JPS5659841A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS5659841A JPS5659841A JP13425779A JP13425779A JPS5659841A JP S5659841 A JPS5659841 A JP S5659841A JP 13425779 A JP13425779 A JP 13425779A JP 13425779 A JP13425779 A JP 13425779A JP S5659841 A JPS5659841 A JP S5659841A
- Authority
- JP
- Japan
- Prior art keywords
- curing agent
- epoxy resin
- resin
- imidazole
- prepared
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
Abstract
PURPOSE: Titled composition, quick-curing and excellent in storage stability, which is prepared by compounding an epoxy resin with a curing agent, prepared by melting and mixing a specified phenol compound and a tetrasubstituted borate of an imidazole.
CONSTITUTION: (A) 100pts.wt. of a phenol compound such as a novolak resin, having at least three phenolic hydroxy groups per molecule, and (B) 1W20pts.wt. of a tetrasubstituted borate of an imidazole of the formula (wherein R1W5 are H, alkyl, alkenyl, amyl, allyl, cycloalkyl or cycloalkenyl; R6 is phenyl or substituted phenyl), are molten and mixed at 80W180°C, to obtain a curing agent. Then an epoxy resin is compounded with said curing agent in such a proportion that a ratio of the epoxy group equivalent of the resin to the phenolic hydroxy group equivalent of the curing agent is 1 to 0.7W1.2.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13425779A JPS5659841A (en) | 1979-10-19 | 1979-10-19 | Epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13425779A JPS5659841A (en) | 1979-10-19 | 1979-10-19 | Epoxy resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5659841A true JPS5659841A (en) | 1981-05-23 |
Family
ID=15124063
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13425779A Pending JPS5659841A (en) | 1979-10-19 | 1979-10-19 | Epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5659841A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5967660A (en) * | 1982-10-12 | 1984-04-17 | Toshiba Corp | Resin sealed type semiconductor device |
EP0328020A2 (en) * | 1988-02-12 | 1989-08-16 | The Dow Chemical Company | Use of a catalyst in epoxy compositions |
JPH06228280A (en) * | 1992-12-10 | 1994-08-16 | Shin Etsu Chem Co Ltd | Curing agent for epoxy resin composition, epoxy resin composition and semiconductor device |
JP2015183131A (en) * | 2014-03-25 | 2015-10-22 | 日本曹達株式会社 | New inclusion compound, epoxy resin composition containing the same, and hardened matter thereof |
-
1979
- 1979-10-19 JP JP13425779A patent/JPS5659841A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5967660A (en) * | 1982-10-12 | 1984-04-17 | Toshiba Corp | Resin sealed type semiconductor device |
JPH0379370B2 (en) * | 1982-10-12 | 1991-12-18 | Tokyo Shibaura Electric Co | |
EP0328020A2 (en) * | 1988-02-12 | 1989-08-16 | The Dow Chemical Company | Use of a catalyst in epoxy compositions |
EP0553887A2 (en) * | 1988-02-12 | 1993-08-04 | The Dow Chemical Company | Catalysts and epoxy resin composition containing the same |
JPH06228280A (en) * | 1992-12-10 | 1994-08-16 | Shin Etsu Chem Co Ltd | Curing agent for epoxy resin composition, epoxy resin composition and semiconductor device |
JP2015183131A (en) * | 2014-03-25 | 2015-10-22 | 日本曹達株式会社 | New inclusion compound, epoxy resin composition containing the same, and hardened matter thereof |
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