JPS6466225A - Resin composition - Google Patents

Resin composition

Info

Publication number
JPS6466225A
JPS6466225A JP22210387A JP22210387A JPS6466225A JP S6466225 A JPS6466225 A JP S6466225A JP 22210387 A JP22210387 A JP 22210387A JP 22210387 A JP22210387 A JP 22210387A JP S6466225 A JPS6466225 A JP S6466225A
Authority
JP
Japan
Prior art keywords
resin
component
epoxy resin
blending
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22210387A
Other languages
Japanese (ja)
Other versions
JPH0725865B2 (en
Inventor
Masahiro Hamaguchi
Tomiyoshi Ishii
Susumu Nagao
Kenichi Mizoguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Kayaku Co Ltd
Original Assignee
Nippon Kayaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Co Ltd filed Critical Nippon Kayaku Co Ltd
Priority to JP62222103A priority Critical patent/JPH0725865B2/en
Publication of JPS6466225A publication Critical patent/JPS6466225A/en
Publication of JPH0725865B2 publication Critical patent/JPH0725865B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE:To obtain a resin composition, having excellent heat and moisture resistance and suitable for sealing electronic parts, etc., by blending a specific epoxy resin with phenolic novolak resin and curing accelerator. CONSTITUTION:A composition obtained by blending (A) an epoxy resin consisting of (i) 95-40pts.wt. o-cresol novolak resin and (ii) 5-60pts.wt. polyfunctional epoxy resin containing >=40wt.% epoxy compound expressed by the formula (R is H or 1-10C alkyl; m is 1, 2 or 3; n is >=1) in a polyfunctional epoxy resin expressed by the formula (R and m are as described above; n is 0-10) with (B) a phenolic novolak resin as a curing agent and (C) a curing accelerator (e.g. 2-methylimidazole). Furthermore, the blending ratio of the components is preferably hydroxyl groups in an amount of 0.8-1.1 equiv. based on 1 epoxy equiv. component (A) and the component (C) in an amount of 0.8-1.2wt.% based on the component (A).
JP62222103A 1987-09-07 1987-09-07 Resin composition Expired - Fee Related JPH0725865B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62222103A JPH0725865B2 (en) 1987-09-07 1987-09-07 Resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62222103A JPH0725865B2 (en) 1987-09-07 1987-09-07 Resin composition

Publications (2)

Publication Number Publication Date
JPS6466225A true JPS6466225A (en) 1989-03-13
JPH0725865B2 JPH0725865B2 (en) 1995-03-22

Family

ID=16777186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62222103A Expired - Fee Related JPH0725865B2 (en) 1987-09-07 1987-09-07 Resin composition

Country Status (1)

Country Link
JP (1) JPH0725865B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0835892A4 (en) * 1995-06-27 1998-06-10 Hitachi Chemical Co Ltd Epoxy resin composition for printed wiring board and laminated board produced with the use of the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6142530A (en) * 1984-08-06 1986-03-01 Sumitomo Bakelite Co Ltd Epoxy resin composition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6142530A (en) * 1984-08-06 1986-03-01 Sumitomo Bakelite Co Ltd Epoxy resin composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0835892A4 (en) * 1995-06-27 1998-06-10 Hitachi Chemical Co Ltd Epoxy resin composition for printed wiring board and laminated board produced with the use of the same

Also Published As

Publication number Publication date
JPH0725865B2 (en) 1995-03-22

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees