JPS641753A - Epoxy resin composition for glass-epoxy laminate - Google Patents

Epoxy resin composition for glass-epoxy laminate

Info

Publication number
JPS641753A
JPS641753A JP15709487A JP15709487A JPS641753A JP S641753 A JPS641753 A JP S641753A JP 15709487 A JP15709487 A JP 15709487A JP 15709487 A JP15709487 A JP 15709487A JP S641753 A JPS641753 A JP S641753A
Authority
JP
Japan
Prior art keywords
epoxy resin
bisphenol
epoxy
type
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15709487A
Other languages
Japanese (ja)
Other versions
JPH0466890B2 (en
JPH011753A (en
Inventor
Toshiharu Takada
Yoshihide Sawa
Koji Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP15709487A priority Critical patent/JPS641753A/en
Publication of JPH011753A publication Critical patent/JPH011753A/en
Publication of JPS641753A publication Critical patent/JPS641753A/en
Publication of JPH0466890B2 publication Critical patent/JPH0466890B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Abstract

PURPOSE: To obtain the titled composition of low cost, outstanding in heat and chemical resistances, suitable for printed wiring board substrates, by incorporating a (brominated) bisphenol A type epoxy resin with a bisphenol A type novolak (epoxy resin), etc. in each specified amount.
CONSTITUTION: The objective composition can be obtained by incorporating 100pts.wt. of a bisphenol A type epoxy resin or brominated one with (A) 5W30pts.wt. of a bisphenol A type novolak epoxy resin of formula I (n is 2W10) or bisphenol A type novolak of formula II (n is 2W10), (B) 2W8pts.wt. of a dicyandiamide curing agent and (C) 0.05W0.5pt.wt. of an imidazole compound as the curing accelerator.
COPYRIGHT: (C)1989,JPO&Japio
JP15709487A 1987-06-24 1987-06-24 Epoxy resin composition for glass-epoxy laminate Granted JPS641753A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15709487A JPS641753A (en) 1987-06-24 1987-06-24 Epoxy resin composition for glass-epoxy laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15709487A JPS641753A (en) 1987-06-24 1987-06-24 Epoxy resin composition for glass-epoxy laminate

Publications (3)

Publication Number Publication Date
JPH011753A JPH011753A (en) 1989-01-06
JPS641753A true JPS641753A (en) 1989-01-06
JPH0466890B2 JPH0466890B2 (en) 1992-10-26

Family

ID=15642116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15709487A Granted JPS641753A (en) 1987-06-24 1987-06-24 Epoxy resin composition for glass-epoxy laminate

Country Status (1)

Country Link
JP (1) JPS641753A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02158338A (en) * 1988-12-12 1990-06-18 Toshiba Chem Corp Heat resistant copper-plated laminated plate
JPH03126550A (en) * 1989-10-12 1991-05-29 Nippon Steel Corp Polyolefin-coated steel material
JPH04202319A (en) * 1990-11-29 1992-07-23 Mitsubishi Electric Corp Epoxy resin composition, cured epoxy resin and copper-clad laminated board

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58194916A (en) * 1982-05-10 1983-11-14 Sumitomo Bakelite Co Ltd Epoxy resin composition
JPS598719A (en) * 1982-07-08 1984-01-18 Sumitomo Bakelite Co Ltd Epoxy resin composition
JPS60219223A (en) * 1984-04-16 1985-11-01 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Composition
JPS60260627A (en) * 1984-06-07 1985-12-23 Hitachi Chem Co Ltd Production of prepreg for printed wiring board
JPS6183233A (en) * 1984-09-29 1986-04-26 Sumitomo Bakelite Co Ltd Production of epoxy reisn laminated sheet
JPS6198745A (en) * 1984-10-22 1986-05-17 Hitachi Chem Co Ltd Production of prepreg for printed circuit board
JPS61138621A (en) * 1984-12-11 1986-06-26 Sumitomo Bakelite Co Ltd Production of epoxy resin laminated board
JPS621720A (en) * 1985-06-28 1987-01-07 Nippon Oil Co Ltd Epoxy resin composition
JPS6215221A (en) * 1985-07-12 1987-01-23 Hitachi Chem Co Ltd Epoxy resin composition
JPS6253342A (en) * 1985-09-03 1987-03-09 Mitsubishi Gas Chem Co Inc Production of epoxy resin laminate sheet

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58194916A (en) * 1982-05-10 1983-11-14 Sumitomo Bakelite Co Ltd Epoxy resin composition
JPS598719A (en) * 1982-07-08 1984-01-18 Sumitomo Bakelite Co Ltd Epoxy resin composition
JPS60219223A (en) * 1984-04-16 1985-11-01 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Composition
JPS60260627A (en) * 1984-06-07 1985-12-23 Hitachi Chem Co Ltd Production of prepreg for printed wiring board
JPS6183233A (en) * 1984-09-29 1986-04-26 Sumitomo Bakelite Co Ltd Production of epoxy reisn laminated sheet
JPS6198745A (en) * 1984-10-22 1986-05-17 Hitachi Chem Co Ltd Production of prepreg for printed circuit board
JPS61138621A (en) * 1984-12-11 1986-06-26 Sumitomo Bakelite Co Ltd Production of epoxy resin laminated board
JPS621720A (en) * 1985-06-28 1987-01-07 Nippon Oil Co Ltd Epoxy resin composition
JPS6215221A (en) * 1985-07-12 1987-01-23 Hitachi Chem Co Ltd Epoxy resin composition
JPS6253342A (en) * 1985-09-03 1987-03-09 Mitsubishi Gas Chem Co Inc Production of epoxy resin laminate sheet

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02158338A (en) * 1988-12-12 1990-06-18 Toshiba Chem Corp Heat resistant copper-plated laminated plate
JPH03126550A (en) * 1989-10-12 1991-05-29 Nippon Steel Corp Polyolefin-coated steel material
JPH04202319A (en) * 1990-11-29 1992-07-23 Mitsubishi Electric Corp Epoxy resin composition, cured epoxy resin and copper-clad laminated board

Also Published As

Publication number Publication date
JPH0466890B2 (en) 1992-10-26

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