JPS61138621A - Production of epoxy resin laminated board - Google Patents
Production of epoxy resin laminated boardInfo
- Publication number
- JPS61138621A JPS61138621A JP59259986A JP25998684A JPS61138621A JP S61138621 A JPS61138621 A JP S61138621A JP 59259986 A JP59259986 A JP 59259986A JP 25998684 A JP25998684 A JP 25998684A JP S61138621 A JPS61138621 A JP S61138621A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin
- bisphenol
- laminate
- type epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は成形性、ドリル加工性、耐熱衝撃性に優れたエ
ポキシ樹脂積層板の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for producing an epoxy resin laminate having excellent moldability, drillability, and thermal shock resistance.
従来、エポキシ樹脂積層板の製造には、エポキシ当量５
００以下の比較的低分子量のビスフェノールＡ型エポキ
シ樹脂が用いられている。このため成形時において、加
熱初期では低粘度で流れが大きく、板厚精度を保つこと
が困難である。さらに加熱硬化の進行につれ急激に増粘
しゲル化に至るため加圧のタイミングが狭められ、成形
が非常に困難である。また、これによって製造されたエ
ポキシ樹脂積層板は、印刷回路板の作成において必須で
あるドリルによる孔明は加工における高速のドリル回転
の衝撃を吸収できず、亀裂を生じたジトリル孔内面が粗
くなったりした。さらにソルダーコート工程のような急
激な温度変化を与えた場合、エポキシ樹脂が急激な温度
変化に伴なう膨張・収縮に追随できず、表面の金属箔や
内部のガラス繊維などの界面で破壊を生じたシした。Conventionally, in the production of epoxy resin laminates, the epoxy equivalent is 5.
A bisphenol A type epoxy resin having a relatively low molecular weight of 0.00 or less is used. Therefore, during molding, the viscosity is low and the flow is large in the initial stage of heating, making it difficult to maintain plate thickness accuracy. Furthermore, as heating and curing progress, the viscosity rapidly increases and gelation occurs, which narrows the timing of pressurization and makes molding very difficult. In addition, the epoxy resin laminates manufactured using this method cannot absorb the impact of the high-speed drill rotation during processing, which is essential for making printed circuit boards, and the inner surface of the ditrile holes may become rough due to cracks. did. Furthermore, when sudden temperature changes are applied such as in the solder coating process, the epoxy resin cannot follow the expansion and contraction caused by the sudden temperature change, and breaks down at the interface between the metal foil on the surface and the glass fiber inside. It happened.
このように、低分子量のエポキシ樹脂によシ製造された
積層板においては、架橋点間の分子量が小さいため分子
鎖の運動に自由度が小さく、ドリル加工時の機械的衝撃
やソルダーコート時の熱的衝撃を分子鎖の運動エネルギ
ーとして吸収することができず樹脂の破壊に至るなど、
信頼性の面で問題があった。In this way, in laminates manufactured using low-molecular-weight epoxy resin, the molecular weight between crosslinking points is small, so the degree of freedom in the movement of the molecular chains is small, and the mechanical impact during drilling and solder coating Thermal shock cannot be absorbed as kinetic energy of molecular chains, leading to resin destruction.
There were problems with reliability.
本発明は、上述のプレス成形時の困難さや積層板のドリ
ル加工性、熱衝撃時の破壊の問題を解決し、生産性、信
頼性の高い印刷回路板用積層板を供給することを目的と
する。The purpose of the present invention is to solve the above-mentioned difficulties in press molding, drill workability of the laminate, and breakage due to thermal shock, and to provide a laminate for printed circuit boards with high productivity and reliability. do.
本発明は、エポキシ樹脂成分としてエポキシ当［６００
ないし９５０を有する非臭素化ビスフェノールＡ型エポ
キシ樹脂、及びビスフェノールＡノボラック型エポキシ
樹脂を主成分とするワニスより調製したるプリプレグを
積層し、加熱加圧成形することを特徴とするエポキシ樹
脂積層板の製造方法である。The present invention uses epoxy [600] as an epoxy resin component.
An epoxy resin laminate characterized by laminating prepregs prepared from a varnish containing a non-brominated bisphenol A type epoxy resin having a molecular weight of 950 to 950 and a varnish containing a bisphenol A novolac type epoxy resin as main components, and molding under heat and pressure. This is the manufacturing method.
本発明に用いられるビスフェノールＡｍエポキシ樹脂は
非臭素化型でエポキシ当量６００ないし９５０のものが
使用される。The bisphenol Am epoxy resin used in the present invention is a non-brominated type having an epoxy equivalent of 600 to 950.
前述のように、低分子量のエポキシ樹脂を用いた積層板
では、加工工程において機械的、熱的衝撃を吸収できず
破壊へとつながることが多かりた。As mentioned above, laminates made of low-molecular-weight epoxy resins are unable to absorb mechanical and thermal shocks during the processing process, often leading to breakage.
そこで、用いるエポキシ樹脂を臭素化タイプとし、その
分子量を上げて６００以上のエポキシ当量のものを用い
ると、従来より架橋点間の分子量が大きくなり１、上述
の加工時の機械的・熱的衝撃を分子運動として吸収し、
積層板にクラック等の破壊が生じＫ＜くなることが分か
った。Therefore, if the epoxy resin used is a brominated type and its molecular weight is increased to use an epoxy equivalent of 600 or more, the molecular weight between the crosslinking points will be larger than before1, which will cause the mechanical and thermal shock during processing mentioned above. is absorbed as molecular motion,
It was found that destruction such as cracks occurred in the laminate and K<.
一部ビスフエノールＡ型エポキシ樹脂の分子量を上げて
ゆくと、加圧成形時に加熱しても粘度が低下せず、ガラ
ス繊維や金属箔との界面に樹脂が浸透せず気泡を残し接
着強度を低下させる。さらに、架橋点間の分子量が大き
くなシすぎるため、溶剤による膨潤が起こシ耐溶剤性が
低下する。そこで高分子量化に伴なう架橋密度の低下を
ノボラック型エポキシ樹脂を併用することによ〕補うこ
フェノールＡ型エボΦシ樹脂を用いうるむとが分かった
。これ以上の高分子量樹脂を用いると、たとえノボラッ
ク型エポキシ樹脂を併用しても耐溶剤性などの面で実用
に耐えるものが得られない。As the molecular weight of some bisphenol A type epoxy resins is increased, the viscosity does not decrease even when heated during pressure molding, and the resin does not penetrate into the interface with glass fibers or metal foils, leaving bubbles to improve adhesive strength. lower. Furthermore, since the molecular weight between the crosslinking points is too large, swelling occurs due to solvents and solvent resistance decreases. Therefore, it has been found that the decrease in crosslinking density due to increase in molecular weight can be compensated for by using a novolac type epoxy resin in combination with a phenol A type epoxy resin. If a resin with a higher molecular weight than this is used, even if a novolac type epoxy resin is used in combination, it will not be possible to obtain a resin that can withstand practical use in terms of solvent resistance and the like.
本発明においては、ノボラック型エポキシ樹脂としてビ
スフェノールＡノボラック型のものを使用する。ビスフ
ェノールＡノボラック型エポキシ樹脂は下記の構造を有
する。In the present invention, a bisphenol A novolak type epoxy resin is used as the novolac type epoxy resin. Bisphenol A novolac type epoxy resin has the following structure.
ビスフェノールＡノボラック型エポキシ樹脂を使用する
と、通常のフェノール又はクレゾールノボラック型エポ
キシ樹脂を使用する場合に比較して、可撓性が増し、硬
化時の歪みをよシ少なくすることかできるので、成形性
がよく、得られた積層板は寸法安定性、熱衝撃性、ドリ
ル加工性等の特性が非常にすぐれたものとなる。The use of bisphenol A novolac type epoxy resin increases flexibility and reduces distortion during curing compared to the use of regular phenol or cresol novolac type epoxy resins, resulting in improved moldability. The resulting laminate has excellent properties such as dimensional stability, thermal shock resistance, and drillability.
ビスフェノールＡノボラック型エポキシ樹脂は分子ｊｋ
４５０〜１４００のものが上記特性の点で好まましい。Bisphenol A novolak type epoxy resin has molecule jk
450 to 1400 is preferable from the viewpoint of the above characteristics.
またビスフェノールＡ型エポキシ樹脂との配合割合は特
に限定されないが、ビスフェノールＡ型エポキシ樹脂６
０〜９０部（重量部、以下同じ）に対しビスフェノール
Ａノボラック型エポキシ樹脂４０〜１０部が好ましい。In addition, the blending ratio with bisphenol A type epoxy resin is not particularly limited, but bisphenol A type epoxy resin 6
It is preferable to use 40 to 10 parts of the bisphenol A novolak type epoxy resin based on 0 to 90 parts (by weight, the same applies hereinafter).
本発明においてエポキシ当量６００ないし９５０の非臭
素化ビスフェノールＡ型エポキシ樹脂の一部を、これよ
シもエポキシ当量の低いエポキシ化合物に置換しても本
発明の目的とする成形性、トリ 、ル加工性、熱衝撃性
において有効な改善が認められるので、この場合も本発
明に含まれる。In the present invention, even if a part of the non-brominated bisphenol A type epoxy resin having an epoxy equivalent of 600 to 950 is replaced with an epoxy compound having a much lower epoxy equivalent, the moldability, tri-processing and tri-processing which are the objectives of the present invention can be achieved. This case is also included in the present invention since effective improvement is observed in the properties and thermal shock properties.
本発明の方法に従うと、加圧条件の選択の幅が広く、従
来に比べ成形性が非常に改善される。According to the method of the present invention, there is a wide range of selection of pressurizing conditions, and moldability is greatly improved compared to the conventional method.
さらに得られたエポキシ樹脂積層板では、熱処理による
反シや寸法変化が極めて小さく、ドリル加工においてド
リル孔内面がきれいく加工され、同時にドリル刃の摩耗
も少なく、ソルダーフート時の熱衝撃によっても樹脂と
金属箔・ガラス繊維との界面の剥離や樹脂の亀裂が改善
され、非常に信頼性の高い、かつ生産性の良い印刷回路
板用エポキシ樹脂積層板を供給することが可能となる。Furthermore, the resulting epoxy resin laminate exhibits extremely little warpage and dimensional changes due to heat treatment, and the inner surface of the drill hole is cleanly machined during drilling.At the same time, there is little wear on the drill blade, and the resin is resistant to thermal shock during solder footing. This improves peeling at the interface between metal foil and glass fiber and cracks in the resin, making it possible to supply epoxy resin laminates for printed circuit boards that are highly reliable and highly productive.
〔実施例〕 以下に実施例を掲げてさらに詳細に説明する。〔Example〕 A more detailed explanation will be given below using examples.
第１表に示した実施例１〜３の樹脂処方のエポキシ樹脂
ワニスをガラス織布に含浸させ乾燥させたのち、このプ
リプレグ（樹脂分４６重量％） ８枚及び銅箔を重ねプ
レスにて加熱加圧成形して厚さ１．６Ｗのエポキシ樹脂
積層板を得た。得られた積層板の特性評価結果を第２表
に示す。After impregnating a glass woven fabric with epoxy resin varnish having the resin formulations of Examples 1 to 3 shown in Table 1 and drying it, 8 sheets of this prepreg (resin content: 46% by weight) and copper foil were heated in a press. An epoxy resin laminate having a thickness of 1.6W was obtained by pressure molding. Table 2 shows the characteristics evaluation results of the obtained laminate.
第３表に示した比較例１（従来例）、及び２〜４の樹脂
処方のエポキシ樹脂ワニスよシ実施例と同様の方法によ
ジェポキシ樹脂積層板を得た。Epoxy resin laminates were obtained in the same manner as in Comparative Example 1 (conventional example) and epoxy resin varnish examples having resin formulations 2 to 4 shown in Table 3.
この特性評価結果を第４表に示す。The results of this characteristic evaluation are shown in Table 4.
本発明の方法によりて得られたエポキシ樹脂積層板は熱
衝撃性、ドリル加工性に優れているのみならず、−膜特
性も良好で優れた実用特性を有していることがわかる。It can be seen that the epoxy resin laminate obtained by the method of the present invention not only has excellent thermal shock resistance and drill workability, but also has good film properties and excellent practical properties.
Claims (1)
５０を有する非臭素化ビスフェノールＡ型エポキシ樹脂
、及びビスフェノールＡノボラック型エポキシ樹脂を主
成分とするワニスより調製したるプリプレグを積層し、
加熱加圧成形することを特徴とするエポキシ樹脂積層板
の製造方法。As an epoxy resin component, the epoxy equivalent is 600 to 9.
A prepreg prepared from a varnish whose main components are a non-brominated bisphenol A epoxy resin having a 50% carbon content and a bisphenol A novolak epoxy resin is laminated,
A method for producing an epoxy resin laminate, characterized by heat and pressure molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59259986A JPS61138621A (en) | 1984-12-11 | 1984-12-11 | Production of epoxy resin laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59259986A JPS61138621A (en) | 1984-12-11 | 1984-12-11 | Production of epoxy resin laminated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61138621A true JPS61138621A (en) | 1986-06-26 |
| JPH0475926B2 JPH0475926B2 (en) | 1992-12-02 |
Family
ID=17341691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59259986A Granted JPS61138621A (en) | 1984-12-11 | 1984-12-11 | Production of epoxy resin laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61138621A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6348324A (en) * | 1986-08-18 | 1988-03-01 | Dainippon Ink & Chem Inc | Epoxy resin composition |
| JPS641753A (en) * | 1987-06-24 | 1989-01-06 | Matsushita Electric Works Ltd | Epoxy resin composition for glass-epoxy laminate |
| JPH02311550A (en) * | 1989-05-25 | 1990-12-27 | Mitsubishi Electric Corp | Resin composition for laminate |
| JP2001253929A (en) * | 2000-03-09 | 2001-09-18 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and prepreg and laminated board produced by using the composition |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5516056A (en) * | 1978-07-23 | 1980-02-04 | Toho Rayon Co Ltd | Epoxy resin composition for carbon fiber prepreg and preparation |
| JPS58167625A (en) * | 1982-03-26 | 1983-10-03 | Toho Rayon Co Ltd | Prepreg |
| JPS58194916A (en) * | 1982-05-10 | 1983-11-14 | Sumitomo Bakelite Co Ltd | Epoxy resin composition |
| JPS5945325A (en) * | 1982-09-08 | 1984-03-14 | Hitachi Chem Co Ltd | Manufacture of flame-retardant laminated sheet |
-
1984
- 1984-12-11 JP JP59259986A patent/JPS61138621A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5516056A (en) * | 1978-07-23 | 1980-02-04 | Toho Rayon Co Ltd | Epoxy resin composition for carbon fiber prepreg and preparation |
| JPS58167625A (en) * | 1982-03-26 | 1983-10-03 | Toho Rayon Co Ltd | Prepreg |
| JPS58194916A (en) * | 1982-05-10 | 1983-11-14 | Sumitomo Bakelite Co Ltd | Epoxy resin composition |
| JPS5945325A (en) * | 1982-09-08 | 1984-03-14 | Hitachi Chem Co Ltd | Manufacture of flame-retardant laminated sheet |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6348324A (en) * | 1986-08-18 | 1988-03-01 | Dainippon Ink & Chem Inc | Epoxy resin composition |
| JPS641753A (en) * | 1987-06-24 | 1989-01-06 | Matsushita Electric Works Ltd | Epoxy resin composition for glass-epoxy laminate |
| JPH0466890B2 (en) * | 1987-06-24 | 1992-10-26 | Matsushita Electric Works Ltd | |
| JPH02311550A (en) * | 1989-05-25 | 1990-12-27 | Mitsubishi Electric Corp | Resin composition for laminate |
| JP2001253929A (en) * | 2000-03-09 | 2001-09-18 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and prepreg and laminated board produced by using the composition |
| JP4496591B2 (en) * | 2000-03-09 | 2010-07-07 | 住友ベークライト株式会社 | Epoxy resin composition, prepreg and laminate using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0475926B2 (en) | 1992-12-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3184485B2 (en) | Resin composition for copper clad laminate, copper foil with resin, multilayer copper clad laminate and multilayer printed wiring board | |
| CN109749360B (en) | Thermosetting resin composition, copper-clad plate capable of being bent statically and printed circuit board prepared from thermosetting resin composition | |
| JPS61138621A (en) | Production of epoxy resin laminated board | |
| JPS60255831A (en) | Production of epoxy resin laminate | |
| JPH0430978B2 (en) | ||
| US4954200A (en) | Method of making drill back-up material for small bore drilling of circuit boards | |
| JPH06100707A (en) | Production of laminated sheet | |
| KR20170005506A (en) | Adhesive composition for cupper clad laminate | |
| US5250347A (en) | Mechanically enhanced, high impact strength triazine resins, and method of preparing same | |
| JPS6221626B2 (en) | ||
| JPS61179221A (en) | Epoxy glass/copper laminate | |
| JPS6259021A (en) | Manufacture of laminated sheet for printed circuit | |
| JPH05309789A (en) | Production of composite copper clad laminated sheet | |
| JP2005002226A (en) | Flame-retardant epoxy resin composition and laminated plate-related product using the same | |
| JP3326862B2 (en) | Manufacturing method of prepreg | |
| JP2950969B2 (en) | Manufacturing method of laminated board | |
| EP0315829A2 (en) | Drill back-up material for small bore drilling of circuit boards | |
| JPS62169828A (en) | Production of substrate for printed circuit | |
| JP2002265634A (en) | Glass fiber nonwoven fabric for electric insulation, composite laminate and printed circuit board | |
| JPH0192238A (en) | Production of epoxy resin laminated sheet | |
| JPH09141781A (en) | Manufacture of laminated plate for printed circuit | |
| JP4715035B2 (en) | Semiconductor device | |
| KR20140002354A (en) | Composition, insulating film made therefrom, and multilayer printed circuit boards having the same | |
| JP2009032926A (en) | Compound substrate and its printed circuit board | |
| JP2002113813A (en) | Composite laminate |