JPS6460623A - Epoxy resin composition for semiconductor sealing - Google Patents
Epoxy resin composition for semiconductor sealingInfo
- Publication number
- JPS6460623A JPS6460623A JP21532887A JP21532887A JPS6460623A JP S6460623 A JPS6460623 A JP S6460623A JP 21532887 A JP21532887 A JP 21532887A JP 21532887 A JP21532887 A JP 21532887A JP S6460623 A JPS6460623 A JP S6460623A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- epoxy resin
- resin
- novolak
- semiconductor sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To provide the title resin composition excellent in heat shock resistance of a cured product, by mixing a specified novolak epoxy resin with a phenol novolak resin, a phenol aralkyl resin and an organophosphine compound. CONSTITUTION:A novolak epoxy resin (A) having a bisphenol A in the skeleton, a phenol novolak resin (B), a phenol aralkyl resin (C), and an organophosphine compound (D) are mixed together as essential components to constitute an epoxy resin composition for semiconductor sealing. Examples of said organophosphine compounds used as cure accelerators include triphenylphosphine, tributylphosphine and butylphenylphosphine. The obtained resin composition can give a cured product excellent in heat shock resistance, so that it can be suitably used for use in, e.g., a semiconductor device of a high degree of integration.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21532887A JPS6460623A (en) | 1987-08-31 | 1987-08-31 | Epoxy resin composition for semiconductor sealing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21532887A JPS6460623A (en) | 1987-08-31 | 1987-08-31 | Epoxy resin composition for semiconductor sealing |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6460623A true JPS6460623A (en) | 1989-03-07 |
Family
ID=16670476
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21532887A Pending JPS6460623A (en) | 1987-08-31 | 1987-08-31 | Epoxy resin composition for semiconductor sealing |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6460623A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH048627U (en) * | 1990-05-11 | 1992-01-27 | ||
JPH04300914A (en) * | 1991-03-29 | 1992-10-23 | Shin Etsu Chem Co Ltd | Epoxy resin composition and semiconductor device |
JP2002275248A (en) * | 2001-01-09 | 2002-09-25 | Mitsui Chemicals Inc | Novolak aralkyl resin, method for manufacturing the same and composition of the resin |
-
1987
- 1987-08-31 JP JP21532887A patent/JPS6460623A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH048627U (en) * | 1990-05-11 | 1992-01-27 | ||
JPH04300914A (en) * | 1991-03-29 | 1992-10-23 | Shin Etsu Chem Co Ltd | Epoxy resin composition and semiconductor device |
JP2002275248A (en) * | 2001-01-09 | 2002-09-25 | Mitsui Chemicals Inc | Novolak aralkyl resin, method for manufacturing the same and composition of the resin |
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