JP3503392B2 - Tape with adhesive for TAB, semiconductor connection substrate, and semiconductor device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting a semiconductor integrated circuit, a tape automated bonding (T).
Tape with adhesive used in the AB method (hereinafter, TA
B tape). More specifically, the present invention relates to a TAB tape having excellent insulation properties under high temperature and high humidity and adhesiveness after resist stripping and plating treatment, and a semiconductor device using the same.

[0002]

2. Description of the Related Art A conventional TAB tape has a three-layer structure in which a flexible organic insulating film such as a polyimide film is laminated with an adhesive layer and a polyester film having releasability as a protective film layer. It is composed of

The TAB tape includes (1) perforations for sprocket and device holes, (2) thermal lamination with copper foil,
(3) Pattern formation (resist coating, etching, resist removal), (4) Tin or gold-plating treatment, and the like to be processed into a TAB tape (pattern tape). FIG. 1 shows the shape of the pattern tape. FIG. 2 shows a cross-sectional view of one embodiment of the semiconductor device of the present invention. The inner lead portion 6 of the pattern tape is thermocompression bonded (inner lead bonding) to the gold bump 10 of the semiconductor integrated circuit 8 to mount the semiconductor integrated circuit. Next, a semiconductor device is created through a resin sealing process using the sealing resin 9. Further, a method of mounting a semiconductor integrated circuit in which the conductor and the gold bump of the semiconductor integrated circuit are connected by wire lead bonding using a pattern tape having no inner lead portion is also adopted. Such a semiconductor device is called a tape carrier package (TCP) type semiconductor device. TCP
The type semiconductor device is connected (outer lead bonding) to a circuit board or the like on which other components are mounted via outer leads 7 and mounted on an electronic device.

On the other hand, as electronic devices have become smaller and lighter in recent years, a semiconductor package has a QFP (quad flat package) in which conventional connection terminals (outer leads) are arranged on the side surface of the package for the purpose of high-density mounting. ), SO
Instead of P (small outline package),
BGA (ball grid array) and CSP (chip scale package) in which connection terminals are arranged on the back surface of the package have come to be used partially. BG
The biggest structural difference between A and CSP from QFP and SOP is that the former requires a substrate called an interposer, while the latter necessarily uses a substrate by using a metal lead frame. Therefore, the substrate is not always required. The interposer used here is generally a glass epoxy substrate, an organic insulating film such as a polyimide film, or the like, to which a copper foil is attached. Therefore, the tape with adhesive for TAB of the present invention can be used for semiconductor devices such as BGA and CSP, and the obtained BGA and CSP are also included in the semiconductor device of the present invention. 3 and 4 are sectional views showing one embodiment of the semiconductor device (BGA, CSP) of the present invention.

In any of the above-mentioned package forms, since the adhesive layer of the TAB tape remains in the package in the end, insulation, heat resistance and adhesiveness are required.

[0006] In recent years, due to the higher density of electronic equipment due to miniaturization, the conductor wire width and the distance between pitches in the TAB tape system tend to become narrower, and higher adhesiveness and adhesiveness are required for adhesives. Has become. In addition, the chemical resistance of the adhesive layer exposed to various chemicals in the above-mentioned many steps has become an important issue along with the initial adhesive strength as the conductor width decreases. In particular, chemical resistance to alkalis and etching during resist stripping, gold plating, and acid during tin plating is important.

Various improvements in adhesives have been investigated. For example, a method of using a bis A type epoxy resin and a polyamide resin having an amine value of 3 or more for the purpose of improving chemical resistance (Japanese Patent Laid-Open No. 5-29399), and a method of adding an epoxy resin having a siloxane structure (Japanese Laid-Open Patent No. No. 259228), a method of adding a maleimide resin (JP-A 5-2).
No. 91356) and a method of highly purifying the chlorine ion content of the epoxy resin to 200 ppm or less for the purpose of improving the insulating property (JP-A-7-74213).
Have been proposed.

[0008]

However, although the adhesives improved by various methods have been gradually effective, they are not sufficient to meet the more demanding requirements accompanying the reduction of the wiring width. It was

It is an object of the present invention to provide a TAB tape having excellent adhesiveness, chemical resistance and insulation, and a semiconductor device using the same, which solves the above problems.

[0010]

That is, the present invention provides a TAB adhesive tape comprising a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film. The adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B), and the epoxy resin (B) contains an epoxy resin (b) having a skeleton represented by the following formula (I) as an essential component. And a tape with an adhesive for TAB and a semiconductor device using the same.

[0011]

[Chemical 2] (However, two of R1 to R8 are 2,3-epoxypropoxy groups, and the rest are hydrogen atoms, C1 to C4 lower alkyl groups or halogen atoms.)

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION The constitution of the present invention will be described in detail below.

In the present invention, the adhesive layer contains the thermoplastic resin (A) and the epoxy resin (B), and the epoxy resin (B) has the skeleton represented by the above formula (I) (b). ) Is essential as an essential ingredient.

The thermoplastic resin (A) in the present invention is not particularly limited as long as it gives flexibility to the adhesive layer, and specific examples thereof include polyethylene, polyester, SBR, NBR, polyamide resin and SEBS. Etc. Among them, the carbon number is 3 which has low water absorption and excellent insulation properties.
A polyamide resin (a) containing a dicarboxylic acid of 6 (so-called dimer acid) as a constituent is preferable. The polyamide resin (a) containing dimer acid as a constituent component is obtained by polycondensation of dimer acid and diamine according to a conventional method. At this time, dicarboxylic acids other than dimer acid such as adipic acid, azelaic acid and sebacic acid are used. The diamine may be contained as a copolymerization component, and known diamines such as ethylenediamine, hexamethylenediamine and piperazine may be used, and two or more kinds may be mixed from the viewpoint of water absorption and solubility. Furthermore, for the purpose of improving compatibility with the epoxy resin (B) and obtaining good adhesiveness, the diamine component was excessively blended in an equivalent ratio during polycondensation to leave unreacted amine at the polyamide terminal. Polyamide resin (a ') is preferred. The preferred range of the amine value is 1 or more and less than 3, and when the amine value is less than 1, the effect of improving the adhesiveness is difficult to be exhibited, and when the amine value is 3 or more, the preservability of the adhesive itself decreases.

The amine value mentioned here means 1 g of polyamide.
The number of mg of KOH equivalent to perchloric acid for neutralizing basic nitrogen contained therein is shown.

In the present invention, the epoxy resin (B) is represented by the following formula (I)

[Chemical 3] (However, two of R1 to R8 are 2,3-epoxypropoxy groups, and the rest are hydrogen atoms, C1 to C4 lower alkyl groups or halogen atoms.) Epoxy resin having a skeleton ( It is important to include b) as an essential component. When the epoxy resin (b) is not contained, high adhesiveness and high insulation after resist treatment and plating treatment cannot be exhibited.

In the above formula (I), preferred examples of R1 to R8 are hydrogen atom, methyl group, ethyl group,
Examples include sec-butyl group, t-butyl group, chlorine atom and bromine atom.

Preferred specific examples of the epoxy resin (b) in the present invention are 1,5-diglycidylnaphthalene, 1,5-diglycidyl-7-methylnaphthalene,
1,6-diglycidylnaphthalene, 1,6-diglycidyl-2-methylnaphthalene, 1,6-diglycidyl-8
-Methylnaphthalene, 1,6-diglycidyl-4,8-
Examples thereof include dimethylnaphthalene, 2-bromo-1,6-diglycidylnaphthalene and 8-bromo-1,6-diglycidylnaphthalene.

In the present invention, the epoxy resin (B) may contain an epoxy resin other than the epoxy resin (b) in combination with the epoxy resin (b). Other epoxy resins that can be used in combination include, for example,
Bisphenol A type epoxy resin, bisphenol F type epoxy, cresol novolac type epoxy resin, phenol novolac type epoxy resin, various novolac type epoxy resins synthesized from bisphenol A and resorcin, linear aliphatic epoxy resin, alicyclic epoxy resin, Examples include heterocyclic epoxy resins.

The proportion of the epoxy resin (b) contained in the epoxy resin (B) is not particularly limited, and the effect of the present invention is exhibited if the epoxy resin (b) is contained as an essential component. In order to exert a more sufficient effect, the epoxy resin (b) must be contained in the epoxy resin (B) in an amount of usually 20% by weight or more, preferably 40% by weight or more, and more preferably 60% by weight or more.

The compounding amount of the epoxy resin (B) in the present invention is 2 to 100 relative to 100 parts by weight of the polyamide resin.
Parts by weight, preferably 5 to 70 parts by weight.

The flexible insulating film as used in the present invention means a plastic such as polyimide, polyester, polyphenylene sulfide, polyether sulfone, polyether ether ketone, aramid, polycarbonate, polyarylate, or epoxy resin-impregnated glass cloth. It is a film made of a composite material and having a thickness of 25 to 125 μm, and a plurality of films selected from these may be laminated and used. Above all, a polyimide film having a small coefficient of thermal expansion is preferably used. Further, it is desirable that these films are subjected to surface treatment such as hydrolysis, corona discharge, low temperature plasma, physical surface roughening, and easy adhesion coating treatment, if necessary.

The protective film layer in the present invention is not particularly limited as long as it can be peeled from the adhesive surface without damaging the form of the TAB tape before laminating the copper foil, but for example, a polyester film coated with silicone or a fluorine compound. , Polyolefin films, and papers obtained by laminating these films.

In the present invention, by adding the phenol resin (C) to the adhesive layer, the adhesiveness and insulating property can be further improved. Phenolic resin (C)
Specific examples thereof include, for example, phenol novolac resin, cresol novolac resin, bisphenol A type resin and various resole resins.

The mixing ratio of the phenol resin is usually 0.5 to 1 of the phenolic hydroxyl group per equivalent of the epoxy resin.
It is desirable that the amount is 0.0 equivalent, preferably 0.7 to 7.0 equivalent.

A single reaction of the epoxy resin (B) with the adhesive layer of the present invention, an epoxy resin (B) and a polyamide resin (A)
Or a curing accelerator that accelerates the reaction with the phenol resin (C). The curing accelerator is not particularly limited as long as it accelerates the curing reaction, and specific examples thereof include 2-methylimidazole, 2,4-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole. , 2-phenyl-4-methylimidazole and 2-imidazole compounds such as 2-heptadecylimidazole, triethylamine, benzyldimethylamine, α-methylbenzyldimethylamine, 2- (dimethylaminomethyl) phenol, 2,
Tertiary amine compounds such as 4,6-tris (dimethylaminomethyl) phenol and 1,8-diazabicyclo (5,4,0) undecene-7, zirconium tetramethoxide, zirconium tetrapropoxide, tetrakis (acetylacetonato) Organometallic compounds such as zirconium and tri (acetylacetonato) aluminum,
And organic phosphine compounds such as triphenylphosphine, trimethylphosphine, triethylphosphine, tributylphosphine, tri (p-methylphenyl) phosphine and tri (nonylphenyl) phosphine.

Two or more of these curing accelerators may be used in combination depending on the intended use, and the addition amount thereof is in the range of 0.1 to 10 parts by weight with respect to 100 parts by weight of the epoxy resin (B). preferable.

Next, a method of manufacturing the adhesive tape for TAB will be described. Insulating film with flexibility,
A paint prepared by dissolving the adhesive composition in a solvent is applied and dried.
It is preferable to apply the adhesive layer so that the film pressure is 10 to 25 μm. Drying conditions are usually 100 to 200 ° C,
1 to 5 minutes. The solvent is not particularly limited, but an aromatic mixed solvent of toluene, xylene, chlorobenzene and the like and an alcoholic mixed solvent of methanol, ethanol, propanol and the like are preferable. A protective film is laminated on the film thus obtained, and finally, usually 35 to 158.
Slit to about mm.

[0029]

EXAMPLES The present invention will be described in more detail below with reference to examples.

Examples 1 to 3 and Comparative Example 1 The following thermoplastic resin, epoxy resin, phenol resin and other additives were blended so as to have the composition ratios shown in Table 1, respectively, so that the concentration was 20% by weight. Was stirred and dissolved in a mixed solvent of methanol / monochlorobenzene at 40 ° C. to prepare an adhesive solution.

A. Thermoplastic resin I. Polyamide resin (acid content: dimer acid, amine component: hexamethylenediamine, acid value 1.0, amine value 0) II. Polyamide resin (acid component: dimer acid, amine component: hexamethylenediamine, acid value 1.0, amine value 2.0) B. Epoxy resin I. 1,6-bis (2,3-epoxypropoxy)-
Naphthalene (epoxy equivalent: 149) II. Bisphenol A type epoxy resin (epoxy equivalent: 186) C.I. Phenol resin Resol phenol "CKM-1282" (manufactured by Showa Polymer Co., Ltd.) D. Additive 2-heptadecyl imidazole

These adhesive solutions were applied on a 75 μm thick polyimide film (“UPILEX” 75S manufactured by Ube Industries, Ltd.) to a dry thickness of about 18 μm by a bar coater, and then dried at 100 ° C. for 1 minute and 160 ° C. The tape with an adhesive for TAB was prepared by drying at 5 ° C. for 5 minutes. Next, an 18 μm electrolytic copper foil was laminated on these tapes with an adhesive for TAB under the conditions of 140 ° C. and 9.8 × 10 ⁴ Pa, and then in an air oven at 80 ° C. for 3 hours.
A heat treatment was sequentially performed at 0 ° C. for 5 hours and 150 ° C. for 5 hours to obtain a TAB tape with a copper foil. Photoresist film formation, etching, and resist stripping were performed on the copper foil surface of the obtained TAB tape with copper foil by a conventional method to prepare samples for evaluation of adhesive strength and tin plating resistance. The properties of the adhesive were evaluated. The results are shown in Table 1.

Evaluation Method (1) Tin Plating Treatment The evaluation sample was immersed in a borofluoric acid-based electroless tin plating solution at 70 ° C. for 5 minutes, and plated with a thickness of 0.5 μm.

(2) Peel strength Using a sample for evaluation having a conductor width of 50 μm, 90
Peeling was performed in the ° direction at a speed of 50 mm / min, and the peeling force at that time was measured.

(3) High-temperature and high-humidity bias insulation Using a comb-shaped measuring pattern having a conductor width of 200 μm and a conductor distance of 50 μm, a voltage of 100 V is applied in an environment of 130 ° C. and 85% RH for insulation. Resistance value is 1 / of initial value
The time to fall below 10 was measured.

Using the tape with adhesive for TAB obtained by the above procedure, a conductor circuit for connecting a semiconductor integrated circuit was formed by the same method as the above-described evaluation methods (1) and (2), and FIG. The pattern tape shown in was obtained. The characteristics are shown in Table 1.

Further, using this pattern tape, 450
Inner lead bonding is performed under the condition of ℃ for 1 minute,
A semiconductor integrated circuit was connected. After that, an epoxy liquid encapsulant (“Chip coat” 132 manufactured by Hokuriku Paint Co., Ltd.)
0-617) was used for resin encapsulation to obtain a semiconductor device. FIG. 2 shows a cross section of the obtained semiconductor device.

[0038]

[Table 1]

As is clear from the results shown in Table 1, the TAB tape obtained according to the present invention has excellent chemical resistance and high adhesiveness and moisture resistant insulation. On the other hand, Comparative Example 1, which does not use the epoxy resin of the present invention, has not only low adhesiveness but also poor chemical resistance and moisture insulation.

[0040]

INDUSTRIAL APPLICABILITY The present invention industrially provides a novel TAB tape having excellent insulating properties under high temperature and high humidity and adhesiveness after resist stripping and plating treatment and a semiconductor device using the same. The TAB tape of the present invention can improve the reliability of a semiconductor device for high-density mounting.

[Brief description of drawings]

FIG. 1 is a perspective view of an embodiment of a pattern tape before processing a semiconductor integrated circuit, which is obtained by processing the tape with an adhesive for TAB of the present invention.

FIG. 2 is a cross-sectional view of one embodiment of a semiconductor device using the tape with adhesive for TAB of the present invention.

FIG. 3 is a cross-sectional view of one embodiment of a semiconductor device (BGA) using the tape with adhesive for TAB of the present invention.

FIG. 4 is a cross-sectional view of one embodiment of a semiconductor device (CSP) using the adhesive tape for TAB of the present invention.

[Explanation of symbols]

1,12,20 Flexible insulating film 2,13,21 Adhesive 3 sprocket holes 4 device holes 5,14,22 Conductors for connecting semiconductor integrated circuits 6 Inner lead part 7 Outer lead part 8, 15, 23 Semiconductor integrated circuit 9,16,24 Sealing resin 10,17,25 gold bumps 11 Protective film 18,26 solder balls 19 Reinforcing plate 27 Solder resist

─────────────────────────────────────────────────── --Continued from the front page (56) Reference JP-A-7-115106 (JP, A) JP-A-7-226581 (JP, A) JP-A-8-127759 (JP, A) JP-A-4- 233115 (JP, A) JP 7-316527 (JP, A) JP 9-165435 (JP, A) JP 9-150425 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/60 311 B32B 7/12 C09J 7/02 C09J 163/00 C09J 177/06

Claims (7)

(57) [Claims] 1. An organic insulating film having flexibility,
An adhesive tape for TAB comprising a laminate having an adhesive layer and a protective film layer, wherein the adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B), and the epoxy resin (B) is used. Is a tape with an adhesive for TAB, which contains an epoxy resin (b) having a skeleton represented by the following formula (I) as an essential component. [Chemical 1] (However, two of R1 to R8 are 2,3-epoxypropoxy groups, and the rest are hydrogen atoms, C1 to C4 lower alkyl groups or halogen atoms.) 2. The adhesive tape for TAB according to claim 1, wherein the thermoplastic resin (A) is a polyamide resin (a) containing a dicarboxylic acid having 36 carbon atoms as an essential constituent. 3. A thermoplastic resin (A) is a polyamide resin (a) containing a dicarboxylic acid having 36 carbon atoms as an essential constituent component, and a polyamide resin (a ') having an amine value of 1 or more and less than 3. the claim 1, characterized in that
Is a tape with an adhesive for TAB described in 2. 4. The tape with an adhesive for TAB according to claim 1, wherein the adhesive layer further contains a phenol resin (C). 5. The adhesive tape for TAB according to claim 1, wherein the organic insulating film having flexibility is a film made of polyimide. 6. A semiconductor connection board using the tape with an adhesive for TAB according to claim 1. 7. A semiconductor device using the TAB adhesive with tape according to any of claims 1 to 5.