JPH0786710A - Laminated board and multilayer printed circuit board - Google Patents

Abstract

PURPOSE:To provide the title laminated board, multilayer printed circuit board, pregreg having small in-surface thermal expansion coefficient and low elastic coefficient. CONSTITUTION:The title laminated board having insulating layer comprising resin parts 2 having sea-island structure and cloth reinforcement members 1 in thermal expansion coefficiency of 3.0-10ppm/K in the in-surface direction of the insulating layer and the glass transition temperature of 150-300 deg.C in the insulating layer is obtained. Thus, the in-surface thermal expansion coefficient of laminated board, multilayer printed circuit board, prepreg, elastic coefficient are reduced thereby notably cutting down the thermal stress of mounting surface. Through these procedures, the reliability upon the connection to mounted element such as an LSI can be notably enhanced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated board and a multilayer printed circuit board on which semiconductor elements can be mounted.

[0002]

2. Description of the Related Art As a low thermal expansion multilayer substrate, there are a substrate having a ceramic score layer, a substrate obtained by spraying ceramics on a copper foil, and the like, and the thermal expansion coefficient in the surface direction is 10 ppm / K or less. However, in the case of ceramics, there is a problem in drill workability when forming through holes. On the other hand, it is known that in an organic substrate, the coefficient of thermal expansion can be reduced by mixing an inorganic filler into a resin system. However, in this case, the elastic modulus becomes large, and it is inevitably not sufficient to reduce the stress.

It has been conventionally known that a rubber-based component can be added to a resin component of a laminated material to achieve a low elastic modulus (Japanese Patent Laid-Open No. 61-100446). In this case, the resin and the rubber-based component are compatibilized to provide a flexible substrate having excellent flexibility and toughness. However, in this case, the coefficient of thermal expansion tends to increase although it is effective in lowering the elastic modulus.

As an example in which a resin component obtained by combining a matrix resin component represented by a sea-island structure with another component having poor compatibility is applied to a laminate, a layer made of a resin component having a sea-island structure is formed only on the substrate surface. It has been proposed to form it to reduce the elastic modulus and achieve a reduction in thermal stress during mounting (Japanese Patent Laid-Open No. 4-356995). However, with this method, it is difficult to reduce the coefficient of thermal expansion in the in-plane direction of the substrate, and the effect on the characteristics of the entire substrate is extremely small.

[0005]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a laminated board, a multilayer printed circuit board, a prepreg and an electronic product using them, which have a small coefficient of thermal expansion and a low elastic modulus and a small thermal stress. To do.

[0006]

To achieve the above object, the present invention provides the following means. The first means is, in a laminated board on which a semiconductor element can be mounted, the laminated board has an insulating layer composed of a resin portion having a sea-island structure and a woven fabric reinforcing material, and heat in the in-plane direction of the insulating layer. Expansion rate is 3.0
-10ppm / K, glass transition temperature of insulating layer is 150-3
A laminated board characterized by being at 00 ° C.

A second means is a multilayer printed circuit board on which a semiconductor element can be mounted, wherein the multilayer printed circuit board has at least two insulating layers composed of a resin portion having a sea-island structure and a woven fabric reinforcing material, A multilayer printed circuit board, wherein the in-plane thermal expansion coefficient of the insulating layer is 3.0 to 10 ppm / K, and the glass transition temperature of the insulating layer is 150 to 300 ° C.

A third means is a laminated board on which a semiconductor element can be mounted, wherein the laminated board has an insulating layer composed of a resin portion having a sea-island structure, an inorganic filler and a woven fabric reinforcing material. Coefficient of thermal expansion in the in-plane direction is 3.0-10ppm /
K, a laminate having a glass transition temperature of the insulating layer of 150 to 300 ° C.

A fourth means is a multilayer printed circuit board on which a semiconductor element can be mounted, wherein the multilayer printed circuit board has at least two insulating layers composed of a resin portion having a sea-island structure, an inorganic filler and a woven fabric reinforcing material. A multilayer printed circuit board having layers, wherein the in-plane thermal expansion coefficient of the insulating layer is 3.0 to 10 ppm / K, and the glass transition temperature of the insulating layer is 150 to 300 ° C.

A fifth means is a prepreg obtained by impregnating a woven fabric reinforcing material with a resin component, wherein the resin component includes a resin portion having a sea-island structure, and the prepreg after curing has a coefficient of thermal expansion of 3 in the in-plane direction. A prepreg characterized in that it has a glass transition temperature of 150 to 300 ° C. and a glass transition temperature of 0.0 to 10 ppm / K.

A sixth means is a prepreg obtained by impregnating a woven fabric reinforcing material with a resin component, wherein the resin component includes a resin portion having a sea-island structure and an inorganic filler having an average particle size of 0.1 to 15 μm, and is cured. The subsequent prepreg has an in-plane thermal expansion coefficient of 3.0 to 10 ppm / K and a glass transition temperature of 150 to 3
A prepreg characterized by having a temperature of 00 ° C.

A seventh means is a memory card in which a memory element is surface-mounted on a circuit board, wherein the circuit board has an insulating layer composed of a resin portion having a sea-island structure and a woven fabric reinforcing material, The in-plane thermal expansion coefficient of the insulating layer is 3.0.
-10ppm / K, glass transition temperature of insulating layer is 150-3
A memory card having a temperature of 00 ° C.

An eighth means is a computer including a multilayer printed circuit board on which a semiconductor element can be mounted, wherein the multilayer printed circuit board has an insulating layer composed of a resin portion having a sea-island structure and a woven fabric reinforcing material, The in-plane thermal expansion coefficient of the insulating layer is 3.0 to 10 ppm / K, and the glass transition temperature of the insulating layer is 1
Signal transmission delay time of 1 to 15 ns / at 50 to 300 ° C
A computer characterized by being m.

A ninth means is a communication device including a circuit board on which a semiconductor element can be mounted, wherein the circuit board has an insulating layer composed of a resin portion having a sea-island structure and a woven fabric reinforcing material. Coefficient of thermal expansion in the in-plane direction is 3.0-10ppm /
K, the glass transition temperature of the insulating layer is 150 to 300 ° C., and the weight is 10 g to 30 kg.
A tenth means is an electronic device including a circuit board on which a semiconductor element can be mounted, wherein the circuit board has an insulating layer composed of a resin portion having a sea-island structure and a woven fabric reinforcing material, and an in-plane surface of the insulating layer. Coefficient of thermal expansion in the direction of 3.0-10ppm /
K, the glass transition temperature of the insulating layer is 150 to 300 ° C., and the occupied volume of the electronic device is 1 to 50%.

An eleventh means is a laminated plate formed by laminating and adhering at least one prepreg or sheet made of a resin and a woven fabric reinforcing material, wherein the woven fabric reinforcing material has an anisotropic material property. The resin is a continuous layer having a sea-island structure and preventing contact between layers of the woven fabric reinforcing material.

A twelfth means is a laminated plate formed by laminating and adhering at least one prepreg or sheet made of a resin and a woven fabric reinforcing material, wherein the woven fabric reinforcing material has anisotropic material properties. The resin is a continuous layer that has a sea-island structure and prevents contact between the layers of the woven fabric reinforcing material, and has a coefficient of thermal expansion in the in-plane direction of the laminate of 3.0 to 1.
The laminated plate is characterized by having 0 ppm / K and a glass transition temperature of 150 to 300 ° C.

In the present invention, the semiconductor element means Si, G
IC, LSI such as memory, logic, custom, power transistor, etc. on a wafer made of semiconductor such as aAs
Is an element having terminals for forming and connecting to leads, bumps, and the like. The element includes a packaged state such as a state in which it is covered with a bare, resin, ceramics, etc., sealed, or a state in which tape automatic bonding (TAB) is performed. In the present invention, the laminated plate is a structure obtained by laminating at least one sheet of prepreg, a sheet or the like obtained by impregnating a woven fabric reinforcing material with a resin component and pressure-bonding the same. Glass (E
Glass, S glass, D glass, Q glass, etc.), cloth made of inorganic fiber such as titanium, sheet, polyamide, polyamide imide, polyimide, liquid crystalline polymer, cloth made of organic fiber such as aramid, sheet, carbon fiber Or a sheet or the like made of the inorganic fiber, the organic fiber, or the carbon fiber. Further, depending on the purpose of electromagnetic wave shielding, radiation resistance, improvement of mechanical strength, conductivity imparting, etc., at least one kind of sheet or cloth made of metal fiber, or metal fiber and inorganic fiber, organic fiber, carbon fiber. It is also possible to use a composite cloth and sheet with.

In the present invention, a multilayer printed circuit board is a circuit board having wiring for mounting the semiconductor element and the like, and two or more wiring layers are formed and the wiring layers are connected through through holes or the like. ing. The wiring layers include copper, silver, gold, aluminum, chromium, molybdenum,
A metal foil such as tungsten, a circuit formed by plating or vapor deposition is used. Particularly, copper is preferable, and copper foil is preferable.

In the present invention, the proportion of the resin varnish impregnated with the woven fabric reinforcing material is 10 to 70% by weight of the woven fabric reinforcing material, and the varnish is 3 in terms of solid content with respect to the total amount of both.
It is about 0 to 90% by weight. If the amount of varnish is small, it is difficult to obtain a good prepreg or film, and if the amount of varnish is too large, it becomes difficult to set the coefficient of thermal expansion in the in-plane direction within the range of 3.0 to 10 ppm / K. Also, the reinforcing effect is reduced.

The laminated board of the present invention is suitable for wiring, for example, as a flexible wiring board and as an insulating film between circuits. For example, the flexible wiring board is used for wiring as follows.

First, a glass cloth is impregnated with a varnish obtained by dissolving a resin composition in an organic solvent. Next, the solvent is evaporated in a dryer and the curing reaction is slightly advanced to form a prepreg as a B-stage (semi-cured state, which melts when heat is applied). Next, metal foil such as copper foil and aluminum foil is laminated on both sides of the prepreg to form a sandwich, or the metal foil is laminated only on one side of the prepreg, and the metal foil is bonded by thermocompression bonding, and at the same time, the impregnating resin is cured. . Next, the resist ink is applied to the copper foil surface in a circuit shape, and the resist ink is dried. Next, the copper foil in the portion other than the circuit is etched with a ferric chloride aqueous solution or the like. Then, the resist ink is removed and washed using an organic solvent such as methylene chloride. Finally, it is placed in a solder bath, and solder is attached to the necessary parts to complete the circuit.

In order to be used for such an application, the flexible substrate of the present invention is generally commercially available in a semi-cured state (prepreg) or in a cured state after thermocompression bonding of a metal foil. The flexible substrate of the present invention includes such a semi-cured state and a cured state.

In the multilayer printed circuit board of the present invention, a varnish in which a resin component is dissolved is applied onto a printed wiring board on which a circuit is formed, and then the solvent is evaporated in a dryer, and the curing is slightly advanced, and B -Stage and then copper foil,
It is also possible to stack a metal foil such as an aluminum foil, apply heat and pressure to cure and bond, and subsequently form a circuit by the method described above to obtain a multilayer printed circuit board.

In the present invention, the woven fabric reinforcing material is impregnated with a resin by using a horizontal type and / or vertical type impregnating coating machine using a resin solution (varnish) which is usually used.
It can be manufactured by performing the treatment once or a plurality of times.
It is also possible to impregnate the woven fabric reinforcing material by coating the resin on one side or both sides. Also,
It is also possible to impregnate a woven cloth reinforcing material with a solid resin sheet in advance and then heat or / and heat the impregnation treatment. If the prepreg or the impregnated sheet after drying has tackiness, a release sheet can be optionally used in an appropriate step. As the release sheet, cellulosic paper or film coated with a release agent, polypropylene film, polyvinyl alcohol film, or the like can be used.

In the present invention, the resin portion having a sea-island structure includes two or more types of resins and compounds having poor compatibility,
It is a phase-separated resin or resin composition such as a polymer obtained by copolymerizing a resin and a resin or a component having poor compatibility. In the resin composition, it is desirable that one component has a lower elastic modulus than the other component.

As the resin composition, one in which at least one of the components used in combination is incompatible and has a sea-island structure is selected and used. For example, epoxy resin, unsaturated polyester resin, epoxy isocyanate resin, maleimide resin, maleimide-epoxy resin, cyanate ester resin, cyanate ester-epoxy resin, cyanate ester-maleimide resin, phenol resin, diallyl phthalate resin, urethane resin , Cyanamide resin, maleimide-cyanamide resin, and various other thermosetting resins.

The compounds and resins which are incompatible with the resin and can form a sea-island structure include, for example, silicon compounds, fluorine compounds and polymers thereof.
Typical examples of the silicon-containing compound include organosiloxanes and organopolysiloxanes having a functional group such as an amino group, a carboxyl group, an epoxy group, a hydroxyl group, a pyrimidine group, and a carboxylic acid at a terminal or a side chain. Typical examples of the fluorine-containing compound include perfluoroether having a functional group such as an amino group, a carboxyl group, an epoxy group, a hydroxyl group, a pyrimidine group, an isocyanate group, and a carboxylic acid at a terminal or a side chain, PTFE, PFA, FEP, PCTF.
E, ETFE, ECTFE, PVDF, PVF and the like can be mentioned. The molecular weight of the above polymer is preferably 10 ³ to 10 ⁶ . The polymer is effective for lowering the elastic modulus.

In the present invention, the above resin composition having excellent heat resistance is particularly preferable in order to attain a glass transition temperature of 150 to 300 ° C. for the laminated plate, the insulating layer of the multilayer printed circuit board and the prepreg. Further, in the present invention, the incompatible form may be either a non-reactive type or a reactive type, but the reactive type is preferable from the viewpoint of imparting heat resistance.
For example, when it is composed of an epoxy compound and a silicon-containing compound, it may be used by previously reacting a silicon-containing compound having a group having reactivity with an epoxy group or a hydroxyl group in a solution when a varnish is prepared. it can. At this time, a curing agent, an inorganic filler, and a coupling agent can be added.

In the present invention, the glass transition temperature of the insulating layer is preferably 150 to 300 ° C. Glass transition temperature is 15
If the temperature is 0 ° C. or less, it becomes difficult to sufficiently support the reliability test (for example, high temperature storage, thermal shock test) of products such as laminated boards and multilayer printed circuit boards. If the temperature is 300 ° C. or higher, it is difficult to impart flexibility to the product, which causes problems such as cracking and molding.

In the present invention, the coefficient of thermal expansion in the in-plane direction is the coefficient of thermal expansion within the bonding surface of the laminate. There are three types of coefficient of thermal expansion within the bonding surface. When manufacturing a prepreg, the direction in which tension is applied to the woven fabric reinforcing material during the coating process is the X direction, the direction orthogonal to this is the Y direction, and the oblique direction is the bias direction. Generally, the coefficient of thermal expansion is Y direction> bias direction> X
In order of direction. The bias direction at an angle of 45 degrees is least affected by the woven fabric reinforcing material and the laminating and bonding process. In the present invention, the coefficient of thermal expansion in the bias direction is defined as the coefficient of thermal expansion in the in-plane direction.

In the present invention, the coefficient of thermal expansion in the in-plane direction is preferably in the range of 3.0 to 10 ppm / K. The coefficient of thermal expansion of a semiconductor element (for example, silicon) is 3.0 to 4.0 ppm / K. Further, the coefficient of thermal expansion of the sealing resin in the resin-sealed semiconductor device is also slightly larger than that of silicon. In order to improve the connection reliability between the semiconductor element and the laminated board (or the multilayer printed circuit board), it is effective to reduce the thermal stress generated between the two, and for that purpose, the laminated board (or the multilayer printed circuit board) In-plane thermal expansion coefficient is 3.0
By setting the range to 10 ppm / K, it is possible to reduce the difference between the thermal expansion coefficients of the laminated plate and the semiconductor element. In addition, the multilayer printed circuit board of the present invention has a low coefficient of thermal expansion without using ceramics as a constituent component. (1) Excellent drill workability.

(2) Since the adhesiveness to the plating is excellent, the connection reliability of the through hole is excellent.

(3) Weight reduction is possible.

(4) Since a low coefficient of thermal expansion and a low coefficient of elasticity can be achieved at the same time, many parts having different coefficients of thermal expansion can be mounted on the same plane. The difference in thermal expansion coefficient can be covered with a low elastic modulus.

(5) Large area substrates can also be manufactured by the same technique as in the past.

The following effects can be obtained.

The present invention comprises a resin and a woven fabric reinforcement,
The resin part has a sea-island structure, the coefficient of thermal expansion in the in-plane direction is 3.0 to 10 ppm / K, and the glass transition temperature is 150 to 300.
By surface-mounting various parts such as semiconductor elements using a circuit board characterized by a temperature of ℃, the circuit board is drilled as compared with a conventional ceramic-containing board which is a low thermal expansion board for surface mounting. Since the adhesiveness with plating is stronger than that of ceramics, an excellent effect can be obtained in terms of reliability of through holes. Generally, a ceramic-based circuit board has a low adhesiveness with a resin, so that there is a problem in reliability of its interface.

Since the circuit board obtained by the present invention does not have such a different phase interface, it is possible to provide a highly reliable memory card. In addition, since the sea-island structure does not contain ceramics and the elastic modulus is lower than that of the unmodified structure, even if various parts with different thermal expansion coefficients are mounted at the same time, the generated thermal stress is small and the connection reliability is excellent. It is possible to provide a multi-function memory card.

The coefficient of thermal expansion of the thin and highly integrated semiconductor device package is about 6 ppm / K, which is almost the same as that of silicon. Therefore, it is composed of resin and woven fabric reinforcement, and the resin part has a sea-island structure and the coefficient of thermal expansion in the in-plane direction is 3.0-1.
By using a circuit board characterized by 0 ppm / K and a glass transition temperature of 150 to 300 ° C., it is possible to surface-mount this highly integrated semiconductor element with a low coefficient of thermal expansion while maintaining connection reliability. become. As a result, the signal transmission distance can be shortened and the signal transmission delay time can be reduced to 1
It is possible to obtain a computer having an excellent calculation processing speed of up to 15 ns / m. In addition, the high-density mounting enables downsizing and weighting, and it is possible to provide a computer with excellent portability.

Further, the present invention comprises a resin and a woven fabric reinforcing material, the resin portion of which has a sea-island structure, a coefficient of thermal expansion in the in-plane direction of 3.0 to 10 ppm / K, and a glass transition temperature of 150 to 3.
By using a circuit board characterized by a temperature of 00 ° C to surface-mount components such as semiconductor elements with high density, 10 g can be obtained.
The size and weight can be reduced to about 30 kg, and a communication device having excellent portability can be obtained. Typical communication devices include mobile phones and mobile wireless devices. In addition, the sea-island substrate is lower in weight and more effective in reducing the weight than the ceramic-containing substrate. In addition, the sea-island substrate has a significantly lower elastic modulus than the ceramic-containing substrate or unmodified substrate, so even if various components with different thermal expansion coefficients are mounted at the same time, the generated thermal stress is small and communication with excellent connection reliability is achieved. Equipment can be provided. Therefore, a wide variety of communication devices can be obtained according to the purpose.

Further, the present invention comprises a resin and a woven fabric reinforcing material, and the resin portion has a sea-island structure, a coefficient of thermal expansion in the in-plane direction of 3.0 to 10 ppm / K, and a glass transition temperature of 150 to 3.
By mounting parts such as semiconductor elements at high density on a circuit board characterized by a temperature of 00 ° C., a car electronics device constituted by the parts can occupy a small volume and can be used in an engine room. It is possible to provide a device having excellent environment resistance in high temperature and high humidity such as inside. Typical examples of such car electronics equipment include an engine control device and a navigation device. These are required to be installed in limited places where the environment is severe. Therefore, equipment using a circuit board composed of sea-island structure resin can be miniaturized by high-density mounting, and since it does not contain a ceramic material, it has few heterogeneous interfaces and excellent connection reliability. Therefore, it is suitable for the car electronics field.

[0042]

According to the present invention, in the laminated plate composed of the resin and the reinforcing material, the resin component has a sea-island structure, that is, a phase-separated structure. In the case of a phase-separated resin having an island structure with a low elastic modulus as a mechanism of manifestation thereof, the elastic modulus of the resin of the matrix layer becomes small due to the workability with the island portion. Regarding the coefficient of thermal expansion in the in-plane direction, it is considered that the thermal expansion of the matrix crushes the island portion, and as a result, the thermal expansion of the entire resin is apparently reduced. Other phase-separated structures can reduce both of these properties simultaneously by various expression mechanisms.

All of its expression mechanisms have not yet been fully elucidated.

[0044]

EXAMPLES The present invention will now be described in detail based on examples.

(Example 1) Phenol novolac resin (Mitsui Toatsu, XL2) as a curing agent was added to 100 parts by weight of an epoxy compound (Dainippon Ink and Chemicals, EXA-1514).
25-3 L) and 10 parts by weight of amine-modified dimethylsiloxane (Chisso, PS513) as a low elastic modulus component were added to methyl ethyl ketone to prepare a varnish having a solid content of 50% by weight. Using this varnish, E glass cloth (100 μm thick) was impregnated and further coated at 120 ° C. 1
After drying for 0 minutes, the solvent was removed to obtain a prepreg. The resin content of the obtained prepreg was 70% by weight.

Copper foil (18 μm) was formed on both sides of the obtained prepreg.
(thickness m) were stacked and heated and pressed by a press to obtain a laminated plate. The pressing conditions were 130 ° C. for 30 minutes and 180 ° C. for 60 minutes in a two-step reaction. The pressure was 20 kg / cm ² . The copper foil peel strength of the obtained laminate and the coefficient of thermal expansion in the in-plane direction after etching the copper foil were determined by the TMA method. Also, for measuring the elastic modulus of the resin part, take the resin powder from the prepreg,
A resin plate was produced under the same pressing conditions as for the laminated plate. The elastic modulus at room temperature of this sample was determined by viscoelasticity measurement.

Example 2 55 parts by weight of phenol novolac (Hitachi Chemical Co., Ltd., H100) as a curing agent and 100 parts by weight of an epoxy compound (oiled shell, YX4000H) and an epoxy-modified polydimethylsiloxane as a low elastic modulus component. 15 parts by weight of (Toray Silicone, SF8413) was used as the resin component. At this time, as a preliminary reaction, a curing agent and an epoxy-modified polydimethylsiloxane were preliminarily reacted in methyl isobutyl ketone at 90 ° C. for 30 minutes, and after cooling to room temperature, an epoxy compound was added to form a varnish having a solid content of 50% by weight. The obtained varnish was mixed with S glass cloth (70 μm
(Thickness) and impregnated and dried at 140 ° C. for 10 minutes to remove the solvent to obtain a prepreg.

A laminate and a resin plate were produced from the obtained prepreg by the same method as in Example 1 and the characteristics were evaluated.

Example 3 Maleimide compound (Mitsui Toatsu, bis (4-maleimidophenyl) methane) 100
Parts by weight and amine compound (Wakayama Seika, 2,2-bis (4
-(4-aminophenoxy) phenyl) propane)) 3
8 parts by weight and 5 parts by weight of amine-modified polydimethylsiloxane (Toray Silicone, SF8418) were used as resin components.
As a preliminary reaction, 50 parts by weight of a maleimide compound and an amine-modified polydimethylsiloxane are reacted in dimethylformamide for 20 minutes at 110 ° C. Further, 50 parts by weight of the remaining maleimide compound and an amine compound are added and reacted for 20 minutes to obtain a solid content of 40% by weight. Got a varnish. Further, 20 parts by weight of fused silica filler (average particle size: 10 μm) was dispersed and mixed therein. The obtained varnish is D glass cloth (80 μm thick)
Was impregnated and coated, and the solvent was removed by drying at 140 ° C. for 5 minutes and 145 ° C. for 5 minutes to obtain a prepreg.

A laminate was prepared from the obtained prepreg in the same manner as in Example 1 and its characteristics were evaluated. Molding condition is 13
The temperature was 0 ° C. for 30 minutes and 200 ° C. for 60 minutes.

(Example 4) Orthocresol novolak (Nippon Kayaku, OCN70) was used as a curing agent for 100 parts by weight of an epoxy compound (oiled shell, YX4000H).
00) in an amount of 72 parts by weight and a low-modulus component as a carboxylic acid-modified perfluoroether at both ends (Montepheros, ZD
IAC-2000) 10 parts by weight was used as a resin component. At this time, imidazole (Shikoku Kasei, 2E4M as a curing accelerator)
Z) 1 part by weight was added. Acetone was used as a solvent to prepare a varnish having a solid content of 60% by weight. The obtained varnish is impregnated and coated on polyaramid cloth (70 μm thick),
The solvent was removed by drying at 110 ° C. for 10 minutes and 120 ° C. for 15 minutes to obtain a prepreg.

A laminate was prepared from the obtained prepreg in the same manner as in Example 1 and the characteristics were evaluated. Molding condition is 13
The temperature was 0 ° C. for 30 minutes and 200 ° C. for 60 minutes.

(Comparative Example 1) Using the epoxy compound and the phenol-based curing agent of Example 1, except for polydimethylsiloxane, a laminated plate and a resin plate having a uniform resin portion having no sea-island structure were prepared, and the characteristics were obtained. Was evaluated.

(Comparative Example 2) Using the maleimide compound, amine compound and fused silica filler of Example 3, a laminated plate and a resin plate having a uniform resin portion with no sea-island structure were prepared except for polydimethylsiloxane. , The characteristics were evaluated.

Further, a copper-clad laminate having a combination of copper foils and a printed wiring board on which a predetermined circuit has been formed are provided with 10 layers each.
Zero device packages were surface-mounted by soldering. For soldering, a far infrared heater was used for connection by heating reflow. This mounted product was tested for 100 cycles according to the MIL standard, and the number of defects in the solder connection portion after completion was measured.

[0056]

[Table 1]

(Embodiment 5) FIG. 1 shows the structure of the laminated plate of the present invention.

It can be obtained by laminating and adhering two prepregs obtained by impregnating the woven fabric reinforcing material 1 with the resin portion 2 having a sea-island structure and drying. In this structure, since the woven fabric reinforcing material is present in all in-plane directions, the effect of reducing the coefficient of thermal expansion due to the sea-island structure in in-plane directions can be maximized.

Since the sea-island structure organic resin matrix continuously exists between the reinforcing materials, there is no problem of adhesion at the interface between different phases in the composite material.

Comparative Example 3 FIG. 2 shows the structure of a conventional laminated plate.

In this structure, the coefficient of thermal expansion in the in-plane direction is reduced, but since the sea-island structure resin matrix is not a continuous body, problems such as adhesion at the interface are likely to occur.

Comparative Example 4 FIG. 3 shows the structure of a conventional laminated plate.

In this structure, the woven fabric reinforcing material exists as an independent body,
Shows isotropic properties for the entire laminate. Therefore, the effect of lowering the coefficient of thermal expansion due to the interaction with the sea-island structure cannot be fully utilized in the in-plane direction.

Examples 6 to 8 Phenolic novolac resin (Mitsui Toatsu, X) as a curing agent for 100 parts by weight of an epoxy compound (Dainippon Ink and Chemicals, EXA-1514).
L225-3L) in an amount of 88 parts by weight and 10,20,50 parts by weight of an amino group-terminated perfluoroether compound (manufactured by Mitsui Fluorochemical Co., Ltd.) as a low elastic modulus component in methyl ethyl ketone to obtain a varnish having a solid content of 50% by weight. It was made. Using this varnish, E glass cloth (100 μm
(Thickness) and impregnated and further dried at 120 ° C. for 10 minutes to remove the solvent to obtain a prepreg. The resin content of the obtained prepreg was 70% by weight.

Copper foil (18 μm) was formed on both sides of the obtained prepreg.
(thickness m) were stacked and heated and pressed by a press to obtain a laminated plate. The pressing conditions were 130 ° C. for 30 minutes and 180 ° C. for 60 minutes in a two-step reaction. The pressure was 20 kg / cm ² . The copper foil peel strength of the obtained laminate and the coefficient of thermal expansion in the in-plane direction after etching the copper foil were determined by the TMA method. Also, for measuring the elastic modulus of the resin part, take the resin powder from the prepreg,
A resin plate was produced under the same pressing conditions as for the laminated plate. The elastic modulus at room temperature of this sample was determined by viscoelasticity measurement.

(Example 9) 55 parts by weight of phenol novolac (Hitachi Chemical Co., Ltd., H100) as a curing agent and 100 parts by weight of an epoxy compound (oiled shell, YX4000H), and a carboxyl group-terminated perfluoroether as a low elastic modulus component. Compounds (Mitsui Fluorochemicals)
15 parts by weight was used as the resin component. At this time, as a preliminary reaction,
A curing agent and an epoxy-modified polydimethylsiloxane are reacted in advance in methyl isobutyl ketone at 90 ° C. for 30 minutes, and after cooling to room temperature, an epoxy compound is added to obtain a solid content of 50% by weight.
Varnish. The obtained varnish was mixed with S glass cloth (7
The prepreg was obtained by impregnating and coating with a thickness of 0 μm) and drying at 140 ° C. for 10 minutes to remove the solvent.

A laminate and a resin plate were produced from the obtained prepreg by the same method as in Example 1 and the characteristics were evaluated.

[0068]

[Table 2]

[0069]

EFFECTS OF THE INVENTION By reducing the in-plane thermal expansion coefficient and elastic modulus of laminated boards, multilayer printed circuit boards, and prepregs, the thermal stress on the mounting surface can be significantly reduced, and the connection reliability with the mounted products can be greatly improved. Can be improved.

[Brief description of drawings]

FIG. 1 schematically shows a cross section of a laminated plate of the present invention.

FIG. 2 schematically shows a cross section of a conventional laminated plate.

FIG. 3 schematically shows a cross section of a conventional laminated plate.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Woven fabric reinforcing material, 2 ... Resin part having a sea-island structure, 3 ...
Dispersed (island) phase.

Claims (15)

[Claims] 1. A laminated board on which a semiconductor element can be mounted,
The laminated plate has an insulating layer composed of a resin portion having a sea-island structure and a woven fabric reinforcing material, the insulating layer has a coefficient of thermal expansion in the in-plane direction of 3.0 to 10 ppm / K, and the glass transition of the insulating layer. A laminate having a temperature of 150 to 300 ° C. 2. A multilayer printed circuit board on which a semiconductor element can be mounted, wherein the multilayer printed circuit board has at least two insulating layers composed of a resin portion having a sea-island structure and a woven fabric reinforcing material. Coefficient of thermal expansion in the in-plane direction is 3.0
-10ppm / K, glass transition temperature of insulating layer is 150-3
A multi-layer printed circuit board, which has a temperature of 00 ° C. 3. A laminated board on which a semiconductor element can be mounted,
The laminated plate has an insulating layer composed of a resin portion having a sea-island structure, an inorganic filler, and a woven fabric reinforcing material, and the thermal expansion coefficient of the insulating layer in the in-plane direction is 3.0 to 10 ppm / K, insulation A laminate having a glass transition temperature of 150 to 300 ° C. 4. A multilayer printed circuit board on which a semiconductor element can be mounted, wherein the multilayer printed circuit board has at least two insulating layers composed of a resin portion having a sea-island structure, an inorganic filler and a woven fabric reinforcing material. A multilayer printed circuit board, wherein the in-plane thermal expansion coefficient of the insulating layer is 3.0 to 10 ppm / K, and the glass transition temperature of the insulating layer is 150 to 300 ° C. 5. The laminate and multilayer print according to claim 1, wherein the resin portion having a sea-island structure contains an epoxy compound and at least one of a siloxane-containing compound and a fluorine-containing compound. Circuit board. 6. A prepreg obtained by impregnating a woven fabric reinforcing material with a resin component, wherein the resin component includes a resin portion having a sea-island structure, and the prepreg after curing has a coefficient of thermal expansion in the in-plane direction of 3.0 to 3.0. 10 ppm / K, glass transition temperature 150-30
A prepreg characterized by being 0 ° C. 7. A prepreg obtained by impregnating a woven fabric reinforcing material with a resin component, wherein the resin component contains a resin portion having a sea-island structure and an inorganic filler having an average particle size of 0.1 to 15 μm, and is a cured prepreg. Coefficient of thermal expansion in the in-plane direction is 3.0
A prepreg characterized by having a glass transition temperature of 150 to 300 ° C. at 10 ppm / K. 8. A memory card in which a memory element is surface-mounted on a circuit board, wherein the circuit board has an insulating layer composed of a resin portion having a sea-island structure and a woven fabric reinforcing material. Coefficient of thermal expansion in the in-plane direction is 3.0-10ppm /
K, a glass transition temperature of the insulating layer is 150 ~ 300 ℃, a memory card. 9. A computer including a multilayer printed circuit board on which a semiconductor device can be mounted, wherein the multilayer printed circuit board has an insulating layer composed of a resin portion having a sea-island structure and a woven fabric reinforcing material. Coefficient of thermal expansion in the in-plane direction of 3.0
10 ppm / K, glass transition temperature of insulating layer is 150 to 30
A computer having a signal transmission delay time of 1 to 15 ns / m at 0 ° C. 10. A communication device including a circuit board on which a semiconductor element can be mounted, wherein the circuit board has an insulating layer composed of a resin portion having a sea-island structure and a woven fabric reinforcing material, and an in-plane surface of the insulating layer. Coefficient of thermal expansion in the direction of 3.0 to 10 ppm / K, the glass transition temperature of the insulating layer is 150 to 300 ° C, and the weight is 10 g to 3
Communication equipment characterized by being 0 kg. 11. An electronic device including a circuit board on which a semiconductor element can be mounted, wherein the circuit board has an insulating layer composed of a resin portion having a sea-island structure and a woven fabric reinforcing material, and an in-plane surface of the insulating layer. Coefficient of thermal expansion in the direction of 3.0-10ppm /
K, the glass transition temperature of the insulating layer is 150 to 300 ° C., and the occupied volume of the electronic device is 1 to 50%. 12. The electronic device according to claim 11, wherein the electronic device is an automotive electronic device. 13. The electronic device according to claim 11, wherein the electronic device is an audio device. 14. A laminated plate obtained by laminating and adhering at least one prepreg or sheet made of a resin and a woven fabric reinforcing material, wherein the woven fabric reinforcing material is constructed so that the physical properties of the material exhibit anisotropy. The laminated board, wherein the resin is a continuum layer having a sea-island structure and preventing contact between layers of the woven fabric reinforcing material. 15. A laminated board obtained by laminating and bonding at least one or more prepregs or sheets made of a resin and a woven fabric reinforcing material, wherein the woven fabric reinforcing material is constructed so that the physical properties of the material exhibit anisotropy. , The resin is a continuum layer having a sea-island structure and preventing contact between layers of the woven fabric reinforcement,
A laminate having a coefficient of thermal expansion in the in-plane direction of 3.0 to 10 ppm / K and a glass transition temperature of 150 to 300 ° C.