JPS572583A - Sealing method for resin of light emitting diode - Google Patents

Sealing method for resin of light emitting diode

Info

Publication number
JPS572583A
JPS572583A JP7666180A JP7666180A JPS572583A JP S572583 A JPS572583 A JP S572583A JP 7666180 A JP7666180 A JP 7666180A JP 7666180 A JP7666180 A JP 7666180A JP S572583 A JPS572583 A JP S572583A
Authority
JP
Japan
Prior art keywords
resin
emitting diode
light emitting
potting
casting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7666180A
Other languages
Japanese (ja)
Other versions
JPS6117136B2 (en
Inventor
Setsuo Suzuki
Shinichi Tanimoto
Koji Morishita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP7666180A priority Critical patent/JPS572583A/en
Publication of JPS572583A publication Critical patent/JPS572583A/en
Publication of JPS6117136B2 publication Critical patent/JPS6117136B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Abstract

PURPOSE:To sealing a light emitting diode with high reliability by employing specific ultraviolet curable low viscosity resin composition. CONSTITUTION:Triallyl isocyanurate, polychiol series are selected as ultraviolet curable resin, an LED is sealed by method, e.g., potting, casting, dipping dropping and the like with resin composition to which a light strating agent, a heat discoloration preventive agent, coloring agent are added to the composition, and is then ultraviolet rays are emitted to cure the resin. Since the triallyl isocyanurate, polychoil series as ultraviolet ray curable resins are very low viscosity liquid, the workability in the potting, casting and the like is preferable, and defoaming operation can be further facilitated.
JP7666180A 1980-06-09 1980-06-09 Sealing method for resin of light emitting diode Granted JPS572583A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7666180A JPS572583A (en) 1980-06-09 1980-06-09 Sealing method for resin of light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7666180A JPS572583A (en) 1980-06-09 1980-06-09 Sealing method for resin of light emitting diode

Publications (2)

Publication Number Publication Date
JPS572583A true JPS572583A (en) 1982-01-07
JPS6117136B2 JPS6117136B2 (en) 1986-05-06

Family

ID=13611584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7666180A Granted JPS572583A (en) 1980-06-09 1980-06-09 Sealing method for resin of light emitting diode

Country Status (1)

Country Link
JP (1) JPS572583A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63108655U (en) * 1986-12-29 1988-07-13
US7651887B2 (en) 2004-09-22 2010-01-26 Dow Corning Toray Company, Ltd. Optical semiconductor device and method of manufacturing thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63108655U (en) * 1986-12-29 1988-07-13
JPH0445258Y2 (en) * 1986-12-29 1992-10-23
US7651887B2 (en) 2004-09-22 2010-01-26 Dow Corning Toray Company, Ltd. Optical semiconductor device and method of manufacturing thereof

Also Published As

Publication number Publication date
JPS6117136B2 (en) 1986-05-06

Similar Documents

Publication Publication Date Title
CN100352858C (en) Uvioresistant epoxy composition and its preparing method and use
JPS57186376A (en) Light emitting semiconductor element
MX171282B (en) BATCH COMPOSITION TO OBTAIN GREEN GLASS THAT ABSORBS INFRARED AND ULTRAVIOLET RADIATION
AU3806789A (en) Resins which may be cured to form polymeric resins which are difficultly inflammable and resistant to high temperatures, and process for preparing them
GB2158833A (en) Polymer material for coating hot greenhouses
WO2002019440A1 (en) Encapsulants for solid state devices
CN104004491A (en) LED ultraviolet curable organosilicon encapsulation adhesive and preparation method thereof
JPS572583A (en) Sealing method for resin of light emitting diode
JP3876251B2 (en) Thermosetting resin composition and light emitting diode using the composition as sealant
KR890015397A (en) Light-emitting or light-receiving device, sealing agent and sealing method
BR8106910A (en) COMPOSITION COATING AGENT AND CURED COATING
DK531882A (en) PROCEDURE FOR INDIRECT PREPARATION OF HIGH-RADIOACTIVE JOD-123 BY USING ITS 123 CHAIN PRECURSORS
JP2003012896A (en) Uv-resistant epoxy resin, and light emitting diode or wavelength conversion element sealed by using the epoxy resin
GB2022280A (en) Improvements in or relating to sealing optical fibres into packages.
ES524157A0 (en) PROCEDURE FOR ENCAPSULATING ELECTRONIC COMPONENTS
ES2005842A6 (en) Sealing and sticking agents, pourable masses and coating agents based on methacrylic esters.
JPS53147798A (en) Curable composition
JPS5312341A (en) Improvement of optical fiber characteristic
JP3969661B2 (en) Thermosetting resin composition and light emitting diode using the composition as sealant
JPS5759366A (en) Epoxy resin composition for sealing semiconductor
JPS5681338A (en) Photocurable composition
JPS5779678A (en) Photocoupling semiconductor device
JPS53120799A (en) Photo-curable composition for bonding glass
JPS57141470A (en) Uv ray-curable adhesive
JPS6460623A (en) Epoxy resin composition for semiconductor sealing