JPS5340098A - Heat resistant resin composition - Google Patents

Heat resistant resin composition

Info

Publication number
JPS5340098A
JPS5340098A JP11563576A JP11563576A JPS5340098A JP S5340098 A JPS5340098 A JP S5340098A JP 11563576 A JP11563576 A JP 11563576A JP 11563576 A JP11563576 A JP 11563576A JP S5340098 A JPS5340098 A JP S5340098A
Authority
JP
Japan
Prior art keywords
resin composition
heat resistant
resistant resin
compound
formulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11563576A
Other languages
Japanese (ja)
Inventor
Takeo Ito
Moriyasu Wada
Shiyuichi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11563576A priority Critical patent/JPS5340098A/en
Publication of JPS5340098A publication Critical patent/JPS5340098A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prepare a liquid or low-melting heat resistant resin composition suitable for electrical insulating material for impregnation and casting by formulating an epoxy compound, maleimide type compound, isocyanate compound and curing catalyst.
COPYRIGHT: (C)1978,JPO&Japio
JP11563576A 1976-09-27 1976-09-27 Heat resistant resin composition Pending JPS5340098A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11563576A JPS5340098A (en) 1976-09-27 1976-09-27 Heat resistant resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11563576A JPS5340098A (en) 1976-09-27 1976-09-27 Heat resistant resin composition

Publications (1)

Publication Number Publication Date
JPS5340098A true JPS5340098A (en) 1978-04-12

Family

ID=14667515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11563576A Pending JPS5340098A (en) 1976-09-27 1976-09-27 Heat resistant resin composition

Country Status (1)

Country Link
JP (1) JPS5340098A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5638318A (en) * 1979-09-06 1981-04-13 Mitsubishi Electric Corp Heat-resistant resin composition
JPH02621A (en) * 1987-11-06 1990-01-05 Shell Internatl Res Maatschappij Bv Glycidyl ether of 2,2-bis-(3-allyl or propenyl)-4-hydroxyphenyl) compound, and resin obtained therefrom
JP2007146171A (en) * 2007-01-05 2007-06-14 Nippon Kayaku Co Ltd Epoxy resin composition for die bonding paste
JP2017095599A (en) * 2015-11-25 2017-06-01 三菱瓦斯化学株式会社 Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5638318A (en) * 1979-09-06 1981-04-13 Mitsubishi Electric Corp Heat-resistant resin composition
JPS6056170B2 (en) * 1979-09-06 1985-12-09 三菱電機株式会社 Heat resistant resin composition
JPH02621A (en) * 1987-11-06 1990-01-05 Shell Internatl Res Maatschappij Bv Glycidyl ether of 2,2-bis-(3-allyl or propenyl)-4-hydroxyphenyl) compound, and resin obtained therefrom
JP2007146171A (en) * 2007-01-05 2007-06-14 Nippon Kayaku Co Ltd Epoxy resin composition for die bonding paste
JP2017095599A (en) * 2015-11-25 2017-06-01 三菱瓦斯化学株式会社 Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board

Similar Documents

Publication Publication Date Title
JPS5340098A (en) Heat resistant resin composition
JPS5250393A (en) Process for preparing phenolic resins
JPS53134099A (en) Heat-resistant resin composition
JPS5254798A (en) Thermosetting resin compositions
JPS5211245A (en) Phenolic resin composition
JPS5386021A (en) Cockroach repellent
JPS5340097A (en) Heat resistant resin composition
JPS52145456A (en) Curing polyimide resin composition
JPS5283616A (en) Digiycidyl oxyalkyl benzene
JPS5378299A (en) Epoxy resin composition
JPS5341398A (en) Heat resistant resin composition
JPS5287167A (en) Preparation of curing agents
JPS524600A (en) Curing of epoxy resin
JPS5382899A (en) Heat resistant resin composition
JPS51146600A (en) Flame retardant thermosetting resin composition
JPS5341399A (en) Heat resistant resin composition
JPS52114643A (en) Stabilized halogen-containing resin composition
JPS5284293A (en) Epoxy resin compositions
JPS5228543A (en) Process for preparing a molding material
JPS5367800A (en) Preparation of resin for laminated sheet
JPS51136827A (en) Mixed insecticide composition
JPS522392A (en) Electricity-sound converting device
JPS51125477A (en) Curable resin
JPS5439497A (en) Thermosetting resin composition
JPS52151397A (en) Preparation of resin for laminate