JPH05170949A - Prepreg - Google Patents
PrepregInfo
- Publication number
- JPH05170949A JPH05170949A JP34047191A JP34047191A JPH05170949A JP H05170949 A JPH05170949 A JP H05170949A JP 34047191 A JP34047191 A JP 34047191A JP 34047191 A JP34047191 A JP 34047191A JP H05170949 A JPH05170949 A JP H05170949A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- prepreg
- epoxy resin
- thermosetting resin
- highly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント配線板の製造
に用いられるプリプレグ、特に多層プリント配線板の製
造の際の接着用に用いられるプリプレグに関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a prepreg used for manufacturing a printed wiring board, and more particularly to a prepreg used for bonding in manufacturing a multilayer printed wiring board.
【０００２】[0002]
【従来の技術】プリント配線板は、ガラス布等の基材に
エポキシ樹脂等の熱硬化性樹脂を含浸乾燥してＢステー
ジのプリプレグを作成し、このプリプレグを複数枚重ね
ると共にさらに銅箔等の金属箔を重ねて加熱加圧成形す
ることによって金属箔張り積層板を作成し、この積層板
の金属箔をエッチング加工等して回路形成することによ
って製造することができる。またこのように製造したプ
リント配線板を内層回路板とし、内層回路板にプリプレ
グを介して外層の金属箔（あるいは外層回路板）を重ね
て加熱加圧成形することによって、多層プリント配線板
を製造することがきる。2. Description of the Related Art A printed wiring board is manufactured by impregnating a base material such as glass cloth with a thermosetting resin such as epoxy resin and drying it to prepare a B-stage prepreg. A metal foil-clad laminate can be produced by stacking metal foils and heat-pressing them, and the metal foils of the laminates can be etched to form a circuit. Also, the printed wiring board manufactured in this way is used as the inner layer circuit board, and the outer layer metal foil (or outer layer circuit board) is overlaid on the inner layer circuit board via the prepreg and heat-pressed to produce a multilayer printed wiring board. I can do it.
【０００３】そしてこのようなプリプレグを作成するた
めに用いる樹脂としては、臭素化ビスフェノールＡ型エ
ポキシ樹脂にフェノールノボラック型エポキシ樹脂、ク
レゾールノボラック型エポキシ樹脂又はビスフェノール
Ａ型ノボラックエポキシ樹脂や４官能エポキシ樹脂、さ
らに必要に応じてフェノキシ樹脂などの粘性調節剤など
を配合して調製したものが広く用いられている。As a resin used for preparing such a prepreg, a brominated bisphenol A type epoxy resin, a phenol novolac type epoxy resin, a cresol novolac type epoxy resin, a bisphenol A type novolac epoxy resin or a tetrafunctional epoxy resin, Further, those prepared by blending a viscosity modifier such as a phenoxy resin as needed are widely used.
【０００４】しかし、最近の表面実装の増加やプリント
配線板の薄型化によってプリント配線板の耐湿性の向上
に対する要望が高まっている。このために米国特許第４
５９９２６８号などにみられるように、フェノール性水
酸基を有するノボラック樹脂などを硬化剤として配合し
たエポキシ樹脂が高耐湿性の熱硬化性樹脂として提供さ
れており、このような高耐湿性の熱硬化性樹脂を含浸し
て作成したプリプレグを用いることによって、耐湿性の
高いプリント配線板を提供することが試みられている。However, due to the recent increase in surface mounting and the thinning of printed wiring boards, there is an increasing demand for improvement in moisture resistance of printed wiring boards. For this purpose, US Pat.
No. 599268 and the like, an epoxy resin containing a novolac resin having a phenolic hydroxyl group as a curing agent is provided as a thermosetting resin having high humidity resistance. By using a prepreg impregnated with a resin, it has been attempted to provide a printed wiring board having high moisture resistance.
【０００５】[0005]
【発明が解決しようとする課題】しかし、フェノール性
水酸基を有するノボラック樹脂などを硬化剤として配合
したエポキシ樹脂のような高耐湿性の熱硬化性樹脂は接
着性能に問題があった。銅箔等の金属箔とのピール強度
やプリプレグ間の接着力は実用に耐え得る程度である
が、プリプレグを多層プリント配線板を製造する際に内
層回路板と外層の金属箔との接着に用いる場合には、内
層回路板の表面に作成されている回路との間の接着強度
が大きく低下するものであった。この内層回路板の回路
は銅箔などの金属箔によって作成されているが、この回
路の表面には酸化処理をして酸化銅の被膜を形成させる
ことによって粗面化し密着性を高めるための処理が施さ
れており（この処理を一般に黒化処理という）、かえっ
て上記の高耐湿性の熱硬化性樹脂はこの黒化処理面との
接着強度が低くなるのである。従って、多層積層板をド
リル加工してスルーホールを形成すると内層回路とプリ
プレグの硬化層との間に剥離が生じ、スルーホールメッ
キを施す際にメッキ液がこの剥離部分に浸入するハロー
不良が発生するおそれがあり、多層プリント配線板の接
着用のプリプレグとして用いることができないものであ
った。However, a thermosetting resin having a high humidity resistance such as an epoxy resin containing a novolac resin having a phenolic hydroxyl group as a curing agent has a problem in adhesion performance. Peel strength with metal foil such as copper foil and adhesive strength between prepregs are practically usable, but prepregs are used for adhesion between inner layer circuit board and outer layer metal foil when manufacturing a multilayer printed wiring board. In this case, the adhesive strength between the inner layer circuit board and the circuit formed on the surface of the inner layer circuit board was significantly reduced. The circuit of this inner layer circuit board is made of metal foil such as copper foil, but the surface of this circuit is oxidized to form a copper oxide film to roughen the surface and improve adhesion. (This treatment is generally referred to as blackening treatment), and on the contrary, the above-mentioned thermosetting resin having high humidity resistance has low adhesive strength with the blackened surface. Therefore, when drilling a multilayer laminated plate to form a through hole, peeling occurs between the inner layer circuit and the hardened layer of the prepreg, causing a halo defect that the plating solution penetrates into this peeled portion during through hole plating. Therefore, it cannot be used as a prepreg for bonding a multilayer printed wiring board.
【０００６】本発明は上記の点に鑑みてなされたもので
あり、耐湿性を保持しつつ接着性を高めて多層プリント
配線板を製造することができるプリプレグを提供するこ
とを目的とするものである。The present invention has been made in view of the above points, and it is an object of the present invention to provide a prepreg capable of manufacturing a multilayer printed wiring board by improving adhesiveness while maintaining moisture resistance. is there.
【０００７】[0007]
【課題を解決するための手段】本発明に係るプリプレグ
は、基材の厚み方向の中央部に高耐湿性の熱硬化性樹脂
が、基材の表面部に高耐湿性熱硬化性樹脂よりも接着性
が高い熱硬化性樹脂がそれぞれ含有されて成ることを特
徴とするものである。以下、本発明を詳細に説明する。In the prepreg according to the present invention, a highly moisture-resistant thermosetting resin is provided in the central portion in the thickness direction of the substrate, and a highly moisture-resistant thermosetting resin is provided on the surface portion of the substrate. It is characterized by containing thermosetting resins each having high adhesiveness. Hereinafter, the present invention will be described in detail.
【０００８】本発明において高耐湿性の熱硬化性樹脂と
しては、２官能以上のエポキシ樹脂（ブロム化物を含
む）を主剤とし、フェノールノボラック樹脂やクレゾー
ルノボラック樹脂、ビスフェノールＡ型ノボラック樹
脂、ビスフェノールＦ型ノボラック樹脂、３官能型ノボ
ラック樹脂などのフェノール性水酸基を有する樹脂を硬
化剤として配合し、さらに硬化促進剤としてイミダゾー
ル類やベンジルジメチルアミン等の３級アミンを配合し
たものを用いることができるものであり、必要に応じて
溶剤で希釈してワニスとして使用するものである。尚、
この高耐湿性の熱硬化性樹脂はその硬化物の吸湿率が後
述する高接着性の熱硬化性樹脂の硬化物の吸湿率の２／
３以下であることが好ましい。In the present invention, the thermosetting resin having high humidity resistance is mainly composed of a bifunctional or higher functional epoxy resin (including bromide), and contains phenol novolac resin, cresol novolac resin, bisphenol A type novolac resin and bisphenol F type. A resin containing a phenolic hydroxyl group such as a novolac resin or a trifunctional novolac resin as a curing agent, and a tertiary amine such as imidazole or benzyldimethylamine as a curing accelerator can be used. It is used as a varnish after diluting with a solvent as needed. still,
This highly moisture-resistant thermosetting resin has a moisture absorption rate of the cured product of 2 / of the moisture absorption rate of the cured product of the highly adhesive thermosetting resin described later.
It is preferably 3 or less.
【０００９】またこの高耐湿性熱硬化性樹脂より接着性
が高い高接着性の熱硬化性樹脂としては、従来から使用
されているエポキシ樹脂など各種の樹脂を用いることが
できるものであり、このエポキシ樹脂としては、エポキ
シ当量が３００〜９００ｇ／ｅｑ程度のビスフェノール
Ａ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂な
どが好ましく、ブロム化されたものでもよい。このエポ
キシ樹脂には３官能や４官能のエポキシ樹脂やノボラッ
ク型エポキシ樹脂を必要に応じて配合することもでき、
硬化剤としてジシアンジアミドや芳香族ジアミン類など
を、硬化促進剤としてイミダゾール類や３級アミン類な
どを配合して用いることができ、必要に応じて溶剤で希
釈してワニスとして使用するものでる。Further, as the highly adhesive thermosetting resin having a higher adhesiveness than the highly moisture resistant thermosetting resin, various resins such as epoxy resins which have been conventionally used can be used. The epoxy resin is preferably a bisphenol A type epoxy resin or a bisphenol F type epoxy resin having an epoxy equivalent of about 300 to 900 g / eq, and may be brominated. If necessary, a trifunctional or tetrafunctional epoxy resin or a novolac type epoxy resin can be added to this epoxy resin.
As a curing agent, dicyandiamide, aromatic diamines and the like can be mixed and used, and as a curing accelerator, imidazoles, tertiary amines and the like can be blended and used as a varnish, if necessary diluted with a solvent.
【００１０】しかして、基材としてはガラス布や紙など
任意のものを用いることができるものであり、プリプレ
グを作成するにあたっては、基材にまず高耐湿性の熱硬
化性樹脂を含浸させる。このとき高耐湿性の熱硬化性樹
脂はプリプレグとして必要な全樹脂量の１／３〜５／６
の量を含浸させるものである。またこのように高耐湿性
の熱硬化性樹脂を基材に含浸させた後に、高耐湿性の熱
硬化性樹脂が次に含浸させる高接着性の熱硬化性樹脂の
ワニスに溶出しない程度まで乾燥しておくのが好まし
い。この段階でのプリプレグ中の樹脂のゲルタイムは２
００秒以下が好ましい。However, any material such as glass cloth or paper can be used as the base material, and when preparing the prepreg, the base material is first impregnated with a thermosetting resin having high humidity resistance. At this time, the thermosetting resin having high humidity resistance is 1/3 to 5/6 of the total amount of resin required as the prepreg.
Is impregnated. In addition, after impregnating the base material with the thermosetting resin with high humidity resistance in this way, it is dried to such an extent that the thermosetting resin with high humidity resistance does not elute into the varnish of the highly adhesive thermosetting resin to be impregnated next. It is preferable to keep it. The gel time of the resin in the prepreg at this stage is 2
00 seconds or less is preferable.
【００１１】このように基材に高耐湿性の熱硬化性樹脂
を含浸乾燥した後に、コーティング法あるいは浸漬法に
よって残りの１／６〜２／３の量の高接着性の熱硬化性
樹脂を含浸させて乾燥することによって、高耐湿性の熱
硬化性樹脂の含有量と高接着性の熱硬化性の含有量の重
量比率が１：２〜５：１になった本発明に係るプリプレ
グを作成することができる。このように基材に高耐湿性
の熱硬化性樹脂を含浸した後に高接着性の熱硬化性樹脂
を含浸することによって、基材の厚み方向の中央部は高
耐湿性熱硬化性樹脂がリッチに含浸されると共に基材の
表面部は高接着性の熱硬化性樹脂がリッチに含浸された
プリプレグを得ることができるものである。またこのよ
うに高接着性の熱硬化性樹脂を含浸した後の乾燥時間や
乾燥温度は、基材に含浸した高接着性の熱硬化性樹脂の
ゲル化時間が１００〜２００秒程度になるように設定す
るのが好ましい。先に基材に含浸した高耐湿性の熱硬化
性樹脂はこの２度目の乾燥によってゲル化時間が１００
秒以下になるようにして、中央部の高耐湿性の熱硬化性
樹脂のゲル化時間が表面部の高接着性熱硬化性樹脂のゲ
ル化温度よりも短くなるようにするのが好ましい。After the base material is impregnated with the highly moisture-resistant thermosetting resin and dried in this manner, the remaining 1/6 to 2/3 amount of the highly adhesive thermosetting resin is applied by the coating method or the dipping method. By impregnating and drying the prepreg according to the present invention, the weight ratio of the content of the highly moisture resistant thermosetting resin to the content of the highly adhesive thermosetting resin is 1: 2 to 5: 1. Can be created. In this way, by impregnating the base material with the thermosetting resin with high humidity resistance and then with the thermosetting resin with high adhesiveness, the high humidity resistance thermosetting resin is rich in the central portion in the thickness direction of the base material. It is possible to obtain a prepreg in which the thermosetting resin with high adhesiveness is impregnated in the surface portion of the base material while being impregnated with the prepreg. In addition, the drying time and the drying temperature after impregnating the highly adhesive thermosetting resin in this manner are such that the gelling time of the highly adhesive thermosetting resin impregnated in the substrate is about 100 to 200 seconds. It is preferable to set to. The high moisture resistance thermosetting resin impregnated in the base material has a gelling time of 100 by the second drying.
It is preferable that the gelling time of the highly moisture-resistant thermosetting resin in the central part is shorter than the gelling temperature of the highly adhesive thermosetting resin in the surface part by setting the time to be equal to or less than a second.
【００１２】このようにして作成したプリプレグを接着
用シートとして用いて多層プリント配線板を製造するこ
とができる。すなわち、内層回路板の表面に１枚乃至複
数枚のプリプレグを介して銅箔等の外層用金属箔（ある
いは外層回路板）を重ね、これを加熱加圧成形すること
によって、プリプレグによる硬化接着層で内層回路板に
外層用金属箔（あるいは外層回路板）を積層した多層プ
リント配線板を製造することができるものである。A multi-layer printed wiring board can be manufactured by using the prepreg thus prepared as an adhesive sheet. That is, an outer layer metal foil (or an outer layer circuit board) such as a copper foil is laid on the surface of the inner layer circuit board through one or more prepregs, and the resulting layer is heat-pressed to form a cured adhesive layer by the prepreg. Thus, it is possible to manufacture a multilayer printed wiring board in which an outer layer metal foil (or an outer layer circuit board) is laminated on an inner layer circuit board.
【００１３】[0013]
【実施例】次に、本発明を実施例によって例証する。 （実施例１） ・高耐湿性エポキシ樹脂ワニスの調製 油化シェルエポキシ社製ノボラック硬化型エポキシ樹脂
「ＹＬ−６２５１」（臭素化エポキシ樹脂とノボラック
樹脂硬化剤の混合物で溶剤を２０重量％含む）１５００
ｇに、２−エチル−４−メチルイミダゾール１．５６ｇ
とメチルセロソルブ３４６ｇとを加えてワニスに調製し
た。このワニスの１７０℃でのゲルタイムは５分であっ
た。The invention will now be illustrated by the examples. (Example 1) -Preparation of highly moisture-resistant epoxy resin varnish Novolak-curable epoxy resin "YL-6251" manufactured by Yuka Shell Epoxy Co., Ltd. (a mixture of a brominated epoxy resin and a novolac resin curing agent, containing 20% by weight of a solvent). 1500
to g, 1.56 g of 2-ethyl-4-methylimidazole
And 346 g of methyl cellosolve were added to prepare a varnish. The gel time of this varnish at 170 ° C. was 5 minutes.
【００１４】・高接着性エポキシ樹脂ワニスの調製 ダウケミカル社製臭素化ビスフェノールＡ型エポキシ樹
脂「ＤＥＲ−５１４」（溶剤２０重量％含む）１１２５
ｇと、東都化成社製クレゾールノボラック型エポキシ樹
脂「ＹＤＣＮ−２２０ＨＨ」（溶剤２５重量％含む）１
３３ｇを、２４ｇのジシアンジアミドを溶解すると共に
１．０ｇの２−エチル−４−メチルイミダゾールを添加
したジメチルホルムアミド２００ｇとメチルセロソルブ
２００ｇの混合溶剤に混合して溶解し、さらにＭＥＫを
加えて濃度調整をおこなってワニスに調整した。このワ
ニスの１７０℃でのゲルタイムは５分３０秒であった。Preparation of highly adhesive epoxy resin varnish 1125 brominated bisphenol A type epoxy resin "DER-514" (including 20% by weight of solvent) manufactured by Dow Chemical Company
g and cresol novolac type epoxy resin “YDCN-220HH” manufactured by Tohto Kasei Co., Ltd. (including 25% by weight of solvent) 1
33 g was dissolved in a mixed solvent of 200 g of dimethylformamide and 200 g of methylcellosolve, in which 24 g of dicyandiamide was dissolved and 1.0 g of 2-ethyl-4-methylimidazole was added, and MEK was further added to adjust the concentration. It was done and adjusted to varnish. The gel time of this varnish at 170 ° C. was 5 minutes and 30 seconds.
【００１５】次に、２１１６タイプのガラス布（旭シュ
エーベル社製「２１６Ｌ」；１０４ｇ／ｍ2 ）を上記高
耐湿性エポキシ樹脂ワニス中に通してガラス布に高耐湿
性エポキシ樹脂を一次含浸させ、１６０℃で４分間加熱
乾燥して巻き取った。高耐湿性エポキシ樹脂の付着量は
１００ｇ／ｍ2 であり、この樹脂のゲルタイムは１８０
秒であった。続いてこの高耐湿性エポキシ樹脂を含浸し
たガラス布を上記高接着性エポキシ樹脂ワニス中に通し
てガラス布の表面部に高接着性エポキシ樹脂を二次含浸
させ、１６０℃で４分間加熱乾燥してプリプレグを作成
した。このプリプレグの樹脂量は１２０ｇ／ｍ2 であり
（樹脂含率５３．４重量％）、従って高接着性エポキシ
樹脂の付着量は２０ｇ／ｍ2 であった。またこのプリプ
レグにおいて高耐湿性エポキシ樹脂のゲルタイムは８０
秒であり、高接着性エポキシ樹脂のゲルタイムは１６０
秒であった。尚、この各ゲルタイムは、高耐湿性エポキ
シ樹脂については上記の高耐湿性エポキシ樹脂を含浸し
て１６０℃で４分間乾燥した基材を再度１６０℃で４分
間加熱したものについて、高接着性エポキシ樹脂につい
ては２１１６タイプのガラス布に高接着性エポキシ樹脂
のみを含浸させて１６０℃で４分間加熱したものについ
て、それぞれ測定した数値である。Next, a 2116 type glass cloth ("216L" manufactured by Asahi Schwabel Co., Ltd .; 104 g / m 2 ) was passed through the above-mentioned highly moisture-resistant epoxy resin varnish to impregnate the glass cloth with the highly moisture-resistant epoxy resin primarily. It was dried by heating at 160 ° C. for 4 minutes and wound up. The adhesion of the high humidity resistant epoxy resin is 100 g / m 2 , and the gel time of this resin is 180
It was seconds. Subsequently, the glass cloth impregnated with the highly moisture resistant epoxy resin is passed through the highly adhesive epoxy resin varnish to secondarily impregnate the surface portion of the glass cloth with the highly adhesive epoxy resin, and dried by heating at 160 ° C. for 4 minutes. I made a prepreg. The resin amount of this prepreg was 120 g / m 2 (resin content 53.4% by weight), and therefore the adhesion amount of the highly adhesive epoxy resin was 20 g / m 2 . In addition, the gel time of highly moisture resistant epoxy resin in this prepreg is 80
Seconds, and the gel time of highly adhesive epoxy resin is 160
It was seconds. In addition, each gel time is a high adhesive epoxy for a high humidity resistant epoxy resin, which is obtained by impregnating the above high humidity resistant epoxy resin and drying the substrate at 160 ° C. for 4 minutes and then heating it again at 160 ° C. for 4 minutes. Regarding the resin, the values are measured for a 2116 type glass cloth impregnated only with a highly adhesive epoxy resin and heated at 160 ° C. for 4 minutes.
【００１６】（実施例２）高耐湿性エポキシ樹脂の付着
量を６０ｇ／ｍ2 に、高接着性エポキシ樹脂の付着量を
６０ｇ／ｍ2 に設定するようにした他は、実施例１と同
様にしてプリプレグを作成した。このプリプレグにおて
高耐湿性エポキシ樹脂の一次含浸乾燥後のゲルタイムは
１６０秒、二次含浸乾燥後のゲルタイムは６０秒であっ
た。[0016] (Example 2) 60g / m 2 adhesion amount of the high moisture resistance epoxy resin, except that so as to set the adhesion amount of high adhesive epoxy resin to 60 g / m 2, similarly to Example 1 I made a prepreg. In this prepreg, the gel time after the primary impregnation and drying of the high humidity resistant epoxy resin was 160 seconds, and the gel time after the secondary impregnation and drying was 60 seconds.
【００１７】（実施例３）高耐湿性エポキシ樹脂の付着
量を４０ｇ／ｍ2 に、高接着性エポキシ樹脂の付着量を
８０ｇ／ｍ2 に設定するようにした他は、実施例１と同
様にしてプリプレグを作成した。このプリプレグにおて
高耐湿性エポキシ樹脂の一次含浸乾燥後のゲルタイムは
１５０秒、二次含浸乾燥後のゲルタイムは５０秒であっ
た。(Example 3) Same as Example 1 except that the adhesion amount of the high humidity resistant epoxy resin was set to 40 g / m 2 and the adhesion amount of the high adhesive epoxy resin was set to 80 g / m 2. I made a prepreg. In this prepreg, the gel time after the primary impregnation and drying of the highly moisture-resistant epoxy resin was 150 seconds, and the gel time after the secondary impregnation and drying was 50 seconds.
【００１８】（比較例１）２１１６タイプのガラス布に
高接着性エポキシ樹脂のみを含浸し、１６０℃で６分間
加熱乾燥して、樹脂含率５４重量％のプリプレグを作成
した。このプリプレグにおいて高接着性エポキシ樹脂の
ゲルタイムは１８０秒であった。 （比較例２）２１１６タイプのガラス布に高耐湿性エポ
キシ樹脂のみを含浸し、１６０℃で５分間加熱乾燥し
て、樹脂含率５４重量％のプリプレグを作成した。この
プリプレグにおいて高接着性エポキシ樹脂のゲルタイム
は１５０秒であった。(Comparative Example 1) A 2116 type glass cloth was impregnated with only a highly adhesive epoxy resin and heat-dried at 160 ° C for 6 minutes to prepare a prepreg having a resin content of 54% by weight. The gel time of the highly adhesive epoxy resin in this prepreg was 180 seconds. (Comparative Example 2) A 2116 type glass cloth was impregnated only with a highly moisture-resistant epoxy resin, and heated and dried at 160 ° C for 5 minutes to prepare a prepreg having a resin content of 54% by weight. The gel time of the highly adhesive epoxy resin in this prepreg was 150 seconds.
【００１９】上記のようにして作成した実施例１乃至３
及び比較例１，２のプリプレグを用いて多層配線板を製
造した。すなわち、３５μｍ厚の銅箔で表面に内層回路
（黒化処理して表面に酸化銅被膜を形成）を作成したエ
ポキシ樹脂積層板による内層回路板の両面にそれぞれ２
枚づつプリプレグを重ねると共にさらにその外側に１８
μｍ厚の銅箔を重ね、これを１７０℃、４０ｋｇ／ｃｍ
2 、９０分間の条件で加熱加圧成形することによって、
四層構成の多層配線板を得た。Examples 1 to 3 prepared as described above
Also, a multilayer wiring board was manufactured using the prepregs of Comparative Examples 1 and 2. That is, 2 layers are formed on both sides of an inner layer circuit board made of an epoxy resin laminated plate in which an inner layer circuit (blackening treatment is performed to form a copper oxide film on the surface) is formed on a surface of a 35 μm thick copper foil
Overlap the prepregs one by one and further on the outside 18
Layered copper foil with a thickness of μm, 170 ℃, 40kg / cm
2 , by heat and pressure molding under the condition of 90 minutes,
A multilayer wiring board having a four-layer structure was obtained.
【００２０】このようにして得た多層配線板について、
外層の銅箔のピール強度、プリプレグ間の接着強度、内
層回路とプリプレグによる硬化樹脂層とのピール強度を
測定し、さらに吸湿率及び半田耐熱性を測定した。吸湿
率の試験は、ＪＩＳに規定されるＣ−６０／４０／９０
の条件で処理した後の重量増加率を測定することによっ
ておこない、半田耐熱性の試験は、試料を４０℃、９０
％ＲＨの条件に置いて吸湿処理した後に２６０℃の半田
に２０秒浸漬することによってミーズリングやフクレ等
が発生する際の吸湿処理時間を測定することによってお
こなった。結果を表１に示す。Regarding the multilayer wiring board thus obtained,
The peel strength of the outer layer copper foil, the adhesive strength between the prepregs, the peel strength between the inner layer circuit and the cured resin layer by the prepreg were measured, and the moisture absorption rate and the solder heat resistance were measured. The moisture absorption test is based on JIS C-60 / 40/90.
The solder heat resistance test was performed by measuring the weight increase rate after the treatment under the conditions
The moisture absorption treatment was performed under a condition of% RH and then immersed in solder at 260 ° C. for 20 seconds to measure the moisture absorption treatment time when measling, blistering and the like occurred. The results are shown in Table 1.
【００２１】[0021]
【表１】 [Table 1]
【００２２】表１にみられるように、高接着性エポキシ
樹脂のみを含浸させた比較例１のプリプレグを用いたも
のでは吸湿率が高くて半田耐熱性が悪く、高耐湿性エポ
キシ樹脂のみを含浸させた比較例２のプリプレグを用い
たものでは内層回路とのピール強度が低くて接着性が悪
いが、各実施例のものでは耐湿性は比較例２と同程度の
高いレベルが得られると共に接着性は比較例１と同程度
の高いレベルが得られ、耐湿性を保持しつつ接着性を高
めることができることが確認される。As shown in Table 1, in the case of using the prepreg of Comparative Example 1 impregnated only with the highly adhesive epoxy resin, the moisture absorption is high and the solder heat resistance is poor, and only the highly moisture resistant epoxy resin is impregnated. In the case of using the prepreg of Comparative Example 2 thus prepared, the peel strength with the inner layer circuit is low and the adhesion is poor, but in the case of each Example, the moisture resistance is as high as that of Comparative Example 2 and the adhesion is high. It is confirmed that the high level of the same property as that of Comparative Example 1 is obtained, and the adhesiveness can be improved while maintaining the moisture resistance.
【００２３】[0023]
【発明の効果】上記のように本発明は、基材の厚み方向
の中央部に高耐湿性の熱硬化性樹脂を、基材の表面部に
高耐湿性熱硬化性樹脂よりも接着性が高い熱硬化性樹脂
をそれぞれ含浸させてプリプレグを調製するようにした
ので、高耐湿性の熱硬化性樹脂で耐湿性を保持しつつ接
着性が高い熱硬化性樹脂で接着性を高めることができる
ものである。As described above, according to the present invention, a highly moisture-resistant thermosetting resin is provided in the central portion of the substrate in the thickness direction, and the surface of the substrate is more adhesive than the highly moisture-resistant thermosetting resin. Since the prepreg is prepared by impregnating each with a high thermosetting resin, it is possible to increase the adhesiveness with the thermosetting resin having high adhesiveness while maintaining the moisture resistance with the thermosetting resin having high moisture resistance. It is a thing.
Claims (2)
硬化性樹脂が、基材の表面部に高耐湿性熱硬化性樹脂よ
りも接着性が高い熱硬化性樹脂がそれぞれ含有されて成
ることを特徴とするプリプレグ。1. A highly moisture-resistant thermosetting resin is contained in the center of the substrate in the thickness direction, and a thermosetting resin having higher adhesiveness than the highly moisture-resistant thermosetting resin is contained in the surface of the substrate. A prepreg characterized by being formed.
水酸基を有する硬化剤を配合したエポキシ系樹脂である
ことを特徴とする請求項１に記載のプリプレグ。2. The prepreg according to claim 1, wherein the thermosetting resin having high humidity resistance is an epoxy resin containing a curing agent having a phenolic hydroxyl group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34047191A JPH05170949A (en) | 1991-12-24 | 1991-12-24 | Prepreg |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34047191A JPH05170949A (en) | 1991-12-24 | 1991-12-24 | Prepreg |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05170949A true JPH05170949A (en) | 1993-07-09 |
Family
ID=18337281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34047191A Withdrawn JPH05170949A (en) | 1991-12-24 | 1991-12-24 | Prepreg |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05170949A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1035164A (en) * | 1996-04-25 | 1998-02-10 | Samsung Aerospace Ind Ltd | Ic card and manufacture thereof |
| JP2009004718A (en) * | 2007-05-18 | 2009-01-08 | Denki Kagaku Kogyo Kk | Metal base circuit board |
-
1991
- 1991-12-24 JP JP34047191A patent/JPH05170949A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1035164A (en) * | 1996-04-25 | 1998-02-10 | Samsung Aerospace Ind Ltd | Ic card and manufacture thereof |
| JP2009004718A (en) * | 2007-05-18 | 2009-01-08 | Denki Kagaku Kogyo Kk | Metal base circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19990311 |