JPS641756A - Epoxy resin composition for glass-epoxy laminate - Google Patents

Epoxy resin composition for glass-epoxy laminate

Info

Publication number
JPS641756A
JPS641756A JP15709587A JP15709587A JPS641756A JP S641756 A JPS641756 A JP S641756A JP 15709587 A JP15709587 A JP 15709587A JP 15709587 A JP15709587 A JP 15709587A JP S641756 A JPS641756 A JP S641756A
Authority
JP
Japan
Prior art keywords
epoxy resin
bisphenol
pref
epoxy
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15709587A
Other languages
Japanese (ja)
Other versions
JPH011756A (en
Inventor
Toshiharu Takada
Koji Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP62-157095A priority Critical patent/JPH011756A/en
Priority claimed from JP62-157095A external-priority patent/JPH011756A/en
Publication of JPS641756A publication Critical patent/JPS641756A/en
Publication of JPH011756A publication Critical patent/JPH011756A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: To obtain the titled composition of low cost, improved in heat, chemical and smear resistances, by incorporating a (brominated) bisphenol A type epoxy resin with a bisphenol F type novolak epoxy resin, dicyandiamide curing agent and imidazole compound.
CONSTITUTION: The objective composition can be obtained by incorporating (A) 100pts.wt. of a bisphenol A type epoxy resin or brominated bisphenol A type epoxy resin with (B) pref. 5W25pts.wt. of a bisphenol F type novolak epoxy resin, pref. predominantly of formula (n is 2W10), (C) pref. 2W8pts.wt. of a dicyandiamide curing agent and (D) as the curing accelerator, pref. 0.1W0.5pt.wt. of at least one kind of imidazole compound.
COPYRIGHT: (C)1989,JPO&Japio
JP62-157095A 1987-06-24 Epoxy resin composition for glass epoxy laminates Pending JPH011756A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62-157095A JPH011756A (en) 1987-06-24 Epoxy resin composition for glass epoxy laminates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62-157095A JPH011756A (en) 1987-06-24 Epoxy resin composition for glass epoxy laminates

Publications (2)

Publication Number Publication Date
JPS641756A true JPS641756A (en) 1989-01-06
JPH011756A JPH011756A (en) 1989-01-06

Family

ID=

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02283714A (en) * 1989-04-25 1990-11-21 Matsushita Electric Works Ltd Curable epoxy resin composition
JP2012021098A (en) * 2010-07-15 2012-02-02 Hitachi Chem Co Ltd Thermosetting resin composition, prepreg using the same, and laminate using the prepreg
JP2012236909A (en) * 2011-05-11 2012-12-06 Hitachi Chemical Co Ltd Thermosetting resin composition, and prepreg, laminate and printed wiring board using the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02283714A (en) * 1989-04-25 1990-11-21 Matsushita Electric Works Ltd Curable epoxy resin composition
JP2012021098A (en) * 2010-07-15 2012-02-02 Hitachi Chem Co Ltd Thermosetting resin composition, prepreg using the same, and laminate using the prepreg
JP2012236909A (en) * 2011-05-11 2012-12-06 Hitachi Chemical Co Ltd Thermosetting resin composition, and prepreg, laminate and printed wiring board using the same

Similar Documents

Publication Publication Date Title
JPS53143649A (en) Reinforced polyethylene terephthalate composition
JPS5659837A (en) Epoxy resin composition
JPS5426000A (en) Epoxy resin composition
JPS5359798A (en) Epoxy resin composition of excellent warm-water resistance
JPS641756A (en) Epoxy resin composition for glass-epoxy laminate
JPS641753A (en) Epoxy resin composition for glass-epoxy laminate
JPS641755A (en) Epoxy resin composition for glass-epoxy laminate
JPS53125475A (en) Prepreg
JPS572328A (en) Composition for adhesive
JPS57187325A (en) Production of epoxy resin laminated sheet
JPS52150500A (en) Epoxy resin compositions
JPS54112939A (en) Adhesive for copper-clad laminate
JPS5351298A (en) Thermosetting resin composition
JPS544994A (en) Epoxy resin composition
JPS6466225A (en) Resin composition
JPS5571718A (en) Fast-setting epoxy resin composition
JPS5439495A (en) Thermosetting resin composition
JPS57205420A (en) Thermosetting resin composition
JPS5728129A (en) Curing agent for epoxy resin
JPS5437200A (en) Epoxy resin composition
JPS53111352A (en) Polyester resin composition
JPS5465797A (en) Epoxy resin composition
JPS5258799A (en) Resin composition reinforced with carbon fibers
JPS5647445A (en) Epoxy resin composition
JPS5374599A (en) Preparation of resin composition