JPH0227754U - - Google Patents
Info
- Publication number
- JPH0227754U JPH0227754U JP1988106331U JP10633188U JPH0227754U JP H0227754 U JPH0227754 U JP H0227754U JP 1988106331 U JP1988106331 U JP 1988106331U JP 10633188 U JP10633188 U JP 10633188U JP H0227754 U JPH0227754 U JP H0227754U
- Authority
- JP
- Japan
- Prior art keywords
- diodes
- lead frame
- exterior body
- diode
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図乃至第４図は本考案実施例を示し、第１
図は、本考案の実施例を示す平面図、第２図は、
同上正面図、第３図は、他の実施例を示す平面図
、第４図は、同上正面図、第５図乃至第９図は従
来例を示し、第５図は、従来例の正面図、第６図
は、同上の結線図、第７図は、他の従来例の正面
図、第８図は、同上の結線図、第９図は、第５図
及び第７図の平面図である。
１…外装体、２，４…支持カツプ、３，５，６
…リードフレーム、Ｄ２，Ｄ３…発光ダイオード
。
Figures 1 to 4 show embodiments of the present invention;
The figure is a plan view showing an embodiment of the present invention, and FIG.
FIG. 3 is a front view of another embodiment; FIG. 4 is a front view of the same; FIGS. 5 to 9 show a conventional example; and FIG. 5 is a front view of the conventional example. , FIG. 6 is a wiring diagram of the same as above, FIG. 7 is a front view of another conventional example, FIG. 8 is a wiring diagram of the same as above, and FIG. 9 is a plan view of FIGS. 5 and 7. be. 1... Exterior body, 2, 4... Support cup, 3, 5, 6
...Lead frame, D2 , D3 ...Light emitting diode.
Claims (1)
分割したそれぞれの取付カツプ内に設置し、各ダ
イオードにそれぞれリードフレームを付設してエ
ポキシ樹脂より成る外装体にて封止してなる２色
発光素子。 A two-color light-emitting element in which two semiconductor light-emitting diodes of different junction types are installed in separate mounting cups, a lead frame is attached to each diode, and the diodes are sealed with an exterior body made of epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988106331U JPH0227754U (en) | 1988-08-10 | 1988-08-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988106331U JPH0227754U (en) | 1988-08-10 | 1988-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0227754U true JPH0227754U (en) | 1990-02-22 |
Family
ID=31339741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988106331U Pending JPH0227754U (en) | 1988-08-10 | 1988-08-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0227754U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5839063B2 (en) * | 1978-03-08 | 1983-08-27 | アントン・ヘツゲンスタラ− | Extruder filling station closing device |
| JPH01157577A (en) * | 1987-12-14 | 1989-06-20 | Mini Pairo Denki:Kk | Semiconductor light emitting device |
-
1988
- 1988-08-10 JP JP1988106331U patent/JPH0227754U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5839063B2 (en) * | 1978-03-08 | 1983-08-27 | アントン・ヘツゲンスタラ− | Extruder filling station closing device |
| JPH01157577A (en) * | 1987-12-14 | 1989-06-20 | Mini Pairo Denki:Kk | Semiconductor light emitting device |