LED package, and various kinds of appliances 430, 440, and 460 mounted thereon.

First, the liquid crystal panel 410 is formed of a liquid crystal layer interposed between the first substrate and the second substrate by a predetermined distance, and implements an image as a signal is applied from the driver PCB 420. In addition to the thin film transistor, various wirings and pixel electrodes are formed on the first substrate, and the second substrate is a color filter substrate for displaying RGB three primary colors, and a color filter layer and a black matrix BM are formed. The driver PCB 420 is mounted with a scan driver IC providing a scan signal for driving the above-mentioned thin film transistor and a data driver IC providing a data signal to the pixel electrode.

The liquid crystal panel 410 will be described in more detail. In the second substrate, a plurality of scan lines and a data line orthogonal to the plurality of scan lines are formed on the second substrate to define a plurality of pixel regions. A thin film transistor which is a switching element is formed.

In addition, the thin film transistor includes a gate electrode connected to a gate line, a semiconductor layer formed by stacking amorphous silicon, etc. on the gate electrode, a source electrode and a drain electrode formed on the semiconductor layer and electrically connected to the data line and the pixel electrode. Is done.

The first substrate is a color filter composed of a plurality of sub-color filters that realize red, green, and blue colors, and a black that separates each sub-color filter and blocks light transmitted through the liquid crystal layer. It consists of a matrix BM.

The upper and lower substrates configured as described above are joined to face each other by sealants formed on the outer side of the image display area to form a liquid crystal panel, and the first and second polarizing plates are attached to the upper and lower substrates, respectively. The polarized light incident to the liquid crystal panel 410 is output to implement an image.

In addition, the backlight unit 450 includes a plurality of LED packages 451 disposed on a lower side of the liquid crystal panel 410 and emitting light, a lamp substrate 452 to which the LED packages 451 are bonded, and an inner side thereof. The lamp housing 453 for mounting the lamp substrate 452 and the light guide plate 454 disposed under the liquid crystal panel 410 to guide light emitted from the LED package 451 to the liquid crystal panel 410. And an optical sheet 455 which is provided between the liquid crystal panel 410 and the light guide plate 454 and is composed of one or more diffusion sheets and prism sheets which are guided by the light guide plate 454 to diffuse and collect light supplied to the liquid crystal panel 410. And a reflector 456 disposed under the light guide plate 454 to reflect light directed to the lower part.

Here, the LED package 510 may be a method of emitting red, green, and blue monochromatic light, or one package may emit white light.

When the LED package emitting monochromatic light is arranged, the red, green, and blue monochromatic light LED packages are alternately arranged at regular intervals, and the monochromatic light emitted from the light is mixed with white light and then supplied to the liquid crystal panel 410, and the white light is emitted. When the LED package is provided, a plurality of LED packages are disposed at predetermined intervals to supply white light to the liquid crystal panel 410.

In addition, in a manner in which one package emits white light, if the LED device serving as the light source is a red light emitting device emitting red light, a cyan fluorescent layer made of a green fluorescent material and a blue fluorescent material is further included inside the lead frame. When the device is a green light emitting device that emits green light, the lead frame further includes a red blue phosphor layer made of a red phosphor and a blue phosphor. In addition, in the case of a blue light emitting device emitting blue light, a red green fluorescent layer including a red phosphor and a green phosphor is further included inside the lead frame.

In addition, although the drawing shows an example in which the LED package is disposed on one side of the LGP as a side type backlight unit, the present invention is also applied to the backlight unit in which the LED package is disposed on both sides of the LGP and the back of the LCD panel. The technical spirit of can be applied.

In addition, the LED package 451 is bonded to a lamp substrate 452 made of a plurality of metal or PCB substrate. The lamp substrate 452 is disposed along the side of the light guide plate 454 and mounted in the lamp housing 453 to face the side. The lamp housing 453 may be formed of a metal material so that light emitted from the LED package 451 may be incident on the light guide plate 454 efficiently. As a result, the LED package 451 bonded to the lamp substrate 452 directly enters light toward the side of the light guide plate 454 when driven, and also allows light reflected through the lamp housing 453 to enter the light guide plate 454. do.

Here, the light emitted from each LED package 451 has a directivity angle concentrated on the side surface, and thus is incident evenly on the side portion of the light guide plate 454.

The light guide plate 454 is used to guide the light emitted from the LED package 451 to the liquid crystal panel 400, and the light incident on one side of the light guide plate 454 is reflected from the top and bottom surfaces of the light guide plate 454 and the other side. After propagating up, it is emitted to the upper portion of the light guide plate 454.

In this case, the light guide plate 454 may have a rectangular parallelepiped having different thicknesses at both ends, and a predetermined pattern or groove may be formed on the lower surface to scatter incident light.

The optical sheet 455 improves the efficiency of light emitted from the light guide plate 454 to supply the liquid crystal panel 410. The optical sheet 455 is composed of a diffusion sheet for diffusing light emitted from the light guide plate 454 and a plurality of prism sheets for condensing the light diffused by the diffusion sheet to supply uniform light to the liquid crystal panel 410. . In this case, one diffusion sheet is typically provided, but the prism sheet includes a first prism sheet and a second prism sheet in which the prism crosses vertically in the x and y axis directions, thereby refracting light in the x and y axis directions to provide light. It is preferable to comprise so that a straightness may be improved.

The reflective plate 456, the light guide plate 454, and the optical sheet 455 of the backlight unit 450 having the structure are accommodated in the cover bottom 460, and then the cover bottom 460, the support main 430, and the case top ( 440 is assembled with each other, and the support main 430 and the case top 440 having the above-described structure and the cover bottom 460 are combined from the bottom, whereby the liquid crystal panel 410 and the backlight unit 450 are assembled. The liquid crystal display module is completed.

In particular, the cover bottom 460 is composed of a bottom surface positioned below the reflective plate 456, a side surface of the light guide plate 454, and a wall surface fixing the rear surface of the lamp substrate 452, and the light guide plate 454 and the optical sheet 450. ), A reflecting plate 456 and the like are accommodated to assemble the backlight unit 450. Here, the reflecting plate 456 may be configured to extend not only to the rear surface of the light guide plate 454 but also to a part of the side surface and the upper surface.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.

100: LED package 110: main body
120: LED element 130: lead frame
140: wire 150: sealing agent
180, 280, 380: light diffusion film 180a, 280a: opening

Claims (15)

Lamp structure for emitting light to the front; And,
Light diffusion film for increasing the side-direction angle of the light emitted through the fine pattern formed by stacking a plurality of thin film having a different refractive index on the front surface of the lamp structure
LED package comprising a. The method of claim 1,
The lamp structure,
LED device;
A lead frame connected to a power source;
A wire electrically connecting the LED element and the lead frame;
A main body in which the LED element and the lead frame are mounted inwardly; And,
Encapsulant Molding the LED Element
LED package comprising a. The method of claim 1,
The plurality of thin film films, LED package, characterized in that the at least the lower thin film film has a higher refractive index than the upper thin film. The method of claim 2,
The plurality of thin film films, LED package, characterized in that at least the lower thin film is lower in refractive index than the encapsulant. The method of claim 3, wherein
The plurality of thin film film, LED package, characterized in that each of the films of the same material having a different thickness. The method of claim 1,
The light diffusing film is an LED package, characterized in that intersecting with the opening. The method of claim 1,
The light diffusing film is arranged in a line with an opening therebetween, the neighboring column is the LED package, characterized in that the light diffusing film and the opening are arranged alternately. The method of claim 2,
The LED device,
In the case of a red light emitting device that emits red light, a cyan fluorescent layer made of a green fluorescent material and a blue fluorescent material inside the lead frame;
In the case of a green light emitting device that emits green light, a red blue fluorescent layer made of a red phosphor and a blue phosphor inside the lead frame; or,
In the case of a blue light emitting device that emits blue light, the red green fluorescent layer comprising a red phosphor and a green phosphor inside the lead frame,
LED package, characterized in that it further comprises any one. The method of claim 2,
The LED device,
Board;
An n-type GaN layer formed on the substrate and having an electrode in a partial region;
An active layer formed on the n-type GaN layer;
A p-type GaN layer formed on the active layer; And,
Transparent electrode layer formed on the p-type GaN layer
LED package comprising a. The method of claim 2,
The LED device,
LED package, characterized in that the forward type or flip type (filp type). The method of claim 2,
The sealing agent,
LED package, characterized in that the compound of the epoxy (epoxy) or silicon (silicon) series. Lamp structure for emitting light to the front; And,
Embossing layer in which a plurality of protrusions having a hemispherical cross section is disposed on the front surface of the lamp structure
LED package comprising a. The method of claim 12,
The lamp structure,
LED device;
A lead frame connected to a power source;
A wire electrically connecting the LED element and the lead frame;
A main body in which the LED element and the lead frame are mounted inwardly; And,
An encapsulant for molding the LED device,
The embossing layer is an LED package, characterized in that formed of the same material as the encapsulant. As a backlight unit for providing light to the liquid crystal panel,
A light diffusing film for increasing the side-direction angle of the light emitted through a fine pattern formed by stacking a lamp structure for emitting light to the front and a plurality of thin films having different refractive indices on the front of the lamp structure LED package comprising a; And,
Optical device member for transmitting the light emitted by the LED package to the liquid crystal panel through optical conversion
Backlight unit comprising a. 15. The method of claim 14,
The optical instrument member,
A lamp substrate on which one or more LED packages are bonded;
A lamp housing in which the lamp substrate is mounted;
A light guide plate disposed to face a side surface of the opening of the lamp housing to guide the light emitted from the LED package and output the light upward;
A diffusion sheet provided on an upper portion of the light guide plate to diffuse the light emitted to the entire area of the liquid crystal panel; And,
A prism sheet provided at the upper portion of the diffusion sheet to emit the diffused light to the front
Backlight unit comprising a.

Images