JPH0369803U - - Google Patents
Info
- Publication number
- JPH0369803U JPH0369803U JP1989131356U JP13135689U JPH0369803U JP H0369803 U JPH0369803 U JP H0369803U JP 1989131356 U JP1989131356 U JP 1989131356U JP 13135689 U JP13135689 U JP 13135689U JP H0369803 U JPH0369803 U JP H0369803U
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting diode
- lead wire
- cylinder
- transmitting colored
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Description
第１図は従来例を示す一部を破断した側面図、
第２図は第１図の要部拡大断面図、第３図も従来
例の要部拡大断面図、第４図は本案実施例、第５
図は本案に用いる発光ダイオードランプの拡大縦
断面図である。
１……合図灯本体、２……グリツプ、３……透
光性着色筒体、４……発光ダイオードランプ、５
……第１のリード線、６……頂部反射板、７……
発光ダイオード、８……第２のリード線、９……
金属細線、１１……凸状反射板、１２……樹脂モ
ールド、１３……周側。
Figure 1 is a partially cutaway side view showing a conventional example;
Fig. 2 is an enlarged sectional view of the main part of Fig. 1, Fig. 3 is an enlarged sectional view of the main part of the conventional example, Fig. 4 is an embodiment of the present invention, and Fig. 5 is an enlarged sectional view of the main part of Fig. 1.
The figure is an enlarged longitudinal sectional view of a light emitting diode lamp used in the present invention. 1...Signal light body, 2...Grip, 3...Translucent colored cylinder, 4...Light emitting diode lamp, 5
...First lead wire, 6...Top reflector, 7...
Light emitting diode, 8... Second lead wire, 9...
Thin metal wire, 11...Convex reflecting plate, 12...Resin mold, 13...Surrounding side.
Claims (1)
色筒体を連設し、該透光性着色筒体内に複数個の
発光ダイオードランプを配設した合図灯において
、前記発光ダイオードランプを頂部反射面に発光
ダイオードを載置固着した第１のリード線と、該
第１のリード線に並設された第２のリード線と、
該第２のリード線の頂部と前記発光ダイオードと
を電気的に接続した金属細線と、前記発光ダイオ
ードと間隔を存して対向位置した凸状反射板と、
これらを覆う樹脂モールドとからならしめ、該発
光ダイオードランプの周側と前記透光性着色筒体
とを平行状態にして筒体の長手方向に沿つて複数
個配設して成る携帯用合図灯。 In a signal light, a light-transmitting colored cylinder is connected to the tip of a grip containing a built-in power supply battery, and a plurality of light-emitting diode lamps are arranged inside the light-transmitting colored cylinder, and the light-emitting diode lamp is connected to the top reflective surface. a first lead wire on which a light emitting diode is placed and fixed; a second lead wire arranged in parallel with the first lead wire;
a thin metal wire electrically connecting the top of the second lead wire and the light emitting diode, and a convex reflecting plate facing the light emitting diode with a gap therebetween;
A portable signal light comprising a plurality of light-emitting diode lamps and a resin mold covering them, and a plurality of light-transmitting colored cylinders arranged in parallel with each other along the longitudinal direction of the cylinder. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989131356U JPH0369803U (en) | 1989-11-09 | 1989-11-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989131356U JPH0369803U (en) | 1989-11-09 | 1989-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0369803U true JPH0369803U (en) | 1991-07-11 |
Family
ID=31678871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989131356U Pending JPH0369803U (en) | 1989-11-09 | 1989-11-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0369803U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11219138A (en) * | 1998-02-04 | 1999-08-10 | Kazuo Kobayashi | Planar light emitting display |
| JP2001053341A (en) * | 1999-08-09 | 2001-02-23 | Kazuo Kobayashi | Surface-emitting indicator |
-
1989
- 1989-11-09 JP JP1989131356U patent/JPH0369803U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11219138A (en) * | 1998-02-04 | 1999-08-10 | Kazuo Kobayashi | Planar light emitting display |
| JP2001053341A (en) * | 1999-08-09 | 2001-02-23 | Kazuo Kobayashi | Surface-emitting indicator |