JPS5340098A - Heat resistant resin composition - Google Patents
Heat resistant resin compositionInfo
- Publication number
- JPS5340098A JPS5340098A JP11563576A JP11563576A JPS5340098A JP S5340098 A JPS5340098 A JP S5340098A JP 11563576 A JP11563576 A JP 11563576A JP 11563576 A JP11563576 A JP 11563576A JP S5340098 A JPS5340098 A JP S5340098A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- heat resistant
- resistant resin
- compound
- formulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To prepare a liquid or low-melting heat resistant resin composition suitable for electrical insulating material for impregnation and casting by formulating an epoxy compound, maleimide type compound, isocyanate compound and curing catalyst.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11563576A JPS5340098A (en) | 1976-09-27 | 1976-09-27 | Heat resistant resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11563576A JPS5340098A (en) | 1976-09-27 | 1976-09-27 | Heat resistant resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5340098A true JPS5340098A (en) | 1978-04-12 |
Family
ID=14667515
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11563576A Pending JPS5340098A (en) | 1976-09-27 | 1976-09-27 | Heat resistant resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5340098A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5638318A (en) * | 1979-09-06 | 1981-04-13 | Mitsubishi Electric Corp | Heat-resistant resin composition |
JPH02621A (en) * | 1987-11-06 | 1990-01-05 | Shell Internatl Res Maatschappij Bv | Glycidyl ether of 2,2-bis-(3-allyl or propenyl)-4-hydroxyphenyl) compound, and resin obtained therefrom |
JP2007146171A (en) * | 2007-01-05 | 2007-06-14 | Nippon Kayaku Co Ltd | Epoxy resin composition for die bonding paste |
JP2017095599A (en) * | 2015-11-25 | 2017-06-01 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board |
-
1976
- 1976-09-27 JP JP11563576A patent/JPS5340098A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5638318A (en) * | 1979-09-06 | 1981-04-13 | Mitsubishi Electric Corp | Heat-resistant resin composition |
JPS6056170B2 (en) * | 1979-09-06 | 1985-12-09 | 三菱電機株式会社 | Heat resistant resin composition |
JPH02621A (en) * | 1987-11-06 | 1990-01-05 | Shell Internatl Res Maatschappij Bv | Glycidyl ether of 2,2-bis-(3-allyl or propenyl)-4-hydroxyphenyl) compound, and resin obtained therefrom |
JP2007146171A (en) * | 2007-01-05 | 2007-06-14 | Nippon Kayaku Co Ltd | Epoxy resin composition for die bonding paste |
JP2017095599A (en) * | 2015-11-25 | 2017-06-01 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board |
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