JPS61179221A - Epoxy glass/copper laminate - Google Patents
Epoxy glass/copper laminateInfo
- Publication number
- JPS61179221A JPS61179221A JP1877385A JP1877385A JPS61179221A JP S61179221 A JPS61179221 A JP S61179221A JP 1877385 A JP1877385 A JP 1877385A JP 1877385 A JP1877385 A JP 1877385A JP S61179221 A JPS61179221 A JP S61179221A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- bisphenol
- resin composition
- copper
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の技術分野］
本発明は、耐湿性、吸湿後の半田耐熱性に優れたガラス
基材エポキシ樹脂銅張積層板（ガラス・エポキシ銅張積
層板）に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a glass-based epoxy resin copper-clad laminate (glass-epoxy copper-clad laminate) having excellent moisture resistance and soldering heat resistance after moisture absorption.
［発明の技術的背景とその問題点］
ガラス基材に、エポキシ樹脂を含浸乾燥積層し、加熱加
圧してなるガラスエポキシ銅張積層板は、主に産業用エ
レクトロニクス機器、０ＡＩＪｉ器のプリント配線基板
用材料として用いられ、最近その需要が拡大している。[Technical background of the invention and its problems] Glass epoxy copper clad laminates, which are made by impregnating and drying a glass base material with epoxy resin and then heating and pressurizing them, are mainly used for industrial electronic equipment and printed wiring boards of OAIJi equipment. It is used as an industrial material, and the demand for it has been increasing recently.
ガラス・エポキシ銅張積層板は、各種の特性に優れてい
るが、プリント配線に板加工する時に吸湿する欠点があ
る′。 即、ち、銅張積層板を、■穴明け、■エツチン
グによる回路以外の銅箔除去、■スルーホー、ルメッキ
、■半田コート、■部品取付け、■半田付けという一連
の工程により加工してプリント配線板とする時、■のエ
ツチング処理時、■のスルーホールメッキ時、あるいは
■の後から■率の間の空気中９湿気、■の後から■迄の
間の空気中の湿気等により吸湿する。 こうして吸湿し
たガラス・エポキシ基板を■の半田コートおよび■の半
田付けのために加熱すると、基板に吸湿されている水分
が爆発的に気化するため、基板の層間剥離が、発生しや
すくなる。 こうした基板を用いたプリント配線板は信
頼性に劣り、また甚だしいときは実用に供することがで
きないという欠点があった。Glass-epoxy copper-clad laminates have excellent properties, but they have the disadvantage of absorbing moisture when processed into printed wiring boards. In other words, the copper-clad laminate is processed through a series of processes: ■Drilling holes, ■Removal of copper foil other than the circuit by etching, ■Through holes, plating, ■Solder coating, ■Attachment of parts, and ■Soldering. Moisture is absorbed when it is made into a board, during the etching process (■), through-hole plating (■), or due to moisture in the air between the time after ■ and the rate of ■, and the moisture in the air between after ■ and the time ■. . When the glass epoxy substrate that has absorbed moisture in this way is heated for the solder coating (1) and the soldering (2), the moisture absorbed by the substrate evaporates explosively, making it easy for the substrate to delaminate. Printed wiring boards using such substrates have a drawback that they are inferior in reliability and, in extreme cases, cannot be put to practical use.
［発明の目的］
本発明は、上記の欠点に鑑みてなされたもので、その目
的は耐湿性、吸湿後の半田耐熱性に優れたガラス・エポ
キシ銅張積層板を提供しようとするものである。[Object of the Invention] The present invention was made in view of the above-mentioned drawbacks, and its purpose is to provide a glass-epoxy copper-clad laminate having excellent moisture resistance and soldering heat resistance after moisture absorption. .
［発明の概要］
本発明は、上記の目的を達成すべく鋭意検討を重ねた結
果、後述するエポキシ樹脂組成物を用いることによって
耐湿性、吸湿後の半田耐熱性に優れていることを見いだ
したものである。[Summary of the Invention] As a result of extensive studies to achieve the above object, the present invention has found that the use of the epoxy resin composition described below provides excellent moisture resistance and soldering heat resistance after moisture absorption. It is something.
即ち、本発明は、
ノボラック型エポキシ樹脂と、ビスフェノール型エポキ
シ樹脂と、ビスフェノールＡとを塩基性触媒下で反応さ
せてなるエポキシ樹脂組成物を用いることを特徴とする
ガラス基材エポキシ樹脂銅張積層板で、ノボラック型エ
ポキシ樹脂がエポキシ樹脂組成物に対して５〜２０重量
％含有するものである。That is, the present invention provides a glass-based epoxy resin copper-clad laminate characterized by using an epoxy resin composition obtained by reacting a novolac type epoxy resin, a bisphenol type epoxy resin, and bisphenol A under a basic catalyst. In the plate, the novolac type epoxy resin is contained in an amount of 5 to 20% by weight based on the epoxy resin composition.
本発明に用いるエポキシ樹脂組成物の第１の成分である
ノボラック型エポキシ樹脂としては、例えばフェノール
ノボラック型エポキシ樹脂、０−タレゾールノボラック
型エポキシ樹脂等が挙げられ、これらは単独又は混合し
て使用する。 具体的にはエポキシ当Ｉ！ ２００〜２
３０ｇ／ｅｑのタレゾールノボラック型エポキシ樹脂、
エポキシ当１１７０〜１９０（１／ｅＱのフェノールノ
ボラック型エポキシ樹脂等が挙げられる。Examples of the novolac type epoxy resin that is the first component of the epoxy resin composition used in the present invention include phenol novolac type epoxy resin, 0-talesol novolac type epoxy resin, etc., and these can be used alone or in combination. do. Specifically, epoxy! 200-2
30g/eq Talesol novolac type epoxy resin,
Examples include phenol novolac type epoxy resins having a molecular weight of 1170 to 190 (1/eQ).
エポキシ樹脂組成物の第２の成分であるビスフェノール
型エポキシ樹脂としては、エポキシ当量１８０〜１９０
ｇ／ｅｑのビスフェノールＡのジグリシジルエーテル型
エポキシ樹脂が挙げられ、これらは単独もしくは２種以
上混合して用いる。The bisphenol type epoxy resin which is the second component of the epoxy resin composition has an epoxy equivalent of 180 to 190.
g/eq bisphenol A diglycidyl ether type epoxy resin, which may be used alone or in combination of two or more.
エポキシ樹脂組成物の第３の成分として用いるごスフエ
ノールＡが挙げられる。 これは一般に市販されている
すべてのものが使用される。 エポキシ樹脂組成物は、
上述したノボラック型エポキシ樹脂、ビスフェノールＡ
型エポキシ樹脂およびビスフェノールＡを塩基性触媒下
で反応させて得ることができる。 この組成物に於いて
、ノボラック型エポキシ樹脂が５〜２０重量％含有する
ことが望ましい。 ノボラック型エポキシ樹脂の含有量
が２０重量％を超えるとプリプレグの成形性が低下し、
かつ積層板の諸特性も低下し好ましくない。 また含有
量が５重量％未渦の場合は耐湿性に効果が少なく、更に
吸湿後の半田耐熱性も低く好ましくない。Suphenol A is used as the third component of the epoxy resin composition. All commercially available products can be used. The epoxy resin composition is
The above-mentioned novolac type epoxy resin, bisphenol A
It can be obtained by reacting type epoxy resin and bisphenol A under a basic catalyst. In this composition, it is desirable that the novolac type epoxy resin is contained in an amount of 5 to 20% by weight. When the content of novolac type epoxy resin exceeds 20% by weight, the moldability of the prepreg decreases,
Moreover, various properties of the laminate are also deteriorated, which is not preferable. Moreover, when the content is 5% by weight without swirling, the effect on moisture resistance is small, and furthermore, the soldering heat resistance after moisture absorption is also low, which is not preferable.
エポキシ樹脂組成物を得る場合に用いる塩基性触媒とし
ては、水酸化ナトリウム、水酸化カリウム等が挙げられ
、これらは単独又は混合して用いる。Examples of the basic catalyst used in obtaining the epoxy resin composition include sodium hydroxide, potassium hydroxide, etc., and these are used alone or in combination.
こうして得られたエポキシ樹脂組成物を用いる銅張積層
板をつくる方法としては、エポキシ樹脂組成物と硬化剤
、硬化促進剤を溶剤に溶解して樹脂固形公約５０％のエ
ポキシ樹脂ワニスを調製する。As a method for producing a copper-clad laminate using the epoxy resin composition obtained in this way, an epoxy resin composition, a curing agent, and a curing accelerator are dissolved in a solvent to prepare an epoxy resin varnish having a resin solid content of approximately 50%.
次いでこのワニスをガラス紙布に塗布含浸させ、加熱し
て半硬化状態のプリプレグを製造する。Next, this varnish is applied to a glass paper cloth to impregnate it and heated to produce a semi-cured prepreg.
このプリプレグの所要枚数と銅箔とを積層加熱加圧して
ガラス・エポキシ銅張積層板を製造する。A glass-epoxy copper-clad laminate is manufactured by laminating a required number of prepreg sheets and copper foil under heat and pressure.
こうして得られた銅張積層板は、産業機器用、Ｏへ機器
用のプリント配線用基板等として使用される。The copper-clad laminate thus obtained is used as a printed wiring board for industrial equipment, OLED equipment, and the like.
［発明の実施例］
次に本発明の詳細な説明するが、本発明はこれらの実施
例に限定されるものではない。 実施例および比較例で
「％ＪとはＦ重量％Ｊを意味する。[Examples of the Invention] Next, the present invention will be described in detail, but the present invention is not limited to these Examples. In Examples and Comparative Examples, "%J" means F weight %J.
実施例
フェノールノボラック型エポキシ樹脂（エポキシ当１１
７５） １２％、ビスフェノールＡ型エポキシ樹脂（エ
ポキシ当量１９０） ６９％およびビスフェノールＡ１
９％を塩基性触媒下で反応させてエポキシ当量３８２の
エポキシ樹脂組成物を得た。 このエポキシ樹脂組成物
１００重量部、硬化剤としてジシアンジアミド３．５重
量部、硬化促進剤として２Ｅ４ＭＺ （四国化成社製、
商品名） ０．１５重量部を溶剤に溶解させて、固形
分５０％のエポキシ樹脂ワニスを調製した。 このワニ
スをガラスクロス７６２８／ＡＳ４５０ （旭シュニー
ベル社製、商品名）に含浸させ、１６０℃の温度で３分
間加熱し、半硬化状のプリプレグを製造した。 このプ
リプレグ８枚とこの両側に厚さ１８μｍの電解銅箔（三
井金属鉱業社製、３ＥＣ箔、商品名）を積層し、１１０
℃の温度、圧力４０ｋｇ／ ａｍ２の条件で加熱加圧成
形して、厚さ １．６ｎ＋ｔｎのＧＥタイプ（ＪＩＳグ
レード）のガラス・エポキシ銅張積層板を製造した。Example Phenol novolac type epoxy resin (epoxy resin 11
75) 12%, bisphenol A type epoxy resin (epoxy equivalent weight 190) 69% and bisphenol A1
9% was reacted under a basic catalyst to obtain an epoxy resin composition having an epoxy equivalent of 382. 100 parts by weight of this epoxy resin composition, 3.5 parts by weight of dicyandiamide as a curing agent, and 2E4MZ (manufactured by Shikoku Kasei Co., Ltd.) as a curing accelerator.
(Product name) 0.15 parts by weight was dissolved in a solvent to prepare an epoxy resin varnish with a solid content of 50%. Glass cloth 7628/AS450 (manufactured by Asahi Schniebel Co., Ltd., trade name) was impregnated with this varnish and heated at a temperature of 160° C. for 3 minutes to produce a semi-cured prepreg. Electrolytic copper foil with a thickness of 18 μm (manufactured by Mitsui Kinzoku Mining Co., Ltd., 3EC foil, trade name) was laminated on these 8 sheets of prepreg and on both sides.
A GE type (JIS grade) glass-epoxy copper-clad laminate having a thickness of 1.6n+tn was manufactured by heat-pressing molding at a temperature of 1.3°C and a pressure of 40kg/am2.
比較例
実施例のエポキシ樹脂組成物の代わりにビス７エノール
型エポキシ樹脂Ｒ−３０１（三井石油エポキシ社製、商
品名）８０％およびノボラック型エポキシ樹脂ＤＥＲ−
４３１（ダウケミカル社製、商品名）２０％を用い、そ
れ以外は・すべて実施例と同じ条件でガラス・エポキシ
銅張積層板を製造した。Comparative Example Instead of the epoxy resin composition of Example, 80% bis-7 enol epoxy resin R-301 (manufactured by Mitsui Oil Epoxy Co., Ltd., trade name) and novolak epoxy resin DER-
A glass-epoxy copper-clad laminate was manufactured using 20% of 431 (manufactured by Dow Chemical Company, trade name) under the same conditions as in the example except for that.
実施例および比較例で製造したガラス・エポキシ銅張積
層板をエツチングして両面の銅箔を除去した後、ｓｏｘ
ｓｏｍｍに切断し強制吸湿試験として４．８，１２．
１６時間の煮沸を行って吸湿率を測定し、さらにこれを
２６０℃の半田槽に３０秒秒間へて層間剥離の発生を試
験した。 その結果本発明のガラス・エポキシ銅張積層
板が耐水性および吸湿後の半田耐熱性に優れていること
が確認された。 この結果を第１表に示した。After etching the glass-epoxy copper-clad laminates manufactured in Examples and Comparative Examples to remove the copper foil on both sides, sox
4.8, 12 as a forced moisture absorption test by cutting into somm.
The sample was boiled for 16 hours, the moisture absorption rate was measured, and the sample was placed in a solder bath at 260° C. for 30 seconds to test for the occurrence of delamination. As a result, it was confirmed that the glass-epoxy copper-clad laminate of the present invention has excellent water resistance and soldering heat resistance after moisture absorption. The results are shown in Table 1.
第１表
＊：８回テストを行いそのうちフクレ・ハガレの発生し
た個数を示した
［発明の効果］
以上説明したように本発明は、ノボラック型エポキシ樹
脂、ビスフェノール型エポキシ樹脂およびビスフェノー
ルＡからなるエポキシ樹脂組成物を用いたことによって
、耐湿性および吸湿後の半田耐熱性に優れた、ガラス・
エポキシ銅張積層板を得ることができ、これをプリント
配線板として用いた場合、極めて優れた信頼性を得るこ
とができる。Table 1*: Shows the number of test pieces that caused blisters and peeling after 8 tests [Effects of the invention] As explained above, the present invention provides a By using a resin composition, we have created glass that has excellent moisture resistance and soldering heat resistance after moisture absorption.
An epoxy copper-clad laminate can be obtained, and when used as a printed wiring board, extremely excellent reliability can be obtained.
−〇−−〇−
Claims (1)
ポキシ樹脂と、ビスフェノールＡとを塩基性触媒下で反
応させてなるエポキシ樹脂組成物を用いることを特徴と
するガラス基材エポキシ樹脂銅張積層板。 ２ ノボラック型エポキシ樹脂がエポキシ樹脂組成物に
対して５〜２０重量％含有する特許請求の範囲第１項記
載のガラス基材エポキシ樹脂銅張積層板。[Claims] 1. Glass base epoxy resin copper cladding characterized by using an epoxy resin composition obtained by reacting a novolac type epoxy resin, a bisphenol type epoxy resin, and bisphenol A under a basic catalyst. Laminated board. 2. The glass-based epoxy resin copper-clad laminate according to claim 1, wherein the novolac type epoxy resin is contained in an amount of 5 to 20% by weight based on the epoxy resin composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1877385A JPS61179221A (en) | 1985-02-04 | 1985-02-04 | Epoxy glass/copper laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1877385A JPS61179221A (en) | 1985-02-04 | 1985-02-04 | Epoxy glass/copper laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61179221A true JPS61179221A (en) | 1986-08-11 |
| JPS6360053B2 JPS6360053B2 (en) | 1988-11-22 |
Family
ID=11980950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1877385A Granted JPS61179221A (en) | 1985-02-04 | 1985-02-04 | Epoxy glass/copper laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61179221A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6346234A (en) * | 1986-08-14 | 1988-02-27 | Sumitomo Bakelite Co Ltd | Production of epoxy resin laminate |
| JPS63125516A (en) * | 1986-11-15 | 1988-05-28 | Matsushita Electric Works Ltd | Production of epoxy resin |
| JPS6469620A (en) * | 1987-08-19 | 1989-03-15 | Ciba Geigy Ag | Advanced epoxy resin and thermosetting composition containing the same |
| JPH06239963A (en) * | 1993-02-18 | 1994-08-30 | Mitsui Petrochem Ind Ltd | Epoxy resin composition for laminate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5879011A (en) * | 1981-10-19 | 1983-05-12 | チバ−ガイギ−・アクチエンゲゼルシヤフト | Precursory solid epoxyresin |
| JPS61148226A (en) * | 1984-12-21 | 1986-07-05 | Toto Kasei Kk | Solid epoxy resin for paint and laminated board |
-
1985
- 1985-02-04 JP JP1877385A patent/JPS61179221A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5879011A (en) * | 1981-10-19 | 1983-05-12 | チバ−ガイギ−・アクチエンゲゼルシヤフト | Precursory solid epoxyresin |
| JPS61148226A (en) * | 1984-12-21 | 1986-07-05 | Toto Kasei Kk | Solid epoxy resin for paint and laminated board |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6346234A (en) * | 1986-08-14 | 1988-02-27 | Sumitomo Bakelite Co Ltd | Production of epoxy resin laminate |
| JPH075769B2 (en) * | 1986-08-14 | 1995-01-25 | 住友ベ−クライト株式会社 | Method for manufacturing epoxy resin laminate |
| JPS63125516A (en) * | 1986-11-15 | 1988-05-28 | Matsushita Electric Works Ltd | Production of epoxy resin |
| JPS6469620A (en) * | 1987-08-19 | 1989-03-15 | Ciba Geigy Ag | Advanced epoxy resin and thermosetting composition containing the same |
| JPH06239963A (en) * | 1993-02-18 | 1994-08-30 | Mitsui Petrochem Ind Ltd | Epoxy resin composition for laminate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6360053B2 (en) | 1988-11-22 |
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