JPS6460623A - Epoxy resin composition for semiconductor sealing - Google Patents

Epoxy resin composition for semiconductor sealing

Info

Publication number
JPS6460623A
JPS6460623A JP21532887A JP21532887A JPS6460623A JP S6460623 A JPS6460623 A JP S6460623A JP 21532887 A JP21532887 A JP 21532887A JP 21532887 A JP21532887 A JP 21532887A JP S6460623 A JPS6460623 A JP S6460623A
Authority
JP
Japan
Prior art keywords
resin composition
epoxy resin
resin
novolak
semiconductor sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21532887A
Other languages
Japanese (ja)
Inventor
Kazutaka Matsumoto
Shinetsu Fujieda
Takeshi Uchida
Akira Yoshizumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP21532887A priority Critical patent/JPS6460623A/en
Publication of JPS6460623A publication Critical patent/JPS6460623A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To provide the title resin composition excellent in heat shock resistance of a cured product, by mixing a specified novolak epoxy resin with a phenol novolak resin, a phenol aralkyl resin and an organophosphine compound. CONSTITUTION:A novolak epoxy resin (A) having a bisphenol A in the skeleton, a phenol novolak resin (B), a phenol aralkyl resin (C), and an organophosphine compound (D) are mixed together as essential components to constitute an epoxy resin composition for semiconductor sealing. Examples of said organophosphine compounds used as cure accelerators include triphenylphosphine, tributylphosphine and butylphenylphosphine. The obtained resin composition can give a cured product excellent in heat shock resistance, so that it can be suitably used for use in, e.g., a semiconductor device of a high degree of integration.
JP21532887A 1987-08-31 1987-08-31 Epoxy resin composition for semiconductor sealing Pending JPS6460623A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21532887A JPS6460623A (en) 1987-08-31 1987-08-31 Epoxy resin composition for semiconductor sealing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21532887A JPS6460623A (en) 1987-08-31 1987-08-31 Epoxy resin composition for semiconductor sealing

Publications (1)

Publication Number Publication Date
JPS6460623A true JPS6460623A (en) 1989-03-07

Family

ID=16670476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21532887A Pending JPS6460623A (en) 1987-08-31 1987-08-31 Epoxy resin composition for semiconductor sealing

Country Status (1)

Country Link
JP (1) JPS6460623A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH048627U (en) * 1990-05-11 1992-01-27
JPH04300914A (en) * 1991-03-29 1992-10-23 Shin Etsu Chem Co Ltd Epoxy resin composition and semiconductor device
JP2002275248A (en) * 2001-01-09 2002-09-25 Mitsui Chemicals Inc Novolak aralkyl resin, method for manufacturing the same and composition of the resin

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH048627U (en) * 1990-05-11 1992-01-27
JPH04300914A (en) * 1991-03-29 1992-10-23 Shin Etsu Chem Co Ltd Epoxy resin composition and semiconductor device
JP2002275248A (en) * 2001-01-09 2002-09-25 Mitsui Chemicals Inc Novolak aralkyl resin, method for manufacturing the same and composition of the resin

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