JPS5659841A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS5659841A
JPS5659841A JP13425779A JP13425779A JPS5659841A JP S5659841 A JPS5659841 A JP S5659841A JP 13425779 A JP13425779 A JP 13425779A JP 13425779 A JP13425779 A JP 13425779A JP S5659841 A JPS5659841 A JP S5659841A
Authority
JP
Japan
Prior art keywords
curing agent
epoxy resin
resin
imidazole
prepared
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13425779A
Other languages
Japanese (ja)
Inventor
Masahiro Kitamura
Hiroshi Suzuki
Takashi Urano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Hitachi Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP13425779A priority Critical patent/JPS5659841A/en
Publication of JPS5659841A publication Critical patent/JPS5659841A/en
Pending legal-status Critical Current

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  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)

Abstract

PURPOSE: Titled composition, quick-curing and excellent in storage stability, which is prepared by compounding an epoxy resin with a curing agent, prepared by melting and mixing a specified phenol compound and a tetrasubstituted borate of an imidazole.
CONSTITUTION: (A) 100pts.wt. of a phenol compound such as a novolak resin, having at least three phenolic hydroxy groups per molecule, and (B) 1W20pts.wt. of a tetrasubstituted borate of an imidazole of the formula (wherein R1W5 are H, alkyl, alkenyl, amyl, allyl, cycloalkyl or cycloalkenyl; R6 is phenyl or substituted phenyl), are molten and mixed at 80W180°C, to obtain a curing agent. Then an epoxy resin is compounded with said curing agent in such a proportion that a ratio of the epoxy group equivalent of the resin to the phenolic hydroxy group equivalent of the curing agent is 1 to 0.7W1.2.
COPYRIGHT: (C)1981,JPO&Japio
JP13425779A 1979-10-19 1979-10-19 Epoxy resin composition Pending JPS5659841A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13425779A JPS5659841A (en) 1979-10-19 1979-10-19 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13425779A JPS5659841A (en) 1979-10-19 1979-10-19 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS5659841A true JPS5659841A (en) 1981-05-23

Family

ID=15124063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13425779A Pending JPS5659841A (en) 1979-10-19 1979-10-19 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS5659841A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967660A (en) * 1982-10-12 1984-04-17 Toshiba Corp Resin sealed type semiconductor device
EP0328020A2 (en) * 1988-02-12 1989-08-16 The Dow Chemical Company Use of a catalyst in epoxy compositions
JPH06228280A (en) * 1992-12-10 1994-08-16 Shin Etsu Chem Co Ltd Curing agent for epoxy resin composition, epoxy resin composition and semiconductor device
JP2015183131A (en) * 2014-03-25 2015-10-22 日本曹達株式会社 New inclusion compound, epoxy resin composition containing the same, and hardened matter thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967660A (en) * 1982-10-12 1984-04-17 Toshiba Corp Resin sealed type semiconductor device
JPH0379370B2 (en) * 1982-10-12 1991-12-18 Tokyo Shibaura Electric Co
EP0328020A2 (en) * 1988-02-12 1989-08-16 The Dow Chemical Company Use of a catalyst in epoxy compositions
EP0553887A2 (en) * 1988-02-12 1993-08-04 The Dow Chemical Company Catalysts and epoxy resin composition containing the same
JPH06228280A (en) * 1992-12-10 1994-08-16 Shin Etsu Chem Co Ltd Curing agent for epoxy resin composition, epoxy resin composition and semiconductor device
JP2015183131A (en) * 2014-03-25 2015-10-22 日本曹達株式会社 New inclusion compound, epoxy resin composition containing the same, and hardened matter thereof

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