JPH05318653A - Manufacture of flame-retardant copper-clad laminate - Google Patents

Manufacture of flame-retardant copper-clad laminate

Info

Publication number
JPH05318653A
JPH05318653A JP4155759A JP15575992A JPH05318653A JP H05318653 A JPH05318653 A JP H05318653A JP 4155759 A JP4155759 A JP 4155759A JP 15575992 A JP15575992 A JP 15575992A JP H05318653 A JPH05318653 A JP H05318653A
Authority
JP
Japan
Prior art keywords
flame
epoxy resin
clad laminate
prepreg
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4155759A
Other languages
Japanese (ja)
Inventor
Tokuo Kurokawa
徳雄 黒川
Masaaki Ueki
正暁 上木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Corp filed Critical Toshiba Chemical Corp
Priority to JP4155759A priority Critical patent/JPH05318653A/en
Publication of JPH05318653A publication Critical patent/JPH05318653A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To ensure that a flame-retardant copper-clad laminate of high quality is obtained which meets safety and environmental requirements by impregnating the sheet with a blend of bifunctional epoxy resin, dihydric phenols, a curing agent and aluminum hydroxide as essential ingredients, then laminating a prepreg obtained by chemical reaction with the bifunctional epoxy resin, divalent phenols and curing agent on a copper foil and molding these materials in one piece under heat and pressure. CONSTITUTION:A flame-retardent copper-clad laminate consists of bifunctional epoxy resin, divalent phenols, a curiang agent and aluminum hydroxide as essential ingredients. A prepreg is prepared by applying the essential ingredients to a base material and allowing the ingredients to undergo a chemical reaction in the B stage during the subsequent impregnation and drying processes, instead of applying, impregnating and drying a resin composition obtained by running the essential ingredients through a previous chemical reaction. The prepreg thus obtained is stacked on the copper foil and these materials are molded in one piece under heat and pressure. This flame-retardant copper-clad laminate, containing aluminum hydroxide in the resin, is perfect from a safety and environmental viewpoint, because water is adsorbed from aluminum hydroxide during the burning process and the adsorbed water is used for fire resistance.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、臭素化合物を含まず、
安全性、耐ミーズリング性等にも優れた難燃性銅張積層
板の製造方法に関する。
The present invention does not contain bromine compounds,
The present invention relates to a method for producing a flame-retardant copper-clad laminate excellent in safety and measling resistance.

【0002】[0002]

【従来の技術】近年、電子機器の発達によりプリント回
路板が、各種の分野に用いられるようになってきてお
り、その基板材料は安全上大部分が難燃タイプ(UL9
4のV−0)となってきている。
2. Description of the Related Art In recent years, with the development of electronic equipment, printed circuit boards have come to be used in various fields, and most of the substrate materials are flame-retardant (UL9) for safety reasons.
4 V-0).

【0003】しかしながら、従来の難燃性基板は、難燃
化のために臭素化エポキシ樹脂等の臭素化合物を使用し
ている。臭素化合物は難燃化の効果は大きいが、燃焼、
熱分解により有毒で刺激の強いガスを発生し、環境上、
安全上好ましくない。このように臭素化合物は難燃性基
板に用いられているにもかかわらず、有毒ガス発生等と
いった大きな欠点があった。
However, the conventional flame-retardant substrate uses a bromine compound such as a brominated epoxy resin for flame retardation. Although bromine compounds have a large flame retardant effect, combustion,
Due to thermal decomposition, toxic and irritating gas is generated,
Not safe. As described above, although the bromine compound is used for the flame-retardant substrate, it has a serious drawback such as generation of toxic gas.

【0004】[0004]

【発明が解決しようとする課題】本発明は、上記の欠点
を解消するためになされたもので、臭素化合物を含まな
い、安全性、環境上に優れ、かつ耐ミーズリング性、接
着性の良好な難燃性銅張積層板の製造方法を提供しよう
とするものである。
DISCLOSURE OF THE INVENTION The present invention has been made to solve the above-mentioned drawbacks, and is free of bromine compounds, excellent in safety and environment, and excellent in measling resistance and adhesiveness. Another object of the present invention is to provide a method for producing a flame-retardant copper-clad laminate.

【0005】[0005]

【課題を解決するための手段】本発明者らは、上記の目
的を達成しようと鋭意研究をすすめた結果、樹脂中に多
量のアルミニウムを含有させ、またプリプレグ製造時に
樹脂成分を反応させることによって、上記目的の安定し
た製造方法が達成できることを見いだし、本発明を完成
したものである。
Means for Solving the Problems As a result of intensive research aimed at achieving the above-mentioned objects, the present inventors have found that a large amount of aluminum is contained in a resin, and a resin component is reacted during the production of a prepreg. The present invention has been completed by finding that the stable manufacturing method for the above purpose can be achieved.

【0006】即ち、本発明は、2官能エポキシ樹脂、 2
価フェノール類、硬化剤および水酸化アルミニウムを必
須成分とし、プリプレグ製造工程において上記必須成分
の混合物を含浸するとともに 2官能エポキシ樹脂、 2価
フェノール類および硬化剤とを反応させてなるプリプレ
グを、銅箔とともに積層し加熱加圧一体に成形すること
を特徴とする難燃性銅張積層板の製造方法である。
That is, the present invention relates to a bifunctional epoxy resin, 2
A prepreg obtained by impregnating a mixture of the above essential components in a prepreg manufacturing process with a dihydric phenol resin, a curing agent and aluminum hydroxide as essential components and reacting the bifunctional epoxy resin, the dihydric phenols and the curing agent with copper. A method for producing a flame-retardant copper-clad laminate, which is characterized in that the foil is laminated with a foil and integrally molded under heat and pressure.

【0007】以下、本発明を詳細に説明する。The present invention will be described in detail below.

【0008】本発明に用いるプリプレグは、 2官能エポ
キシ樹脂、 2価フェノール類、硬化剤および水酸化アル
ミニウムの混合物を基材に塗布・含浸し、プリプレグ製
造時に 2官能エポキシ樹脂、 2価フェノール類および硬
化剤の反応させてなるものである。
The prepreg used in the present invention is obtained by coating and impregnating a base material with a mixture of a bifunctional epoxy resin, a dihydric phenol, a curing agent and aluminum hydroxide, and at the time of producing a prepreg, a bifunctional epoxy resin, a dihydric phenol and It is a reaction of a curing agent.

【0009】プリプレグに用いる 2官能エポキシ樹脂と
しては、ビスフェノールA系エポキシ樹脂、ビスフェノ
ールF系エポキシ樹脂等が挙げられ、これらは単独又は
混合して使用することができる。また必要に応じてクレ
ゾールノボラックエポキシ樹脂、フェノールノボラック
エポキシ樹脂、ビスフェノールAノボラックエポキシ樹
脂、その他の 3官能、 4官能等の多官能エポキシ樹脂を
配合することも可能である。
Examples of the bifunctional epoxy resin used for the prepreg include a bisphenol A type epoxy resin and a bisphenol F type epoxy resin, which can be used alone or in combination. If necessary, cresol novolac epoxy resin, phenol novolac epoxy resin, bisphenol A novolac epoxy resin, and other polyfunctional epoxy resins such as trifunctional and tetrafunctional compounds can be blended.

【0010】また、プリプレグに用いる 2価フェノール
類としては、ビスフェノールA、メチレンビスフェノー
ル等が挙げられ、これらは単独又は混合して使用するこ
とができる。
Examples of the dihydric phenols used in the prepreg include bisphenol A and methylene bisphenol, which can be used alone or in combination.

【0011】プリプレグに用いる硬化剤としては、ジシ
アンジアミド類、フェノール類を挙げることができ、フ
ェノール類の具体的な化合物としては、フェノールノボ
ラック、クレゾールノボラック、ビスフェノールAノボ
ラック等が一般的であるが、特に限定されるものではな
い。これらは単独又は混合して使用することができる。
また、硬化促進剤としては、イミダゾール類、3級アン
モニウム塩、3級アミン等が挙げられ、これらは単独又
は混合して使用することができる。
Examples of the curing agent used for the prepreg include dicyandiamides and phenols, and specific compounds of the phenols include phenol novolac, cresol novolac, and bisphenol A novolac. It is not limited. These can be used alone or in combination.
In addition, examples of the curing accelerator include imidazoles, tertiary ammonium salts, tertiary amines, and the like, and these can be used alone or in combination.

【0012】本発明に用いる水酸化アルミニウムとして
は、通常積層板に用いるものが使用でき粒径等特に限定
されるものではないが、作業上高充填できる数μm 程度
の粒径のものが好ましい。
As the aluminum hydroxide used in the present invention, those which are usually used for laminated plates can be used, and the particle size and the like are not particularly limited, but those having a particle size of several μm which can be highly filled in operation are preferable.

【0013】本発明において用いるプリプレグは、以上
の各成分を予め反応させて樹脂組成物としたものを基材
に塗布・含浸・乾燥させて得たものではなく、各成分を
基材に塗布・含浸・乾燥中においてBステージ反応をさ
せて製造したものである。こうして得たプリプレグと銅
箔を重ねて加熱加圧、一体に積層成形して難燃性銅張積
層板を製造することができる。
The prepreg used in the present invention is not obtained by coating, impregnating and drying a base material with a resin composition prepared by preliminarily reacting each of the above components. It is produced by a B-stage reaction during impregnation and drying. The flame-retardant copper-clad laminate can be manufactured by stacking the prepreg and the copper foil thus obtained, heating and pressurizing, and integrally laminating.

【0014】[0014]

【作用】本発明の製造方法による難燃性銅張積層板は、
樹脂中に水酸化アルミニウムを含有させることによっ
て、燃焼時に水酸化アルミニウム中の水を離脱させ、離
脱成分の水を難燃化に利用させているため、安全上、環
境上全く問題がない。また、従来積層用の樹脂組成物
は、エポキシ樹脂と 2価フェノールAを反応釜中で反応
させて高分子化した後、基材に塗布・含浸・乾燥させて
プリプレグを製造していた。これに対して、本発明では
反応前の低分子の各成分の混合物を塗布してガラスクロ
ス等への含浸性を改善し、またプリプレグ製造時に各成
分のBステージ反応を進めることにより、2 官能エポキ
シ樹脂と 2価フェノールと硬化剤間での競争反応をコン
トロールする方法を採用し、耐熱エポキシ樹脂の欠点で
あった耐衝撃性、加工性を大幅に改善し、接着性、耐ミ
ーズリング性を向上させたものである。
The flame-retardant copper-clad laminate according to the manufacturing method of the present invention is
By including aluminum hydroxide in the resin, water in the aluminum hydroxide is released at the time of combustion, and the water as a leaving component is used for flame retardancy, so there is no safety or environmental problem at all. In the conventional resin composition for lamination, epoxy resin and dihydric phenol A are reacted in a reaction vessel to polymerize, and then coated, impregnated and dried on a substrate to produce a prepreg. On the other hand, in the present invention, a mixture of low molecular weight components before the reaction is applied to improve the impregnation property into glass cloth and the like, and the B stage reaction of the respective components is promoted during the production of the prepreg, whereby the bifunctional By adopting a method that controls the competitive reaction between the epoxy resin, dihydric phenol and curing agent, the impact resistance and workability, which were the drawbacks of heat-resistant epoxy resin, have been greatly improved, and adhesion and measling resistance have been improved. It is an improvement.

【0015】[0015]

【実施例】次に本発明を実施例によって説明する。本発
明はこれらの実施例よって限定されるものではない。以
下の実施例および比較例において、「部」とは「重量
部」を意味する。
EXAMPLES The present invention will now be described with reference to examples. The invention is not limited by these examples. In the following examples and comparative examples, "part" means "part by weight".

【0016】実施例1 2官能エポキシ樹脂のエピコート828(油化シェルエ
ポキシ社製、商品名)90部、多官能エポキシ樹脂YDC
N704(東都化成社製、クレゾールノボラックエポキ
シ樹脂、商品名)10部、ビスフェノールA40部、ジジア
ンジアミド 6部およびメチルセロソルブ60部を加熱溶解
して均一な溶液を得た。この溶液を冷却後に2-エチル−
4-メチルイミダゾール 0.12 部を添加し、さらに水酸化
アルミニウムのハイジライトH31(日本軽金属社製、
商品名) 100部を加えてディスパースで十分攪拌してワ
ニスを作成した。
Example 1 Bifunctional epoxy resin Epicoat 828 (manufactured by Yuka Shell Epoxy Co., trade name) 90 parts, multifunctional epoxy resin YDC
N704 (manufactured by Tohto Kasei Co., cresol novolac epoxy resin, trade name), 10 parts of bisphenol A, 6 parts of didiandiamide and 60 parts of methyl cellosolve were dissolved by heating to obtain a uniform solution. After cooling the solution, 2-ethyl-
4-methylimidazole 0.12 parts was added, and aluminum hydroxide Hydilite H31 (manufactured by Nippon Light Metal Co., Ltd.,
A varnish was prepared by adding 100 parts of the product name and thoroughly stirring with a disperse.

【0017】このワニスに、シラン処理したガラスクロ
スを浸漬して塗布・含浸し、縦型乾燥機で乾燥して 2官
能エポキシ樹脂と 2価フェノール類を反応させてプリプ
レグを製造した。
Silane-treated glass cloth was dipped in this varnish to apply and impregnate it, and dried in a vertical dryer to react the bifunctional epoxy resin with the dihydric phenol to produce a prepreg.

【0018】このプリプレグを複数枚重ね、さらに銅箔
を表裏に重ねて圧力40kg/cm2 ,温度 180℃で 2時間加
熱加圧して難燃性銅張積層板を製造した。
A plurality of the prepregs were stacked, copper foils were stacked on the front and back, and heated and pressed at a pressure of 40 kg / cm 2 and a temperature of 180 ° C. for 2 hours to produce a flame-retardant copper-clad laminate.

【0019】実施例2〜4 表1に示した組成で、実施例1と同様にしてプリプレグ
をつくり、さらに実施例1と同様にして難燃性銅張積層
板を製造した。
Examples 2 to 4 Using the composition shown in Table 1, a prepreg was prepared in the same manner as in Example 1, and a flame-retardant copper-clad laminate was manufactured in the same manner as in Example 1.

【0020】比較例1〜2 表1に示した組成で、実施例1と同様にしてプリプレグ
をつくり、さらに実施例1と同様にして難燃性銅張積層
板を製造した。
Comparative Examples 1-2 A prepreg having the composition shown in Table 1 was prepared in the same manner as in Example 1, and a flame-retardant copper-clad laminate was manufactured in the same manner as in Example 1.

【0021】実施例1〜4および比較例1〜2で製造し
た難燃性銅張積層板を用いて、ガラス転移温度、銅箔剥
離強度、耐ミーズリング性、難燃性、刺激臭ガス発生の
有無を試験したので、その結果を表1に示した。ガラス
転移温度はTMA法で測定した。銅箔剥離強度は、18μ
m の銅箔を用いて試験した。耐ミーズング性は、煮沸4
時間後、 260℃の半田浴に30秒間浸漬した後のものを目
視で評価した。難燃性はUL94によって試験した。刺
激臭ガス発生は、燃焼時の刺激臭ガス発生の有無を試験
した。本発明による難燃性銅張積層板は、いずれの特性
についても優れており、本発明の効果を確認することが
できた。
Using the flame-retardant copper-clad laminates produced in Examples 1 to 4 and Comparative Examples 1 to 2, glass transition temperature, copper foil peel strength, resistance to measling, flame retardancy, and generation of irritating odor gas. The results were shown in Table 1. The glass transition temperature was measured by the TMA method. Copper foil peel strength is 18μ
Tested with m 2 copper foil. The boiling resistance is 4
After a lapse of time, the product after being immersed in a solder bath at 260 ° C. for 30 seconds was visually evaluated. Flame retardance was tested by UL94. For the generation of irritating odor gas, the presence or absence of irritating odor gas during combustion was tested. The flame-retardant copper-clad laminate according to the present invention was excellent in all properties, and the effects of the present invention could be confirmed.

【0022】[0022]

【表1】 *1 :臭素化ビスフェノールAエポキシ樹脂(臭素化率
21%)チパガイギー社製、商品名。 *2 :フェノール当量約 120。 *3 :表面プリプレグはハイジライトH31なしのもの
を使用した。 *4 :煮沸 4時間後、 260℃の半田浴に30秒間浸漬した
後のものを目視で評価した。○印…フクレなし。 *5 :○印…発生なし。
[Table 1] * 1: Brominated bisphenol A epoxy resin (bromination rate
21%) Product name, manufactured by Chipa Geigy. * 2: Phenol equivalent of about 120. * 3: The surface prepreg used was one without Heidilite H31. * 4: After boiling for 4 hours, the product was immersed in a solder bath at 260 ° C for 30 seconds and visually evaluated. ○: No blister. * 5: ○: No occurrence.

【0023】[0023]

【発明の効果】以上の説明および1表から明らかなよ
う、本発明の製造方法による難燃性銅張積層板は、臭素
化合物を含まないため有毒ガスを発生することはなく、
安全性、環境上優れたものであり、また耐ミーズリング
性など信頼性が高く難燃性である。
As is apparent from the above description and Table 1, the flame-retardant copper-clad laminate produced by the production method of the present invention does not contain a bromine compound and therefore does not generate a toxic gas.
It is excellent in safety and environment, and is highly reliable and flame retardant such as measling resistance.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 C08K 3/20 7242−4J C08L 63/00 NJF 8830−4J H05K 1/03 K 7011−4E ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI Technical display area C08K 3/20 7242-4J C08L 63/00 NJF 8830-4J H05K 1/03 K 7011-4E

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 2官能エポキシ樹脂、 2価フェノール
類、硬化剤および水酸化アルミニウムを必須成分とし、
プリプレグ製造工程において上記必須成分の混合物を含
浸するとともに 2官能エポキシ樹脂、 2価フェノール類
および硬化剤とを反応させてなるプリプレグを、銅箔と
ともに積層し加熱加圧一体に成形することを特徴とする
難燃性銅張積層板の製造方法。
1. A bifunctional epoxy resin, a divalent phenol, a curing agent and aluminum hydroxide as essential components,
In the prepreg manufacturing process, a prepreg obtained by impregnating the mixture of the above essential components and reacting a bifunctional epoxy resin, a dihydric phenol and a curing agent is laminated with a copper foil, and integrally molded by heating and pressurizing. A method for producing a flame-retardant copper-clad laminate.
JP4155759A 1992-05-23 1992-05-23 Manufacture of flame-retardant copper-clad laminate Pending JPH05318653A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4155759A JPH05318653A (en) 1992-05-23 1992-05-23 Manufacture of flame-retardant copper-clad laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4155759A JPH05318653A (en) 1992-05-23 1992-05-23 Manufacture of flame-retardant copper-clad laminate

Publications (1)

Publication Number Publication Date
JPH05318653A true JPH05318653A (en) 1993-12-03

Family

ID=15612791

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4155759A Pending JPH05318653A (en) 1992-05-23 1992-05-23 Manufacture of flame-retardant copper-clad laminate

Country Status (1)

Country Link
JP (1) JPH05318653A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996028511A1 (en) * 1995-03-10 1996-09-19 Toshiba Chemical Corporation Halogen-free flame-retardant epoxy resin composition
EP0795570A4 (en) * 1995-09-29 2001-01-24 Toshiba Chem Corp Halogen-free flame-retardant epoxy resin composition, and prepreg and laminate containing the same
US6214455B1 (en) 1995-09-29 2001-04-10 Toshiba Chemical Corporation Bisphenol A and novolak epoxy resins with nitrogen-containing phenolic resin
US6730402B2 (en) 1999-12-08 2004-05-04 Nec Corporation Flame-retardant epoxy resin composition and laminate made with the same
CN101921457A (en) * 2010-07-05 2010-12-22 江苏星源航天材料股份有限公司 Material and production process for producing copper-clad plate
WO2019203291A1 (en) * 2018-04-20 2019-10-24 三菱瓦斯化学株式会社 Thermosetting composition, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996028511A1 (en) * 1995-03-10 1996-09-19 Toshiba Chemical Corporation Halogen-free flame-retardant epoxy resin composition
EP0795570A4 (en) * 1995-09-29 2001-01-24 Toshiba Chem Corp Halogen-free flame-retardant epoxy resin composition, and prepreg and laminate containing the same
US6214455B1 (en) 1995-09-29 2001-04-10 Toshiba Chemical Corporation Bisphenol A and novolak epoxy resins with nitrogen-containing phenolic resin
US6730402B2 (en) 1999-12-08 2004-05-04 Nec Corporation Flame-retardant epoxy resin composition and laminate made with the same
CN101921457A (en) * 2010-07-05 2010-12-22 江苏星源航天材料股份有限公司 Material and production process for producing copper-clad plate
WO2019203291A1 (en) * 2018-04-20 2019-10-24 三菱瓦斯化学株式会社 Thermosetting composition, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board
CN112004855A (en) * 2018-04-20 2020-11-27 三菱瓦斯化学株式会社 Thermosetting composition, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board
JPWO2019203291A1 (en) * 2018-04-20 2021-05-20 三菱瓦斯化学株式会社 Thermosetting compositions, prepregs, laminates, metal foil-clad laminates, printed wiring boards and multilayer printed wiring boards
CN112004855B (en) * 2018-04-20 2024-01-12 三菱瓦斯化学株式会社 Thermosetting composition, prepreg, laminated board, metal foil-clad laminated board, printed wiring board, and multilayer printed wiring board

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