JP4496591B2 - Epoxy resin composition, prepreg and laminate using the same - Google Patents
Epoxy resin composition, prepreg and laminate using the same Download PDFInfo
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- JP4496591B2 JP4496591B2 JP2000064369A JP2000064369A JP4496591B2 JP 4496591 B2 JP4496591 B2 JP 4496591B2 JP 2000064369 A JP2000064369 A JP 2000064369A JP 2000064369 A JP2000064369 A JP 2000064369A JP 4496591 B2 JP4496591 B2 JP 4496591B2
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Description
【０００１】
【発明の属する技術分野】
本発明は、半田耐熱性に優れたエポキシ樹脂組成物、これを用いたプリプレグ、及び積層板に関するものである。
【０００２】
【従来の技術】
ノート型パーソナルコンピューターや携帯電話等の情報処理用機器は小型化が求められている。ＬＳＩ等の電子部品を搭載するプリント配線板においても小型軽量化の要求は強くなっている。小型軽量化のためにプリプレグの薄物化、高多層化、高密度化が進められているが、その場合さらに半田耐熱性の向上が求められる。
【０００３】
多層プリント配線板等の回路基板用積層板において、半田耐熱性を向上させるためには樹脂の架橋密度を上昇させ、ガラス転移点を向上させることで樹脂の耐熱性を上昇させればよいが、熱硬化性樹脂においては一般に架橋密度を上昇させた場合、同時に硬化収縮が大きくなる。硬化収縮が大きくなると、密着力の低下を引き起こす。このため多層プリント配線板においては、高密度化が進んだ場合、樹脂の硬化収縮により、樹脂と内層回路の黒化処理面の密着力が低下し、吸湿しやすくなり半田耐熱性が悪化する。
【０００４】
【発明が解決しようとする課題】
本発明は、このような問題を解決すべく検討結果なされたものであり、プリント配線板、特に多層プリント配線板に適用された場合に薄物化、高多層化、高密度化に対応しうる、半田耐熱性に優れたエポキシ樹脂組成物、これを用いたプリプレグ、及び積層板に関するものである。
【０００５】
前述のように、プリント配線板、特に多層プリント配線板の材料には半田耐熱性が求められており、耐熱性と密着力が同時に求められている。一般に用いられるビスフェノールＡエポキシ樹脂において、エポキシ当量が大きく、エポキシ鎖長が長いものを使用すれば、密着力は改善するが、樹脂のガラス転移温度が低下し耐熱性が悪化し半田耐熱性も悪化する。密着性を良くするためにはノボラックエポキシ樹脂を併用すれば良いが、クレゾールノボラックエポキシ樹脂やフェノールノボラックエポキシ樹脂は、鎖長の長いビスフェノールＡエポキシ樹脂と相溶性が悪く使用が困難である。このように密着力と耐熱性を同時に満足することは困難である。
【０００６】
本発明者は上記の課題を解決するために鋭意研究を重ねた結果、エポキシ当量が１０００〜２０００なるビスフェノールＡ型エポキシ樹脂とビスフェノールＡノボラックエポキシ樹脂を併用することで、密着力と耐熱性を同時に満足させることを見いだした。すなわち、エポキシ当量が１０００〜２０００なるビスフェノールＡ型エポキシ樹脂は密着力が高い。またビスフェノールＡノボラックエポキシ樹脂は耐熱性が高い。このためこの２つを併用したエポキシ樹脂組成物は密着力と耐熱性を両立できる。一般に積層板に使用されるクレゾールノボラックエポキシ樹脂やフェノールノボラックエポキシ樹脂は長鎖ビスフェノールＡ型エポキシ樹脂と相溶しにくいのに対し、ビスフェノールＡノボラックエポキシ樹脂は構造中にイソプロピル基を有するため、長鎖ビスフェノールＡ型エポキシ樹脂との相溶性が優れている。
【０００７】
【課題を解決するための手段】
本発明は、（Ａ）エポキシ当量が１０００〜２０００であるビスフェノールＡ型エポキシ樹脂、（Ｂ）ビスフェノールＡノボラックエポキシ樹脂、及び（Ｃ）硬化剤を必須成分としてなることを特徴とするエポキシ樹脂組成物であり、好ましくは（Ｃ）硬化剤としてジシアンジアミドを使用することを特徴とするエポキシ樹脂組成物である。
さらに、本発明は、前記記載のエポキシ樹脂組成物を基材に含浸させてなることを特徴とするプリプレグであり、前記のプリプレグを１枚以上重ね合わせ加熱加圧してなることを特徴とする積層板又は銅張積層板である。
【０００８】
本発明で用いる（Ａ）エポキシ当量が１０００〜２０００なるビスフェノールＡ型エポキシ樹脂はエポキシ樹脂１００重量部中、１０〜６０重量部であることが望ましい。１０重量部未満では樹脂の密着力が十分でなく、６０重量部を越えると耐熱性が低下するので望ましくない。耐熱性を考慮するとエポキシ当量は１０００程度が望ましく、密着力を考慮するとエポキシ当量は２０００程度が望ましい。また、エポキシ樹脂組成物に耐燃性を付与することを目的として、一部ハロゲン化したものを用いることができる。
【０００９】
本発明で用いる（Ｂ）ビスフェノールＡノボラックエポキシ樹脂は、エポキシ樹脂１００重量部中１５重量部以上であることが望ましい。１５重量部未満では耐熱性が低下するので望ましくない。エポキシ樹脂組成物に耐燃性を付与することを目的として、一部ハロゲン化したものを用いることができる。
【００１０】
本発明で用いる（Ｃ）硬化剤は、芳香族アミン化合物、酸無水物、ノボラック樹脂などがあげられ、特に限定されないが、耐熱性を考慮するとジシアンジアミドが望ましい。
【００１１】
本発明のエポキシ樹脂組成物は、上述した（Ａ）エポキシ当量が１０００〜２０００であるビスフェノールＡ型エポキシ樹脂、（Ｂ）ビスフェノールＡノボラックエポキシ樹脂、及び（Ｃ）硬化剤を必須成分とするが、本発明の目的に反しない範囲において、その他の硬化促進剤、カップリング剤、その他の成分を添加することは差し支えない。
【００１２】
本発明のエポキシ樹脂組成物は種々の形態で利用されるが、基材に含浸する際には通常溶剤が使用される。用いられる溶剤は組成の一部に対して良好な溶解性を示すことが必要であるが、悪影響を及ぼさない範囲で貧溶媒を使用しても構わない。
【００１３】
本発明のエポキシ樹脂組成物を溶剤に溶解して得られるワニスはガラス織布、ガラス不織布紙、あるいはガラス以外を成分とする布等の基材に塗布、含浸させ、８０〜２００℃で乾燥させることによりプリント配線板用プリプレグを得ることが出来る。プリプレグは加熱加圧してプリント配線板を製造することに用いられるが、本発明のエポキシ樹脂組成物は、半田耐熱性に優れたプリプレグ、及び積層板に好適に適用されるものである。
【００１４】
【実施例】
以下、本発明について実施例により具体的に説明する。
【００１５】
（実施例１）
臭素化ビスフェノールＡエポキシ樹脂（油化シェルエポキシ社製エピコート６６４６：エポキシ当量１５５０、臭素化率３１％）４０重量部、ビスフェノールＡノボラックエポキシ樹脂（油化シェルエポキシ社製エピコート１５７Ｓ６５：エポキシ当量２１０）６０重量部、ジシアンジアミド３．３重量部、及び２−エチル−４−メチルイミダゾール０．１５重量部に、ジメチルホルムアミドを加え、不揮発分濃度６０％となるようにワニスを調整した。このワニスを用いて、ガラス織布（厚さ０．１８ｍｍ、日東紡績（株）製）１００重量部にワニス固形分で８０重量部を含浸させて、１５０℃の乾燥機炉で５分乾燥させ、樹脂含有量４４．４重量％のプリプレグを作製した。
【００１６】
上記プリプレグを６枚を重ね、上下に厚さ３５μｍの電解銅箔を重ねて、圧力４０ｋｇｆ／ｃｍ2 、温度１９０℃で１２０分加熱加圧成形を行い、厚さ１．２ｍｍの両面銅張積層板を得た。
また、上記両面銅張積層板を黒化処理した後、上下に上記プリプレグを１枚ずつ重ね、さらに上下に厚さ３５μｍの電解銅箔を重ねて、圧力４０ｋｇｆ／ｃｍ2 、温度１９０℃で１２０分加熱加圧成形を行い、厚さ１．６ｍｍの多層プリント配線板を得た。
【００１７】
得られた積層板の半田耐熱性、ピール強度についてはＪＩＳ Ｃ ６４８１に準じて測定した。半田耐熱性は煮沸２時間の吸湿処理を行った後、２６０℃の半田槽に１２０秒浸漬した後の外観の異常の有無を調べた。多層プリント配線板の半田耐熱性は１２１℃の蒸気圧で加湿した後、２６０℃の半田槽に１２０秒浸漬した後の外観の異常の有無を調べた。得られた結果を樹脂組成物の配合とともに表１に示す。
【００１８】
（実施例２〜４、及び比較例１〜３）
表１及び表２に示した配合処方で、これ以外は全て実施例１と同様の方法で両面銅張積層板を作製した。評価結果を表１及び表２に示す。表１に示す実施例では、いずれも内層ピール強度が強く、かつガラス転移点が高く、半田耐熱性に優れていることがわかる。
【００１９】
【表１】
【表２】
表の注
１）油化シェルエポキシ社製エピコート６６４６
２）油化シェルエポキシ社製エピコート１００６
３）油化シェルエポキシ社製エピコート８２８
４）油化シェルエポキシ社製エピコート５０５０
５）油化シェルエポキシ社製エピコート１５３Ｓ６５
６）油化シェルエポキシ社製エピコート５０４７
７）大日本インキ化学工業社製Ｎ−６９０
【００２２】
【発明の効果】
本発明は半田耐熱性に優れたエポキシ樹脂組成物であり、特に多層プリント配線板に適用された場合に薄物化、高多層化、高密度化に対応する材料であり、今後、小型情報処理用機器のプリント配線板に最適な新規エポキシ樹脂組成物を提供するものである。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an epoxy resin composition excellent in solder heat resistance, a prepreg using the same, and a laminate.
[0002]
[Prior art]
Information processing devices such as notebook personal computers and mobile phones are required to be downsized. There is an increasing demand for reduction in size and weight in printed wiring boards on which electronic components such as LSIs are mounted. In order to reduce the size and weight, prepregs are being made thinner, more multilayered, and more dense. In this case, further improvement in solder heat resistance is required.
[0003]
In a laminated board for circuit boards such as a multilayer printed wiring board, in order to improve solder heat resistance, the crosslink density of the resin should be increased, and the heat resistance of the resin should be increased by improving the glass transition point. In thermosetting resins, generally, when the crosslink density is increased, curing shrinkage is increased at the same time. When the curing shrinkage is increased, the adhesion force is reduced. For this reason, in the multilayer printed wiring board, when the density is increased, the adhesive strength between the resin and the blackened surface of the inner layer circuit is reduced due to the curing shrinkage of the resin, and it becomes easy to absorb moisture and solder heat resistance is deteriorated.
[0004]
[Problems to be solved by the invention]
The present invention has been made as a result of studies to solve such a problem, and can be applied to printed wiring boards, in particular, multilayer printed wiring boards, thinning, high multilayering, and high density. The present invention relates to an epoxy resin composition excellent in solder heat resistance, a prepreg using the same, and a laminate.
[0005]
As described above, printed circuit boards, particularly multilayer printed circuit boards, are required to have solder heat resistance, and heat resistance and adhesion are required at the same time. Generally used bisphenol A epoxy resin with a large epoxy equivalent and a long epoxy chain length improves adhesion, but the glass transition temperature of the resin decreases, heat resistance deteriorates and solder heat resistance deteriorates. To do. In order to improve adhesion, a novolac epoxy resin may be used in combination, but cresol novolac epoxy resins and phenol novolac epoxy resins are not compatible with bisphenol A epoxy resins having a long chain length and are difficult to use. As described above, it is difficult to satisfy the adhesion and heat resistance at the same time.
[0006]
As a result of intensive studies to solve the above-mentioned problems, the present inventor uses both a bisphenol A type epoxy resin having an epoxy equivalent of 1000 to 2000 and a bisphenol A novolac epoxy resin, thereby simultaneously achieving adhesion and heat resistance. I found it satisfying. That is, a bisphenol A type epoxy resin having an epoxy equivalent of 1000 to 2000 has high adhesion. Bisphenol A novolac epoxy resin has high heat resistance. For this reason, the epoxy resin composition using these two in combination can achieve both adhesion and heat resistance. In general, cresol novolac epoxy resins and phenol novolac epoxy resins used for laminates are not compatible with long-chain bisphenol A type epoxy resins, whereas bisphenol A novolac epoxy resins have an isopropyl group in the structure, so long chain Excellent compatibility with bisphenol A type epoxy resin.
[0007]
[Means for Solving the Problems]
The present invention provides an epoxy resin composition comprising (A) a bisphenol A type epoxy resin having an epoxy equivalent of 1000 to 2000, (B) a bisphenol A novolac epoxy resin, and (C) a curing agent as essential components. Preferably, the epoxy resin composition is characterized in that (C) dicyandiamide is used as a curing agent.
Furthermore, the present invention is a prepreg obtained by impregnating a base material with the epoxy resin composition described above, and is a laminate formed by heating and pressing one or more of the prepregs. It is a board or a copper clad laminated board.
[0008]
The bisphenol A type epoxy resin having an epoxy equivalent of 1000 to 2000 used in the present invention is preferably 10 to 60 parts by weight in 100 parts by weight of the epoxy resin. If it is less than 10 parts by weight, the adhesion of the resin is not sufficient. In consideration of heat resistance, the epoxy equivalent is preferably about 1000, and in consideration of adhesion, the epoxy equivalent is preferably about 2000. In addition, a partially halogenated product can be used for the purpose of imparting flame resistance to the epoxy resin composition.
[0009]
The (B) bisphenol A novolac epoxy resin used in the present invention is desirably 15 parts by weight or more in 100 parts by weight of the epoxy resin. If it is less than 15 parts by weight, the heat resistance is lowered, which is not desirable. For the purpose of imparting flame resistance to the epoxy resin composition, a partially halogenated one can be used.
[0010]
Examples of the curing agent (C) used in the present invention include aromatic amine compounds, acid anhydrides, novolak resins, and the like, and are not particularly limited, but dicyandiamide is desirable in view of heat resistance.
[0011]
The epoxy resin composition of the present invention contains (A) the bisphenol A type epoxy resin having an epoxy equivalent of 1000 to 2000, (B) bisphenol A novolac epoxy resin, and (C) a curing agent as essential components. Other curing accelerators, coupling agents, and other components may be added as long as they do not contradict the purpose of the present invention.
[0012]
Although the epoxy resin composition of the present invention is used in various forms, a solvent is usually used when impregnating the base material. The solvent to be used needs to exhibit good solubility with respect to a part of the composition, but a poor solvent may be used as long as it does not adversely affect the composition.
[0013]
The varnish obtained by dissolving the epoxy resin composition of the present invention in a solvent is coated and impregnated on a substrate such as a glass woven fabric, a glass nonwoven paper, or a cloth containing components other than glass, and dried at 80 to 200 ° C. Thus, a prepreg for a printed wiring board can be obtained. Although the prepreg is used for producing a printed wiring board by heating and pressing, the epoxy resin composition of the present invention is suitably applied to a prepreg excellent in soldering heat resistance and a laminated board.
[0014]
【Example】
Hereinafter, the present invention will be specifically described with reference to examples.
[0015]
Example 1
40 parts by weight of brominated bisphenol A epoxy resin (Epicoat 6646 manufactured by Yuka Shell Epoxy Co., Ltd .: Epoxy equivalent 1550, bromination rate 31%), bisphenol A novolac epoxy resin (Epicoat 157S65 manufactured by Yuka Shell Epoxy Co., Ltd. 210) 60 Dimethylformamide was added to parts by weight, 3.3 parts by weight of dicyandiamide, and 0.15 parts by weight of 2-ethyl-4-methylimidazole, and the varnish was adjusted to a non-volatile content concentration of 60%. Using this varnish, 100 parts by weight of glass woven fabric (thickness 0.18 mm, manufactured by Nitto Boseki Co., Ltd.) was impregnated with 80 parts by weight of varnish solid, and dried in a dryer oven at 150 ° C. for 5 minutes. A prepreg having a resin content of 44.4% by weight was produced.
[0016]
6 sheets of the above prepreg are stacked, 35 μm thick electrolytic copper foils are stacked on the top and bottom, heat-pressed at a pressure of 40 kgf / cm 2 and a temperature of 190 ° C. for 120 minutes, and a double-sided copper-clad laminate with a thickness of 1.2 mm I got a plate.
Further, after blackening the double-sided copper-clad laminate, the above prepregs are stacked one by one on top and bottom, and an electrolytic copper foil having a thickness of 35 μm is stacked on top and bottom, and the pressure is 40 kgf / cm 2 and the temperature is 190 ° C. Minute heating and pressing were performed to obtain a multilayer printed wiring board having a thickness of 1.6 mm.
[0017]
The solder heat resistance and peel strength of the obtained laminate were measured according to JIS C 6481. The solder heat resistance was examined for the presence or absence of abnormal appearance after immersion in a solder bath at 260 ° C. for 120 seconds after a moisture absorption treatment for 2 hours at boiling. The solder heat resistance of the multilayer printed wiring board was examined for the presence or absence of abnormal appearance after dipping in a solder bath at 260 ° C. for 120 seconds after humidifying at a vapor pressure of 121 ° C. The obtained results are shown in Table 1 together with the composition of the resin composition.
[0018]
(Examples 2 to 4 and Comparative Examples 1 to 3)
A double-sided copper clad laminate was prepared in the same manner as in Example 1 except for the formulation shown in Tables 1 and 2. The evaluation results are shown in Tables 1 and 2. In the examples shown in Table 1, it can be seen that the inner layer peel strength is high, the glass transition point is high, and the solder heat resistance is excellent.
[0019]
[Table 1]
[Table 2]
Note 1) Epicote 6646 manufactured by Yuka Shell Epoxy
2) Epicoat 1006 manufactured by Yuka Shell Epoxy
3) Epicoat 828 manufactured by Yuka Shell Epoxy
4) Epicoat 5050 manufactured by Yuka Shell Epoxy
5) Epicoat 153S65 manufactured by Yuka Shell Epoxy
6) Epicoat 5047 manufactured by Yuka Shell Epoxy
7) N-690 manufactured by Dainippon Ink & Chemicals, Inc.
[0022]
【The invention's effect】
The present invention is an epoxy resin composition excellent in soldering heat resistance, and is a material that can cope with thinning, high multilayering, and high density especially when applied to multilayer printed wiring boards. The present invention provides a novel epoxy resin composition that is most suitable for printed wiring boards of equipment.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000064369A JP4496591B2 (en) | 2000-03-09 | 2000-03-09 | Epoxy resin composition, prepreg and laminate using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000064369A JP4496591B2 (en) | 2000-03-09 | 2000-03-09 | Epoxy resin composition, prepreg and laminate using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001253929A JP2001253929A (en) | 2001-09-18 |
| JP4496591B2 true JP4496591B2 (en) | 2010-07-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000064369A Expired - Fee Related JP4496591B2 (en) | 2000-03-09 | 2000-03-09 | Epoxy resin composition, prepreg and laminate using the same |
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| Country | Link |
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| JP (1) | JP4496591B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011079986A (en) * | 2009-10-08 | 2011-04-21 | Uniplus Electronics Co Ltd | Method for producing laminating adhesive having high thermal conductivity and low dissipation factor |
| JP6413915B2 (en) * | 2015-05-11 | 2018-10-31 | 信越化学工業株式会社 | Semiconductor sealing resin composition and semiconductor device provided with cured product thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61138621A (en) * | 1984-12-11 | 1986-06-26 | Sumitomo Bakelite Co Ltd | Production of epoxy resin laminated board |
| JPS6259021A (en) * | 1985-09-10 | 1987-03-14 | Sumitomo Bakelite Co Ltd | Manufacture of laminated sheet for printed circuit |
| JPH01152138A (en) * | 1987-12-09 | 1989-06-14 | Sumitomo Bakelite Co Ltd | Production of laminate for printed circuit |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61246228A (en) * | 1985-04-24 | 1986-11-01 | Shin Kobe Electric Mach Co Ltd | Resin composition for laminate |
| JPH11228670A (en) * | 1998-02-19 | 1999-08-24 | Hitachi Chem Co Ltd | Epoxy resin composition, epoxy resin prepreg, epoxy resin laminate and metal-clad epoxy resin laminate |
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2000
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61138621A (en) * | 1984-12-11 | 1986-06-26 | Sumitomo Bakelite Co Ltd | Production of epoxy resin laminated board |
| JPS6259021A (en) * | 1985-09-10 | 1987-03-14 | Sumitomo Bakelite Co Ltd | Manufacture of laminated sheet for printed circuit |
| JPH01152138A (en) * | 1987-12-09 | 1989-06-14 | Sumitomo Bakelite Co Ltd | Production of laminate for printed circuit |
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| JP2001253929A (en) | 2001-09-18 |
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