JPS5590554A - Silicone-epoxy resin composition - Google Patents

Silicone-epoxy resin composition

Info

Publication number
JPS5590554A
JPS5590554A JP16183278A JP16183278A JPS5590554A JP S5590554 A JPS5590554 A JP S5590554A JP 16183278 A JP16183278 A JP 16183278A JP 16183278 A JP16183278 A JP 16183278A JP S5590554 A JPS5590554 A JP S5590554A
Authority
JP
Japan
Prior art keywords
epoxy resin
group
silicone
resin composition
alkylphenylpolysiloxane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16183278A
Other languages
Japanese (ja)
Other versions
JPS5742664B2 (en
Inventor
Ryuzo Mikami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Toray Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Silicone Co Ltd filed Critical Toray Silicone Co Ltd
Priority to JP16183278A priority Critical patent/JPS5590554A/en
Publication of JPS5590554A publication Critical patent/JPS5590554A/en
Publication of JPS5742664B2 publication Critical patent/JPS5742664B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: A silicone-epoxy resin composition having the powder to form a film excellent in adhesiveness, moisture resistance, and boiling water resistance and consisting of a silicone-modified epoxy resin from the reaction of a specific composition of an alkylphenylpolysiloxane and an epoxy resin, an organo-silicon compound, and a hardener.
CONSTITUTION: One hundred pts.wt. of a silicone-modified epoxy resin (A), obtained from the reaction of 5W70pts.wt. of an alkylphenylpolysiloxane of the formula (R is an alkyl-phenyl group in an alkyl/phenyl ratio of 0.3W3, X is an alkoxy group and/or hydroxyl group, a is 0.9W1.8, and b is 0.01W2) and 95W30pts.wt. of an epoxy resin having at least two epoxy groups per one molecule, 0.01W100pts.wt. of an organic silicon compound having univalent organic residual group with epoxy group combining with silicon atom and univalent organic residual group with methacrylic group, and a hardener (C) for the component A are mixed together to obtain the subjective resin composition.
COPYRIGHT: (C)1980,JPO&Japio
JP16183278A 1978-12-29 1978-12-29 Silicone-epoxy resin composition Granted JPS5590554A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16183278A JPS5590554A (en) 1978-12-29 1978-12-29 Silicone-epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16183278A JPS5590554A (en) 1978-12-29 1978-12-29 Silicone-epoxy resin composition

Publications (2)

Publication Number Publication Date
JPS5590554A true JPS5590554A (en) 1980-07-09
JPS5742664B2 JPS5742664B2 (en) 1982-09-09

Family

ID=15742761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16183278A Granted JPS5590554A (en) 1978-12-29 1978-12-29 Silicone-epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS5590554A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10195381A (en) * 1997-01-13 1998-07-28 Daihachi Chem Ind Co Ltd Composition for coating film formation
JP2008513575A (en) * 2004-09-15 2008-05-01 ピーピージー インダストリーズ オハイオ， インコーポレイテッド Fast-curing modified siloxane composition
WO2022075213A1 (en) * 2020-10-05 2022-04-14 デンカ株式会社 Two-part curing composition set, thermally conductive cured article, and electronic device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10195381A (en) * 1997-01-13 1998-07-28 Daihachi Chem Ind Co Ltd Composition for coating film formation
JP2008513575A (en) * 2004-09-15 2008-05-01 ピーピージー インダストリーズ オハイオ， インコーポレイテッド Fast-curing modified siloxane composition
WO2022075213A1 (en) * 2020-10-05 2022-04-14 デンカ株式会社 Two-part curing composition set, thermally conductive cured article, and electronic device

Also Published As

Publication number Publication date
JPS5742664B2 (en) 1982-09-09

Similar Documents

Publication Publication Date Title
JPS562319A (en) Epoxy resin composition
JPS56103224A (en) Preparation of epoxy-modified silicone resin
JPS5548245A (en) Silicone resin composition
JPS5590554A (en) Silicone-epoxy resin composition
JPS5679161A (en) Epoxy resin composition for powder coating compound
JPS5590553A (en) Silicone-modified epoxy resin composition
JPS5356284A (en) Ultraviolet-curing resin compositions
JPS5763358A (en) Resin composition
JPS572328A (en) Composition for adhesive
JPS5767664A (en) Film forming assistant composition for vinyl polymeric aqueous emulsion
JPS557861A (en) Thermosetting resin composition
ES8400757A1 (en) Process for increasing the viscosity of mixtures containing epoxy resins.
JPS5236133A (en) Resin compositions for powder coating compounds
JPS5755921A (en) Water-resistant epoxy resin composition
JPS5467000A (en) Transparent thermosetting resin composition
JPS5655421A (en) Thermosetting resin composition
JPS53106746A (en) Polyolefin resin composition
JPS54129098A (en) Thermosetting resin composition
JPS55116772A (en) Primer composition
JPS55152716A (en) Preparation of epoxy resin composition
JPS56139527A (en) Epoxy series resin composition
JPS54118435A (en) Unsaturated polyester resin coating composition curable in air
JPS5237957A (en) Chlorine-containing resin compositions
JPS57108123A (en) Flame-retarding resin composition
JPS5693748A (en) Epoxy resin composition with excellent thixotropic property