JPH0459167U - - Google Patents

Info

Publication number
JPH0459167U
JPH0459167U JP1990100245U JP10024590U JPH0459167U JP H0459167 U JPH0459167 U JP H0459167U JP 1990100245 U JP1990100245 U JP 1990100245U JP 10024590 U JP10024590 U JP 10024590U JP H0459167 U JPH0459167 U JP H0459167U
Authority
JP
Japan
Prior art keywords
chip
type light
emitting diodes
step surface
mounting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990100245U
Other languages
Japanese (ja)
Other versions
JPH0810211Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990100245U priority Critical patent/JPH0810211Y2/en
Publication of JPH0459167U publication Critical patent/JPH0459167U/ja
Application granted granted Critical
Publication of JPH0810211Y2 publication Critical patent/JPH0810211Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48475—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
    • H01L2224/48476—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
    • H01L2224/48477—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding)
    • H01L2224/48478—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball
    • H01L2224/4848—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案に係るチツプ型発光ダイオード
の取付構造の一実施例を示す断面図、第２図は平
面図、第３図は従来のチツプ型発光ダイオードの
取付構造を示す一部破断平面図、第４図は要部の
平面図、第５図は第３図のＶ−Ｖ線拡大断面図、
第６図はボンデイングワイヤのシヨートを防止す
る構造例を示す断面図、第７図はその平面図であ
る。 １……基板、２……収納凹部、３……導電層、
４……リード電極、５……チツプ型発光ダイオー
ド、６……ボンデイングワイヤ、７……透明樹脂
、８……凸レンズ、１１……段差面、１２……外
側の周壁面、１２ａ……ボンデイングワイヤ引き
出し方向の壁面部分。 Fig. 1 is a cross-sectional view showing an embodiment of the mounting structure for a chip-type light emitting diode according to the present invention, Fig. 2 is a plan view, and Fig. 3 is a partially cutaway plane showing a conventional mounting structure for a chip-type light-emitting diode. Figure 4 is a plan view of the main part, Figure 5 is an enlarged sectional view taken along the line V-V in Figure 3,
FIG. 6 is a sectional view showing an example of a structure for preventing shortening of the bonding wire, and FIG. 7 is a plan view thereof. 1... Substrate, 2... Storage recess, 3... Conductive layer,
4... Lead electrode, 5... Chip type light emitting diode, 6... Bonding wire, 7... Transparent resin, 8... Convex lens, 11... Step surface, 12... Outer peripheral wall surface, 12a... Bonding wire Wall area facing the drawer.

Claims (1)

【実用新案登録請求の範囲】 基板上に複数個のチツプ型発光ダイオードを配
列し、これらのダイオードをボンデイングワイヤ
によつて直列に接続したチツプ型発光ダイオード
の取付構造において、 前記基板の表面に各発光ダイオードをそれぞれ
収納する略皿型の収納凹部を設け、この収納凹部
の周壁の外周寄りに環状の段差面を形成し、且つ
この段差面より外側の周壁面のうちで前記ボンデ
イングワイヤの引き出し方向の壁面部分を除く収
納凹部の内面全体に導電層を形成したことを特徴
とするチツプ型発光ダイオードの取付構造。[Claims for Utility Model Registration] In a mounting structure for chip-type light-emitting diodes in which a plurality of chip-type light-emitting diodes are arranged on a substrate and these diodes are connected in series by bonding wires, Approximately dish-shaped storage recesses for storing the light emitting diodes are provided, an annular step surface is formed near the outer periphery of the peripheral wall of the storage recess, and a step surface is formed on the peripheral wall surface outside the step surface in the direction in which the bonding wire is drawn out. A mounting structure for a chip-type light emitting diode, characterized in that a conductive layer is formed on the entire inner surface of the storage recess except for the wall surface portion.
JP1990100245U 1990-09-27 1990-09-27 Chip type LED mounting structure Expired - Lifetime JPH0810211Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990100245U JPH0810211Y2 (en) 1990-09-27 1990-09-27 Chip type LED mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990100245U JPH0810211Y2 (en) 1990-09-27 1990-09-27 Chip type LED mounting structure

Publications (2)

Publication Number Publication Date
JPH0459167U true JPH0459167U (en) 1992-05-21
JPH0810211Y2 JPH0810211Y2 (en) 1996-03-27

Family

ID=31842749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990100245U Expired - Lifetime JPH0810211Y2 (en) 1990-09-27 1990-09-27 Chip type LED mounting structure

Country Status (1)

Country Link
JP (1) JPH0810211Y2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003534628A (en) * 2000-05-02 2003-11-18 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Lighting equipment
JP2005159276A (en) * 2003-10-28 2005-06-16 Matsushita Electric Works Ltd Semiconductor light emitting device and method of manufacturing the same
WO2008038708A1 (en) * 2006-09-29 2008-04-03 Rohm Co., Ltd. Semiconductor light emitting device
JP2021192422A (en) * 2020-04-02 2021-12-16 日亜化学工業株式会社 Surface light source and method of manufacturing the same
US12027501B2 (en) 2020-04-02 2024-07-02 Nichia Corporation Surface light source and method of manufacturing surface light source

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003534628A (en) * 2000-05-02 2003-11-18 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Lighting equipment
JP2005159276A (en) * 2003-10-28 2005-06-16 Matsushita Electric Works Ltd Semiconductor light emitting device and method of manufacturing the same
WO2008038708A1 (en) * 2006-09-29 2008-04-03 Rohm Co., Ltd. Semiconductor light emitting device
JPWO2008038708A1 (en) * 2006-09-29 2010-01-28 ローム株式会社 Semiconductor light emitting device
JP2021192422A (en) * 2020-04-02 2021-12-16 日亜化学工業株式会社 Surface light source and method of manufacturing the same
US12027501B2 (en) 2020-04-02 2024-07-02 Nichia Corporation Surface light source and method of manufacturing surface light source

Also Published As

Publication number Publication date
JPH0810211Y2 (en) 1996-03-27

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