JPH08242020A - Mounting structure of light emitting diode - Google Patents
Mounting structure of light emitting diodeInfo
- Publication number
- JPH08242020A JPH08242020A JP7045555A JP4555595A JPH08242020A JP H08242020 A JPH08242020 A JP H08242020A JP 7045555 A JP7045555 A JP 7045555A JP 4555595 A JP4555595 A JP 4555595A JP H08242020 A JPH08242020 A JP H08242020A
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- metal circuit
- circuit substrate
- recessed part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、カメラのオートフォー
カスをはじめとして光学的距離測定などに利用されてい
る発光ダイオードを実装する構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for mounting a light emitting diode which is used for optical distance measurement and the like, including auto focus of a camera.
【０００２】[0002]
【従来の技術】従来の発光ダイオードの実装構造として
は、図２（ａ）、（ｂ）に示すような構造が挙げられ
る。すなわち、回路基板に実装するリードフレーム５１
上に側面が傾斜面となっている凹部５１ａを形成し、凹
部５１ａ内に発光ダイオード５２をダイボンディングし
て、並設されている配線パターン５３にリード線５４に
て結線し、そして、リードフレーム５１の両端は回路基
板に実装するための端子として残しておいて、発光ダイ
オード５２をモールド材５５でモールドするという構造
である。2. Description of the Related Art As a conventional mounting structure of a light emitting diode, there is a structure as shown in FIGS. That is, the lead frame 51 mounted on the circuit board
A concave portion 51a having an inclined side surface is formed on the upper side, the light emitting diode 52 is die-bonded in the concave portion 51a, and the wiring pattern 53 arranged in parallel is connected by a lead wire 54, and the lead frame is formed. Both ends of 51 are left as terminals for mounting on a circuit board, and the light emitting diode 52 is molded with a molding material 55.
【０００３】[0003]
【発明が解決しようとする課題】従来のものは、リード
フレームに反射面を設けているため反射面の角度に安定
性がなく、さらに、発光ダイオードの周囲をモールド材
でモールドするために特別なモールド型を必要とし、ま
た、その作業は極めて煩雑であるという問題点を有して
いた。In the conventional device, the lead frame is provided with a reflecting surface, so that the angle of the reflecting surface is not stable, and further, it is special for molding the periphery of the light emitting diode with a molding material. There is a problem that a mold is required and the work is extremely complicated.
【０００４】そこで本発明の目的は、発光ダイオードの
発する光を安定して反射でき、実装作業が容易にできる
発光ダイオードの実装構造を提供することにある。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a mounting structure of a light emitting diode which can stably reflect the light emitted from the light emitting diode and can be easily mounted.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するため
に、本発明では、金属回路基板の表面には、側面が傾斜
面となった凹部が設けてあり、金属回路基板の表面に
は、凹部に到達する配線パターンが絶縁層を介して設け
てあり、凹部には、配線パターンと接続された発光ダイ
オードチップが実装してあり、絶縁層は、配線パターン
に対応する部分に形成され、残余部分からは金属回路基
板の地肌が露見しており、地肌が露見した傾斜面が発光
ダイオードチップから発せられる光の反射面となってお
り、凹部には、発光ダイオードチップを保護するポッテ
ィング樹脂が充填されている。In order to achieve the above object, according to the present invention, a concave portion having a slanted side surface is provided on the surface of the metal circuit board, and the surface of the metal circuit board is A wiring pattern reaching the concave portion is provided via an insulating layer, and a light emitting diode chip connected to the wiring pattern is mounted in the concave portion, and the insulating layer is formed in a portion corresponding to the wiring pattern, and a residual portion is formed. The bare surface of the metal circuit board is exposed from the part, the inclined surface where the bare surface is exposed is the reflection surface of the light emitted from the light emitting diode chip, and the recess is filled with potting resin that protects the light emitting diode chip. Has been done.
【０００６】[0006]
【実施例】以下、本発明の詳細を添付図面に示した好適
な実施例にそって説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the present invention will be described below with reference to the preferred embodiments shown in the accompanying drawings.
【０００７】図１に本発明の発光ダイオード１の実装構
造を示す。金属回路基板２には側面が傾斜面となった凹
部３が設けられている。金属回路基板２の表面には、一
方が凹部３の底部３ａまで、もう一方が凹部３の周囲に
形成された棚部３ｂまで到達する配線パターン４ａ、４
ｂが絶縁層５を介して設けてある。棚部３ｂはボンディ
ングを容易にするために部分的に水平面にしてある。配
線パターン４ａ、４ｂの設けられていない表面には絶縁
層５は設けられておらず、金属回路基板２の地肌３ｃが
露見して反射面を形成している。凹部３の底面３ａには
発光ダイオードチップ１が実装され、棚部３ｂの配線パ
ターン４ｂにボンディングワイヤ６にて結線されてい
る。そして、凹部３にはポッティング樹脂７が充填され
ていて、発光ダイオードチップ１は保護されている。な
お、ポッティング樹脂７の表面が上端開口部で水平にな
るようにポッティング樹脂７は充填されている。FIG. 1 shows a mounting structure of the light emitting diode 1 of the present invention. The metal circuit board 2 is provided with a concave portion 3 whose side surface is an inclined surface. On the surface of the metal circuit board 2, one of the wiring patterns 4a, 4a reaches the bottom 3a of the recess 3 and the other reaches the shelf 3b formed around the recess 3.
b is provided via the insulating layer 5. The shelves 3b are partially horizontal to facilitate bonding. The insulating layer 5 is not provided on the surface where the wiring patterns 4a and 4b are not provided, and the background 3c of the metal circuit board 2 is exposed to form a reflection surface. The light emitting diode chip 1 is mounted on the bottom surface 3a of the recess 3 and is connected to the wiring pattern 4b of the shelf 3b by a bonding wire 6. The recess 3 is filled with potting resin 7 to protect the light emitting diode chip 1. The potting resin 7 is filled so that the surface of the potting resin 7 is horizontal at the upper end opening.
【０００８】本実施例によれば、発光ダイオード１を実
装する凹部は側面が傾斜面となった金属回路基板２に設
けてあるから、反射面が金属回路基板の金属地肌で形成
されていて発光ダイオード１の発する光が安定して反射
され、照射効率が高くなる。さらに、金属回路基板の表
面の凹部に充填するポッティング樹脂の表面を平面にす
ることにより、距離測定に誤差が生じにくくなる。According to the present embodiment, since the concave portion for mounting the light emitting diode 1 is provided on the metal circuit board 2 having the inclined side surface, the reflecting surface is formed by the metal surface of the metal circuit board to emit light. The light emitted from the diode 1 is stably reflected and the irradiation efficiency is increased. Further, by making the surface of the potting resin that fills the concave portion on the surface of the metal circuit board flat, an error is less likely to occur in the distance measurement.
【０００９】[0009]
【発明の効果】本発明の構成によれば、発光ダイオード
の発光する光は安定して反射され、実装作業は容易に行
なわれる。According to the structure of the present invention, the light emitted from the light emitting diode is stably reflected, and the mounting work is facilitated.
【図１】本発明の発光ダイオードの実装構造を示す図で
あり、（ａ）は平面図、（ｂ）は断面図である。1A and 1B are views showing a mounting structure of a light emitting diode of the present invention, in which FIG. 1A is a plan view and FIG. 1B is a sectional view.
【図２】従来の発光ダイオードの実装構造を示す図であ
り、（ａ）は平面図、（ｂ）は断面図である。2A and 2B are views showing a mounting structure of a conventional light emitting diode, wherein FIG. 2A is a plan view and FIG. 2B is a sectional view.
１ 発光ダイオードチップ ２ 金属回路基板 ３ 凹部 ４ 配線パターン ５ 絶縁層 ７ ポッティング樹脂 1 Light Emitting Diode Chip 2 Metal Circuit Board 3 Recess 4 Wiring Pattern 5 Insulating Layer 7 Potting Resin
Claims (1)
となった凹部が設けてあり、 上記金属回路基板の表面には、上記凹部に到達する配線
パターンが絶縁層を介して設けてあり、 上記凹部には、上記配線パターンと接続された発光ダイ
オードチップが実装してあり、 上記絶縁層は、上記配線パターンに対応する部分に形成
され、残余部分からは上記金属回路基板の地肌が露見し
ており、 地肌が露見した上記傾斜面が上記発光ダイオードチップ
から発せられる光の反射面となっており、 上記凹部には、上記発光ダイオードチップを保護するポ
ッティング樹脂が充填されていることを特徴とする発光
ダイオードの実装構造。1. A surface of the metal circuit board is provided with a concave portion whose side surface is an inclined surface, and a wiring pattern reaching the concave portion is provided on the surface of the metal circuit board via an insulating layer. The light emitting diode chip connected to the wiring pattern is mounted in the concave portion, the insulating layer is formed in a portion corresponding to the wiring pattern, and the background of the metal circuit board is formed from the remaining portion. It is exposed, the inclined surface where the background is exposed is a reflection surface of the light emitted from the light emitting diode chip, and the recess is filled with potting resin that protects the light emitting diode chip. Characteristic light-emitting diode mounting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7045555A JPH08242020A (en) | 1995-03-06 | 1995-03-06 | Mounting structure of light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7045555A JPH08242020A (en) | 1995-03-06 | 1995-03-06 | Mounting structure of light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08242020A true JPH08242020A (en) | 1996-09-17 |
Family
ID=12722615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7045555A Pending JPH08242020A (en) | 1995-03-06 | 1995-03-06 | Mounting structure of light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08242020A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006179520A (en) * | 2004-12-20 | 2006-07-06 | Nichia Chem Ind Ltd | Semiconductor device |
| KR100757826B1 (en) * | 2006-09-29 | 2007-09-11 | 서울반도체 주식회사 | Side-view light emitting diode package |
| JP2007294966A (en) * | 2006-04-21 | 2007-11-08 | Samsung Electro-Mechanics Co Ltd | Led package with multi-level reflection surface structure, and manufacturing method of the same |
| US8083372B2 (en) * | 2008-04-25 | 2011-12-27 | Epson Imaging Devices Corporation | Illumination system, electro-optic device, and electronic apparatus |
| CN102708761A (en) * | 2012-06-14 | 2012-10-03 | 广东威创视讯科技股份有限公司 | Device for eliminating joint seam of rear projector splicing wall |
| KR101279998B1 (en) * | 2012-11-07 | 2013-07-05 | 김영석 | Chip on board light-emitting diode package of high radiation |
| JP2015099948A (en) * | 2015-03-02 | 2015-05-28 | ローム株式会社 | Light emitting device, manufacturing method of light emitting device, and optical device |
-
1995
- 1995-03-06 JP JP7045555A patent/JPH08242020A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4591071B2 (en) * | 2004-12-20 | 2010-12-01 | 日亜化学工業株式会社 | Semiconductor device |
| JP2006179520A (en) * | 2004-12-20 | 2006-07-06 | Nichia Chem Ind Ltd | Semiconductor device |
| JP2007294966A (en) * | 2006-04-21 | 2007-11-08 | Samsung Electro-Mechanics Co Ltd | Led package with multi-level reflection surface structure, and manufacturing method of the same |
| US20090227050A1 (en) * | 2006-04-21 | 2009-09-10 | Samsung Electro-Mechanics Co., Ltd. | Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof |
| US8586128B2 (en) * | 2006-04-21 | 2013-11-19 | Samsung Electronics Co., Ltd. | Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof |
| US8373180B2 (en) | 2006-09-29 | 2013-02-12 | Seoul Semiconductor Co., Ltd. | Light emitting diode package |
| KR100757826B1 (en) * | 2006-09-29 | 2007-09-11 | 서울반도체 주식회사 | Side-view light emitting diode package |
| WO2008038978A1 (en) * | 2006-09-29 | 2008-04-03 | Seoul Semiconductor Co., Ltd. | Light emitting diode package |
| US8083372B2 (en) * | 2008-04-25 | 2011-12-27 | Epson Imaging Devices Corporation | Illumination system, electro-optic device, and electronic apparatus |
| US8833957B2 (en) | 2008-04-25 | 2014-09-16 | Epson Imaging Devices Corporation | Illumination system, electro-optic device, and electronic apparatus |
| CN102708761A (en) * | 2012-06-14 | 2012-10-03 | 广东威创视讯科技股份有限公司 | Device for eliminating joint seam of rear projector splicing wall |
| KR101279998B1 (en) * | 2012-11-07 | 2013-07-05 | 김영석 | Chip on board light-emitting diode package of high radiation |
| JP2015099948A (en) * | 2015-03-02 | 2015-05-28 | ローム株式会社 | Light emitting device, manufacturing method of light emitting device, and optical device |
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