JPH06181239A - Tape with adhesive agent for tab - Google Patents

Abstract

PURPOSE:To prevent conductors from being buried in an adhesive agent by causing the adhesive agent layer to contain polyimide resin, epoxy resin, and phenol resin as essential components, and causing the epoxy resin to contain trishydroxyphenylmethane epoxy resin represented by a specific structural formula, as an essential component. CONSTITUTION:An adhesive agent layer contains polyamide resin, epoxy resin, and phenol resin as essential components. Besides, the epoxy resin contains, as an essential component, trishydrophenylmethane represented by the formula (R1 and R2 represent 1-6H or 1-6C hydrocarbon radicals; G represents a glycidyl radical; and (n) represents an integer of 0 to 100). And a tape with an adhesive agent for TAB is made by laminating an organic insulating film and the adhesive agent layer, or an organic insulating film and the adhesive agent layer and a protective film in this order. Consequently, it is possible to fully endure the thermocompression bonding condition or transfer molding condition of a thermosetting anisotropic conductive adhesive agent.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape with an adhesive used for a semiconductor integrated circuit mounting tape (hereinafter referred to as "TAB tape") called a TAB (Tape Automated Bonding) system.

[0002]

2. Description of the Related Art The basic structure of a TAB tape is generally as shown in FIG.
As a base material, and a mixed system of polyamide and epoxy on it (abbreviated as "polyamide / epoxy system".
□□ / △△△ system "means a mixed system of □□□ and △△△) consisting of a conductor 4 such as a copper foil adhered via a thermosetting adhesive 2 such as an adhesive. ing. These adhesives are required to have various properties such as adhesiveness, insulation and chemical resistance.

A liquid crystal driving IC (hereinafter referred to as "driver I"
In order to connect a tape carrier package (hereinafter abbreviated as “TCP”) equipped with “C”) to a liquid crystal display panel, a thermocompression bonding method using an anisotropic conductive adhesive is usually adopted. The adhesive for the TAB tape used in the method requires new performance in addition to the above characteristics. That is, the anisotropic conductive adhesive is a thermosetting type adhesive in order to obtain a sufficiently reliable electrical and mechanical connection between the outer lead of the TCP and the transparent electrode formed on the glass surface of the liquid crystal display panel. Therefore, the thermocompression bonding conditions have to be strong in terms of temperature, pressure and time. Conventionally, as an adhesive for a TAB tape, examples using a polyamide / epoxy type, a polyamide / epoxy / phenol type, and a curing agent are known. As a typical example of each of these components, as a polyamide,
Nylon, dimer acid polyamide, epoxy resins such as bisphenol, phenol novolac, cresol novolac, phenolic resins such as polyparavinylphenol, alkylphenol, and curing agents such as:
Imidazoles, amines and acid anhydrides are known. However, in the TCP using these conventional adhesives, when the thermosetting anisotropic conductive adhesive is used for thermocompression bonding to the liquid crystal panel, the conductor of the TAB tape is embedded in the adhesive due to the thermal pressure. There is a problem that a serious defect occurs. FIG. 3 shows a model in which the conductor 4 is buried in the adhesive 2. In such a state, the original performance expected of the anisotropic conductive adhesive cannot be exhibited at all.

In addition, in TCP, the resin molding by the transfer molding method is being studied from the viewpoint of improving the reliability of the IC or making the package form such as the QFP type the same as that of the normal wire bonding method. In this case, the TCP using the conventional adhesive also has a problem that the conductor of the TAB tape is buried in the adhesive as shown in FIG. 3 due to heat and pressure during molding, and the original purpose cannot be achieved.

The TAB tape is the same as the flexible printed circuit board (FPC) in terms of material composition, and a nylon (polyamide) / epoxy adhesive has long been known as an adhesive for FPC ("Adhesion" Vol. 17, No7, pp31 ~
38 (1973)). It is well known that polyamide / epoxy type adhesives (including curing agents such as phenolic resin and dicyandiamide (DICY)) exhibit excellent performance as adhesives for TAB tapes (JP-A-53-1343).
65, Japanese Patent Publication No. 58-30755, Japanese Patent Publication No. 6
1-3101), and more recently, polyamide / epoxy / polyparavinylphenol (including imidazole-based curing agent) system (JP-A-2-15664) and polyamide / epoxy / phenolic resin-based (imidazole curing agent). (Including JP-A-2-143447 and JP-A-3-217035).

These adhesives are based on the excellent adhesiveness, toughness, and chemical resistance of nylon (polyamide) resin, and the epoxy resin and the active terminal group (-NH
₍₂ , -COOH) forms a cross-linked structure with each other, and at the same time increases the cross-link density of the epoxy resin itself with an epoxy curing agent such as DICY or imidazole to improve heat resistance, chemical resistance, and electrical insulation. The basic idea is to raise the level to the desired level. It is well known that the phenolic hydroxyl group in the molecular structure of a phenol resin or polyparavinylphenol acts as a curing agent for an epoxy resin to form a cured product excellent in heat resistance and electric insulation. Therefore, even in the adhesive for TAB, it has a function of further modifying the characteristics of the polyamide / epoxy resin or the polyamide / epoxy / phenol resin system.

However, these conventionally known adhesives cannot withstand the thermocompression bonding conditions of thermosetting anisotropic conductive adhesives and transfer molding conditions, and the conductors are buried in the adhesives. There is a drawback that the initial purpose cannot be achieved.

[0008]

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to have adhesiveness, insulation, chemical resistance, etc., which have been conventionally required as an adhesive for TAB tape.
For high-performance TAB that can withstand the heat and pressure of connecting TCP and liquid crystal panel with thermosetting anisotropic conductive adhesive or transfer molding of TAB method IC, and the conductor is not buried in the adhesive in the process. To provide a tape with an adhesive.

[0009]

The object of the present invention is as follows.
A tape having a basic structure, which comprises an organic insulating film and an adhesive layer, or an organic insulating film, an adhesive layer and a protective film laminated in this order, wherein the adhesive layer comprises (a) a polyamide resin, It contains (b) an epoxy resin and (c) a phenol resin as essential components, and the epoxy resin has the general formula (1)

[Chemical 3] (Wherein, R _1, R ₂ is .G represents hydrogen or a hydrocarbon group having 1 to 6 carbon atoms, .n representing the glycidyl group, 0
Represents an integer of 100. ) A tape with an adhesive for TAB, which comprises a trishydroxyphenylmethane type epoxy resin represented by the formula (1) as an essential component.

The organic insulating film used in the present invention is a so-called heat resistant film made of polyimide, polyetherimide, aromatic polyamide, polyethylene terephthalate or flexible epoxy /
A composite material such as glass cloth can be preferably used.

The polyamide resin which is the component (a) of the adhesive is obtained by thermally polymerizing a mixture of an acid and a diamine, and is one which is soluble in a mixed solvent containing alcohols such as methanol as a main component. Although all can be used, those containing a dicarboxylic acid having a carbon number of 36 (so-called "dimer acid") as an acid component of the raw material of the polyamide resin (so-called "dimer acid-based polyamide") are particularly preferable. Polyamide resin generally has a high water absorption rate and thus tends to have a low insulation resistance, but by using dimer acid, it is possible to reduce the water absorption rate and increase the electrical insulation.

The dimer acid type polyamide can be obtained by thermally polymerizing an equimolar mixture of dimer acid and diamine. As the dicarboxylic acid component, not only dimer acid but also other dicarboxylic acids such as azelaic acid and sebacic acid may be contained as a copolymerization component.
At this time, the dimer acid content is more preferably 70 mol% or more in the acid component. Among the dimer acid-based polyamides, those having a high degree of polymerization are preferable because they have a relatively low water absorption rate and are likely to have high electric insulation even in a high humidity atmosphere.

As the diamine component, hexamethylenediamine, ethylenediamine, piperazine, bis (4-aminocyclohexyl) methane, bis (4-amino, 1,
2-Methylcyclohexyl) methane and the like can be mentioned, and particularly preferable one is hexamethylenediamine. Dimer acid-based polyamides containing hexamethylenediamine as a main component are particularly preferable because they exhibit excellent properties in overall performance. Further, the diamine component may be used not only in one kind but also in a mixture of two or more kinds.

The epoxy resin which is the component (b) of the adhesive has the general formula (1)

[Chemical 4] (Wherein, R _1, R ₂ is .G represents hydrogen or a hydrocarbon group having 1 to 6 carbon atoms, .n representing the glycidyl group, 0
Represents an integer of 100. ) A trishydroxyphenylmethane type epoxy resin represented by the formula) is contained as an essential component. R
_{As the} number of carbon atoms of ₁ and R ₂ is larger, the structure is more rigid and the adhesive force is less likely to be obtained. Therefore, the smaller the carbon number, the more preferable. Such a trishydroxyphenylmethane type epoxy resin can be easily obtained as, for example, Ep1032S50, Ep1032H60 manufactured by Yuka Shell and EPPN501H, 502H manufactured by Nippon Kayaku.

Further, in order to improve the compatibility with the polyamide resin of the component (a), the general formula (3)

[Chemical 5] (In the formula, R ₄ and R ₅ are fluorine, hydrogen or a carbon number of 1 to
Represents 6 hydrocarbons. G represents a glycidyl group. m
Represents an integer of 0 to 100. The bisphenol type epoxy resin represented by the formula (1) can be mixed with the trishydroxyphenylmethane type epoxy resin which is an essential component of the present invention. The compatibility affects the transparency of the adhesive, and the higher the compatibility is, the more transparent the adhesive becomes. Therefore, the processability at the time of processing the TAB tape is improved. As a mixing ratio of the bisphenol type epoxy resin and the trishydroxyphenylmethane type epoxy resin which is an essential component of the present invention, trishydroxyphenylmethane type: bisphenol type is preferably 20:80 to 80:20, and more preferably, It is from 30:70 to 70:30. As the bisphenol type epoxy resin, for example, Ep828 manufactured by Yuka Shell can be used.

Examples of the phenolic resin as the component (c) of the adhesive include known phenolic resins such as novolac phenolic resins such as alkylphenolic resins and paraphenylphenolic resins, and resole phenolic resins. In particular, a thermosetting type that is solid at room temperature is preferable, and among these, the general formula (2)

[Chemical 6] (In the formula, R ₃ represents hydrogen or a hydrocarbon having 1 to 9 carbon atoms.) Those having a structural unit represented by the formula are particularly preferable because the object of the present invention is further improved. The more the structural unit represented by the general formula (2) is, the better the heat pressing property is. Therefore, the content of the phenol resin is preferably 35% by weight or more, and more preferably 50% by weight or more. Further, as the carbon number of R increases, the compatibility with the polyamide resin and the epoxy resin increases, but if it increases too much, the heat pressing property decreases, so that R is 4 (butyl group).
Is more preferred. In addition, a t-butyl group is particularly preferable because it is easily available.

Regarding the respective component ratios, when the polyamide resin of the component (a) is 100 parts by weight, the epoxy resin of the component (b) is preferably 10 to 80 parts by weight, more preferably 20 to 60 parts by weight. is there. If the amount of epoxy resin is too small, it tends to be weak against thermocompression bonding. If the amount of the epoxy resin is too large, the adhesive force will be reduced and it will be difficult. The amount of the phenol resin as the component (c) is preferably 5 to 70 parts by weight, more preferably 10 to 60 parts by weight. The thermocompression is further strengthened by the additional inclusion of phenolic resin. On the other hand, when the amount of the phenol resin is too large, the thermocompression bonding becomes weak, which is not preferable.

An adhesive resin mixture solution is obtained by dissolving the above components in a solvent. As a solvent for dissolving each component of the adhesive, a mixed solvent of an aromatic solvent such as toluene, xylene, chlorobenzene, and benzyl alcohol and an alcohol solvent such as methanol, ethanol, isopropyl alcohol, and butyl alcohol is suitable.

Further, in the present invention, a protective film is formed on the adhesive layer, if necessary. The protective film is used for the purpose of dust prevention or handling,
Polyethylene, polypropylene, polyethylene terephthalate, polyphenylene sulfide, etc. are preferably used.

The adhesive tape for TAB is usually produced by any of the following methods (1) and (2).

(1) The above-mentioned adhesive resin mixture solution is applied to an organic insulating film and dried. At this time, it is preferable to apply so that the film thickness after drying is about 10 to 25 μm. The drying condition is usually 100 to 20.
The range is 0 ° C. and 1 to 5 minutes. If necessary, a protective film having releasability is laminated on the film and slit to a desired width. Its width is usually about 35 to 158 mm.

(2) The adhesive resin mixture solution is applied and dried on the releasable film to be the protective film in the same manner as in the above (1). If necessary, a second release film is laminated on the adhesive layer and slit to a desired width in the same manner as (1) above. Then, the second release film is peeled off from the organic insulating film such as polyimide which is slit in advance to a desired width, and the adhesive surface is attached.
Usually, the width of the organic insulating film that is the base material is set wider than the width of the adhesive.

FIG. 1 is a schematic cross-sectional view of the adhesive tape for TAB according to the present invention. It is composed of a base material made of the organic insulating film 1 and a protective film 3 adhered on the base material via an adhesive 2.

The TAB tape for mounting the IC is the above-mentioned TAB tape.
Using the adhesive-attached tape, it is manufactured through the following steps.

Punching process for sprocket holes / device holes, protection film removal / copper foil laminating process, adhesive heating curing process, photoresist coating / pattern exposure / development process, copper foil pattern etching process, photoresist stripping process, ( If necessary, solder resist application process), plating process (tin, solder, gold, etc.).

An IC is mounted on the TAB tape thus obtained.

The operation of the present invention will be described below.

As shown in detail in Examples and Comparative Examples, for example, conventional polyamide resin / epoxy resin system and polyamide resin / epoxy resin / phenol resin (or polyparavinylphenol resin) system have been proposed as adhesives for TAB tapes. When the conductor of the TAB tape is pressed with a pressure of 25 kg / cm ² with the adhesive, 100 to 120
While the conductor is buried in the adhesive at a temperature of ° C, the general formula (1) of the present invention is used.

[Chemical 7] When an epoxy resin containing a trishydroxyphenylmethane type epoxy resin represented by is used, a dramatic effect that burying does not occur even at 160 ° C. is recognized.

Although the conductor burying phenomenon does not occur due to the pressing force at high temperature, the adhesiveness, chemical resistance, electric insulation and the like required for the adhesive for TAB tape must be maintained in a well-balanced manner. It was confirmed that the adhesive of the present invention is at a satisfactory level in these performances, and it was found that it can play a very important role industrially in the TAB mounting field.

[0030]

The present invention will be described in more detail with reference to the following examples.

Each test in this example was conducted as follows.

<Heat-pressing test method> TAB tape for performance study: conductor width 200 μm pattern pitch 300 μm conductor thickness 35 μm Heat-pressing tester: Nippon Avionics PULSE HEATE BO
NDER MODEL TCW-125 Heater chip 3 × 30mm Head pressure is set to 25kg, pressurization time is set to 6 seconds, a heat pressing test is performed while changing the heater temperature in steps of 10 ℃, and the temperature at which the conductor begins to be embedded in the adhesive. (This temperature is referred to as "heat distortion temperature") is measured. Practically, the heat distortion temperature is preferably 150 ° C. or higher, more preferably 180 ° C. or higher.

<Adhesive force measuring method> TAB tape for performance examination: conductor width 200 μm Measuring machine: Orientec tensile tester The conductor is peeled in the 90 ° direction at a speed of 50 mm / min, and the stress at that time is measured. Generally, 1.0k
g / cm or more is required.

<Insulation measurement method> TAB tape for performance examination: conductor width 200 μm pattern pitch 250 μm space conductor spacing 50 μm TAB tape at 130 ° C., 85%, 2 atm, 100 V
Measure the time until a short circuit occurs under application. The time to short circuit is preferably 100 hours or more, and particularly preferably 500 hours or more.

EXAMPLE 1 A polyimide film having a thickness of 75 μm (“UPILEX” 75S manufactured by Ube Industries, Ltd.) was coated with the following composition at a solid content concentration of 20.
After being dissolved in a mixed solution of methanol / monochlorobenzene so as to have a weight percentage, the obtained adhesive solution is applied so as to have a dry film thickness of 18 μm, and an
It was dried at 00 ° C for 1 minute and at 150 ° C for 2 minutes.

<Adhesive Composition> Polyamide resin 100 parts by weight (Nylon 6.36 “PRIADIT” 2053 manufactured by Unichema, dimer acid and hexamethylenediamine as main components, weight average molecular weight 100,000, MI value at 175 ° C. 10 gr / Min) Trishydroxyphenylmethane type epoxy resin 60 parts by weight (Ep1032S60 manufactured by Yuka Shell Co., R ₁ = R ₂ = hydrogen, n = 0.7) 40 parts by weight thermosetting alkylphenol resin (PS2780 manufactured by Gunei Chemical Co., Ltd.) 4,4′-diaminodiphenylmethane 5 parts by weight The adhesive-attached polyimide film obtained above had a thickness of 3
A 5 μm electrolytic copper foil was laminated by a roll laminating method. Then, in the air oven, 80 ℃ × 3 hours, 1
The adhesive was cured by heat treatment under the conditions of 00 ° C x 5 hours and 150 ° C x 5 hours.

Using the obtained adhesive tape for TAB, a comb pattern was formed on a copper foil surface by a conventional method through steps of photoresist coating, pattern exposure, development, copper foil pattern etching and photoresist stripping. Further, a TAB tape for performance study was prepared by plating with a thickness of 0.5 μm using an immersion tin plating solution.

The obtained TAB tape was tested for heat pressing property, adhesive force and insulating property by the above-mentioned methods. The results are shown in Table 1.

Example 2 A 25 μm thick polyethylene terephthalate film which had been subjected to a mold release treatment was coated with the same adhesive solution as in Example 1 by the same method as in Example 1 and dried. The adhesive surface of the film was adhered to a polyimide film having a thickness of 125 μm (“Kapton” 500V manufactured by Toray DuPont Co., Ltd.) at a temperature of 120 ° C. by a roll laminating method to prepare a polyimide film with an adhesive. Using this, a TAB tape for performance study was prepared in exactly the same manner as in Example 1.

The obtained TAB tape was tested for heat pressing property, adhesive force and insulating property by the above-mentioned method. The results are shown in Table 1.

Example 3 A TAB tape for performance study was prepared in the same manner as in Example 2 except that the adhesive components were as follows.

<Adhesive Composition> 100 parts by weight of polyamide resin (same as the polyamide resin of Example 1 except that nylon “MACROMELT” 6901 manufactured by Henkel Co., Ltd. and azelaic acid as a copolymerization component of about 10 mol%) are used. Methane type epoxy resin 20 parts by weight (Ep1032S60 manufactured by Yuka Shell Co., Ltd.) 20 parts by weight of bisphenol A type epoxy resin (Ep828 manufactured by Yuka Shell Co., Ltd.) 50 parts by weight of thermosetting alkylphenol resin (PS2780 manufactured by Gunei Chemical Co., Ltd.) The TAB tape was tested for heat pressing property, adhesive force and insulating property by the above-mentioned methods. The results are shown in Table 1.

Example 4 A TAB tape for performance examination was prepared in the same manner as in Example 2 except that the adhesive components were as follows.

<Adhesive composition> 100 parts by weight of polyamide resin (nylon “MACROMELT” 6901 manufactured by Henkel) Trishydroxyphenylmethane type epoxy resin 20 parts by weight (Ep1032S60 manufactured by Yuka Shell Co., Ltd.) 20 parts by weight of bisphenol A type epoxy resin ( Yuka Shell Co., Ltd. Ep828) Thermoplastic phenolic resin 50 parts by weight (Gunei Chemical Co., Ltd. PSM4326) 4,4'-diaminodiphenylmethane 5 parts by weight About the obtained TAB tape, the heat pressing property, the adhesive force and the insulating property are obtained. The test was performed according to the method described above. The results are shown in Table 1.

Comparative Example 1 A TAB tape for performance study was prepared having exactly the same contents as in Example 1 except that the adhesive component used had the following composition.

<Adhesive composition> Polyamide resin 100 parts by weight (Unichema nylon 6.36 "PRIADIT" 2053) Phenol novolac type epoxy resin 60 parts by weight (Okaka Shell Ep152) Thermoplastic phenol resin 40 parts by weight (PSM4326, manufactured by Gunei Chemical Co., Ltd.) 4,4′-diaminodiphenylmethane 5 parts by weight The obtained TAB tape was tested for heat pressing property, adhesive force and insulating property by the above-mentioned methods. The results are shown in Table 1.

Comparative Example 2 A TAB tape for performance examination was prepared having exactly the same contents as in Example 1 except that the adhesive composition had the following composition.

<Adhesive Composition> Polyamide resin 100 parts by weight (Unichema nylon 6.36 “PRIADIT” 2053) Bisphenol A type epoxy resin 60 parts by weight (Oka Shell Ep828) thermosetting alkylphenol resin 40 parts by weight (Showa High Polymer Co., Ltd. CKM1282) 2-Ethylimidazole 5 parts by weight The obtained TAB tape was tested for heat pressing property, adhesive force and insulating property by the above-mentioned methods. The results are shown in Table 1.

Comparative Example 3 A TAB tape for performance examination was prepared having exactly the same contents as in Example 1 except that the adhesive component used had the following composition.

<Adhesive composition> Polyamide resin 100 parts by weight (Nylon “MACROMELT” 6901 manufactured by Henkel) Phenol novolac type epoxy resin 20 parts by weight (Ep152 manufactured by Yuka Shell Co., Ltd.) Bisphenol A type epoxy resin 20 parts by weight (oilification Ep828 manufactured by Shell Co., Ltd. 50 parts by weight of thermoplastic phenolic resin (PSM4326 manufactured by Gunei Chemical Co., Ltd.) The obtained TAB tape was tested for heat pressing property, adhesive force and insulating property by the above-mentioned methods. The results are shown in Table 1.

[0051]

[Table 1]

[0052]

The TAB tape made from the tape with adhesive for TAB according to the present invention has the same adhesiveness as the conventional one,
Insulation and chemical resistance, and I such as driver IC
When TCP mounted with C by TAB method is connected to liquid crystal display panel with thermosetting anisotropic conductive adhesive,
Since the IC mounted by the AB method can withstand the thermal stress when the resin molding is performed by the transfer molding method, the conductor is of high quality without being buried in the adhesive.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view of a tape with an adhesive for TAB according to the present invention.

FIG. 2 is a schematic sectional view of a TAB tape.

FIG. 3 is a schematic cross-sectional view showing a state in which a conductor of a TAB tape is embedded in an adhesive.

[Explanation of symbols]

 1: Organic insulating film 2: Adhesive 3: Protective film 4: Conductor

Claims (4)

[Claims] 1. A tape having an adhesive for TAB, which has a basic structure in which an organic insulating film and an adhesive layer or an organic insulating film, an adhesive layer and a protective film are laminated in this order, the adhesive layer comprising: a) polyamide resin,
It contains (b) an epoxy resin and (c) a phenol resin as essential components, and the epoxy resin has the general formula (1): (Wherein, R _1, R ₂ is .G represents hydrogen or a hydrocarbon group having 1 to 6 carbon atoms, .n representing the glycidyl group, 0
Represents an integer of 100. ) A tape with an adhesive for TAB, comprising a trishydroxyphenylmethane type epoxy resin represented by the formula (1) as an essential component. 2. The adhesive tape for TAB according to claim 1, wherein the polyamide resin contains a dicarboxylic acid having 36 carbon atoms as an essential component. 3. The adhesive tape for TAB according to claim 1 or 2, wherein the phenol resin contains a thermosetting phenol resin which is solid at room temperature as an essential component. 4. A thermosetting phenolic resin which is solid at room temperature,
General formula (2) The tape with an adhesive for TAB according to claim 3, comprising a structural unit represented by the formula: wherein R ₃ represents hydrogen or a hydrocarbon having 1 to 9 carbon atoms.