JPH05286074A - Copper-clad laminate - Google Patents

Abstract

PURPOSE:To improve durability and interlaminar strength by using a prepreg formed by reacting an epoxy resin, phenols and a curing agent at the time of manufacture while specifying the glass transition point temperature of a curable resin and ply separation strength between glass cloth respectively. CONSTITUTION:A copper-clad laminate is applied as the substrate of a printed circuit board, and constituted while mainly comprising a specific prepreg. The specific prepreg is formed by reacting a polyfunctional epoxy resin, a bifunctional epoxy resin, bivalent phenols and a curing agent at the time of the manufacture of the prepreg. The glass transition point temperature of a curable resin is set at 145 deg.C or higher. Ply separation strength between glass cloth in the laminated board is set in 0.9kgf/cm<2> or more. Accordingly, the copper-clad laminate having excellent high heat resistance, interlaminar strength, shock resistance and workability while having high interlaminar strength in spite of the high glass transition point temperature and high reliability is obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to heat resistance, interlayer bond strength,
The present invention relates to a copper clad laminate having excellent impact resistance and workability.

[0002]

2. Description of the Related Art In recent years, with the development of electronic equipment, printed circuit boards have come to be used in various fields, and the substrate materials thereof have been required to have many characteristics. The heat resistance of the substrate is one of the important items. In conventional heat-resistant substrates, the interlayer bond strength tends to decrease as the glass transition temperature of the resin is raised, and therefore impact resistance and workability, moisture absorption when multilayered, heat resistance characteristics, etc. There was a drawback that it was inferior to the ordinary FR-4 material.

[0003]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned drawbacks, and provides a copper clad laminate having high heat resistance, interlayer bond strength, impact resistance, and workability. It is what

[0004]

As a result of intensive studies aimed at achieving the above object, the present inventors have found that the above object can be achieved by reacting a resin component during prepreg production. Has been completed.

That is, the present invention relates to a polyfunctional epoxy resin, 2
Functional epoxy resin, dihydric phenols and curing agent,
The prepreg that was reacted during the production of prepreg is used, and the glass transition temperature of the cured resin is 145 ℃ or more, and the delamination strength between the glass cloth in the laminate is 0.9 kgf / cm ²
It is a copper clad laminate characterized by the above.

The present invention will be described in detail below.

The prepreg used in the present invention is obtained by coating and impregnating a base material with a polyfunctional epoxy resin, a bifunctional epoxy resin, a dihydric phenol and a curing agent and reacting them during the production of the prepreg.

Examples of the polyfunctional epoxy resin used in the prepreg include cresol novolac epoxy resin, phenol novolac epoxy resin, bisphenol A novolac epoxy resin and various trifunctional and tetrafunctional epoxy resins, which may be used alone or in combination. Can be used.

Examples of the bifunctional epoxy resin used for the prepreg include a bisphenol A type epoxy resin and a bisphenol F type epoxy resin, which can be used alone or in combination.

The dihydric phenols used in the prepreg include bisphenol A, tetrabromobisphenol A, methylenebisphenol, tetrabromomethylenebisphenol and the like, and these can be used alone or in combination.

Examples of the curing agent used in the prepreg include dicyandiamides and phenols, and specific compounds of the phenols include phenol novolac, cresol novolac, and bisphenol A novolac. It is not something that will be done. These can be used alone or in combination.
Examples of the curing accelerator include imidazoles, tertiary ammonium salts, tertiary amines and the like, and these can be used alone or in combination.

Next, the blending ratio of each of the above components will be described.

The blending ratio of the polyfunctional epoxy resin is preferably 20 to 50 parts by weight based on 100 parts by weight of the total amount of the bifunctional epoxy resin and the dihydric phenol. If the proportion is less than 20 parts by weight, the glass transition temperature is low, and if it exceeds 50 parts by weight, impact resistance and workability are deteriorated, which is not preferable.

The mixing ratio of the dihydric phenol is preferably 20 to 50 parts by weight based on 100 parts by weight of the total amount of the bifunctional epoxy resin and the dihydric phenol. The proportion is
If it is less than 20 parts by weight, impact resistance and workability are insufficient,
Further, if it exceeds 50 parts by weight, the glass transition temperature becomes low, which is not preferable.

The glass transition temperature is preferably 145 ° C. or higher. If the glass transition temperature of the cured resin is less than 145 ° C, the heat resistance is poor, which is not preferable. Further, it is desirable that the delamination strength between the glass cloths in the laminated plate is 0.9 kgf / cm ² or more. If the interlaminar peel strength is less than 0.9 kgf / cm ² , it is not preferable because the workability is poor.

The prepreg used in the present invention is not obtained by coating, impregnating and drying a resin composition obtained by pre-reacting each of the above components on a substrate, but coating each component on the substrate. It is produced by reacting during impregnation and drying. This prepreg can be laminated with a copper foil and integrally molded by heat and pressure to produce a copper clad laminate.

[0017]

The present invention is characterized in that a polyfunctional epoxy resin, a bifunctional epoxy resin and a dihydric phenol are reacted during the production of a prepreg. Conventionally, a resin composition for lamination has been manufactured by reacting an epoxy resin and a dihydric phenol A in a reaction vessel to polymerize the resin, and then coating, impregnating and drying the base material to produce a prepreg. On the other hand, in the present invention, the low molecular weight components before the reaction are applied to improve the impregnation property into the glass cloth, etc., and the reaction of the components is promoted during the production of the prepreg, so that the epoxy resin and the divalent phenol can be reacted. A
By controlling the competitive reaction between the curing agent and the curing agent, the impact resistance and workability, which were the drawbacks of heat-resistant epoxy resin, have been greatly improved.

[0018]

EXAMPLES Next, the present invention will be explained by examples. The invention is not limited by these examples.
In the following examples and comparative examples, "part" means "part by weight".

EXAMPLE Multifunctional epoxy resin YDCN704 (Tohto Kasei Co., Ltd. cresol novolac epoxy resin, trade name) 35 parts, Bifunctional epoxy resin Epicoat 828 (Okaka Shell Epoxy Co., trade name) 30 parts, tetrabromobisphenol A35
Part, 25 parts of phenol novolac resin, and 50 parts of methyl cellosolve were heated and dissolved at 80 ° C. to obtain a uniform solution. After cooling this solution, 2-ethyl-4-methylimidazole 0.1
5 parts were added to obtain a varnish.

Silane-treated glass cloth is dipped in this varnish to apply and impregnate it, and is dried in a vertical dryer to react a polyfunctional epoxy resin and a bifunctional epoxy resin with a dihydric phenol to prepare a prepreg. Was manufactured.

A plurality of these prepregs were stacked, copper foils were stacked on the front and back, and pressure was applied for 2 hours at a pressure of 40 kg / cm ² and a temperature of 180 ° C. to produce a copper clad laminate.

Examples 2 to 4 Using the composition shown in Table 1, a prepreg was prepared in the same manner as in Example 1, and a copper clad laminate was manufactured in the same manner as in Example 1.

Comparative Examples 1-2 A prepreg having the composition shown in Table 1 was prepared in the same manner as in Example 1, and a copper clad laminate was manufactured in the same manner as in Example 1.

Using the copper clad laminates produced in Examples 1 to 4 and Comparative Examples 1 to 2, the glass transition temperature, delamination strength, measling property, interlaminar strength at impact, and solder resistance were tested. The results are shown in Table 2. The glass transition temperature was measured by the TMA method. Delamination strength was tested on one layer of 180 μm glass cloth. The measling property is
After being immersed in a solder bath at 260 ° C for 30 seconds after PCT at 2 atm for 5 hours, the test was performed. The copper-clad laminate of the present invention was excellent in all properties, and the effects of the present invention could be confirmed.

[0025]

[Table 1] * 1: Brominated bisphenol A epoxy resin (bromination rate
21%) Ciba Geigy product name. * 2: Phenol equivalent of about 120.

[0026]

[Table 2] *: Regarding the measling property, interlaminar strength at impact, and solder resistance, ○ indicates no abnormality, Δ indicates some abnormality, and × indicates abnormality.

[0027]

As is clear from the above description and Table 2, the copper clad laminate of the present invention is excellent in high heat resistance, interlayer bond strength, impact resistance and workability, and has a high glass transition temperature. Nevertheless, the interlayer strength is high and the reliability is high.

Claims (1)

[Claims] 1. A prepreg obtained by reacting a polyfunctional epoxy resin, a bifunctional epoxy resin, a dihydric phenol and a curing agent during the production of a prepreg, wherein the cured resin has a glass transition temperature of 145 ° C. or higher, A copper clad laminate having a delamination strength of 0.9 kgf / cm ² or more between glass cloths.