JPH0964111A - Tape with adhesive for tab and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable a novel tape for a TAB having excellent adhesive properties and insulating properties by investigating the relationship of the chemical structure of the adhesive component of the tape for the TAB and the adhesive properties and insulating properties to a metal and skillfully combining an organometallic compound and a polyamide resin. SOLUTION: A layer, particularly, an adhesive layer composed of a laminate with an adhesive layer and a protective film layer on an organic insulating film having flexibility contains at least one kind or more of organometallic compounds selected from a polyamid resin and an organometallic compound shown by the formula of M(O-R')n(O-CO-R<2> )m or a metallic chelate compound constituted of the organometallic compound and a chelate aegent as essential ingredients. Where M in formula represents a metallic element, (n) and (m) naural numbers and R<1> and R<2> substitutional or non-substitutional monovalent hydrocarbon groups. Accordingly, a novel tape for a TAB having excellent adhesive properties and insulating properties is acquired.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape automated bonding (T)
Tape with adhesive used in the AB method (hereinafter, TA
B) and a semiconductor device using the same.

[0002]

2. Description of the Related Art An ordinary TAB tape has a three-layer structure in which a flexible organic insulating film such as a polyimide film is laminated with a releasing polyester film or the like as an adhesive layer and a protective film layer. It is composed of

[0003] TAB tapes include sprockets and device holes, thermal lamination with copper foil, pattern formation (resist coating, etching, resist removal),
TA through processing process such as tin or gold-plating
Processed into B tape (pattern tape). FIG. 1 shows the shape of the pattern tape. FIG. 2 is a cross-sectional view of one embodiment of the semiconductor device of the present invention. The inner lead portion 6 of the pattern tape is thermocompression-bonded (inner lead bonding) to the gold bump 10 of the semiconductor integrated circuit 8 to mount the semiconductor integrated circuit. Next, a semiconductor device is created through a resin sealing process using the sealing resin 9. Such a semiconductor device is called a tape carrier package (TCP) type semiconductor device. The TCP type semiconductor device is connected (outer lead bonding) to a circuit board or the like on which other components are mounted via outer leads 7 and mounted on an electronic device.

Finally, since the adhesive layer of the TAB tape remains in the package, it is required to have insulation, heat resistance and adhesiveness. In recent years, as electronic devices have been miniaturized and densified, the conductor width in the TAB method has become extremely narrow, and the need for an adhesive having high adhesive strength and insulating properties has increased. In addition, in recent years, particularly as an insulation reliability acceleration test, the reduction rate of insulation under a continuous voltage application state at a high temperature of 125 ° C. to 150 ° C. has become important.

From such a viewpoint, a mixed composition of an epoxy resin and / or a phenol resin and a polyamide resin has been mainly used for the adhesive layer of the conventional TAB tape. (JP-A-2-143447, JP-A-3
-217035).

[0006]

However, conventional TAB tapes are not always satisfactory in the above-mentioned adhesiveness and insulating properties. For example, as the conductor width becomes narrower, the adhesive strength decreases, the conductor may peel off in a later step such as bonding, and it may not be possible to connect to an integrated circuit or a circuit board. This is mainly due to a shortage of the absolute value of the adhesive strength and a decrease in the effective adhesive area due to the penetration of the plating solution between the conductor and the adhesive. In addition, since the insulation deterioration is slow under the continuous voltage application condition at high temperature, if the mounting density increases and the distance between the conductors decreases in the future, there is concern about the insulation durability.

It is an object of the present invention to solve the above problems and provide a novel TAB tape having excellent adhesiveness and insulation and a semiconductor device using the same.

[0008]

Means for Solving the Problems In order to achieve the above-mentioned object, the present inventors have made earnest studies on the relationship between the chemical structure of the adhesive component of the TAB tape and the adhesiveness and insulating property to metal. It was found that a TAB tape having excellent adhesiveness and insulating properties can be obtained by skillfully combining an organometallic compound and a polyamide resin, and the present invention has been completed.

That is, the present invention comprises a laminate having an adhesive layer and a protective film layer on a flexible insulating film, the adhesive layer comprising a polyamide resin and the following (1) to (2). (1) An adhesive tape for TAB, which comprises at least one or more organometallic compounds selected from the above as an essential component, and a semiconductor device using the same. (1) Organometallic compound represented by the following general formula (I) M (O-R ¹ ) n (O-CO-R ² ) m (I) (where M is a metal element and n and m are Natural number, R ¹ , R ²
Represents a substituted or unsubstituted monovalent hydrocarbon group. (2) A metal chelate compound composed of the organometallic compound of (1) and a chelating agent.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION The metal elements constituting the organometallic compound used in the present invention are preferably Mg, Al and S.
i, Ti, Zr, Fe, Co, Cr, Mn, Ni, P
It is one or more selected from d, Rh, V and Zn.

The organic groups R ¹ and R ² of the organometallic compound represented by the above general formula (I) are not particularly limited as long as they are substituted or unsubstituted monovalent hydrocarbon groups, and examples thereof include a methyl group and an ethyl group. , N- and i-propyl groups, n
-Butyl group, n-amyl group, stearyl group, and other alkyl groups, phenyl group, or those groups in which some of the hydrogen atoms are replaced with halogen elements.

A metal chelate compound composed of an organometallic compound represented by the general formula (I) and a chelating agent is
Examples of the chelating agent that can be used include acetylacetone, trifluoroacetylacetone, pentafluoroacetylacetone, ethylacetoacetate, salicylaldehyde, diethyl malonate, triethanolamine, and the like.

The organometallic compound in the present invention may contain one or more of the above metal elements and organic groups.

The metal chelate compound composed of the organometallic compound and the chelating agent in the present invention is usually obtained by reacting an organometallic compound with a chelate.

Various well-known polyamide resins can be used in the present invention. In particular, those containing a dicarboxylic acid having 36 carbon atoms (so-called dimer acid), which has flexibility in the adhesive layer and has excellent insulating property due to low water absorption, are preferable. Polyamide resin containing dimer acid is obtained by polycondensation of dimer acid and diamine by a conventional method, at this time adipic acid other than dimer acid, azelaic acid, containing dicarboxylic acid such as sebacic acid as a copolymerization component. Good. Diamine is ethylenediamine,
Known materials such as hexamethylenediamine and piperazine can be used, and two or more kinds may be mixed in view of hygroscopicity and solubility.

The mixing ratio of the organometallic compound to the polyamide resin is usually 0.05 to 20.0 parts by weight, preferably 0.5 to 10.0 parts by weight, based on 100 parts by weight of the polyamide resin. Is. If the amount of the organometallic compound is less than 0.05 parts by weight, the adhesiveness and insulating property will be insufficient. Further, when it exceeds 20.0 parts by weight, the adhesiveness is deteriorated, which is not preferable.

In the present invention, by adding a known epoxy resin to the adhesive layer, the adhesiveness and insulating property can be further improved. The epoxy resin is not particularly limited as long as it has two or more epoxy groups in one molecule, but diglycidyl ethers such as bisphenol F, bisphenol A, bisphenol S, and dihydroxynaphthalene, epoxidized phenol novolac, epoxidized cresol novolac. , Epoxidized trisphenylol methane, epoxidized tetraphenylol ethane, epoxidized meta-xylene diamine, and the like. The addition amount of the epoxy resin is 5 to 100 parts by weight, preferably 20 to 70 parts by weight, based on 100 parts by weight of the polyamide resin.

Further, the adhesive layer may contain a known phenol resin such as a novolac type phenol resin or a resol type phenol resin, which is effective in improving insulation and heat resistance such as thermal deformation. The added amount of the phenol resin is preferably 5 to 100 parts by weight based on 100 parts by weight of the polyamide resin.

Addition of a curing agent and a curing accelerator for epoxy resin and phenol resin to the adhesive layer of the present invention is not limited in any way. For example, aromatic polyamines, amine complexes of boron trifluoride such as boron trifluoride triethylamine complex, imidazole derivatives such as 2-alkyl-4-methylimidazole and 2-phenyl-4-alkylimidazole, phthalic anhydride, trianhydride Organic acids such as melitic acid, dicyandiamide, and known compounds such as triphenylphosphine can be used. The addition amount is preferably 0.1 to 10 parts by weight based on 100 parts by weight of the polyamide resin.

In addition to the above components, addition of organic or inorganic components such as an antioxidant and an ion scavenger is not limited to the extent that the characteristics of the adhesive are not impaired.

The flexible insulating film referred to in the present invention means plastic such as polyimide, polyester, polyphenylene sulfide, polyether sulfone, polyether ether ketone, aramid, polycarbonate, polyarylate, or epoxy resin-impregnated glass cloth. A film having a thickness of 25 to 125 μm, which is made of the composite material, and a plurality of films selected from these may be laminated and used. If necessary, surface treatment such as hydrolysis, corona discharge, low temperature plasma, physical surface roughening, and easy adhesion coating treatment can be applied.

The protective film layer referred to in the present invention is not particularly limited as long as it can be peeled off from the adhesive surface without impairing the form of the TAB tape before heat-laminating the copper foil,
For example, a polyester film or a polyolefin film coated with a silicone or fluorine compound, and a paper obtained by laminating the same.

Next, a method of manufacturing the adhesive tape for TAB will be described.

A coating material prepared by dissolving the above adhesive composition in a solvent is applied to a flexible insulating film and dried. It is preferable to apply the adhesive layer so that the thickness thereof is 10 to 25 μm. The drying conditions are 100 to 200 ° C. and 1 to 5 minutes. The solvent is not particularly limited, but a mixture of an aromatic solvent such as toluene, xylene and chlorobenzene and an alcohol solvent such as methanol, ethanol and propanol is preferable. A protective film is laminated on the film thus obtained, and finally slit to about 35 to 158 mm.

[0025]

The present invention will be described below with reference to examples.
The present invention is not limited to these examples. The evaluation method will be described before the description of the examples.

Evaluation method (1) Preparation method for evaluation sample A tape sample with an adhesive for TAB was laminated with an electrolytic copper foil of 18 μ under the conditions of 140 ° C. and 1 kg / cm 2. Then, in an air oven at 80 ° C for 3 hours, 100
C., 5 hours, 150.degree. C., 5 hours in order to prepare a TAB tape with copper foil. Photoresist film formation, etching, and resist peeling were performed on the copper foil surface of the obtained TAB tape with copper foil by a conventional method, and samples for evaluation of adhesive strength and insulating property were prepared.

(2) Tin Plating Treatment The sample obtained by the method of (1) above was immersed in a borofluoric acid-based electroless tin plating solution at 70 ° C. for 5 minutes, and then subjected to a 0.
5 μm thick plating was applied.

(3) Peel strength Using the evaluation sample having a conductor width of 50 μ obtained by the above methods (1) and (2), the conductor was 50 mm / 90 mm in the direction.
The film was peeled at a speed of min and the peeling force at that time was measured.

(4) Insulating property Conductor width 200 μ obtained by the above method (1) and (2),
Using a comb-shaped evaluation sample having a conductor-to-conductor distance of 50 μ, the resistance value was 1/10 of the initial value in a state in which a voltage of 150 ° C. and 100 V was continuously applied in an air oven.
The following times were measured.

Comparative Example (Synthesis of Polyamide Resin) The acid / amine ratio was changed in the range of 1.1 to 0.9 as shown in Table 1, and the acid / amine reactant, antifoaming agent and phosphorus of 1% or less were used. An acid catalyst was added to prepare a reactant. This reactant
After stirring and heating at 140 ° C. for 1 hour, the temperature was raised to 205 ° C. and the mixture was stirred for about 1.5 hours. Under vacuum of about 15 mmHg,
Hold for 5 hours to reduce temperature. Finally, an antioxidant was added and the polyamide resin was taken out.

Example 1 Polyamide resin A shown in Table 1 (acid value 3
9.5), epoxy resin (Okaka Shell Epoxy Co., Ltd.)
"Epicoat" 828, epoxy equivalent 186), phenol resin (Showa Polymer Co., Ltd., CKM128)
2), the organometallic compounds A shown in Table 2 were blended so as to have the composition ratios shown in Table 3, respectively, and the mixture was stirred and mixed at 30 ° C. in a methanol / monochlorobenzene mixed solvent so as to have a concentration of 20% by weight and bonded. An agent solution was prepared. This adhesive was applied with a bar coater to a polyethylene terephthalate film (“Lumirror” manufactured by Toray Industries, Inc.) having a thickness of 25 μm so that the dry thickness was about 18 μm, and the temperature was 100 ° C. for 1 minute and 16
An adhesive sheet was prepared by drying at 0 ° C for 5 minutes. Furthermore, the obtained adhesive sheet was formed into a polyimide film having a thickness of 75 μ (“UPILEX” manufactured by Ube Industries, Ltd.).
75S) was laminated under the conditions of 120 ° C. and 1 kg / cm ² to prepare an adhesive tape for TAB. Table 3 shows the characteristics.

Using the TAB adhesive tape obtained by the above procedure, a conductor circuit for connecting a semiconductor integrated circuit was formed in the same manner as in the above evaluation methods (1) and (2). Was obtained.

Further, using this pattern tape, 45
Inner lead bonding was performed at 0 ° C. for 1 minute to connect a semiconductor integrated circuit. After that, an epoxy-based liquid sealant ("Hitariku Paint Co., Ltd." Chipcoat "1
320-617), resin sealing was performed to obtain a semiconductor device. FIG. 2 shows a cross section of the obtained semiconductor device.

Examples 2 to 4 and Comparative Example 1 In the same manner as in Example 1, tapes with an adhesive for TAB were obtained by using the adhesives prepared with the raw materials and the composition ratios shown in Tables 1 to 3, respectively. . Table 3 shows the characteristics.

[0035]

[Table 1]

[0036]

[Table 2]

[0037]

[Table 3]

From the examples and comparative examples in Table 3, it can be seen that the tapes with an adhesive for TAB obtained according to the present invention are excellent in adhesiveness and insulation.

[0039]

The present invention is to industrially provide a novel TAB adhesive tape having excellent adhesiveness and insulating properties and a semiconductor device using the same.
The reliability and economy of the semiconductor device for high-density mounting can be improved by the adhesive tape.

[Brief description of drawings]

FIG. 1 is a perspective view of one embodiment of a pattern tape before mounting a semiconductor integrated circuit, obtained by processing a tape with an adhesive for TAB of the present invention.

FIG. 2 is a cross-sectional view of one embodiment of a semiconductor device using the tape with an adhesive for TAB of the present invention.

[Explanation of symbols]

 1 Flexible Insulating Film 2 Adhesive 3 Sprocket Hole 4 Device Hole 5 Conductor for Connecting Semiconductor Integrated Circuit 6 Inner Lead Part 7 Outer Lead Part 8 Semiconductor Integrated Circuit 9 Sealing Resin 10 Gold Bump 11 Protective Film

Claims (7)

[Claims] 1. An organic insulating film having flexibility,
It is composed of a laminate having an adhesive layer and a protective film layer, and the adhesive layer comprises a polyamide resin and the following (1):
A tape with an adhesive for TAB, which contains at least one or more organometallic compounds selected from (2) as an essential component. (1) Organometallic compound represented by the following general formula (I) M (O-R ¹ ) n (O-CO-R ² ) m (I) (where M is a metal element and n and m are Natural number, R ¹ , R ²
Represents a substituted or unsubstituted monovalent hydrocarbon group. (2) A metal chelate compound composed of the organometallic compound of (1) and a chelating agent. 2. The adhesive tape for TAB according to claim 1, wherein the adhesive layer contains an epoxy resin. 3. The organometallic compound is Mg, Al, Si, T
i, Zr, Fe, Co, Cr, Mn, Ni, Pd, R
The tape with an adhesive for TAB according to claim 1, which is composed of one or more metal elements selected from h, V, and Zn. 4. The adhesive tape for TAB according to claim 1, wherein the content of the organometallic compound is 0.05 to 20 parts by weight with respect to 100 parts by weight of the polyamide resin. 5. The adhesive tape for TAB according to claim 1, wherein the polyamide resin contains a dicarboxylic acid having 36 carbon atoms as an essential component. 6. The adhesive tape for TAB according to claim 1, wherein the adhesive layer contains a phenol resin. 7. A semiconductor device using the tape with an adhesive for TAB according to claim 1.