JPS6466225A - Resin composition - Google Patents
Resin compositionInfo
- Publication number
- JPS6466225A JPS6466225A JP22210387A JP22210387A JPS6466225A JP S6466225 A JPS6466225 A JP S6466225A JP 22210387 A JP22210387 A JP 22210387A JP 22210387 A JP22210387 A JP 22210387A JP S6466225 A JPS6466225 A JP S6466225A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- component
- epoxy resin
- blending
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE:To obtain a resin composition, having excellent heat and moisture resistance and suitable for sealing electronic parts, etc., by blending a specific epoxy resin with phenolic novolak resin and curing accelerator. CONSTITUTION:A composition obtained by blending (A) an epoxy resin consisting of (i) 95-40pts.wt. o-cresol novolak resin and (ii) 5-60pts.wt. polyfunctional epoxy resin containing >=40wt.% epoxy compound expressed by the formula (R is H or 1-10C alkyl; m is 1, 2 or 3; n is >=1) in a polyfunctional epoxy resin expressed by the formula (R and m are as described above; n is 0-10) with (B) a phenolic novolak resin as a curing agent and (C) a curing accelerator (e.g. 2-methylimidazole). Furthermore, the blending ratio of the components is preferably hydroxyl groups in an amount of 0.8-1.1 equiv. based on 1 epoxy equiv. component (A) and the component (C) in an amount of 0.8-1.2wt.% based on the component (A).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62222103A JPH0725865B2 (en) | 1987-09-07 | 1987-09-07 | Resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62222103A JPH0725865B2 (en) | 1987-09-07 | 1987-09-07 | Resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6466225A true JPS6466225A (en) | 1989-03-13 |
JPH0725865B2 JPH0725865B2 (en) | 1995-03-22 |
Family
ID=16777186
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62222103A Expired - Fee Related JPH0725865B2 (en) | 1987-09-07 | 1987-09-07 | Resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0725865B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0835892A4 (en) * | 1995-06-27 | 1998-06-10 | Hitachi Chemical Co Ltd | Epoxy resin composition for printed wiring board and laminated board produced with the use of the same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6142530A (en) * | 1984-08-06 | 1986-03-01 | Sumitomo Bakelite Co Ltd | Epoxy resin composition |
-
1987
- 1987-09-07 JP JP62222103A patent/JPH0725865B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6142530A (en) * | 1984-08-06 | 1986-03-01 | Sumitomo Bakelite Co Ltd | Epoxy resin composition |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0835892A4 (en) * | 1995-06-27 | 1998-06-10 | Hitachi Chemical Co Ltd | Epoxy resin composition for printed wiring board and laminated board produced with the use of the same |
Also Published As
Publication number | Publication date |
---|---|
JPH0725865B2 (en) | 1995-03-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |