JP2005243830A - Printed wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a printed wiring board that can be manufactured in a short time by reducing the number of steps and at a high yield by preventing the adhesion of fallen-off resin powder. <P>SOLUTION: The printed wiring board is constituted by laminating upon another a circuit board having circuits on one surface or both surfaces, and a thermosetting adhesive sheet obtained by impregnating an adhesive material composition having an elastic modulus of 200-6,000 MPa when the composition is cured into a fibrous base material. The adhesive material composition contains (A) an epoxy resin, (B) a curing agent for epoxy resin, (C) an accelerating agent, and (D) as elastomer as essential ingredients. It is preferable to adjust the content of the elastomer in the adhesive material composition to 5-80 mass%. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a printed wiring board in which a circuit board having a circuit formed on one side or both sides and a thermosetting adhesive sheet are laminated, and by using a predetermined adhesive sheet, a print that can be manufactured in a short time and with a high yield. It relates to a wiring board.

  Conventionally, printed wiring boards used for wiring of electrical and electronic equipment are composed of copper-clad laminates, coverlays, adhesive sheets (bonding sheets: film-like adhesives), or prepregs (materials in which glass cloth is impregnated with resin). It had been.

  As this adhesive sheet, for example, a flexible printed wiring board (for example, see Patent Document 1) using an adhesive composition containing a synthetic rubber or the like as a component in a polyepoxide compound is known, but used here. Since the adhesive sheet does not contain a reinforcing agent such as glass cloth, it has the disadvantages of poor handling and low strength.

On the other hand, prepreg has resin powder that falls off by cutting or punching, which causes a decrease in yield, and after curing, the elastic modulus becomes 10 to 40 GPa and the flexibility is almost lost. When used as a wiring board, the flexibility has been lost.
JP 2002-60720 A

  Therefore, the present invention aims to provide a printed wiring board that can be manufactured with good yield by improving the handling properties of the adhesive sheet and preventing the resin powder from falling off like a prepreg. And

  As a result of diligent studies to achieve the above object, the present inventors set the elastic modulus of the cured product of the adhesive composition within a predetermined range, and an adhesive sheet obtained by impregnating the fiber base material with the elastic modulus. The present invention has been completed by finding that the above object can be achieved by producing a printed wiring board using the above.

  The printed wiring board of the present invention is a printed wiring board formed by laminating a circuit board having a circuit formed on one side or both sides thereof and a thermosetting adhesive sheet, and the thermosetting adhesive sheet has a cured product having an elastic modulus of 200. The fiber base material is impregnated with an adhesive composition of ˜6000 MPa.

  As a preferable aspect of the adhesive composition used at this time, (A) an epoxy resin, (B) a curing agent for epoxy resin, (C) a curing accelerator, and (D) an elastomer are essential components. ) Containing an elastomer in a proportion of 5 to 80% by mass with respect to the entire adhesive composition.

  The printed wiring board of the present invention has good handling properties of the adhesive sheet, does not require a release paper, and does not fall off the resin from the cut surface before and after curing, and in a short time, and It can be manufactured with good yield.

  Moreover, when it is set as a flexible printed wiring board, since it has the flexibility and the low elastic modulus characteristic which can be set as a flexible printed wiring board, the adhesive sheet is reinforced with the glass cloth, a reinforcement board is unnecessary.

  Hereinafter, the present invention will be described in detail.

  The circuit board used in the printed wiring board of the present invention is not particularly limited as long as it is a circuit board such as a copper-clad laminate in which a wiring pattern is formed with a copper foil usually used for printed wiring boards. However, the flexible copper-clad laminate is preferable because it can take advantage of the use of a flexible adhesive sheet.

  As an adhesive sheet used for the printed wiring board of the present invention, it is an essential requirement to use an adhesive composition whose cured product has an elastic modulus of 200 to 6000 MPa. In particular, the elastic modulus is preferably 500 to 5000 MPa.

  When this elastic modulus is less than 200 MPa, the handling property is deteriorated and the strength is also small, and when it exceeds 6000 MPa, the rigidity is increased and breakage and powder falling are likely to occur.

  In the present invention, the elastic modulus of the cured product of the adhesive composition is measured in accordance with ASTM D-882, and a film-shaped cured product having a thickness of 50 μm is used as a test piece, and DMS6100 manufactured by Seiko Instruments Inc. is used. The tensile modulus measured at a frequency of 1 Hz.

  Moreover, as a component of the adhesive composition at this time, either a thermosetting resin, a thermoplastic resin, or both can be used together, and it is preferable to use a thermosetting resin and an elastomer together. Examples of the thermosetting resin used here include an epoxy resin, a polyimide resin, an unsaturated polyester resin, and a phenol resin.

  As a more specific combination of the components of this adhesive composition, (A) an epoxy resin, (B) a curing agent for epoxy resin, (C) a curing accelerator, and (D) an elastomer are essential components. At this time, it is preferable that (D) the elastomer is contained at a ratio of 5 to 80% by mass with respect to the entire adhesive composition.

  Here, each component in this preferable aspect is demonstrated.

  The (A) epoxy resin used in the present invention is not particularly limited as long as it is an epoxy resin having two or more epoxy groups in one molecule. For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolak type Epoxy resin, glycidyl ether type epoxy resin, alicyclic epoxy resin, epoxy resin such as heterocyclic epoxy resin, polyfunctional epoxy resin containing biphenyl skeleton, or a mixture of two or more of these Things can be used.

  Further, when imparting flame retardancy to the adhesive composition, it can be achieved by using an epoxy resin having a general flame retardant mechanism, such as a brominated epoxy resin, a phosphorus-modified epoxy resin, or the like. .

  These epoxy resins can usually be used after being dissolved in a solvent, and as the solvent, any epoxy resin, curing agent for epoxy resin, curing accelerator for epoxy resin, and elastomer can be used. It is preferable that the boiling point is 160 ° C. or lower so that the solvent does not remain in the adhesive coating and drying step.

  Specific examples of the solvent include methyl ethyl ketone, toluene, acetone, ethyl cellosolve, methyl cellosolve, cyclohexanone and the like, and these can be used alone or in combination of two or more.

  The (B) epoxy resin curing agent used in the present invention can be used without particular limitation as long as it is a compound usually used for curing epoxy resins. Examples of amine curing systems include dicyandiamide and aromatic compounds. Examples of phenolic curing systems include phenol novolak resins, cresol novolak resins, bisphenol A type novolaks, triazine-modified phenol novolak resins, and the like. These may be used alone or in combination of two or more. it can.

  The (C) curing accelerator used in the present invention is usually used as a curing accelerator for epoxy resins, and is an imidazole such as 2-ethyl-4-methylimidazole or 1-benzyl-2-methylimidazole. Examples thereof include compounds, boron trifluoride amine complexes, and triphenylphosphine. These curing accelerators can be used alone or in combination of two or more.

  The elastomer (D) used in the present invention is not particularly limited as long as it has rubber-like elasticity near room temperature. For example, various synthetic rubbers such as acrylic rubber, acrylonitrile butadiene rubber, carboxyl group-containing acrylonitrile butadiene rubber, and rubber-modified polymers. Examples thereof include a compound, a polymer epoxy resin, a phenoxy resin, a modified polyimide, a modified polyamideimide, and the like. These can be used alone or in admixture of two or more.

  The (D) elastomer is preferably a synthetic rubber, a rubber-modified polymer, or a polymer epoxy resin, and particularly preferably a carboxyl group-containing acrylonitrile butadiene rubber.

  The blending ratio of the constituent components (A) to (D) of the adhesive composition used in the present invention is 2 to 50 parts by mass of the curing agent for (B) epoxy resin with respect to 100 parts by mass of (A) epoxy resin. It is preferable that it is a range, (C) It is preferable that a hardening accelerator is the range of 0.01-5 mass parts. At this time, the blending amount of the curing agent for (B) epoxy resin reacts with the equivalent ratio of (A) epoxy resin and (B) curing agent for epoxy resin, that is, the epoxy group of the curing agent with respect to the number of epoxy groups. The ratio of the number of functional groups (amine groups, hydroxyl groups, etc.) is particularly preferably in the range of 0.5 to 1.5.

  In addition, it is preferable that (D) elastomer is mix | blended in the ratio of 5-80 mass% with respect to the whole adhesive composition, and it is especially preferable that it is 10-60 mass%. When it exceeds 80% by mass, the fiber base material is poorly impregnated, and when it is less than 5% by mass, the elastic modulus is not sufficiently lowered.

  In addition to these components, when imparting flame retardancy, a bromine compound, a phosphorus compound, a metal hydrate can be added, and if necessary, a finely divided inorganic or organic filler, Pigments, deterioration inhibitors and the like can be added and blended within a range that does not impair the effects of the present invention.

  The adhesive composition of the present invention described above is diluted with a suitable organic solvent such as methyl ethyl ketone, toluene, acetone, ethyl cellosolve, methyl cellosolve, cyclohexanone to form a resin solution, and this is impregnated into the fiber base material. The adhesive sheet can be produced by drying.

  Examples of the fiber base material used in the present invention include inorganic fiber base materials such as glass cloth and glass mat, and organic fiber base materials such as aromatic polyamide fiber, cellulose fiber, and polyester fiber. Can be used as a mixture.

  The fiber base material is preferably a glass cloth, and the type of glass cloth can be used without any particular limitation, but a plain weave E glass cloth defined in IPC-EG-140 or the like should be used. In order to give flexibility, a material having a thickness of 30 to 50 μm such as 1080 type or 1037 type is particularly preferable.

  The adhesive sheet used here is a fiber base material impregnated with an adhesive composition, and its thickness is a little thicker than the thickness of the fiber base material. Therefore, the adhesive sheet in the present invention preferably has a thickness of 30 to 60 μm.

  In addition, the printed wiring board of the present invention includes a copper-clad laminate and an insulating film joined by an adhesive sheet, but the insulating film used at this time is any one that is usually used for a printed wiring board. It can use without being specifically limited, For example, a polyimide film, a polyester film, a polyethylene film, a polypropylene film, a polyvinyl chloride film etc. are mentioned, It is preferable that it is a polyimide film.

  Next, the manufacturing method of the printed wiring board of this invention is demonstrated, referring drawings. Here, FIG. 1 is a diagram showing an outline of a configuration of a flexible printed wiring board with an insulating film, and FIG. 2 is a diagram showing an outline of a configuration of a multilayer printed wiring board. 3 and 4 are diagrams showing an outline of the configuration of the flex-rigid printed wiring board.

  As shown in FIG. 1, the flexible printed wiring board 1 with an insulating film forms a circuit on a laminated board, drills through-hole plating if necessary, and then overlays a coverlay with holes in predetermined places. The flexible circuit board 2 can be manufactured by a general method of heat and pressure molding, and the insulating film 4 can be superimposed on the adhesive sheet 3 via the adhesive sheet 3 and heated and pressure molded. The flexible printed wiring board manufactured here is inferior in flexibility because the adhesive sheet 3 has a higher elastic modulus than the conventional adhesive sheet, but is flexible enough to be used as a flexible printed wiring board. have.

  In addition, as shown in FIG. 2, the multilayer printed wiring board 11 is formed by alternately superposing a plurality of flexible circuit boards 2 and adhesive sheets 3 on each other, and forming a through hole if necessary. After through-hole plating, it can be manufactured by a normal manufacturing method of forming a predetermined circuit.

  Further, as shown in FIGS. 3 and 4, the flex-rigid printed wiring board 21 has a portion where the adhesive sheet 3 is laminated and a portion where the adhesive sheet 3 is not laminated on both surfaces of the flexible circuit board 2. It is manufactured by a method in which the adhesive sheet 3 is superposed on the flexible circuit board 2 and heated and pressed to form a through hole 23 and plated through, and then a predetermined circuit is formed on the adhesive sheet. can do. Moreover, as this circuit board, what formed the circuit directly by the additive method without using copper foil can also be used. The coverlay 24 is configured to protect the surface of the flexible circuit board as in the conventional case. In addition, the flex-rigid printed wiring board of the present invention does not require a rigid board laminated as a conventional rigid portion, and thus can be manufactured to be thinner and can be applied to higher-density products.

  In this case, the portion where the adhesive sheet 3 is laminated becomes the rigid portion 25, and the portion where the adhesive sheet 3 is not laminated becomes the flexible portion 26. Since the adhesive sheet 3 has flexibility between the conventional flexible portion and the rigid portion, the rigid portion here is considerably more flexible than the rigid portion of the conventional flex-rigid wiring board.

  Thus, when the manufacturing process in the printed wiring board of the present invention is compared with the conventional manufacturing process, when the conventional adhesive sheet is used, the release sheet on one side is peeled off after the adhesive sheet is cut and punched out. And then temporarily sticking, then through the operation of peeling the release paper on the other side, it is necessary to set the adherend and heat-press molding, but in the present invention, release of the release paper, Temporary pasting operation can be omitted at all, and after cutting and punching the adhesive sheet, it is only necessary to set the adherend and heat-press molding, greatly reducing the number of printed wiring board manufacturing processes. Can do.

  Hereinafter, the present invention will be described with reference to reference examples, examples, and comparative examples. The blending ratio of the adhesive composition prepared in the reference example is shown in Table 1.

[Creation of adhesive composition]
(Reference Example 1)
40.5 parts by mass of carboxyl group-containing acrylonitrile butadiene rubber Nipol 1072 (trade name, manufactured by Nippon Zeon Co., Ltd.), Epicoat 1001 of bisphenol A type epoxy resin (trade name: manufactured by Japan Epoxy Resin Co., Ltd .; epoxy equivalent 475) 43.5 masses Parts, 4,4′-diaminodiphenylsulfone (amine equivalent 62) 5.7 parts by mass, 2-ethyl-4-methylimidazole 0.2 parts by mass, aluminum hydroxide 10 parts by mass, cyclophenoxyphosphazene oligomer (melting point: 100 C.) 10 parts by mass and 1 part by mass of anti-aging agent N, N′-di-2-naphthyl-p-phenylenediamine were dissolved and diluted in a mixed solvent of methyl ethyl ketone / toluene = 6/4, and this was glass cloth AS1080. / A760AW (manufactured by Asahi Sebel, trade name; 1080 Type) was impregnated and dried at 180 ° C. for 3 minutes to produce a glass cloth-containing adhesive sheet with a resin weight ratio of 60%.
It was confirmed that the elastic modulus after curing of the adhesive composition used at this time was 1200 MPa, and the adhesive strength after curing between the adhesive sheet and the imide film was 1.9 kN.

(Reference Example 2)
Epicoat 1001 of bisphenol A type epoxy resin (trade name; epoxy equivalent 475, manufactured by Japan Epoxy Resin Co., Ltd.) 72.5 parts by mass, 4,4′-diaminodiphenylsulfone (amine equivalent 62) 9.5 parts by mass, 2-ethyl -4-methylimidazole 0.3 parts by mass, aluminum hydroxide 16.6 parts by mass, cyclophenoxyphosphazene oligomer (melting point: 100 ° C.) 16.6 parts by mass and anti-aging agent N, N′-di-2-naphthyl -1.7 parts by mass of p-phenylenediamine is dissolved and diluted in a mixed solvent of methyl ethyl ketone / toluene = 6/4, and impregnated into glass cloth AS1080 / A760AW (manufactured by Asahi Sebel, trade name: 1080 type), 180 A glass cloth adhesive sheet with a resin weight ratio of 60% can be obtained by drying at ℃ for 3 minutes. And elephants.
It was confirmed that the elastic modulus after curing of the adhesive composition used at this time was 7500 MPa, and the adhesive strength after curing between the adhesive sheet and the imide film was 0.2 kN.

(Reference Example 3)
40.5 parts by mass of carboxyl group-containing acrylonitrile butadiene rubber Nipol 1072 (trade name, manufactured by Nippon Zeon Co., Ltd.), Epicoat 1001 of bisphenol A type epoxy resin (trade name: manufactured by Japan Epoxy Resin Co., Ltd .; epoxy equivalent 475) 43.5 masses Parts, 4,4′-diaminodiphenylsulfone (amine equivalent 62) 5.7 parts by mass, 2-ethyl-4-methylimidazole 0.2 parts by mass, aluminum hydroxide 10 parts by mass, cyclophenoxyphosphazene oligomer (melting point: 100 C.) 10 parts by mass and 1 part by mass of anti-aging agent N, N′-di-2-naphthyl-p-phenylenediamine were dissolved and diluted in a mixed solvent of methyl ethyl ketone / toluene = 6/4. (Thickness: 50 μm) and coated so that the thickness becomes 30 μm. In dried 3 minutes to produce an adhesive sheet with release liner by bonding a release paper.
It was confirmed that the elastic modulus after curing of the adhesive composition used at this time was 1200 MPa, and the adhesive strength after curing between the adhesive sheet and the imide film was 1.5 kN.

  The elastic modulus after curing of the adhesive compositions created in Reference Examples 1 to 3 was measured at a frequency of 1 Hz using a DMS6100 manufactured by Seiko Instruments Inc. after curing the adhesive composition into a film having a thickness of 50 μm. The value is shown.

  Next, the printed wiring board was manufactured as follows using the adhesive sheet manufactured in the reference example. This printed wiring board was evaluated according to the following criteria.

Solder heat resistance: Based on JIS-C-6481, the presence or absence of swelling after floating at 280 ° C. for 1 minute was confirmed. Those that did not bulge were judged as good, and those that swelled were judged as bad.
Mountability: SMT components were mounted on a printed wiring board, and the presence or absence of trouble was confirmed. Those with no trouble were judged as good, and those with trouble were judged as bad.
Non-defective product rate: Appearance good product rate (%) in the production of 440 sheets. The ratio of non-defective products was calculated by assuming that the circuit without short circuit or disconnection was good and the circuit with short circuit or disconnection was defective.
Manufacturing time: The processing time per sheet is calculated from the time of manufacturing 440 sheets, excluding the pressing time.

[Manufacture of printed wiring board with insulating film]
(Example 1)
Flexible copper-clad laminate (Kyocera Chemical Co., Ltd., trade name: TLF-510MW 12/25 (single-sided copper-clad) formed with a 25 μm-thick polyimide film and a circuit using the adhesive sheet for printed wiring boards prepared in Reference Example 1 The laminated board)) was heated and pressure-bonded at 160 ° C. and 0.5 MPa for 30 minutes to produce a flexible printed wiring board with a film.

(Comparative Example 1)
A flexible printed wiring board with a film was produced under the same conditions using the same material as in Example 1 except that the adhesive sheet for printed wiring board prepared in Reference Example 2 was used as the adhesive sheet.

(Comparative Example 2)
The adhesive sheet for printed wiring boards prepared in Reference Example 3 was used as the adhesive sheet, and after pressure-bonding to a polyimide film having a thickness of 125 μm with a 120 ° C. laminate roll, the release paper was peeled off to form a circuit-formed flexible copper-clad laminate. Flexible printing with insulating film by heating and pressure bonding to the film surface of a plate (Kyocera Chemical Co., Ltd., trade name: TLF-510MW 12/25 (single-sided copper-clad laminate)) at 160 ° C. and 0.5 MPa for 30 minutes A wiring board was manufactured.

The printed wiring boards manufactured in Example 1, Comparative Example 1 and Comparative Example 2 were evaluated, and the results are shown in Table 2.

[Manufacture of flexible multilayer printed wiring boards]
(Example 2)
Four flexible copper-clad laminates (made by Kyocera Chemical Co., Ltd., trade name: TLF-510MW 12/25/12 (double-sided copper-clad laminate) )) And alternately bonded at 160 ° C. and 0.5 MPa for 30 minutes to produce an 8-layer printed wiring board.

(Comparative Example 3)
An 8-layer printed wiring board was produced under the same conditions using the same material as in Example 2 except that the printed wiring board adhesive sheet prepared in Reference Example 2 was used.

(Comparative Example 4)
Three flexible copper-clad laminates (made by Kyocera Chemical Co., Ltd., trade name: TLF-510MW 12/25/12 (double-sided copper-clad laminate) )) After being pressure-bonded to a laminate roll at 120 ° C., each release paper is peeled off, and four flexible plates (one sheet is not attached with an adhesive sheet) are stacked and heated and pressed at 160 ° C. and 0.5 MPa for 30 minutes. By bonding, an 8-layer printed wiring board was produced.

The printed wiring boards manufactured in Example 2, Comparative Example 3 and Comparative Example 4 were evaluated, and the results are shown in Table 3.

[Manufacture of flex-rigid printed wiring boards]
(Example 3)
A flexible copper-clad laminate (manufactured by Kyocera Chemical Co., Ltd., trade name: TLF-510MW 12/25/12 (double-sided copper-clad laminate)) in which the adhesive sheet for a printed wiring board prepared in Reference Example 1 is formed as a circuit It is arranged on both sides of a flexible printed wiring board prepared by a general method of overlaying coverlay films (trade name: TFA-577-25 / 25, manufactured by Kyocera Chemical Co., Ltd.) on both sides, and 18 μm on the outer layer. A copper foil was placed, and heat and pressure adhesion was performed at 160 ° C. and 0.5 MPa for 30 minutes, and a circuit was formed on the outer layer to produce a flex-rigid printed wiring board.

(Comparative Example 5)
A flexible copper-clad laminate formed by using the adhesive sheet for printed wiring board prepared in Reference Example 3 (Kyocera Chemical Co., Ltd., trade name: TLF-510MW 12/25/12 (double-sided copper-clad laminate)) A flexible printed wiring board prepared by a general method of applying pressure and forming a coverlay film (trade name: TFA-577-25 / 25, manufactured by Kyocera Chemical Co., Ltd.) on both sides, and a rigid copper-clad circuit formed in advance A laminate (Kyocera Chemical Co., Ltd., trade name: TLC-555-0.1-18 (single-sided copper-clad plate)) is heated and pressure-bonded at 160 ° C. and 0.5 MPa for 30 minutes, and flex-rigid print A wiring board was manufactured.

The printed wiring boards manufactured in Example 3 and Comparative Example 5 were evaluated, and the results are shown in Table 4.

  As described above, as is apparent from Tables 2 to 4, the printed wiring board of the present invention has good handling properties of the adhesive sheet to be used and is easy to handle, and does not require a release paper. Since the number of manufacturing steps of the sheet can be shortened and the resin component can be prevented from falling off, the sheet can be manufactured in a short time and with a high yield.

It is the figure which showed the outline of the structure of the flexible printed wiring board with an insulating film which concerns on this invention. It is the figure which showed the outline of the structure of the flexible multilayer printed wiring board which concerns on this invention. It is the figure which showed the outline of the structure of the flex-rigid wiring board based on this invention. It is the figure which showed more specifically the layer structure after the crimping | compression-bonding in the flex-rigid wiring board of FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Flexible printed wiring board with an insulating film, 2 ... Flexible circuit board, 3 ... Thermosetting adhesive sheet, 4 ... Insulating film, 11 ... Multi-layer (8 layers) printed wiring board, 21 ... Flex-rigid printed wiring board, 22 ... Wiring pattern, 23 ... through hole, 24 ... coverlay film, 25 ... rigid part, 26 ... flexible part

Claims (9)

In a printed wiring board formed by laminating a circuit board having a circuit formed on one side or both sides and a thermosetting adhesive sheet,
The printed wiring board, wherein the thermosetting adhesive sheet is obtained by impregnating a fiber base material with an adhesive composition having a cured product having an elastic modulus of 200 to 6000 MPa.   2. The flexible multilayer printed wiring according to claim 1, wherein the printed wiring board is formed by alternately laminating a flexible circuit board having a circuit formed on a plurality of one side or both sides with the thermosetting adhesive sheet. Board.   The flexible printed wiring board according to claim 1, wherein the printed wiring board is obtained by joining the flexible circuit board and an insulating film with the thermosetting adhesive sheet.   The printed wiring board is obtained by laminating the thermosetting adhesive sheet on both surfaces of a flexible circuit board, and has a rigid part in which the thermosetting adhesive sheet is laminated and a flexible part that is not laminated. The flex-rigid printed wiring board according to claim 1.   The printed wiring board according to claim 3, wherein the insulating film is a polyimide film.   The printed wiring board according to claim 1, wherein the fiber base material is a glass cloth.   The adhesive composition comprises (A) an epoxy resin, (B) a curing agent for epoxy resin, (C) a curing accelerator, and (D) an elastomer as essential components, and (D) the elastomer as an adhesive. It contains in the ratio of 5-80 mass% with respect to the whole composition, The printed wiring board of any one of the Claims 1 thru | or 6 characterized by the above-mentioned.   8. The printed wiring board according to claim 7, wherein the elastomer (D) is a combination of one or more selected from synthetic rubber, rubber-modified polymer compound and polymer epoxy resin.   The amount of the (B) epoxy resin curing agent is 2 to 50 parts by mass and the (C) curing accelerator is 0.01 to 5 parts by mass with respect to 100 parts by mass of the (A) epoxy resin. The printed wiring board according to claim 7 or 8.

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