JPH03106764U - - Google Patents

Info

Publication number
JPH03106764U
JPH03106764U JP1990014908U JP1490890U JPH03106764U JP H03106764 U JPH03106764 U JP H03106764U JP 1990014908 U JP1990014908 U JP 1990014908U JP 1490890 U JP1490890 U JP 1490890U JP H03106764 U JPH03106764 U JP H03106764U
Authority
JP
Japan
Prior art keywords
facing
light
mounting
emitting diode
mounting surfaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990014908U
Other languages
Japanese (ja)
Other versions
JP2544236Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990014908U priority Critical patent/JP2544236Y2/en
Publication of JPH03106764U publication Critical patent/JPH03106764U/ja
Application granted granted Critical
Publication of JP2544236Y2 publication Critical patent/JP2544236Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案実施例の平面図、第２図は第１
図のＡ−Ａ′断面図、第３図は第１図のＢ−Ｂ′
断面図、第４図は本考案実施例の応用例１、第５
図は本考案実施例の応用例２、第６図は従来の表
示装置の断面図である。 １……第１のリードフレーム、２……第２のリ
ードフレーム、３，４……反射部、５……赤色発
光ダイオード、６……緑色発光ダイオード、７，
８……載置面、９，１０……底面、１１ａ……第
１の配線用リードフレーム、１１ｂ……第２の配
線用リードフレーム、１２……透明エポキシ樹脂
。 Fig. 1 is a plan view of an embodiment of the present invention, and Fig. 2 is a plan view of an embodiment of the present invention.
A cross-sectional view taken along line A-A' in the figure, and Figure 3 is taken along line B-B' in Figure 1.
The sectional view and FIG. 4 are application examples 1 and 5 of the embodiment of the present invention.
The figure is a second application example of the embodiment of the present invention, and FIG. 6 is a sectional view of a conventional display device. DESCRIPTION OF SYMBOLS 1...First lead frame, 2...Second lead frame, 3, 4...Reflection part, 5...Red light emitting diode, 6...Green light emitting diode, 7,
8... Placement surface, 9, 10... Bottom surface, 11a... First wiring lead frame, 11b... Second wiring lead frame, 12... Transparent epoxy resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 側壁に発光ダイオードの載置面を形成し該載置
面に対向した側面と上方とを開放しかつ窪んだ底
面からなる反射部を有し、前記載置面が略平行で
ありかつ対向するように配置された第１、第２の
リードフレームと、前記載置面の各々に側面が略
真上を指向するように載置固着された互いに発光
色の異なる発光ダイオードと、前記反射部の近傍
と前記発光ダイオードとを覆う透明樹脂とを具備
したことを特徴とする発光ダイオードランプ。 A light-emitting diode mounting surface is formed on the side wall, the side surface facing the mounting surface and the upper side are open, and the reflecting portion is formed of a recessed bottom surface, so that the mounting surfaces are substantially parallel and facing each other. first and second lead frames disposed on each of the mounting surfaces, light emitting diodes emitting light of different colors that are mounted and fixed on each of the mounting surfaces with their side surfaces facing substantially directly above, and a vicinity of the reflecting section. and a transparent resin covering the light emitting diode.
JP1990014908U 1990-02-16 1990-02-16 Light emitting diode lamp Expired - Lifetime JP2544236Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990014908U JP2544236Y2 (en) 1990-02-16 1990-02-16 Light emitting diode lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990014908U JP2544236Y2 (en) 1990-02-16 1990-02-16 Light emitting diode lamp

Publications (2)

Publication Number Publication Date
JPH03106764U true JPH03106764U (en) 1991-11-05
JP2544236Y2 JP2544236Y2 (en) 1997-08-13

Family

ID=31518244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990014908U Expired - Lifetime JP2544236Y2 (en) 1990-02-16 1990-02-16 Light emitting diode lamp

Country Status (1)

Country Link
JP (1) JP2544236Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011142123A1 (en) * 2010-05-14 2011-11-17 コニカミノルタセンシング株式会社 Light sources, illumination optical system and reflection property measurement apparatus

Also Published As

Publication number Publication date
JP2544236Y2 (en) 1997-08-13

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