JPS557861A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPS557861A JPS557861A JP8076078A JP8076078A JPS557861A JP S557861 A JPS557861 A JP S557861A JP 8076078 A JP8076078 A JP 8076078A JP 8076078 A JP8076078 A JP 8076078A JP S557861 A JPS557861 A JP S557861A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- group
- polymaleimide
- vinylphenol
- aminophenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: The title resin composition having improved heat resistance, stability, and performance, comprising an adduct of a polymaleimide with an aminophenol, an epoxy resin, and a poly-p-vinylphenol.
CONSTITUTION: A resin composition comprising (A) 20W80 wt.% of an adduct of (a) a polymaleimide, e.g. 4,4'-dephenylmethanebismaleimide, of formula I: (R1 is n-functional organic group; X1 and X2 are H, halogen, or organic groups; n is an integer ≥2), with (b) an aminophenol of formula II: (R2 is H, halogen, or organic group, m is an integer 1W5), (B) an epoxy resin, and (C) a poly-p-vinylphenol at an equivalent ratio of hydroxyl group to epoxy group of 0.8W1.2:1.
USE: Prepreg tapes, copper-clad laminates, coating powder, and impregnating varnishes.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8076078A JPS557861A (en) | 1978-07-03 | 1978-07-03 | Thermosetting resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8076078A JPS557861A (en) | 1978-07-03 | 1978-07-03 | Thermosetting resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS557861A true JPS557861A (en) | 1980-01-21 |
Family
ID=13727362
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8076078A Pending JPS557861A (en) | 1978-07-03 | 1978-07-03 | Thermosetting resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS557861A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56151725A (en) * | 1980-04-26 | 1981-11-24 | Matsushita Electric Works Ltd | Curing agent for epoxy resin |
US4415688A (en) * | 1981-11-27 | 1983-11-15 | Adeka Argus Chemical Co., Ltd. | Poly(piperidylamine) alkanes and synthetic resin compositions stabilized thereby |
JPS63267758A (en) * | 1987-04-27 | 1988-11-04 | Adeka Argus Chem Co Ltd | Piperidine compound |
JP2009024146A (en) * | 2006-09-29 | 2009-02-05 | Hitachi Chem Co Ltd | Thermosetting resin composition and prepreg and laminate using the same |
US9603244B2 (en) | 2006-09-29 | 2017-03-21 | Hitachi Chemical Company, Ltd | Thermosetting resin composition and prepreg and laminate obtained with the same |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5177698A (en) * | 1974-12-28 | 1976-07-06 | Sumitomo Bakelite Co | TAINETSUSEIJUSHISOSEIBUTSU |
JPS5251499A (en) * | 1975-10-23 | 1977-04-25 | Toshiba Chem Corp | Theremosetting resin compositions |
JPS5254798A (en) * | 1975-10-31 | 1977-05-04 | Hitachi Ltd | Thermosetting resin compositions |
JPS5341397A (en) * | 1976-09-28 | 1978-04-14 | Toshiba Corp | Thermosetting resin composition |
-
1978
- 1978-07-03 JP JP8076078A patent/JPS557861A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5177698A (en) * | 1974-12-28 | 1976-07-06 | Sumitomo Bakelite Co | TAINETSUSEIJUSHISOSEIBUTSU |
JPS5251499A (en) * | 1975-10-23 | 1977-04-25 | Toshiba Chem Corp | Theremosetting resin compositions |
JPS5254798A (en) * | 1975-10-31 | 1977-05-04 | Hitachi Ltd | Thermosetting resin compositions |
JPS5341397A (en) * | 1976-09-28 | 1978-04-14 | Toshiba Corp | Thermosetting resin composition |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56151725A (en) * | 1980-04-26 | 1981-11-24 | Matsushita Electric Works Ltd | Curing agent for epoxy resin |
US4415688A (en) * | 1981-11-27 | 1983-11-15 | Adeka Argus Chemical Co., Ltd. | Poly(piperidylamine) alkanes and synthetic resin compositions stabilized thereby |
JPS63267758A (en) * | 1987-04-27 | 1988-11-04 | Adeka Argus Chem Co Ltd | Piperidine compound |
JP2009024146A (en) * | 2006-09-29 | 2009-02-05 | Hitachi Chem Co Ltd | Thermosetting resin composition and prepreg and laminate using the same |
US9603244B2 (en) | 2006-09-29 | 2017-03-21 | Hitachi Chemical Company, Ltd | Thermosetting resin composition and prepreg and laminate obtained with the same |
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