JP2000104038A - Composition for adhesive sheet, adhesive sheet, adhesive sheet with metal foil and laminated sheet - Google Patents
Composition for adhesive sheet, adhesive sheet, adhesive sheet with metal foil and laminated sheetInfo
- Publication number
- JP2000104038A JP2000104038A JP10271875A JP27187598A JP2000104038A JP 2000104038 A JP2000104038 A JP 2000104038A JP 10271875 A JP10271875 A JP 10271875A JP 27187598 A JP27187598 A JP 27187598A JP 2000104038 A JP2000104038 A JP 2000104038A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive sheet
- composition
- metal foil
- insulating layer
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント配線板の
製造に用いられる積層板、及びその積層板の製造に用い
られる接着シート、及びこの接着シートの製造に用いら
れる接着シート用組成物に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminate used for producing a printed wiring board, an adhesive sheet used for producing the laminate, and a composition for an adhesive sheet used for producing the adhesive sheet. It is.
【０００２】[0002]
【従来の技術】従来、電気・電子部品等に使用されてい
る多層プリント配線板を作製するにあたっては例えば下
記のような方法を用いていた。2. Description of the Related Art Hitherto, for example, the following method has been used for producing a multilayer printed wiring board used for electric / electronic parts and the like.
【０００３】銅張積層板等の金属箔張積層板を用意す
る。一方ガラスクロス等の基材にエポキシ樹脂組成物等
の熱硬化性樹脂組成物を含浸させた後、加熱乾燥して樹
脂成分を半硬化させてプリプレグを作製する。金属箔張
積層板の表面にエッチング処理を施して内層回路の形成
を行い、内層基板を作製する。この内層基板の内層回路
表面に、必要に応じて接着強度を高めるための表面処理
を行い、次いでその内層回路表面にプリプレグを所要枚
数重ね、更にその外側に外層回路用の金属箔を積層し、
加熱加圧して一体成形する。このようにして、内層回路
と外層回路用の金属箔との間に、基材及び熱硬化性樹脂
組成物の硬化物からなる絶縁層が形成された多層の積層
板が製造される。次いで、この多層の積層板にスルーホ
ールやバイアホール用の穴あけ加工を施した後、この穴
の壁面に内層回路と外層回路用の金属箔とを導通させる
めっき金属皮膜を形成し、更に外層回路用の金属箔にエ
ッチング処理を施して外層回路を形成し、プリント配線
板が製造される。[0003] A metal foil-clad laminate such as a copper-clad laminate is prepared. On the other hand, a base material such as a glass cloth is impregnated with a thermosetting resin composition such as an epoxy resin composition, and then heated and dried to semi-harden the resin component to prepare a prepreg. An etching process is performed on the surface of the metal foil-clad laminate to form an inner circuit, thereby producing an inner substrate. On the inner layer circuit surface of this inner layer substrate, a surface treatment is performed to increase the adhesive strength as necessary, then a required number of prepregs are stacked on the inner layer circuit surface, and a metal foil for an outer layer circuit is further laminated on the outside thereof.
It is heated and pressed to form a single piece. In this way, a multilayer laminate in which an insulating layer made of a cured product of the base material and the thermosetting resin composition is formed between the inner layer circuit and the metal foil for the outer layer circuit is manufactured. Next, after making a hole for a through hole or a via hole in this multilayer laminate, a plating metal film is formed on the wall surface of the hole to conduct the inner layer circuit and the metal foil for the outer layer circuit. An outer layer circuit is formed by performing an etching process on a metal foil for use, and a printed wiring board is manufactured.
【０００４】しかし、近年のプリント配線板の高密度化
や生産性向上の要求に伴い、内層回路と外層回路用の金
属箔との間に基材を用いない熱硬化性樹脂組成物単独の
絶縁層を形成した、ビルドアップ基板と呼ばれる多層の
積層板の使用が検討されている。このビルドアップ基板
は、内層基板の内層回路の表面に熱硬化性樹脂組成物単
独の絶縁層と導体層とを交互に積み上げながら製造した
積層板である。このようなビルドアップ基板は、絶縁層
の厚みが基材の厚みに制限されないため、絶縁層の厚み
を薄くすることができるものであり、また基材を用いて
いないため絶縁層にレーザー処理にて穴あけ加工を施す
ことが可能となり、穴あけ効率が向上するといる特長が
あるため、近年増加しつつある。However, with the recent demand for higher density and improved productivity of printed wiring boards, the insulation of a thermosetting resin composition alone without using a base material between an inner layer circuit and a metal foil for an outer layer circuit has been proposed. The use of a multilayer laminate, called a build-up substrate, having layers formed is being studied. This build-up board is a laminate manufactured by alternately stacking the insulating layer and the conductor layer of the thermosetting resin composition alone on the surface of the inner layer circuit of the inner layer board. Such a build-up substrate can reduce the thickness of the insulating layer because the thickness of the insulating layer is not limited by the thickness of the base material. In recent years, it is possible to perform drilling and improve drilling efficiency.
【０００５】このようなビルドアップ基板を製造するに
あたり、絶縁層を形成する方法としては、液状の熱硬化
性樹脂組成物を内層回路の表面に塗布した後、硬化させ
て形成する方法が一般に行われていが、このような絶縁
層の形成方法の場合、熱硬化性樹脂組成物が液状のため
流動し、絶縁層の厚みにバラツキが生じやすいという問
題や、絶縁層中に気泡が生じやすという問題があった。
そのため、絶縁層を形成する方法として、熱硬化性樹脂
組成物をシート状に成形して接着シートを作製し、この
接着シートを内層回路の表面に重ねた後、圧着して絶縁
層を形成する方法が検討されている。In manufacturing such a build-up substrate, as a method of forming an insulating layer, generally, a method of applying a liquid thermosetting resin composition to the surface of an inner layer circuit and then curing the same is used. However, in the case of such a method for forming an insulating layer, the thermosetting resin composition flows because of a liquid state, and the thickness of the insulating layer tends to vary, and bubbles are easily generated in the insulating layer. There was a problem.
Therefore, as a method of forming an insulating layer, a thermosetting resin composition is formed into a sheet to form an adhesive sheet, and the adhesive sheet is laminated on the surface of the inner layer circuit, and then pressed to form an insulating layer. A method is being considered.
【０００６】[0006]
【発明が解決しようとする課題】しかし、上記のような
ビルドアップ基板の絶縁層は、従来のプリプレグを用い
て形成される絶縁層とは異なりガラスクロス等の基材を
用いていないため、誘電率は小さくなるものの、逆に誘
電正接が大きくなる。そのため高周波特性が要求される
分野においては、更なる低誘電率、低誘電正接の、絶縁
層形成用の接着シートが求められている。However, unlike the insulating layer formed using the conventional prepreg, the insulating layer of the above-described build-up substrate does not use a base material such as glass cloth. Although the ratio decreases, the dielectric loss tangent increases. Therefore, in the field where high-frequency characteristics are required, an adhesive sheet for forming an insulating layer having a further lower dielectric constant and a lower dielectric loss tangent is required.
【０００７】本発明は上記の点に鑑みてなされたもので
あり、内層回路表面に積層した際の回路埋め込み性が良
好で気泡が形成されることがなく、かつ低誘電率、低誘
電正接の接着シートを形成することができる接着シート
用組成物、この接着シート用組成物にて形成される接着
シート及び金属箔付き接着シート、並びにこの接着シー
ト又は金属箔付き接着シートにて絶縁層が形成され、誘
電特性が優れた積層板を提供することを目的とするもの
である。The present invention has been made in view of the above points, and has good circuit embedding properties when laminated on the surface of an inner layer circuit, does not form bubbles, and has a low dielectric constant and a low dielectric loss tangent. A composition for an adhesive sheet capable of forming an adhesive sheet, an adhesive sheet and an adhesive sheet with a metal foil formed with the composition for an adhesive sheet, and an insulating layer formed with the adhesive sheet or the adhesive sheet with a metal foil It is an object of the present invention to provide a laminate having excellent dielectric properties.
【０００８】[0008]
【課題を解決するための手段】本発明の請求項１に記載
の接着シート用組成物は、数平均分子量が１００００〜
３００００のポリフェニレンエーテルと、エラストマー
と、トリアリルイソシアヌレートとを含有し、数平均分
子量が１００００〜３００００のポリフェニレンエーテ
ルとエラストマーとの合計量と、トリアリルイソシアヌ
レートとの配合重量比を、６５／３５〜３５／６５とし
て成ることを特徴とするものである。The composition for an adhesive sheet according to claim 1 of the present invention has a number average molecular weight of 10,000 to 10,000.
The total weight of the polyphenylene ether and the elastomer containing 30,000 polyphenylene ethers, the elastomer, and the triallyl isocyanurate, and having a number average molecular weight of 10,000 to 30,000, and the compounding weight ratio of the triallyl isocyanurate to 65/35 ３５35/65.
【０００９】また本発明の請求項２に記載の接着シート
用組成物は、エラストマーとしてスチレンブタジエンコ
ポリマーを用いて成ることを特徴とするものである。[0009] The composition for an adhesive sheet according to claim 2 of the present invention is characterized in that the composition comprises a styrene-butadiene copolymer as an elastomer.
【００１０】また本発明の請求項３に記載の接着シート
は、請求項１又は２に記載の接着シート用組成物をシー
ト状に成形して成ることを特徴とするものであるまた本
発明の請求項４に記載の金属箔付き接着シートは、金属
箔の一面に、請求項１又は２に記載の接着シート用組成
物からなる接着シートの層を形成して成ることを特徴と
するものである。The adhesive sheet according to a third aspect of the present invention is obtained by molding the composition for an adhesive sheet according to the first or second aspect into a sheet. According to a fourth aspect of the present invention, there is provided an adhesive sheet with a metal foil, wherein a layer of the adhesive sheet comprising the adhesive sheet composition according to the first or second aspect is formed on one surface of the metal foil. is there.
【００１１】また本発明の請求項５に記載の積層板は、
請求項３に記載の接着シートを、表面に導体回路を有す
る内層基板の導体回路と接着して成ることを特徴とする
ものである。[0011] The laminate according to claim 5 of the present invention is characterized in that:
The adhesive sheet according to claim 3 is adhered to a conductor circuit of an inner layer substrate having a conductor circuit on a surface.
【００１２】また本発明の請求項６に記載の積層板は、
請求項４に記載の金属箔付き接着シートの接着シート側
を、表面に導体回路を有する内層基板の導体回路と接着
して成ることを特徴とするものである。The laminate according to claim 6 of the present invention comprises:
The adhesive sheet side of the adhesive sheet with a metal foil according to claim 4 is bonded to a conductive circuit of an inner substrate having a conductive circuit on the surface.
【００１３】[0013]
【発明の実施の形態】以下、本発明の実施の形態を説明
する。Embodiments of the present invention will be described below.
【００１４】本発明の接着シート用組成物に含有させる
ポリフェニレンエーテル（ＰＰＥ）樹脂としては、数平
均分子量が、１００００〜３００００のものを用いるも
のである。The polyphenylene ether (PPE) resin contained in the adhesive sheet composition of the present invention has a number average molecular weight of 10,000 to 30,000.
【００１５】また本発明の接着シート用組成物に含有さ
せるエラストマーとしては、反応性のものでも、非反応
性のものでも良いが、特に下記一般式（Ａ）に示すよう
なスチレンブタジエンコポリマーを用いると、スチレン
ブタジエンコポリマーのスチレン部分とポリフェニレン
エーテルとの相溶性が高いため、エラストマー成分の添
加量が少量である場合でもシート成形性を高いものとす
ることができるものである。ここでこのエラストマーの
配合量は、ＰＰＥ樹脂の配合量に対して５〜２０重量％
とすることが好ましいものであり、ＰＰＥ樹脂の配合量
に対して５重量％未満であると、組成物を柔構造とする
効果が小さく、接着シートを形成することが困難とな
り、また２０重量％を超えると、この組成物にて得られ
る接着シートの耐熱性が低下し、この接着シートにて絶
縁層が形成された積層板の耐熱性が低下するおそれがあ
る。The elastomer contained in the composition for an adhesive sheet of the present invention may be a reactive or non-reactive elastomer. In particular, a styrene-butadiene copolymer represented by the following general formula (A) is used. In addition, since the compatibility between the styrene portion of the styrene-butadiene copolymer and the polyphenylene ether is high, the sheet moldability can be improved even when the amount of the elastomer component is small. Here, the amount of the elastomer is 5 to 20% by weight based on the amount of the PPE resin.
When the amount is less than 5% by weight based on the amount of the PPE resin, the effect of forming the composition into a flexible structure is small, and it becomes difficult to form an adhesive sheet. If the ratio exceeds the above range, the heat resistance of the adhesive sheet obtained from this composition may decrease, and the heat resistance of the laminate having the insulating layer formed on the adhesive sheet may decrease.
【００１６】[0016]
【化１】 また本発明の接着シート用組成物に含有させるトリアリ
ルイソシアヌレート（ＴＡＩＣ）は、そのままの状態で
配合しても良く、あらかじめ一部又は全部をプレポリマ
ー化したものを配合しても良い。Embedded image Further, triallyl isocyanurate (TAIC) to be contained in the composition for an adhesive sheet of the present invention may be blended as it is, or may be blended beforehand partially or wholly in the form of a prepolymer.
【００１７】以上の原材料の配合割合は、ＰＰＥ樹脂と
エラストマーとの合計量と、ＴＡＩＣとの重量比を、６
５／３５〜３５／６５の範囲内とするものである。ＴＡ
ＩＣのＰＰＥ樹脂とエラストマーとの合計量に対する配
合量が小さすぎると、この組成物にて接着シートを成形
した場合にシートの流動性が損なわれて、この接着シー
トを内層基板の内層回路上に積層する際の回路埋め込み
性が確保できなくなって接着シートからなる絶縁層に気
泡が発生するおそれがあり、ＴＡＩＣの配合量が大きす
ぎると、シート状に成形することが困難となって、実用
上使用することが困難となる。The weight ratio of the total amount of the PPE resin and the elastomer to the TAIC is 6
The range is from 5/35 to 35/65. TA
If the compounding amount of the IC with respect to the total amount of the PPE resin and the elastomer is too small, the fluidity of the sheet is impaired when an adhesive sheet is formed with this composition, and this adhesive sheet is placed on the inner circuit of the inner substrate. There is a possibility that air bubbles may be generated in the insulating layer made of the adhesive sheet when the circuit embedding property at the time of lamination cannot be ensured, and if the amount of TAIC is too large, it is difficult to form the sheet into a sheet shape, so that practical use becomes difficult. It becomes difficult to use.
【００１８】また本発明の組成物には、シート形成の際
のＴＡＩＣによる架橋反応を促進するためにジアルキル
パーオキサイド、ハイドロパーオキサイド等のラジカル
開始剤を添加することが好ましい。Further, it is preferable to add a radical initiator such as dialkyl peroxide and hydroperoxide to the composition of the present invention in order to promote a crosslinking reaction by TAIC in forming a sheet.
【００１９】また本発明の組成物には、必要に応じて溶
媒を配合することができる。用いることができる溶媒と
しては、トルエン、ベンゼン、キシレン等の芳香族炭化
水素系の溶媒を挙げることができる。A solvent can be added to the composition of the present invention, if necessary. Examples of the solvent that can be used include aromatic hydrocarbon solvents such as toluene, benzene, and xylene.
【００２０】上記のような原料を配合して得られる接着
シート用組成物をシート状に成形して、接着シート用組
成物の硬化物からなる接着シートを得ることができる。
このときの成形方法は、特に限定するものではないが、
例えばポリエステルフィルム、ポリイミドフィルム等の
接着シート用組成物に溶解しないキャリアフィルムに、
接着シート用組成物を、好ましくは５〜１００μｍの厚
みに塗布した後、１００〜１５０℃の温度で乾燥してシ
ート状に成形する一般にキャスティング法と呼ばれる方
法で成形することができる。このとき接着シート用組成
物を塗布するシートには、あらかじめ離型剤にて表面処
理を施しておくと、成形された接着シートを容易に剥離
することができ、生産性を向上することができて好まし
い。ここで接着シートの厚みは５〜８０μｍに形成する
ことが好ましい。The composition for an adhesive sheet obtained by blending the above-mentioned raw materials can be formed into a sheet to obtain an adhesive sheet comprising a cured product of the composition for an adhesive sheet.
The molding method at this time is not particularly limited,
For example, a polyester film, a carrier film that does not dissolve in the adhesive sheet composition such as a polyimide film,
The composition for an adhesive sheet is preferably applied to a thickness of 5 to 100 μm, and then dried at a temperature of 100 to 150 ° C. to form a sheet, which can be formed by a method generally called a casting method. At this time, if the sheet to which the adhesive sheet composition is applied is subjected to a surface treatment with a release agent in advance, the formed adhesive sheet can be easily peeled off, and the productivity can be improved. Preferred. Here, it is preferable that the thickness of the adhesive sheet is 5 to 80 μm.
【００２１】また接着シート用組成物を金属箔の一方の
面に塗布した後、１００〜１５０℃の温度で乾燥するこ
とにより、金属箔の一面に接着シート用組成物の硬化物
からなる接着シートを形成した金属箔付き接着シートを
形成することもできる。ここで接着シートは、その厚み
を５〜８０μｍに形成することが好ましく、また金属箔
としては、厚みが０．０１２〜０．０７０ｍｍの銅箔又
はアルミニウム箔を用いることができる。このようにし
て金属箔付き接着シートを作製すると、金属箔と絶縁層
の間に気泡が介在することを防ぐことができる。Further, the adhesive sheet composition is applied to one surface of a metal foil and then dried at a temperature of 100 to 150 ° C., whereby an adhesive sheet comprising a cured product of the adhesive sheet composition is applied to one surface of the metal foil. Can be formed. Here, the adhesive sheet is preferably formed to have a thickness of 5 to 80 μm, and a copper foil or an aluminum foil having a thickness of 0.012 to 0.070 mm can be used as the metal foil. When the adhesive sheet with a metal foil is manufactured in this manner, it is possible to prevent bubbles from intervening between the metal foil and the insulating layer.
【００２２】上記のようにして接着シートや金属箔付き
接着シートを作製すると、誘電率及び誘電正接が低減さ
れ、かつ上記のような好適条件にて形成された場合は未
反応部分が多く含まれた良好な流動性を有する接着シー
トを得ることができるものであり、このようにして形成
される接着シート及び金属箔付き接着シートは、積層板
の絶縁層を形成するために好適なものである。When an adhesive sheet or an adhesive sheet with a metal foil is prepared as described above, the dielectric constant and the dielectric loss tangent are reduced, and when formed under the above preferable conditions, many unreacted portions are contained. The adhesive sheet having good fluidity can be obtained, and the adhesive sheet and the adhesive sheet with metal foil thus formed are suitable for forming an insulating layer of a laminate. .
【００２３】上記のような接着シートを用いて積層板を
製造する場合は、表面に導体回路が形成された内層基板
の、導体回路表面に、接着シートを接着する。この接着
シートの接着方法としては、接着シート用組成物のみか
らなる接着シートをキャリアフィルムの表面に形成した
場合は、キャリアフィルムに貼着された接着シートを、
内層基板の導体回路表面に重ね、例えば１５０〜２００
℃、３０〜５０ｋｇ／ｃｍ2の条件で６０〜１８０分間
加熱・加圧した後、キャリアフィルムを剥離して、内層
基板の導体回路の外側に接着シートにて絶縁層を形成す
ることにより、積層板を製造することができるものであ
る。このとき接着シートは、内層基板の導体回路の形状
に追随して変形し、接着シートにて形成される絶縁層
と、内層基板の導体回路との間に気泡が発生することが
ないものである。そしてこのように製造される積層板
に、必要に応じて絶縁層にレーザー加工等によりスルー
ホールやバイアホール用の穴あけ加工を施した後、この
穴の壁面にめっき金属皮膜を形成してスルーホールやバ
イアホールを形成し、そしてアディティブ法にて絶縁層
の表面に導体回路を形成することにより、プリント配線
板を製造することができる。またこのようにして製造さ
れたプリント配線板の導体回路表面に更に同様にして絶
縁層の形成、ホール加工、及び導体回路の形成を行い、
これを繰り返し行うことにより、多層のプリント配線板
を製造することができる。In the case of manufacturing a laminate using the above-described adhesive sheet, the adhesive sheet is bonded to the surface of the conductor circuit of the inner layer substrate having the conductor circuit formed on the surface. As a method of bonding the adhesive sheet, when an adhesive sheet made of only the adhesive sheet composition is formed on the surface of the carrier film, the adhesive sheet attached to the carrier film is
For example, 150 to 200
After heating and pressurizing for 60 to 180 minutes at 30 ° C. and 30 to 50 kg / cm 2 , the carrier film is peeled off, and an insulating layer is formed with an adhesive sheet outside the conductor circuit of the inner layer substrate to form a laminate. A plate can be manufactured. At this time, the adhesive sheet is deformed following the shape of the conductor circuit of the inner layer substrate, so that no bubbles are generated between the insulating layer formed by the adhesive sheet and the conductor circuit of the inner layer substrate. . Then, the laminated board thus manufactured is subjected to drilling for through holes and via holes by laser processing or the like to the insulating layer, if necessary, and then a plated metal film is formed on the wall surfaces of the holes to form through holes. By forming a conductive circuit on the surface of the insulating layer by an additive method, a printed wiring board can be manufactured. Further, an insulating layer is formed in the same manner on the surface of the conductor circuit of the printed wiring board manufactured in this manner, a hole is formed, and a conductor circuit is formed.
By repeating this, a multilayer printed wiring board can be manufactured.
【００２４】また金属箔付き接着シートを用いて積層板
を製造する場合は、金属箔付き接着シートの接着シート
側を、内層基板の導体回路表面に重ね、例えば１５０〜
２００℃、３０〜５０ｋｇ／ｃｍ2の条件で６０〜８０
分間加熱・加圧し、内層基板の導体回路の外側に接着シ
ートにて絶縁層を形成すると共に、絶縁層の外側に導体
回路用の金属箔を形成して、積層板を製造するものであ
る。このとき接着シートは、内層基板の導体回路の形状
に追随して変形し、接着シートにて形成される絶縁層
と、内層基板の導体回路との間に気泡が発生することが
ないものである。特に接着シートを、上記のように未反
応部分の多い半硬化状態として形成すると、加熱加圧時
に流動して内層基板の導体回路の埋め込み性が向上する
ものである。またこのようにして製造される積層板にお
いては、上記のように金属箔付き接着シートの金属箔と
接着シートとの間には気泡が介在しないため、絶縁層に
気泡が発生することを防ぐことができ、内層基材の導体
回路と、外層の導体回路用の金属箔との間の絶縁信頼性
を確保することができるものである。そしてこのように
製造される積層板の表面の金属箔にエッチング処理を施
すことにより、導体回路を形成し、更に必要に応じて絶
縁層にスルーホール又はバイアホールを形成し、プリン
ト配線板用を製造することができる。またこのようにし
て製造された積層板の導体回路表面に更に同様にして絶
縁層の形成、ホール加工、及び導体回路の形成を行い、
これを繰り返し行うことにより、多層のプリント配線板
を製造することができる。In the case of manufacturing a laminate using an adhesive sheet with a metal foil, the adhesive sheet side of the adhesive sheet with a metal foil is superposed on the surface of the conductor circuit of the inner layer substrate, and for example, 150 to
60-80 under the condition of 200 ° C. and 30-50 kg / cm 2
Heating and pressurizing for one minute, forming an insulating layer with an adhesive sheet outside the conductive circuit on the inner layer substrate, and forming a metal foil for the conductive circuit outside the insulating layer to manufacture a laminate. At this time, the adhesive sheet is deformed following the shape of the conductor circuit of the inner layer substrate, so that no bubbles are generated between the insulating layer formed by the adhesive sheet and the conductor circuit of the inner layer substrate. . In particular, when the adhesive sheet is formed in a semi-cured state having many unreacted portions as described above, the adhesive sheet flows at the time of heating and pressurizing, and the embedding property of the conductor circuit on the inner layer substrate is improved. Further, in the laminated plate manufactured in this manner, since no air bubbles are interposed between the metal foil and the adhesive sheet of the adhesive sheet with a metal foil as described above, it is necessary to prevent the generation of air bubbles in the insulating layer. Thus, insulation reliability between the conductor circuit of the inner layer base material and the metal foil for the outer layer conductor circuit can be ensured. Then, by performing an etching treatment on the metal foil on the surface of the laminated board manufactured in this manner, a conductive circuit is formed, and if necessary, a through hole or a via hole is formed in the insulating layer, and the printed circuit board is used. Can be manufactured. Further, on the conductor circuit surface of the laminated board manufactured in this manner, an insulating layer is formed in the same manner, a hole is formed, and a conductor circuit is formed.
By repeating this, a multilayer printed wiring board can be manufactured.
【００２５】ここで、上記の積層板を製造するための内
層基板としては、特に限定するものではないが、例えば
エポキシ樹脂系、フェノール樹脂系、ポリイミド樹脂
系、不飽和ポリエステル樹脂系等の熱硬化性樹脂や、こ
れらの熱硬化性樹脂に無機充填材等を配合した樹脂組成
物にて形成される絶縁板や、ガラス繊維等の無機質繊維
やポリエステル、ポリアミド、木綿等の有機質繊維のク
ロス、ペーパー等の基材を、複数枚積層して上記熱硬化
性樹脂で接着して形成される絶縁板を用い、これらの絶
縁板の片面又は両面に銅箔等の金属箔を貼着し、この表
面の金属箔にエッチング処理等を施して導体回路を形成
したもの、あるいは絶縁板の表面にめっき処理を施して
導体回路を形成したもの等を使用することができる。Here, the inner layer substrate for producing the above-mentioned laminated board is not particularly limited. For example, a thermosetting resin such as an epoxy resin, a phenol resin, a polyimide resin, and an unsaturated polyester resin is used. Resin, or an insulating plate formed of a resin composition in which an inorganic filler or the like is blended with these thermosetting resins, or an inorganic fiber such as glass fiber or a cloth or paper of an organic fiber such as polyester, polyamide, or cotton. Using an insulating plate formed by laminating a plurality of base materials and bonding them with the thermosetting resin, a metal foil such as a copper foil is adhered to one or both surfaces of these insulating plates. Can be used in which a conductive circuit is formed by subjecting a metal foil to an etching process or the like, or a conductive circuit formed by subjecting a surface of an insulating plate to a plating process.
【００２６】上記のようにして製造される積層板は、絶
縁層を、誘電率及び誘電正接が低減された接着シートに
て形成するため、高周波特性が要求される分野における
誘電特性に優れた積層板を得ることができるものであ
る。また接着シートを内層基板の導体回路に接着する際
に、接着シートが導体回路の形状に追随して変形し、接
着シートにて形成される絶縁層と、内層基板の導体回路
との間に気泡が発生することがないものである。In the laminate manufactured as described above, since the insulating layer is formed of an adhesive sheet having a reduced dielectric constant and dielectric loss tangent, the laminate has excellent dielectric properties in a field where high frequency characteristics are required. A plate can be obtained. Also, when the adhesive sheet is bonded to the conductor circuit of the inner substrate, the adhesive sheet deforms following the shape of the conductor circuit, and bubbles are generated between the insulating layer formed by the adhesive sheet and the conductor circuit of the inner substrate. Does not occur.
【００２７】[0027]
【実施例】 以下、本発明を実施例に基づいて説明する
が、本発明はこれに限定されるものではない。〔実施例
１〕 日本ＧＥプラスチック製の数平均分子量（Ｍｎ）
２００００のポリフェニレンエーテル（ＰＰＥ）６０ｇ
と、エラストマー成分として上記一般式（Ａ）で示さ
れ、式中のｍの値が２００、ｎの値が１２０であるスチ
レンブタジエンコポリマー（旭化成工業（株）製、商品
名「タフプレンＡ」）５ｇと、ＴＡIＣ（日本化成
（株）製）３５ｇと、トルエン２００ｇとを配合して、
９０℃で６０分間攪拌後、反応開始剤としてパーブチル
Ｐ（商品名、日本油脂（株）製）を１．５ｇ加えた後、
３０℃まで冷却し接着シート用組成物を調製した。EXAMPLES Hereinafter, the present invention will be described based on examples, but the present invention is not limited thereto. Example 1 Number average molecular weight (Mn) manufactured by Nippon GE Plastics
20,000 polyphenylene ether (PPE) 60g
And 5 g of a styrene-butadiene copolymer represented by the above general formula (A) as an elastomer component and having a value of m of 200 and a value of n of 120 (trade name “Taphrene A” manufactured by Asahi Kasei Kogyo Co., Ltd.) And 35 g of TAIC (manufactured by Nippon Kasei Co., Ltd.) and 200 g of toluene,
After stirring at 90 ° C. for 60 minutes, 1.5 g of perbutyl P (trade name, manufactured by NOF CORPORATION) was added as a reaction initiator.
The composition was cooled to 30 ° C. to prepare a composition for an adhesive sheet.
【００２８】次いで、得られた接着シート用組成物を、
離型剤で表面処理したポリエチレンテレフタレートフィ
ルム上にバーコーターを用いて塗布した後、１３０℃で
５分間処理し、樹脂塗布厚み６０μｍの接着シートを得
た。Next, the obtained composition for an adhesive sheet is
It was applied on a polyethylene terephthalate film surface-treated with a release agent using a bar coater, and then treated at 130 ° C. for 5 minutes to obtain an adhesive sheet having a resin applied thickness of 60 μm.
【００２９】次いで、銅張積層板（松下電工（株）製、
商品名「Ｒ−１７６６」）の表面の銅箔（厚み０．０１
８ｍｍ）にエッチング処理を施して両面に導体回路を形
成した内層基板を得た。そしてその内層基板の表裏に接
着シートをそれぞれ１枚ずつ重ね、温度１８０℃、圧力
３０ｋｇ／ｃｍ2の条件で１００分加熱・加圧した後、
ＰＥＴフィルムを剥離して両面に絶縁層が形成された積
層板を得た。 〔実施例２〕接着シート用組成物中のＰＰＥの配合量を
４５ｇ、ＴＡＩＣの配合量を５０ｇ、トルエンの配合量
を１５０ｇとした以外は、実施例１と同様にして接着シ
ートを作製し、この接着シートを用いて、実施例１と同
様にして両面に絶縁層が形成された積層板を得た。 〔実施例3〕接着シート用組成物中のＰＰＥの配合量を
３０ｇ、ＴＡＩＣの配合量を６５ｇ、トルエンの配合量
を１００ｇとした以外は、実施例１と同様にして接着シ
ートを作製し、この接着シートを用いて、実施例１と同
様にして両面に絶縁層が形成された積層板を得た。 〔実施例４〕実施例１と同様の組成の接着シート用組成
物を厚み０．０１８ｍｍの金属箔の片面に塗布した後、
１３０℃で５分間処理し、樹脂塗布厚み６０μｍの接着
シートを有する金属箔付き接着シートを得た。そして実
施例１と同一の内層基板の表裏に、金属箔付き接着シー
トをそれぞれ１枚ずつ、接着シート側が内層基板の導体
回路と密着するように重ね、温度１８０℃、圧力３０ｋ
ｇ／ｃｍ2の条件で１００分加熱・加圧して、両面に絶
縁層が形成され、更にその外側に金属箔の層が形成され
た積層板を得た。 〔実施例５〕実施例２と同様の組成の接着シート用組成
物を用いて、実施例４と同様にして金属箔付き接着シー
トを作製し、この金属箔付き接着シートを用いて実施例
４と同様にして、両面に絶縁層が形成され、更にその外
側に金属箔の層が形成された積層板を得た。 〔実施例６〕実施例３と同様の組成の接着シート用組成
物を用いて、実施例４と同様にして金属箔付き接着シー
トを作製し、この金属箔付き接着シートを用いて実施例
４と同様にして、両面に絶縁層が形成され、更にその外
側に金属箔の層が形成された積層板を得た。 〔比較例1〕 接着シート用組成物中のＰＰＥの配合量
を６５ｇ、ＴＡＩＣの配合量を３０ｇ、トルエンの配合
量を２５０ｇとした以外は、実施例１と同様にして接着
シートを作製し、この接着シートを用いて、実施例１と
同様にして両面に絶縁層が形成された積層板を得た。 〔比較例２〕接着シート用組成物中のＰＰＥの配合量を
２５ｇ、ＴＡＩＣの配合量を７０ｇ、トルエンの配合量
を８０ｇとした以外は、実施例１と同様にして接着シー
トを作製しようと試みたが、シート状に形成することが
できなかった。 〔比較例３〕接着シートの代わりにＦＲ−４タイプのガ
ラス基材エポキシ樹脂プリプレグ（松下電工株式会社
製、品番「Ｒ１６６１」）を用いた以外は、実施例１と
同様にして両面に絶縁層が形成された積層板を得た。
〔比較例４〕ブロム化ビスフェノールＡ型エポキシ樹脂
９０重量部、クレゾールノボラック型エポキシ樹脂１０
重量部、末端カルボキシル基変性ブタジエン−アクリロ
ニトリル（（株）宇部興産製、商品名：ＨＹＣＡＲ Ｃ
ＴＢＮ）、１２重量部、ジシアンジアミド２重量部、２
−エチル−４メチルイミダゾール（２Ｅ４ＭＺ）０．０
８重量部の組成のエポキシ樹脂組成物を接着シート用組
成物として用い、この接着シート用組成物にて、実施例
１と同様にして接着シートを作製し、この接着シートを
用いて、実施例１と同様にして両面に絶縁層が形成され
た積層板を得た。 （評価試験） 〔回路埋め込み性〕各実施例、並びに比較例１、３、４
で得られた積層板における、内層基板の導体回路への絶
縁層の埋め込み性を、積層板の表面より５０倍のマイク
ロスコープにて観察することにより確認し、絶縁層と内
層基板の導体回路との間に気泡が認められなかったもの
を「○」、絶縁層と内層基板の導体回路との間に気泡が
発生したものを「×」として評価した。 〔誘電特性〕各実施例、並びに比較例１、４で用いた接
着シート用組成物を、離型剤で表面処理したポリエチレ
ンテレフタレートフィルム上にバーコーターを用いて塗
布した後、１３０℃で５分間処理し、樹脂塗布厚み６０
μｍの接着シートを得た。このような接着シートをポリ
エチレンテレフタレートフィルムを付けたまま、接着シ
ート側が重なるように２枚積層し、温度１８０℃、圧力
３０ｋｇ／ｃｍ2の条件で１００分加熱熱・加圧した
後、ＰＥＴフィルムを剥離して、接着シートの硬化物か
らなる樹脂硬化物を作製し、この樹脂硬化物の誘電率及
び誘電正接を、ＭＩＬ法に準じて測定した。また比較例
３で用いたプリプレグを２枚積層し、温度１８０℃、圧
力３０ｋｇ／ｃｍ2の条件で１００分加熱・加圧した
後、ＰＥＴフィルムを剥離して樹脂硬化物を作製し、こ
の樹脂硬化物の誘電率及び誘電正接を、ＭＩＬ法に準じ
て測定した。Next, a copper-clad laminate (manufactured by Matsushita Electric Works, Ltd.)
Copper foil (thickness 0.01) on the surface of the product name “R-1766”
8 mm) to obtain an inner substrate having conductor circuits formed on both sides. Then, an adhesive sheet is stacked on each of the front and back surfaces of the inner layer substrate, and heated and pressed at a temperature of 180 ° C. and a pressure of 30 kg / cm 2 for 100 minutes.
The PET film was peeled off to obtain a laminate having insulating layers formed on both sides. Example 2 An adhesive sheet was prepared in the same manner as in Example 1, except that the amount of PPE in the adhesive sheet composition was 45 g, the amount of TAIC was 50 g, and the amount of toluene was 150 g. Using this adhesive sheet, a laminate having an insulating layer formed on both surfaces was obtained in the same manner as in Example 1. Example 3 An adhesive sheet was prepared in the same manner as in Example 1 except that the amount of PPE in the adhesive sheet composition was 30 g, the amount of TAIC was 65 g, and the amount of toluene was 100 g. Using this adhesive sheet, a laminate having an insulating layer formed on both surfaces was obtained in the same manner as in Example 1. Example 4 A composition for an adhesive sheet having the same composition as in Example 1 was applied to one surface of a metal foil having a thickness of 0.018 mm.
This was treated at 130 ° C. for 5 minutes to obtain an adhesive sheet with a metal foil having an adhesive sheet having a resin applied thickness of 60 μm. Then, on the front and back of the same inner layer substrate as in Example 1, an adhesive sheet with a metal foil is stacked one by one so that the adhesive sheet side is in close contact with the conductor circuit of the inner layer substrate, and the temperature is 180 ° C. and the pressure is 30 k.
Heating and pressing were performed for 100 minutes under the conditions of g / cm 2 to obtain a laminate in which an insulating layer was formed on both sides and a metal foil layer was formed outside the insulating layer. [Example 5] An adhesive sheet with a metal foil was prepared in the same manner as in Example 4 using the adhesive sheet composition of the same composition as in Example 2, and the adhesive sheet with the metal foil was used as in Example 4 In the same manner as in the above, a laminate having an insulating layer formed on both surfaces and a metal foil layer formed outside the insulating layer was obtained. Example 6 An adhesive sheet with a metal foil was prepared in the same manner as in Example 4 using the adhesive sheet composition of the same composition as in Example 3, and the adhesive sheet with the metal foil was used in Example 4 In the same manner as in the above, a laminate having an insulating layer formed on both surfaces and a metal foil layer formed outside the insulating layer was obtained. Comparative Example 1 An adhesive sheet was prepared in the same manner as in Example 1, except that the compounding amount of PPE in the adhesive sheet composition was 65 g, the compounding amount of TAIC was 30 g, and the compounding amount of toluene was 250 g. Using this adhesive sheet, a laminate having an insulating layer formed on both surfaces was obtained in the same manner as in Example 1. [Comparative Example 2] An adhesive sheet was prepared in the same manner as in Example 1, except that the amount of PPE in the adhesive sheet composition was 25 g, the amount of TAIC was 70 g, and the amount of toluene was 80 g. Attempted, but could not be formed into a sheet. [Comparative Example 3] An insulating layer was formed on both surfaces in the same manner as in Example 1 except that an FR-4 type glass base epoxy resin prepreg (manufactured by Matsushita Electric Works, product number "R1661") was used instead of the adhesive sheet. Was obtained.
Comparative Example 4 90 parts by weight of brominated bisphenol A type epoxy resin, cresol novolak type epoxy resin 10
Parts by weight, terminal carboxyl group-modified butadiene-acrylonitrile (manufactured by Ube Industries, Ltd., trade name: HYCAR C)
TBN), 12 parts by weight, dicyandiamide 2 parts by weight, 2
-Ethyl-4-methylimidazole (2E4MZ) 0.0
Using an epoxy resin composition having a composition of 8 parts by weight as a composition for an adhesive sheet, an adhesive sheet was prepared in the same manner as in Example 1 using the composition for an adhesive sheet. In the same manner as in Example 1, a laminate having insulating layers formed on both surfaces was obtained. (Evaluation Test) [Circuit Embedding Property] Each Example and Comparative Examples 1, 3, and 4
In the laminate obtained in the above, the embedding property of the insulating layer into the conductor circuit of the inner layer substrate was confirmed by observing with a microscope 50 times the surface of the laminate, and the insulating layer and the conductor circuit of the inner layer substrate were checked. The sample was evaluated as "O" when no air bubbles were observed between them, and evaluated as "X" when air bubbles were generated between the insulating layer and the conductor circuit of the inner layer substrate. [Dielectric properties] The composition for an adhesive sheet used in each of Examples and Comparative Examples 1 and 4 was applied on a polyethylene terephthalate film surface-treated with a release agent using a bar coater, and then at 130 ° C for 5 minutes. Processing, resin coating thickness 60
A μm adhesive sheet was obtained. Two such adhesive sheets are laminated with the polyethylene terephthalate film attached so that the adhesive sheets are overlapped, and heated and pressed at a temperature of 180 ° C. and a pressure of 30 kg / cm 2 for 100 minutes. After peeling, a cured resin made of a cured adhesive sheet was prepared, and the dielectric constant and the dielectric loss tangent of the cured resin were measured according to the MIL method. Further, two prepregs used in Comparative Example 3 were laminated, heated and pressed at a temperature of 180 ° C. and a pressure of 30 kg / cm 2 for 100 minutes, and then the PET film was peeled off to produce a cured resin. The dielectric constant and the dielectric loss tangent of the cured product were measured according to the MIL method.
【００３０】以上の結果を表１に示す。Table 1 shows the above results.
【００３１】[0031]
【表１】 表１から明らかなように、実施例１乃至６における絶縁
層は、比較例３のエポキシ樹脂を用いたプリプレグから
なる絶縁層や、比較例４のエポキシ樹脂組成物からなる
絶縁層と比べて、誘電率及び誘電正接が低減し、誘電特
性が向上したことが確認できた。また接着シート用組成
物中のＴＡＩＣの配合量が小さすぎる比較例１では、回
路埋め込み性が悪化し、ＴＡＩＣの配合量が大きすぎる
比較例２では、接着シートを成形するこができないこと
が確認できた。[Table 1] As is clear from Table 1, the insulating layers in Examples 1 to 6 are different from the insulating layer made of the prepreg using the epoxy resin of Comparative Example 3 and the insulating layer made of the epoxy resin composition of Comparative Example 4. It was confirmed that the dielectric constant and the dielectric loss tangent were reduced, and the dielectric properties were improved. In Comparative Example 1 where the content of TAIC in the composition for an adhesive sheet was too small, the circuit embedding property was deteriorated, and in Comparative Example 2 where the content of TAIC was too large, it was confirmed that the adhesive sheet could not be formed. did it.
【００３２】[0032]
【発明の効果】上記のように本発明の請求項１に記載の
接着シート用組成物は、数平均分子量が１００００〜３
００００のポリフェニレンエーテルと、エラストマー
と、トリアリルイソシアヌレートとを含有し、数平均分
子量が１００００〜３００００のポリフェニレンエーテ
ルとエラストマーとの合計量と、トリアリルイソシアヌ
レートとの配合重量比を、６５／３５〜３５／６５とす
るため、シート状に成形する際の成形性が良好であり、
かつこの接着シート用組成物を硬化させることにより、
良好な柔軟性を有すると共に、誘電率及び誘電正接が低
減された硬化物を成形することができるものである。As described above, the composition for an adhesive sheet according to the first aspect of the present invention has a number average molecular weight of 10,000 to 3.
The total weight of polyphenylene ether and elastomer having a number average molecular weight of 10,000 to 30,000, containing polyphenylene ether of 0000, an elastomer, and triallyl isocyanurate, and the blending weight ratio of triallyl isocyanurate to 65/35 To 35/65, the moldability when forming into a sheet is good,
And by curing this adhesive sheet composition,
A cured product having good flexibility and reduced dielectric constant and dielectric loss tangent can be formed.
【００３３】また本発明の請求項２に記載の接着シート
用組成物は、エラストマーとしてスチレン−ブタジエン
−スチレンを用いるため、エラストマーの添加量を少量
にしても、シート成形性を高くすることができるもので
ある。In the composition for an adhesive sheet according to the second aspect of the present invention, styrene-butadiene-styrene is used as the elastomer, so that even if the amount of the elastomer is small, the sheet formability can be improved. Things.
【００３４】また本発明の請求項３に記載の接着シート
は、請求項１又は２に記載の接着シート用組成物をシー
ト状に成形するため、良好な流動性を有すると共に、誘
電率及び誘電正接が低減された接着シートを得ることが
できるものである。The adhesive sheet according to the third aspect of the present invention has good fluidity, and has a dielectric constant and a dielectric constant, since the adhesive sheet composition according to the first or second aspect is formed into a sheet. An adhesive sheet having a reduced tangent can be obtained.
【００３５】また本発明の請求項４に記載の金属箔付き
接着シートは、金属箔の一面に、請求項１又は２に記載
の接着シート用組成物からなる接着シートの層を形成す
るため、良好な流動性を有すると共に、誘電率及び誘電
正接が低減された接着シートが形成された金属箔付き接
着シートを得ることができるものである。According to a fourth aspect of the present invention, there is provided an adhesive sheet with a metal foil, wherein a layer of the adhesive sheet comprising the adhesive sheet composition according to the first or second aspect is formed on one surface of the metal foil. It is possible to obtain an adhesive sheet with a metal foil on which an adhesive sheet having good fluidity and a reduced dielectric constant and a reduced dielectric tangent is formed.
【００３６】また本発明の請求項５に記載の積層板は、
請求項３に記載の接着シートを、表面に導体回路を有す
る基板のその表面の導体回路と接着するため、導体回路
の外側に、誘電率及び誘電正接が低く、誘電特性が向上
した接着シートにて形成された絶縁層が配置された積層
板を得ることができるものであり、高周波特性が要求さ
れる分野における誘電特性に優れた積層板を得ることが
できるものである。また接着シートを内層基板の導体回
路に接着する際に、接着シートが導体回路の形状に追随
して変形し、接着シートにて形成される絶縁層と、内層
基板の導体回路との間に気泡が発生することがないもの
である。The laminate according to claim 5 of the present invention comprises:
Since the adhesive sheet according to claim 3 is bonded to a conductive circuit on the surface of a substrate having a conductive circuit on the surface, an adhesive sheet having a low dielectric constant and a low dielectric loss tangent and an improved dielectric property is provided outside the conductive circuit. It is possible to obtain a laminated plate on which an insulating layer formed by disposing is provided, and to obtain a laminated plate having excellent dielectric properties in a field where high frequency characteristics are required. Also, when the adhesive sheet is bonded to the conductor circuit of the inner substrate, the adhesive sheet deforms following the shape of the conductor circuit, and bubbles are generated between the insulating layer formed by the adhesive sheet and the conductor circuit of the inner substrate. Does not occur.
【００３７】また本発明の請求項６に記載の積層板は、
請求項４に記載の金属箔付き接着シートの接着シート側
を、表面に導体回路を有する基板のその表面の導体回路
と接着するため、導体回路の外側に、誘電率及び誘電正
接が低く、誘電特性が向上した接着シートにて形成され
た絶縁層が配置され、更にその外側に導体回路用の金属
箔の層が配置された積層板を得ることができるものであ
り、高周波特性が要求される分野における誘電特性に優
れた積層板を得ることができるものである。また金属箔
付き接着シートを内層基板の導体回路に接着する際に、
接着シートが導体回路の形状に追随して変形し、接着シ
ートにて形成される絶縁層と、内層基板の導体回路との
間に気泡が発生することがないものである。The laminate according to claim 6 of the present invention comprises:
The adhesive sheet side of the adhesive sheet with a metal foil according to claim 4 is bonded to a conductive circuit on the surface of a substrate having a conductive circuit on the surface, so that the dielectric constant and the dielectric loss tangent are low outside the conductive circuit. An insulating layer formed of an adhesive sheet having improved characteristics is disposed, and a laminate having a metal foil layer for a conductor circuit disposed outside thereof can be obtained, and high-frequency characteristics are required. A laminate having excellent dielectric properties in the field can be obtained. Also, when bonding the adhesive sheet with metal foil to the conductor circuit of the inner layer board,
The adhesive sheet is deformed following the shape of the conductor circuit, and no air bubbles are generated between the insulating layer formed by the adhesive sheet and the conductor circuit of the inner layer substrate.
フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｃ０９Ｊ 125/10 Ｃ０９Ｊ 125/10 171/00 171/00 Ｚ Ｆターム(参考） 4F071 AA10A AA51A AB06B AC12A AH13 CA01 CB06 CC02 CD01 4F100 AB17 AB33B AK51A AK54A AK73A AL05A AL09A AR00C BA02 BA03 BA05 BA07 BA10B BA10C EJ15 GB43 HB31C JA07A JG01C JG04 JG05 JK13 JL01 JL11A YY00A 4J004 AA02 AA05 AA07 AA11 AB03 AB05 BA02 CA01 CA08 CC02 FA05 4J040 CA081 CA082 EE061 EE062 FA061 FA062 JA09 LA01 LA09 NA20 Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat II (reference) C09J 125/10 C09J 125/10 171/00 171/00 Z F term (reference) 4F071 AA10A AA51A AB06B AC12A AH13 CA01 CB06 CC02 CD01 4F100 AB17 AB33B AK51A AK54A AK73A AL05A AL09A AR00C BA02 BA03 BA05 BA07 BA10B BA10C EJ15 GB43 HB31C JA07A JG01C JG04 JG05 JK13 JL01 JL11A YY00A 4J004 AA02 AA05 CAA1A02 CA08
Claims (6)
のポリフェニレンエーテルと、エラストマーと、トリア
リルイソシアヌレートとを含有し、数平均分子量が１０
０００〜３００００のポリフェニレンエーテルとエラス
トマーとの合計量と、トリアリルイソシアヌレートとの
配合重量比を、６５／３５〜３５／６５として成ること
を特徴とする接着シート用組成物。1. A compound having a number average molecular weight of 10,000 to 30,000
Containing a polyphenylene ether, an elastomer and triallyl isocyanurate, and having a number average molecular weight of 10
A composition for an adhesive sheet, wherein a total weight ratio of polyphenylene ether and elastomer of 000 to 30,000 and a blending weight ratio of triallyl isocyanurate is 65/35 to 35/65.
コポリマーを用いて成ることを特徴とする請求項１に記
載の接着シート用組成物。2. The composition for an adhesive sheet according to claim 1, wherein the composition comprises a styrene-butadiene copolymer as the elastomer.
成物をシート状に成形して成ることを特徴とする接着シ
ート。3. An adhesive sheet formed by molding the composition for an adhesive sheet according to claim 1 into a sheet.
の接着シート用組成物からなる接着シートの層を形成し
て成ることを特徴とする金属箔付き接着シート。4. An adhesive sheet with a metal foil, comprising a layer of an adhesive sheet comprising the adhesive sheet composition according to claim 1 formed on one surface of the metal foil.
導体回路を有する内層基板の導体回路と接着して成るこ
とを特徴とする積層板。5. A laminate comprising the adhesive sheet according to claim 3 and a conductive circuit of an inner substrate having a conductive circuit on a surface thereof.
の接着シート側を、表面に導体回路を有する内層基板の
導体回路と接着して成ることを特徴とする積層板。6. A laminate, wherein the adhesive sheet side of the adhesive sheet with a metal foil according to claim 4 is bonded to a conductor circuit of an inner substrate having a conductor circuit on the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27187598A JP4214573B2 (en) | 1998-09-25 | 1998-09-25 | Laminate production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27187598A JP4214573B2 (en) | 1998-09-25 | 1998-09-25 | Laminate production method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000104038A true JP2000104038A (en) | 2000-04-11 |
| JP4214573B2 JP4214573B2 (en) | 2009-01-28 |
Family
ID=17506126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27187598A Expired - Lifetime JP4214573B2 (en) | 1998-09-25 | 1998-09-25 | Laminate production method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4214573B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002072700A1 (en) * | 2001-03-12 | 2002-09-19 | Matsushita Electric Works, Ltd. | Poly(phenylene oxide) resin composition, prepreg, laminates sheet, printed wiring board, and multilayer printed wiring board |
| US9051465B1 (en) | 2012-02-21 | 2015-06-09 | Park Electrochemical Corporation | Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound |
| US9243164B1 (en) | 2012-02-21 | 2016-01-26 | Park Electrochemical Corporation | Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound |
| JP2016027131A (en) * | 2014-06-26 | 2016-02-18 | 住友電気工業株式会社 | Adhesive composition, coverlay for printed wiring board, bonding film for printed wiring board, and printed wiring board |
| KR20170060025A (en) | 2014-09-18 | 2017-05-31 | 미쓰비시 쥬시 가부시끼가이샤 | Photocrosslinkable transparent adhesive material, transparent adhesive material layered body, and layered body for constituting optical device |
-
1998
- 1998-09-25 JP JP27187598A patent/JP4214573B2/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002072700A1 (en) * | 2001-03-12 | 2002-09-19 | Matsushita Electric Works, Ltd. | Poly(phenylene oxide) resin composition, prepreg, laminates sheet, printed wiring board, and multilayer printed wiring board |
| US7288587B2 (en) * | 2001-03-12 | 2007-10-30 | Matsushita Electric Works, Ltd. | Poly(phenylene oxide) resin composition, prepreg, laminates sheet, printed wiring board, and multilayer printed wiring board |
| US9051465B1 (en) | 2012-02-21 | 2015-06-09 | Park Electrochemical Corporation | Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound |
| US9243164B1 (en) | 2012-02-21 | 2016-01-26 | Park Electrochemical Corporation | Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound |
| JP2016027131A (en) * | 2014-06-26 | 2016-02-18 | 住友電気工業株式会社 | Adhesive composition, coverlay for printed wiring board, bonding film for printed wiring board, and printed wiring board |
| KR20170060025A (en) | 2014-09-18 | 2017-05-31 | 미쓰비시 쥬시 가부시끼가이샤 | Photocrosslinkable transparent adhesive material, transparent adhesive material layered body, and layered body for constituting optical device |
| JPWO2016043268A1 (en) * | 2014-09-18 | 2017-06-29 | 三菱ケミカル株式会社 | Photocrosslinkable transparent adhesive material, transparent adhesive material laminate and optical device constituting laminate |
| US11111419B2 (en) | 2014-09-18 | 2021-09-07 | Mitsubishi Chemical Corporation | Photocrosslinkable transparent adhesive material, transparent adhesive material layered body, and layered body for constituting optical device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4214573B2 (en) | 2009-01-28 |
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