JP2645969B2 - Adhesive tape for semiconductor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention has attracted attention in the process of assembling semiconductor devices for increasing the number of pins, miniaturizing the device, and mounting at a high density (TAB) (Tape Out).
used omated Bo nding) method, a protective film, an adhesive, a three-layer structure of the insulating film T
The present invention relates to an AB tape, a lead frame fixing tape, and a semiconductor adhesive tape formed of a sheet or the like for connecting a lead frame and a TAB tape by wire bonding.

[0002]

2. Description of the Related Art Conventionally, TAB tapes are formed by processing as follows. 1) Drill a sprocket / device hole by stamping. 2) After the copper foil is thermocompression-bonded to the perforated tape, the adhesive is cured by heating. 3) A photoresist is applied, irradiated with ultraviolet rays or the like through a mask, and then developed. 4) Backing the device hole, etching copper, removing the resist, and removing the backing to form a circuit and apply a solder resist. 5) Tin and gold plating. After the chip is subjected to inner lead bonding to the tape manufactured through the above steps, the lead is cut, outer lead bonded to a printed board or the like, and sealed with resin. Or, after inner lead bonding,
Seal with resin, cut including peripheral circuits, and perform outer lead bonding.

[0003]

SUMMARY OF THE INVENTION Conventionally used T
The adhesive of the AB tape has the following problems with respect to the properties at high temperatures. 1) A decrease in adhesive strength to an organic insulating film at a high temperature during inner lead and outer lead bonding. 2) Misalignment of the inner lead end pattern under high temperature and high pressure during inner lead bonding. 3) Submersion of the outer leads into the adhesive layer under high temperature and pressure during outer lead bonding. 4) A decrease in adhesive force due to adhesive deterioration caused by prolonged high-temperature curing during curing of the molding resin toward molding of a TAB tape. 5) Poor wire bonding due to softening of the adhesive at high temperatures during wire bonding of TAB tape.

[0004] From the above problems, in the current TAB tape manufacturing process, a bonding failure occurs and causes a reduction in yield. Also, in a mounting method such as wire bonding using a TAB tape, the current T
AB tape is difficult to mount and has not been put to practical use. An object of the present invention is to solve the above-mentioned problems in a conventional TAB tape. That is, an object of the present invention is to provide a TAB tape having excellent bonding characteristics by preventing softening and deterioration of an adhesive at a high temperature, and a transfer molding mounting of a TAB tape which is difficult to be realized by a conventional adhesive. An object of the present invention is to provide a TAB tape that enables wire bonding mounting with a TAB.

[0005]

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and its outline is as follows.
It is as described. Claim 1: An adhesive layer and a protective layer on an insulating film.
Of adhesive tapes for semiconductors with a protective layer
Both contain a maleimide resin in the adhesive, and
4 × 10 ⁸ dyne /
cm ² or more.
H. Invention of claim 2: an adhesive layer and a protective layer on the insulating film.
Of adhesive tapes for semiconductors with a protective layer
Includes maleimide resin and polyamide resin in adhesive
And the cured Young's modulus is 4 × at 20 ° C. to 300 ° C.
A half of at least 10 ⁸ dyne / cm ²
Adhesive tape for conductors. Claim 3: The layer thickness of the adhesive layer is 3 to 50 μm.
The adhesive tape for a semiconductor according to claim 1 or 2, wherein

[0006] Figure 1 is a schematic sectional view of a TAB tape according to an embodiment of the present invention, on one surface of the insulating full I Lum 1, the protective film 3 serving as the adhesive layer 2 and the protective layer successively It is laminated. Although FIG. 1 shows the adhesive layer 2 having a one-layer structure, the adhesive layer 2 may have two or more layers. The thickness of the insulating film is 25
Insulation of a heat-resistant plastic film of polyimide, polyetherimide, polyphenylene sulfide, polyetheretherketone or the like, or a composite heat-resistant film of epoxy resin-glass cloth, epoxy resin-polyimide-glass cloth, having a thickness of about 188 μm, preferably 50 to 125 μm. Film can be used.

The adhesive layer constituting the present invention is of a thermosetting type and needs to be semi-cured, and contains at least one maleimide resin as a thermosetting component.
It is necessary that the adhesive layer after curing has a Young's modulus of 4 × 10 ⁸ dyne / cm ² or more at 20 ° C. to 300 ° C. Curing in this case means that multistage heating is sequentially performed at, for example, 60 ° C. for 6 hours, 80 ° C. for 8 hours, and 160 ° C. for 5 hours. The measurement of the Young's modulus referred to in the present invention is performed by using a rheovibron as a measuring device.
DDV-II using (Oriental manufactured emissions Tech), the vibration frequency 110Hz as the measurement conditions, heating rate 3 ° C. / mi
n and is defined as a dynamic elastic modulus (E ') based on a predetermined calculation method.

[0008] Since this adhesive layer is in direct contact with the insulating film, it exhibits high adhesiveness even at high temperatures, and has high adhesiveness to copper foil and chemicals exposed during TAB tape processing. It is required to have excellent chemical resistance. In order to satisfy such requirements, in the present invention, the adhesive layer contains an elastomer component for ensuring flexibility and a curing component for thermosetting.

In the present invention, at least one of thermoplastic resins such as polyamide resin, polyester resin, NBR, SBR and polyvinyl acetal resin is used in combination as a component for giving flexibility to the above-mentioned cured adhesive layer. Is preferred. Further, a thermoplastic resin alone can be used as the adhesive layer. Polyamide resin not only gives the adhesive layer flexibility before and after curing,
Since it also acts as a curing agent for the epoxy resin, it is particularly preferable that the adhesive layer contains a polyamide resin.
Various known polyamide resins can be used. Among them, the amine value is 3.0 or more (preferably 5 to 5).
The polyamide resin (0) is particularly preferred because it effectively acts as a curing agent for the epoxy resin and exhibits the effects of improving the adhesive strength, chemical resistance, and heat resistance of the cured adhesive. Examples of the polyamide resin that can be used in the present invention include aliphatic polyamides and aromatic polyamides, and have a molecular weight in the range of 1,000 to 150,000 and a softening temperature of 5 to 5.
Those having a range of 0 to 180 ° C are used.

[0010] The curing component of the adhesive layer in the present invention is
Has a functional group in the structure, reacts with the same component and other components
Initiating and curing ingredients can be used. For example, d
Poxy compounds, phenol compounds, maleimide compounds, etc.
Can be given. Yarn after curing of the adhesive layer of the present invention
4 × 10⁸dyne / cm²To do more
Is to mix a large amount of the curing component, or
Has high heat resistance like amide compounds and phenol compounds
This can be achieved by means of formulating the composition.
Epoxy compounds have two or more epoxy groups in one molecule.
It is necessary to contain, other than epoxy group, hydroxyl group,
It may contain an alkoxy group or a vinyl group.

Specifically, allyl glycidyl ether, butyl glycidyl ether, glycidyl methacrylate,
3,4-epoxy-6-methylcyclohexylmethyl-
3,4-epoxy-6-methylcyclohexanecarboxylate, vinylcyclohexene carboxylate, vinylcyclohexene dioxide, dipentenedionoxide, dicyclopentadiene dioxide, bis (3
4-epoxy-6-methylcyclohexylmethyl) adipate, diglycidyl tetrahydrophthalate,
Examples include phenol novolak epoxy resins, triglycidyl isocyanurates , bisphenol A type epoxy resins such as bisphenol A diglycidyl ether obtained from bisphenol A and epichlorohydrin, epoxidized cresol novolak resins, and epoxy compounds obtained by partially modifying the above epoxy compounds with fatty acids. Is done. Epoxy compounds of still other structures, for example, silicone,
Various elastomer-modified epoxy resins such as NBR, SBR, BR and dimer acid can be used in combination.

In the present invention, the phenolic resin which can be used in combination with the above polyamide resin includes a bisphenol A type wherein the phenol component is selected from bisphenol A and an alkylphenol, an alkylphenol type, or a co-condensation type resol type phenol thereof. Resins and novolak-type phenol resins, and one or more of them can be used in combination. As alkylphenol-type resole-type phenolic resins,
A methyl group at the o- or p-position of the phenolic hydroxyl group,
Those having an ethyl group, a propyl group, a t-butyl group, a nonyl group and the like can be mentioned. These resole-type phenolic resins react by heating to become an insoluble and infusible solid having adhesive strength, adhesive strength of adhesive, insulation reliability, chemical resistance,
It is preferable because it has an effect of improving heat resistance. The phenol resin is 5 to 100 parts by weight of the polyamide resin.
It is blended in a blending amount of 100 parts by weight.

The maleimide component has at least one maleimide group as a functional group in the basic skeleton, and generally includes bismaleimides represented by the following general formula.

[0014]

Embedded image

As specific examples, N, N'-m-phenylenebismaleimide, N, N'-p-phenylenebismaleimide, N, N'-m-toluylenebismaleimide , N , N
N'-4,4 '- biphenylene bismaleimide, N,
N'-4,4 '-[3,3'-dimethylbiphenylene]
Bismaleimide, N, N'-4,4 '- [3,3' - dimethyl-diphenylmethane] bismaleimide, N, N'
4,4 '- [3,3' - diethyl diphenylmethane] bismaleimide, N, N'-4,4'- diphenylmethane bismaleimide, N, N'-4,4'- diphenylpropane bismaleimide, N, N '-4,4'-diphenyletherbismaleimide, N, N'-3,3'-diphenylsulfonebismaleimide, N, N'-4,4'-
It can be mentioned diphenyl Le sulfone bismaleimide.

Other examples of the maleimide compound include a maleimide resin which has been polymerized. For example, a novolak-type maleimide resin represented by the following general formula can be used.

[0017]

Embedded image

In addition, a maleimide having a siloxane, aliphatic or other structure as a basic skeleton can be used.
In the present invention, one or more of the above maleimide resins can be used. The maleimide resin can be used in combination with the epoxy resin and the phenol resin. Maleimide resin is added to 100 parts by weight of polyamide resin.
It is preferable to mix in the range of 0 to 500 parts by weight. In this case, if the amount of the maleimide resin is less than 10 parts by weight, it is impossible to obtain the Young's modulus specified in the present invention, and if it exceeds 500 parts by weight, a problem is likely to occur in film formability such as repelling of a coated surface.

In the present invention, it is desirable that the adhesive layer contains an imidazole compound for the purpose of accelerating curing. Examples of the imidazole compound include compounds soluble in general-purpose solvents represented by methyl ethyl ketone such as 2-methylimidazole and 2-ethyl-4-methylimidazole, and general-purpose compounds such as 2-phenyl-4-benzyl-5-hydroxyimidazole. Examples thereof include those hardly soluble in a solvent.
The imidazole compound is usually used in the epoxy resin 10 in the system.
It can be used in the range of 0.03 to 10 parts by weight with respect to 0 parts by weight. If the amount is less than 0.03 parts by weight, the curing is insufficient, and if it exceeds 10 parts by weight, the amount is too large for the purpose of curing. The thickness of the adhesive layer of the present invention is preferably from 3 to
It is more preferably 50 μm to 5 to 30 μm. In this case, if it is less than 3 μm, the required adhesive strength cannot be obtained, while
If the ratio exceeds the above, a problem may occur in the bending property of the adhesive layer.

As the protective layer of the adhesive layer, a protective film is used, and examples thereof include films of polyethylene, polyethylene terephthalate, polypropylene and the like. Next, a method for producing the TAB tape of the present invention will be described. FIG. 2 shows a manufacturing process. (A) An adhesive having a predetermined composition is applied on the protective film 3 so that the film thickness after drying is in the above range. At that time, the heating condition is 150 to 180 in order to obtain a semi-cured state.
It is necessary to dry at 2 ° C. for 2 minutes. Next, (b)
The organic insulating film 1 is overlaid on the surface of the formed adhesive layer 2, and (c) 1 kg / cm ² at 100 to 130 ° C.
Thermocompression bonding is performed under the above conditions. (D) The obtained TAB tape is wound, for example, with a width of 30 to 200 mm and a thickness of 30 to 200 mm.
A length of 300 m is obtained.

[0021]

According to the present invention, by setting the Young's modulus of the adhesive layer at 20 ° C. to 300 ° C. to 4 × 10 ⁸ dyne / cm ² or more, in TAB tape packaging,
A TAB tape having excellent bonding resistance can be provided. In other words, by improving the heat resistance of the adhesive layer compared to conventional ones, by suppressing the softening of the adhesive layer against the high temperature and high pressure applied during bonding, the adhesive strength at high temperatures is maintained, and the lead pattern is maintained. And prevents the lead pattern from sinking into the adhesive, and also enables the mounting of a TAB tape in a mold package and wire bonding. The Young's modulus of the adhesive layer at 20 ° C to 300 ° C is 4 × 10
When the resin is less than ⁸ dyne / cm ² , the above-mentioned effects cannot be obtained.

[0022]

The present invention will be described below with reference to examples. Hereinafter, all “parts” mean “parts by weight”. Example 1 An adhesive layer forming paint having the following composition was applied to a 38 μm-thick polyethylene terephthalate film protective film, and dried at 160 ° C. for 2 minutes to form a 20 μm-thick adhesive layer.

-50 parts of a 25% isopropyl alcohol / water mixed solution of a polyamide resin (Tomide TXC-232-C manufactured by Fuji Kasei Kogyo)-20% dimethylacetamide solution of a maleimide resin (MB-8000 manufactured by Mitsubishi Yuka) 50 Parts ・ 15 parts of 1% 2-ethylimidazole solution in methyl ethyl ketone

Next, an insulating film made of a polyimide film having a thickness of 50 μm is laminated on the adhesive layer, and
A thermocompression bonding was performed at 0 ° C. and 1 kg / cm ² to prepare a TAB tape. Next, the protective film on the surface of this TAB tape was peeled off, and 1 oz of electrolytic copper foil (thickness: 35
４０40 μm) and 8 hours at 60 ° C. for 6 hours.
Heating was sequentially performed at 0 ° C. for 6 hours and at 160 ° C. for 5 hours to cure the adhesive layer. Further, by an ordinary method and processed to form a photoresist film on a copper foil, a copper foil was etched, it was to form a 100μm thin lines and evaluation pattern <br/>. The sample for measuring the Young's modulus was formed by sequentially laminating only a 20 μm adhesive layer at 100 ° C. at a speed of 1 m / sec using a high-temperature laminator.
μm × 8) After lamination, the adhesive was cured by sequentially heating at 60 ° C. for 6 hours, 80 ° C. for 8 hours, and 160 ° C. for 5 hours. Thereafter, the Young's modulus was measured using a sample having a predetermined shape.

Example 2 A TAB tape was prepared in the same manner as in Example 1 except that the paint for forming the adhesive layer had the following composition. Further, a sample for characteristic evaluation was prepared in the same manner as in Example 1.・ 50 parts of a 25% isopropyl alcohol / water mixed solution of a polyamide resin (Tomide TXC-232-C manufactured by Fuji Kasei Kogyo) ・ 30 parts of a 20% dimethylacetamide solution of a bismaleimide resin (BMI-MP manufactured by Mitsui Toatsu Chemicals)・ 5 parts of epoxy resin (Epicoat 828 manufactured by Yuka Shell Co., Ltd.) ・ 5 parts of a 50% methyl ethyl ketone solution of novolak type phenol resin (Tamanol 752 manufactured by Arakawa Chemical) ・ 15 parts of a 1% solution of 2-ethylimidazole in 1% methyl ethyl ketone

Comparative Example 1 A TAB tape for comparison and a tape for property evaluation were prepared in the same manner as in Example 1, except that the paint having the following composition was used as the adhesive forming paint. Polyamide resin (Tomide TXC-232-C by Fuji Kasei Kogyo Co., Ltd.) 25% isoprene port pill alcohol / water mixed solution 100 parts epoxy resin (Epikote made 8 2 8 Yuka Shell Co., Ltd.) 8 parts Novolac type phenol resin 5 parts of a 50% methyl ethyl ketone solution (Tamanol 752 Arakawa Chemical Co., Ltd.) 10 parts of a 1% methyl ethyl ketone solution of 2-ethylimidazole

(Characteristic Evaluation Test) The TAB tapes of Examples 1 and 2 and Comparative Example 1 were subjected to the following characteristic evaluation tests. 1) Young's modulus measurement test About Examples 1 and 2 and Comparative Example 1, 20 ° C. to 300 ° C.
Was measured. In addition, the measurement was performed at a vibration frequency of 110 Hz and a sample heating rate of 3 ° C./min using Leo Vibron DDV-II (manufactured by Orientec). FIG. 3 shows the measurement results.

2) Heat-resistant adhesiveness A film carrier tape having a copper foil pattern having a width of 1 cm is fixed on a hot plate at 300 ° C so that the back surface of the insulating film is in contact with the film carrier tape. 5cm
The adhesive was peeled at a peeling rate of / min, and the adhesive strength (referred to as peeling strength) at that time was measured. Table 1 shows the results.

[0029]

[Table 1]

As is clear from FIG. 3 and Table 1, the TAB tape of the present invention was confirmed to exhibit excellent heat resistance by the above test.

[0031]

The adhesive tape for a semiconductor according to the present invention has a temperature of 20.degree.
The adhesive layer after curing at -300 ° C. has a Young's modulus of 5 ×
Since it has a characteristic of 10 ⁸ dyne / cm ² , TA
During the mounting process of the tape for B, there is no displacement of the lead pattern and no sinking into the adhesive layer under high temperature and high pressure at the time of inner lead and outer lead bonding,
Since the temperature dependence of the properties of the adhesive layer is small, the adhesive strength to the copper foil and the insulating film does not decrease.

Accordingly, the adhesive tape for a semiconductor of the present invention comprises:
It can be applied to a circuit with high density. Furthermore,
When a multi-pin chip is mounted, bonding errors are less likely to occur, and lead deformation is reduced in the transporting process and the bonding process, thereby greatly increasing the yield. Also TAB
The present invention can provide a member having high temperature and high pressure resistance, which is compatible with transfer mold mounting and wire bonding mounting using a tape for mounting.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of a TAB tape of the present invention.

FIG. 2 is a view showing a manufacturing process of the TAB tape of the present invention.

FIG. 3 is a graph showing Young's modulus measurement results of Examples and Comparative Examples.

[Description of Signs] 1 Insulating film 2 Adhesive layer 3 Protective film

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Shoji Aoki Inventor, Electronic Materials Research Laboratories, Hamakawa Paper Mill, 3-1 Yosoba Tomoe, Shizuoka City, Shizuoka Prefecture 3-1 Machi-cho, Electronic Materials Research Laboratories of Hamikawa Paper Mill Co., Ltd. (72) Inventor Tadahiro Oishi 3-1, Yomiba-cho, Shizuoka-shi, Shizuoka Pref. JP-A-2-91177 (JP, A) JP-A-1-278737 (JP, A) JP-A-1-191435 (JP, A)

Claims (3)

(57) [Claims] To 1. A dielectric film on a semiconductor adhesive tape formed by providing an adhesive layer and a protective layer, less the
Also contains a maleimide resin in the adhesive and has a Young's modulus after curing of 4 × 10 ⁸ dyne / c at 20 ° C. to 300 ° C.
Semiconductor adhesive tape, characterized in that m ² or more. 2. An adhesive layer and a protective film on an insulating film.
In semiconductor adhesive tapes provided with layers, at least
Also contains maleimide resin and polyamide resin in the adhesive
And the cured Young's modulus is 4 × at 20 ° C. to 300 ° C.
A half of at least 10 ⁸ dyne / cm ²
Adhesive tape for conductors. 3. A process according to claim 1 or 2 for semiconductor Adhesive tape according thickness of the adhesive layer is 3 to 50 [mu] m.