JPS5728129A - Curing agent for epoxy resin - Google Patents

Curing agent for epoxy resin

Info

Publication number
JPS5728129A
JPS5728129A JP10286680A JP10286680A JPS5728129A JP S5728129 A JPS5728129 A JP S5728129A JP 10286680 A JP10286680 A JP 10286680A JP 10286680 A JP10286680 A JP 10286680A JP S5728129 A JPS5728129 A JP S5728129A
Authority
JP
Japan
Prior art keywords
curing agent
epoxy resin
compound
dihydroxydiphenylamine
maleimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10286680A
Other languages
Japanese (ja)
Inventor
Masahiro Matsumura
Masaaki Otsu
Yoshihiro Kitsuta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP10286680A priority Critical patent/JPS5728129A/en
Publication of JPS5728129A publication Critical patent/JPS5728129A/en
Pending legal-status Critical Current

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Landscapes

  • Epoxy Resins (AREA)

Abstract

PURPOSE: The titled curing agent that contains a specific compound having phenolic residue, thus being suitably used to produce printed circuit base plates, because of its giving of cured epoxy resin of high heat resistance.
CONSTITUTION: The compound of the formula (R is mono- or more valent group containing at least one of aromatic or heterocyclic ring; n is the number corresponding to the bonds of R, when n is 2 or more, the structure of [ ] need not to be the same) is used as an epoxy resin curing agent, preferably so that the molar ratio of epoxy groups in the epoxy resin/active hydrogens in the curing agent becomes 0.8W 1.2. The above compound is obtained by the addition reaction of 4,4'-dihydroxydiphenylamine to a maleimide.
COPYRIGHT: (C)1982,JPO&Japio
JP10286680A 1980-07-26 1980-07-26 Curing agent for epoxy resin Pending JPS5728129A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10286680A JPS5728129A (en) 1980-07-26 1980-07-26 Curing agent for epoxy resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10286680A JPS5728129A (en) 1980-07-26 1980-07-26 Curing agent for epoxy resin

Publications (1)

Publication Number Publication Date
JPS5728129A true JPS5728129A (en) 1982-02-15

Family

ID=14338823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10286680A Pending JPS5728129A (en) 1980-07-26 1980-07-26 Curing agent for epoxy resin

Country Status (1)

Country Link
JP (1) JPS5728129A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5477479A (en) * 1993-03-08 1995-12-19 Nkk Corporation Multiplying system having multi-stages for processing a digital signal based on the Booth's algorithm
WO2007142140A1 (en) * 2006-06-06 2007-12-13 Hitachi Chemical Company, Ltd. Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate
WO2008041453A1 (en) * 2006-09-29 2008-04-10 Hitachi Chemical Company, Ltd. Thermosetting resin composition and prepreg and laminate obtained with the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5251499A (en) * 1975-10-23 1977-04-25 Toshiba Chem Corp Theremosetting resin compositions

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5251499A (en) * 1975-10-23 1977-04-25 Toshiba Chem Corp Theremosetting resin compositions

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5477479A (en) * 1993-03-08 1995-12-19 Nkk Corporation Multiplying system having multi-stages for processing a digital signal based on the Booth's algorithm
WO2007142140A1 (en) * 2006-06-06 2007-12-13 Hitachi Chemical Company, Ltd. Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate
US8461332B2 (en) 2006-06-06 2013-06-11 Hitachi Chemical Company, Ltd. Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate
US8796473B2 (en) 2006-06-06 2014-08-05 Hitachi Chemical Company, Ltd. Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate
WO2008041453A1 (en) * 2006-09-29 2008-04-10 Hitachi Chemical Company, Ltd. Thermosetting resin composition and prepreg and laminate obtained with the same
CN102558505A (en) * 2006-09-29 2012-07-11 日立化成工业株式会社 Thermosetting resin composition and prepreg and laminate obtained with the same
US9603244B2 (en) 2006-09-29 2017-03-21 Hitachi Chemical Company, Ltd Thermosetting resin composition and prepreg and laminate obtained with the same

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