JPS6424869A - Coating material for hybrid ic - Google Patents

Coating material for hybrid ic

Info

Publication number
JPS6424869A
JPS6424869A JP18137287A JP18137287A JPS6424869A JP S6424869 A JPS6424869 A JP S6424869A JP 18137287 A JP18137287 A JP 18137287A JP 18137287 A JP18137287 A JP 18137287A JP S6424869 A JPS6424869 A JP S6424869A
Authority
JP
Japan
Prior art keywords
hybrid
coating material
bisphenol
derived
organic solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18137287A
Other languages
Japanese (ja)
Inventor
Kimihide Fujita
Manabu Yamane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP18137287A priority Critical patent/JPS6424869A/en
Publication of JPS6424869A publication Critical patent/JPS6424869A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Abstract

PURPOSE:To make it possible to obtain a coating material for a hybrid IC, which can give a hybrid IC markedly improved in moisture resistance, especially, pressure cooking property and excellent in heat shock resistance by a simple working step, by mixing two specified epoxy resins with a curing agent, a cure accelerator, an organic solvent and a silica filler. CONSTITUTION:This coating material contains 30-95pts.wt. epoxy resin (1) derived from bisphenol A and/or bisphenol F, 5-70pts.wt. epoxy resin (2) derived from cresol novolac resin [provided that the total amount of components (1) and (2) is 100pts.wt.], a phenol novolac resin curing agent (3), a cure accelerator (4), an organic solvent (5) and a surface-treated silica filler (6).
JP18137287A 1987-07-21 1987-07-21 Coating material for hybrid ic Pending JPS6424869A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18137287A JPS6424869A (en) 1987-07-21 1987-07-21 Coating material for hybrid ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18137287A JPS6424869A (en) 1987-07-21 1987-07-21 Coating material for hybrid ic

Publications (1)

Publication Number Publication Date
JPS6424869A true JPS6424869A (en) 1989-01-26

Family

ID=16099576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18137287A Pending JPS6424869A (en) 1987-07-21 1987-07-21 Coating material for hybrid ic

Country Status (1)

Country Link
JP (1) JPS6424869A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09502466A (en) * 1993-07-06 1997-03-11 ビーエーエスエフ ラッケ ウント ファルベン アクチエンゲゼルシャフト Powder lacquer, outer coating method for metal tubes and use of said powder lacquer for single-layer outer coating of metal tubes
JPH11286647A (en) * 1998-04-03 1999-10-19 Matsushita Electric Ind Co Ltd Coating material for fixed resistor
JP2006176595A (en) * 2004-12-21 2006-07-06 Matsushita Electric Works Ltd Epoxy resin composition for sealing semiconductor and semiconductor apparatus
JP2008130796A (en) * 2006-11-21 2008-06-05 Sumitomo Bakelite Co Ltd Insulating resin composition for multilayer printed circuit boards, insulation sheet with base material, multilayer printed circuit board, and semiconductor device
JP2012054573A (en) * 2011-10-11 2012-03-15 Sumitomo Bakelite Co Ltd Insulating resin composition for multilayer printed circuit board, insulation sheet with substrate, multilayer printed circuit board, and semiconductor device
JP2016130290A (en) * 2015-01-14 2016-07-21 リコーイメージング株式会社 Coating liquid and manufacturing method thereof
JP2022503626A (en) * 2019-09-11 2022-01-12 エルジー・ケム・リミテッド Manufacturing method of highly absorbent resin

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09502466A (en) * 1993-07-06 1997-03-11 ビーエーエスエフ ラッケ ウント ファルベン アクチエンゲゼルシャフト Powder lacquer, outer coating method for metal tubes and use of said powder lacquer for single-layer outer coating of metal tubes
JPH11286647A (en) * 1998-04-03 1999-10-19 Matsushita Electric Ind Co Ltd Coating material for fixed resistor
JP2006176595A (en) * 2004-12-21 2006-07-06 Matsushita Electric Works Ltd Epoxy resin composition for sealing semiconductor and semiconductor apparatus
JP2008130796A (en) * 2006-11-21 2008-06-05 Sumitomo Bakelite Co Ltd Insulating resin composition for multilayer printed circuit boards, insulation sheet with base material, multilayer printed circuit board, and semiconductor device
JP2012054573A (en) * 2011-10-11 2012-03-15 Sumitomo Bakelite Co Ltd Insulating resin composition for multilayer printed circuit board, insulation sheet with substrate, multilayer printed circuit board, and semiconductor device
JP2016130290A (en) * 2015-01-14 2016-07-21 リコーイメージング株式会社 Coating liquid and manufacturing method thereof
JP2022503626A (en) * 2019-09-11 2022-01-12 エルジー・ケム・リミテッド Manufacturing method of highly absorbent resin

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