JPS58167625A - Prepreg - Google Patents
PrepregInfo
- Publication number
- JPS58167625A JPS58167625A JP4826782A JP4826782A JPS58167625A JP S58167625 A JPS58167625 A JP S58167625A JP 4826782 A JP4826782 A JP 4826782A JP 4826782 A JP4826782 A JP 4826782A JP S58167625 A JPS58167625 A JP S58167625A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- prepreg
- parts
- type
- manufactured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 claims abstract description 27
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 27
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229920003986 novolac Polymers 0.000 claims abstract description 12
- 239000004593 Epoxy Substances 0.000 claims abstract description 7
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims abstract description 7
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000011342 resin composition Substances 0.000 claims abstract description 5
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims 1
- 239000004615 ingredient Substances 0.000 claims 1
- 239000002131 composite material Substances 0.000 abstract description 10
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 abstract description 3
- 239000003795 chemical substances by application Substances 0.000 abstract description 3
- 229930003836 cresol Natural products 0.000 abstract description 3
- 239000002657 fibrous material Substances 0.000 abstract description 3
- 229920000049 Carbon (fiber) Polymers 0.000 abstract description 2
- 239000004917 carbon fiber Substances 0.000 abstract description 2
- 238000002156 mixing Methods 0.000 abstract description 2
- XMTQQYYKAHVGBJ-UHFFFAOYSA-N 3-(3,4-DICHLOROPHENYL)-1,1-DIMETHYLUREA Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C(Cl)=C1 XMTQQYYKAHVGBJ-UHFFFAOYSA-N 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 26
- MGJKQDOBUOMPEZ-UHFFFAOYSA-N N,N'-dimethylurea Chemical compound CNC(=O)NC MGJKQDOBUOMPEZ-UHFFFAOYSA-N 0.000 description 11
- 230000000704 physical effect Effects 0.000 description 7
- 229920003319 Araldite® Polymers 0.000 description 4
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 2
- 235000002595 Solanum tuberosum Nutrition 0.000 description 2
- 244000061456 Solanum tuberosum Species 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000000805 composite resin Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241000238557 Decapoda Species 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、優れたコンポジット特性、特に低圧成形でボ
イドがなく優れたコンポジブｌ−特性を与えるプリプレ
グに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a prepreg that provides excellent composite properties, particularly void-free and excellent composite l-properties when molded at low pressure.
近時炭素繊維をはじめガラス繊維、芳香族ポリアミド繊
維などを補強拐とした樹脂複合材料はスポーツ・レジャ
ー用品、航空機、一般産業資材の方面に広く用いられて
きている。繊維で補強された熱硬化性樹脂複合体成形物
を！ｌｌ造するには、一方向に配列された繊維又は織物
にエポキシ樹脂等の熱硬化性樹脂を含浸させた、いわゆ
るプリプレグを作り、これを所定の角度に積層して加熱
加圧し硬化成形する方法が一般に行われている。In recent years, resin composite materials reinforced with carbon fiber, glass fiber, aromatic polyamide fiber, etc. have been widely used in sports and leisure goods, aircraft, and general industrial materials. A thermosetting resin composite molded product reinforced with fibers! To make this, a so-called prepreg is made by impregnating fibers or fabrics arranged in one direction with a thermosetting resin such as epoxy resin, and the prepreg is laminated at a predetermined angle and heated and pressurized to harden and mold. is commonly practiced.
この場合の成形手段としてはホットプレス成形、オート
クレーブ成形、真空バッグ成形等がある。このうちホッ
トプレス成形又はオートクレーブ成形が一般的であり、
この場合には成形は加熱下５〜１０ｋｇ／ｃｍ２もの高
圧を加えて行われる。これ以下の圧力では、できた成形
物中にボイドが残りその］ンポジット特性が低下する。Molding means in this case include hot press molding, autoclave molding, vacuum bag molding, and the like. Of these, hot press molding or autoclave molding is common,
In this case, the molding is carried out under heating and applying a high pressure of 5 to 10 kg/cm<2>. If the pressure is lower than this, voids will remain in the molded product and its composite properties will deteriorate.
真空バッグ成形は、本来１ｋｇ ／ａｍ’以下の低圧で
行われるもので、ハニカムリ゛ンドイッチパネル等ごく
限られた成形物の製造に利用されている。Vacuum bag molding is originally performed at a low pressure of 1 kg/am' or less, and is used for manufacturing very limited molded products such as honeycomb lead switch panels.
高圧を用いるホットプレス成形や７１−１〜クレープ成
形では、大型の装置を必要とし設備費、維持費がかさみ
、しかも成形圧力が高くなればなるほどこの傾向は強く
なる。この点低圧の真空バッグ成形は設備費等がかから
ず有利である。Hot press molding and 71-1 to crepe molding using high pressure require large equipment, increasing equipment costs and maintenance costs, and this tendency becomes stronger as the molding pressure becomes higher. In this respect, low-pressure vacuum bag molding is advantageous because it does not require equipment costs.
ホットプレス成形やオートクレーブ成形でも低圧成形が
可能になれば設備費等が軒減されそれだけ有利になるは
ずである。If low-pressure molding becomes possible even with hot press molding and autoclave molding, equipment costs will be reduced, which will be advantageous.
いずれの成形手段によるにせよ、低圧成形において成形
物中にボイドを残さないプリプレグが開発されれば、そ
の工業的意義は極めて大きいと考えられる。Regardless of the molding method used, if a prepreg that does not leave voids in the molded product during low-pressure molding can be developed, it would be of extremely great industrial significance.
本発明者は、このようなプリプレグの開発をめざして鋭
意検討の結果、本発明に到達した。The present inventor has arrived at the present invention as a result of intensive studies aimed at developing such a prepreg.
すなわち、本発明は、下記成分〔Δ〕、（Ｂ）（Ｃ）
（Ａ）ノア禮うック型エポキシ樹脂
５５〜７５重吊部
ＣＢ）ビスフェノール△型エポキシ樹脂２０〜３５重間
部
（Ｃ）グリシジルアミン型エポキシ樹脂５〜１０重邑部
のエポキシ樹脂成分とジシアンジアミド及び３−（３，
４−ジクロルフェニル） −１，１−Ｎジメチル尿素（
以下ＤＭＵと略記）を含む樹脂組成物を含浸してなるプ
リプレグである。That is, the present invention uses the following components [Δ], (B) (C) (A) Noah's type epoxy resin 55-75 heavy suspended part CB) Bisphenol Δ type epoxy resin 20-35 heavy suspended part (C ) Glycidylamine type epoxy resin 5 to 10 epoxy resin components, dicyandiamide and 3-(3,
4-dichlorophenyl) -1,1-N dimethylurea (
This is a prepreg impregnated with a resin composition containing DMU (hereinafter abbreviated as DMU).
本発明のプリプレグを使用すると、低圧成形の場合でも
得られた成形物にボイドが残らず侵れたコンポジット特
性を与えることができる。When the prepreg of the present invention is used, even in the case of low-pressure molding, the resulting molded product can be given excellent composite properties without leaving any voids.
特に、成分（Ｂ）のうちにエポキシ当量が１８０〜５５
０のビスフェノールＡ型エポキシ樹脂を８０重邑％以上
含むときに、著しく優れたコンポジット特性が得られる
。In particular, component (B) has an epoxy equivalent of 180 to 55.
When the composition contains 80% by weight or more of 0 bisphenol A type epoxy resin, extremely excellent composite properties can be obtained.
本発明における成分（Ａ）のノボラック型エポキシ樹脂
としてはフェノールノボラック型とクレゾールノボラッ
ク型のものがあり、具体的には次のものを例示すること
ができる。The novolak type epoxy resin of component (A) in the present invention includes phenol novolac type and cresol novolak type, and specifically, the following can be exemplified.
〔フェノールノボラック型〕 エビコー１−１５２、同
１５４〈シェル化学社製）、アラルダイト−Ｅ Ｐ Ｎ
１１３８、同−Ｅ Ｐ Ｎ １１３９、（チバガイギ
ー社製）、ダウエポキシＤＥＮ４３８、同Ｄ Ｅ、Ｎ４
３９、同Ｘ Ｄ ７８５５ （ダウケミカル社製＞、Ｅ
ＰＰＮ２６１（日本化薬礼製）、エビ’ｉ Ｄ ンＮ
−７４０（大日本インキ社製）、エポトートＹＤＮ１８
０（東部化成社製）等。[Phenol novolac type] Ebiko 1-152, Ebiko 154 (manufactured by Shell Chemical Co., Ltd.), Araldite-E P N
1138, E P N 1139, (manufactured by Ciba Geigy), Dowepoxy DEN438, D E, N4
39, X D 7855 (manufactured by Dow Chemical Company), E
PPN261 (manufactured by Nippon Kayakurei), Ebi'i D'nN
-740 (manufactured by Dainippon Ink Co., Ltd.), Epotote YDN18
0 (manufactured by Tobu Kasei Co., Ltd.), etc.
〔クレゾールノボラック型） Ｅ ＣＮ １２８０゜
同１２９９ （チバガイギー社製） 、ＥＯＣＮ １
０２（日本化薬社製） 、Ｙ、Ｄ、ＣＮ ２２０Ｌ（東
部化成社製）等。[Cresol novolac type] E CN 1280゜1299 (manufactured by Ciba Geigy), EOCN 1
02 (manufactured by Nippon Kayaku Co., Ltd.), Y, D, CN 220L (manufactured by Tobu Kasei Co., Ltd.), etc.
また、成分（Ｂ）ビスフェノールＡ型エポキシ樹脂の具
体例は次のとおりである。Further, specific examples of the component (B) bisphenol A type epoxy resin are as follows.
エピコート８２８、同８３４、同１００１、同１００２
、同１００４ （シェル化学社製）、ダウエポキシｒ）
ＥＲ３３２、同ＤＥＲ６６２（ダウケミカル社製）、ア
ラルダイ１へＧＹ２６０、同Ｇ’ｌ’２８０、同６０７
１、５−
同７０７１（チハガー１’キー相！ＪＪ）、エビクロン
８５０゜同８６０、同１０５０ （大日本インキ社製）
、エポト＝］〜Ｙｌ）１１５、同ＹＤ１１７、同ＹＤＯ
１１、同ＹＤＯ１２（東部化成社製）等。Epicote 828, 834, 1001, 1002
, 1004 (manufactured by Shell Chemical Co., Ltd., Dowepoxy R)
ER332, DER662 (manufactured by Dow Chemical Company), GY260 to Araldai 1, G'l'280, 607
1, 5- Same 7071 (Chihagar 1' key phase! JJ), Ebikuron 850゜ Same 860, Same 1050 (manufactured by Dainippon Ink Co., Ltd.)
, epoto = ] ~ Yl) 115, same YD117, same YDO
11, YDO12 (manufactured by Tobu Kasei Co., Ltd.), etc.
成分（Ｂ）の特に好ましいものは１ボキシ当聞が１８０
へ・５５０のものを８０重間％以上含むビスフェノール
Ａ型エポキシ樹脂であり、このものの具体例は前記のう
ちエピコート ８２８、同８３４、同１００１、ダウエ
ポキシＤＥＲ３３２等である。Particularly preferred component (B) is 180
It is a bisphenol A type epoxy resin containing 80% by weight or more of 550.Specific examples of this resin include Epicoat 828, Epicoat 834, Epicoat 1001, and Dowepoxy DER332.
ビスフェノールＡ型エポキシ樹脂のうちエポキシ当量が
５５０以上のものが２０％以上含有すると低圧成形物中
にボイドが残りコンボジッ１へ特性が低下してくる。If 20% or more of the bisphenol A type epoxy resin has an epoxy equivalent of 550 or more, voids remain in the low-pressure molded product and the properties deteriorate to composite 1.
さらに、成分（Ｃ）グリシジルアミン型エポキシ樹脂と
しては、アラルダイトＭＹ７２０（ヂバガイギー社製〉
、］−］ボ１〜−トＹｌ−１／１３４同ＹＤＭ１２０（
東部化成社製）、ＰＧＡ−Ｘ （三菱ガス化学社製）等
を例示することができる。Furthermore, as the component (C) glycidylamine type epoxy resin, Araldite MY720 (manufactured by Ziba Geigy)
,]-]bot1~-toYl-1/134YDM120(
(manufactured by Tobu Kasei Co., Ltd.), PGA-X (manufactured by Mitsubishi Gas Chemical Co., Ltd.), and the like.
前記〔△〕、（Ｂ）、（Ｃ）の成分はそれぞれ１種又は
２種以上を用いることができる。Each of the components [Δ], (B), and (C) may be used alone or in combination of two or more.
−〇−
本発明プリプレグにおいてエポキシ樹脂成分の組成比は
〔△〕ノボラック型エボ：１ニジ樹脂
５５〜７５重吊部
（Ｂ）ビスフェノール△型エポキシ樹脂２０へ・３５重
量部
（Ｃ）グリシジルアミン型エポキシ樹脂５〜１０重量部
とする必要がある。成分（△）が７５重量部を超えると
硬化樹脂の破断伸度が小さくなり成形物中にクラックガ
発生しやすくなり、５５重量部未満では成形物の層間剪
断強度（ＩＬＳＳ）が低Ｆする。成分（Ｂ）が３５重量
部を超えると低圧成形物性が低下し、２０重量部未満で
は硬化樹脂がもろくなる。成分（Ｃ）が１０重量部を超
えるか、５重量部に満たないと低圧成形物の物性が低下
する。-〇- In the prepreg of the present invention, the composition ratio of the epoxy resin components is [△] Novolac type Evo: 1 Niji resin 55-75 heavy hanging part (B) Bisphenol △ type epoxy resin 20 to 35 parts by weight (C) Glycidylamine type It is necessary to use 5 to 10 parts by weight of epoxy resin. When the component (Δ) exceeds 75 parts by weight, the elongation at break of the cured resin decreases and cracks tend to occur in the molded product, while when it is less than 55 parts by weight, the interlaminar shear strength (ILSS) of the molded product becomes low. If component (B) exceeds 35 parts by weight, the low-pressure molding properties will deteriorate, and if it is less than 20 parts by weight, the cured resin will become brittle. If component (C) exceeds 10 parts by weight or is less than 5 parts by weight, the physical properties of the low-pressure molded product will deteriorate.
いずれにゼに、成分の組成比がこの範囲をはずれるど、
低圧成形物にボイドが残り、ｒＬＳＳが低下したり硬化
樹脂がもろくなったりしてコンポジット特ｔ１が低下す
る。In any case, if the composition ratio of the components falls outside this range,
Voids remain in the low-pressure molded product, the rLSS decreases, the cured resin becomes brittle, and the composite characteristic t1 decreases.
本発明において前記のエポキシ樹脂成分に硬化剤として
ジシアンジアミド（ＤＩＣＹ＞及び硬化促進剤として３
−（３，４−ジクロルフェニル）１．１− Ｎジメチル
尿素（ＤＭＵ）が配合される。In the present invention, the above-mentioned epoxy resin component contains dicyandiamide (DICY> as a curing agent and 3% as a curing accelerator).
-(3,4-dichlorophenyl)1.1-N dimethylurea (DMU) is blended.
ＤｒＣＹとＤＭＵの配合間はそれぞれエポキシ樹脂全量
に対し１．５〜７．０重量％が好ましい。The blending ratio of DrCY and DMU is preferably 1.5 to 7.0% by weight based on the total amount of the epoxy resin.
本発明プリプレグは前記の樹脂組成物をｍ維材利、例え
ば炭素ｍ紐、ガラスｍ紺、芳香族ポリアミドｌ１ｉｓ等
に含浸させたものである。形態としては一方向引揃え、
一方向織物、織物のプリプレグである。The prepreg of the present invention is obtained by impregnating a fiber material such as carbon string, dark blue glass, or aromatic polyamide IIS with the above resin composition. In terms of form, it is aligned in one direction,
Unidirectional woven fabric, woven prepreg.
本発明プリプレグは、プリプレグ製造の常法によって製
造することができる。The prepreg of the present invention can be manufactured by a conventional prepreg manufacturing method.
本発明プリプレグを使用すると、低圧成形してもボイド
が残らず成形物に侵れたコンポジット特性が与えられる
。When the prepreg of the present invention is used, no voids remain even after low-pressure molding, and the molded product has excellent composite properties.
以下本発明を実施例により説明するとともに比較例を掲
げる。例中、部とあるは重量部を意味する。。The present invention will be explained below with reference to examples, and comparative examples will also be listed. In the examples, parts mean parts by weight. .
実施例１゜
（Ａ）フェノールノボラック型エポキシ樹脂アラルダイ
トＥＰＮ１１３８（チバガイギー着製）６５部、（Ｂ）
Ｉビコート１００１ （エポキシ当量４７０）２５部、
エピコート ８２８（エポキシ当量１９０） ３部（
以上シェル化学社製）、（Ｃ）Ｉポトート’１’ｌ−１
４３４（京都化成社製）７部、それに（ＤｒＣＹ）３部
（ＤＭＵ＞５部をアレトン／メチルセロソルブ混合溶剤
に溶かし５０重量％溶液とした。この樹脂溶液を炭素繊
維（ベスフフイ１〜１−ＩＴ−６０００東邦ベスロン社
製）に含浸させた後、乾燥させて樹脂金ｆｆ１４０Ｂｌ
ｄｉ１％の一方向プリプレグを作った。Example 1 (A) 65 parts of phenol novolac type epoxy resin Araldite EPN1138 (manufactured by Ciba Geigy Co., Ltd.), (B)
I Bicoat 1001 (epoxy equivalent weight 470) 25 parts,
Epicote 828 (epoxy equivalent weight 190) 3 parts (
(manufactured by Shell Chemical Co., Ltd.), (C) I Potato '1'l-1
434 (manufactured by Kyoto Kasei Co., Ltd.) and 3 parts (DrCY) (DMU>5 parts) were dissolved in a mixed solvent of Aretone/Methyl Cellosolve to make a 50% solution by weight. -6000 (manufactured by Toho Bethlon Co., Ltd.), then dried and resin gold ff140Bl
A unidirectional prepreg with a di of 1% was made.
このプリプレグを用いて １３０℃、７ｋｇ ／ｃｍ’
、９０分の硬化条件でホットプレス成形したところ、
下記物性の成形物を得た。Using this prepreg, 130℃, 7kg/cm'
, when hot press molded under 90 minute curing conditions,
A molded article having the following physical properties was obtained.
曲げ強度 １６８ｋａ ／ｍｎ＋’曲げ弾性率
１３．２７ ／ ｍｍ’ｒ Ｌ Ｓ Ｓ ９，８
ｋｇ／ｍｍ’また、このプリプレグを７０℃、真空約１
ｋｇ／９−
ｃｍ’ 、３０分、次いで１３０℃、真空約１ｋ（１／
ａｍ’、９０分の硬化条件で真空バッグ成形したところ
、次の物性の成形物を（ｑた。Bending strength 168ka/mn+'bending modulus
13.27 / mm'r L S S 9,8
kg/mm' Also, this prepreg was heated at 70℃ and in a vacuum of about 1
kg/9-cm', 30 minutes, then 130°C, vacuum approx.
When molded in a vacuum bag under curing conditions of 90 minutes, a molded product with the following physical properties was obtained.
曲げ強度 １６４ｋｇ ／ｍｍ’
曲げ弾性率 １３．ＯＴ／ｍｍ２
ｒ Ｌ Ｓ Ｓ ９，６ｋ（］／ ｍｍ’真空バ
ッグ成形（１ｋＱ ／ Ｃｍ２ ＞で１ｑられたこの成
形物は、前記ホットプレス成形（７ｋｇ／ａｍ２）によ
る場合と同等の物性を示し、成形物の内部にボイドは認
められなかった。Bending strength 164kg/mm' Bending modulus 13. OT/mm2 r L S S 9,6k(]/mm' This molded product obtained by vacuum bag molding (1kQ/Cm2>1q) exhibits physical properties equivalent to those obtained by hot press molding (7kg/am2), No voids were observed inside the molded product.
実施例２゜
（Ａ）ダウ■ボキシＤＦＮ４３９（ダウケミカル社ｖＪ
）６５部、（Ｂ）エビ＝：＋−ト８３４（Ｉポキシ当量
２５０、シェル化学社！１７）３０部、（Ｃ）■ポトー
トＹＨ４３４（東部化成社製）５部、それにＤＩＣＹ３
部、ＤＭＵ ５部を用いて実施例１と同様にして樹脂溶
液を作った。この樹脂溶液をガラスＩ！ｉ維ＲＳ ４８
Ｐ Ｊ −４５２（日東紡社製）に含浸させ、樹脂含量
３１重量％の一方向ブリブレグを作った。Example 2゜(A) Dow Boxy DFN439 (Dow Chemical Company vJ
) 65 parts, (B) 30 parts of shrimp=:+-to834 (I poxy equivalent 250, Shell Chemical Co., Ltd.!17), (C) 5 parts of Potato YH434 (manufactured by Tobu Kasei Co., Ltd.), and DICY3
A resin solution was prepared in the same manner as in Example 1 using 5 parts of DMU and 5 parts of DMU. Glass I! This resin solution! iVi RS 48
PJ-452 (manufactured by Nittobo Co., Ltd.) was impregnated to produce a unidirectional blob leg with a resin content of 31% by weight.
１０−
このプリプレグを用いて実施例１と全く同様の条件でホ
ットプレス成形物（７ｋＱ ／ｃｍ’ ）と真空バッグ
成形物（Ｉｋｏ ／ｃｍ’ ）を作った。各成形物の物
性は次のとおりであった。10- Using this prepreg, a hot press molded product (7 kQ/cm') and a vacuum bag molded product (Iko/cm') were made under exactly the same conditions as in Example 1. The physical properties of each molded product were as follows.
比較例１．（成分（Ｂ）量が本発明の範囲外）（Ａ）ア
ラルダイトＥＰＮ１１３８（チバガイギー社製）５５部
、（Ｂ）エピコート１００１ （シェル化学社製）４０
部、（Ｃ）エポトートＹＨ４３４（東部化成社製）５部
、それにＤＩＣＹ３部、ＤＭＵ ５部を用いて実施例１
と同様にしてプリプレグを作り、さらにこのプリプレグ
を用いてホットプレス成形又は真空バッグ成形によって
、下記物性の成形物を１ｑた。Comparative example 1. (Amount of component (B) is outside the scope of the present invention) (A) Araldite EPN1138 (manufactured by Ciba Geigy) 55 parts, (B) Epicote 1001 (manufactured by Shell Chemical Company) 40 parts
(C) Example 1 using 5 parts of Epotote YH434 (manufactured by Tobu Kasei Co., Ltd.), 3 parts of DICY, and 5 parts of DMU.
A prepreg was prepared in the same manner as above, and this prepreg was further subjected to hot press molding or vacuum bag molding to obtain 1 q of molded products having the following physical properties.
前記真空バッグ成形物は内部に多数のボイドが認められ
、前表に示すようにｒ ＬＳＳ値が低くコンボジン１〜
特性に劣るものであった。The vacuum bag molded product had a large number of voids inside, and as shown in the table above, the r LSS value was low and Compojin 1~
It had inferior characteristics.
比較例２（成分（Ｂ）量が本発明の範囲外）〔△〕アラ
ルダイトＥＰＮ１１３８（チバガイギー社製）６５部、
（Ｂ）エピコート１００２ （エポキシ当量６３０、シ
ェル化学社製）１０部、（Ｃ）エボトートＹＨ４３４（
東部化成社製）７部、それにＤｒＣＹ３部、ＤＭＵ
５部をを用いて、実施例１と同様にしてプリプレグを作
り、さらにこのプリプレグを用いてホットプレス成形又
は真空バッグ成形により下記物性の成形物を得た。Comparative Example 2 (Amount of component (B) is outside the range of the present invention) [△] 65 parts of Araldite EPN1138 (manufactured by Ciba Geigy),
(B) 10 parts of Epicote 1002 (epoxy equivalent: 630, manufactured by Shell Chemical Co., Ltd.), (C) Evotote YH434 (
(manufactured by Tobu Kasei Co., Ltd.) 7 parts, and 3 parts of DrCY, DMU
Using 5 parts, a prepreg was prepared in the same manner as in Example 1, and this prepreg was further subjected to hot press molding or vacuum bag molding to obtain a molded product having the following physical properties.
前記の真空バッグ成形物は内部に多数のボイドが認めら
れ、前表に示すようにＩ ＬＳＳ値が低くコンポジット
特性に劣るものであった。Many voids were observed inside the vacuum bag molded product, and as shown in the table above, the ILSS value was low and the composite properties were poor.
比較例３〜５
１３−
（注）＊： 本発明の範囲外
＊＊： プリプレグを１０Ｏｎ＋＋ｎΦのマンドレル
に長さ方向に対し９０°方
向に１０ブライし、次にＯ°力方
向１０プライしてポリ１ステルテ
ープでラッピングした後１３０°Ｃ
で９０分硬化して得たパイプにつ
いて、室温に冷却したとき外層
の０°方向にクラックが発生す
るかどうかのテストによる結果。Comparative Examples 3 to 5 13- (Note) *: Outside the scope of the present invention**: The prepreg was laid on a 10On++nΦ mandrel 10 times in the 90° direction with respect to the length direction, and then 10 times in the 0° force direction to form a polyester. The results of a test to determine whether or not cracks would occur in the 0° direction of the outer layer when the pipe was wrapped with Stell tape and cured at 130°C for 90 minutes when cooled to room temperature.
特許出願人 東邦ヘスロン林式会社
代理人弁理士 土 居 三 部
１４−
手続補正書（方式）
昭和５７年７月１７日
特許庁長官 殿
１、事件の表示
昭和５７年特許願第４８２６７Ｍ
２、発明の名称
プリプレグ
３、補正をする者 〒１０３
事件との関係 （特許出願人）
居 所 東京都中央区日本橋三丁目３番９号名 称
東邦ベスロン株式会礼
代表者 湯 浅 誠 也
４、代理人 〒１０５
住 所 東京都港区西新橋１丁目１０番８号！５、
補正命令の日付
昭和５７年６月１１日（発送日 昭和５７年６月２９日
）６、補正の対象 願書および明細書７、？ｉｉ
正の内容 別紙の通り（浄書、内容に変更なし）
１６１−Patent Applicant Toho Hesron Hayashi Shiki Company Patent Attorney Doi Doi 3 Part 14 - Procedural Amendment (Method) July 17, 1980 Director General of the Patent Office 1, Indication of Case 1982 Patent Application No. 48267M 2, Invention Name of Prepreg 3, Person making the amendment Address: 103 Relationship to the case (Patent applicant) Address: 3-3-9 Nihonbashi, Chuo-ku, Tokyo Name: Toho Bethlon Co., Ltd. Representative Seiya Yuasa 4, Agent 105 Address: 1-10-8 Nishi-Shinbashi, Minato-ku, Tokyo! 5,
Date of amendment order: June 11, 1980 (Shipping date: June 29, 1982) 6. Subject of amendment: Application and specification 7. ii
Correct content As shown in the attached sheet (engraved, no changes to the content)
161-
Claims (2)
ック型Ｊポキシ樹脂 ５５〜７５重量部 （Ｂ）ビスフェノールＡ型エポキシ樹脂２０〜３５重量
部 （Ｃ）グリシジルアミン型エポキシ樹脂５〜１０重量部 のエポキシ樹脂成分と、ジシアンジアミド及び３ −（
３，４−ジクロルフェニル） −１，１−Ｎ −ジメチ
ル尿素を含む樹脂組成物を含浸してなるプリプレグ。(1) The following components (A), (B), (C), (A) 55 to 75 parts by weight of novolac type J poxy resin (B) 20 to 35 parts by weight of bisphenol A type epoxy resin (C) Glycidylamine type epoxy An epoxy resin component of 5 to 10 parts by weight of resin, dicyandiamide and 3-(
A prepreg impregnated with a resin composition containing 3,4-dichlorophenyl)-1,1-N-dimethylurea.
（７）ビスフェノールＡ型エポキシ樹脂を８０重量％以
上含む特許請求の範囲（１）のプリプレグ。(2) Ingredient (B) 1180-550
(7) The prepreg according to claim (1), which contains 80% by weight or more of bisphenol A epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4826782A JPS58167625A (en) | 1982-03-26 | 1982-03-26 | Prepreg |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4826782A JPS58167625A (en) | 1982-03-26 | 1982-03-26 | Prepreg |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58167625A true JPS58167625A (en) | 1983-10-03 |
| JPS6345739B2 JPS6345739B2 (en) | 1988-09-12 |
Family
ID=12798657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4826782A Granted JPS58167625A (en) | 1982-03-26 | 1982-03-26 | Prepreg |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58167625A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61138621A (en) * | 1984-12-11 | 1986-06-26 | Sumitomo Bakelite Co Ltd | Production of epoxy resin laminated board |
| JPS6259021A (en) * | 1985-09-10 | 1987-03-14 | Sumitomo Bakelite Co Ltd | Manufacture of laminated sheet for printed circuit |
| JPS6271643A (en) * | 1985-09-26 | 1987-04-02 | 住友ベークライト株式会社 | Manufacture of laminated board for printed circuit |
| US4714648A (en) * | 1984-08-01 | 1987-12-22 | Toho Rayon Co., Ltd. | Prepregs and method for production thereof |
| JPS6310618A (en) * | 1986-06-30 | 1988-01-18 | Mitsubishi Rayon Co Ltd | Epoxy resin composition |
| JP2016504472A (en) * | 2013-01-07 | 2016-02-12 | 東レ株式会社 | Epoxy resin composition, prepreg, fiber reinforced plastic material, and method for producing fiber reinforced plastic material |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5569616A (en) * | 1978-11-17 | 1980-05-26 | Toray Ind Inc | Epoxy resin composition for carbon fiber-reinforcement |
-
1982
- 1982-03-26 JP JP4826782A patent/JPS58167625A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5569616A (en) * | 1978-11-17 | 1980-05-26 | Toray Ind Inc | Epoxy resin composition for carbon fiber-reinforcement |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4714648A (en) * | 1984-08-01 | 1987-12-22 | Toho Rayon Co., Ltd. | Prepregs and method for production thereof |
| JPS61138621A (en) * | 1984-12-11 | 1986-06-26 | Sumitomo Bakelite Co Ltd | Production of epoxy resin laminated board |
| JPH0475926B2 (en) * | 1984-12-11 | 1992-12-02 | Sumitomo Bakelite Co | |
| JPS6259021A (en) * | 1985-09-10 | 1987-03-14 | Sumitomo Bakelite Co Ltd | Manufacture of laminated sheet for printed circuit |
| JPH0573076B2 (en) * | 1985-09-10 | 1993-10-13 | Sumitomo Bakelite Co | |
| JPS6271643A (en) * | 1985-09-26 | 1987-04-02 | 住友ベークライト株式会社 | Manufacture of laminated board for printed circuit |
| JPH0573077B2 (en) * | 1985-09-26 | 1993-10-13 | Sumitomo Bakelite Co | |
| JPS6310618A (en) * | 1986-06-30 | 1988-01-18 | Mitsubishi Rayon Co Ltd | Epoxy resin composition |
| JP2016504472A (en) * | 2013-01-07 | 2016-02-12 | 東レ株式会社 | Epoxy resin composition, prepreg, fiber reinforced plastic material, and method for producing fiber reinforced plastic material |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6345739B2 (en) | 1988-09-12 |
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