JPS557861A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS557861A
JPS557861A JP8076078A JP8076078A JPS557861A JP S557861 A JPS557861 A JP S557861A JP 8076078 A JP8076078 A JP 8076078A JP 8076078 A JP8076078 A JP 8076078A JP S557861 A JPS557861 A JP S557861A
Authority
JP
Japan
Prior art keywords
resin composition
group
polymaleimide
vinylphenol
aminophenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8076078A
Other languages
Japanese (ja)
Inventor
Kazuyuki Tomonaga
Tsutomu Okawa
Kiyoji Makino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Products Co Ltd
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd, Toshiba Chemical Corp filed Critical Toshiba Chemical Products Co Ltd
Priority to JP8076078A priority Critical patent/JPS557861A/en
Publication of JPS557861A publication Critical patent/JPS557861A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: The title resin composition having improved heat resistance, stability, and performance, comprising an adduct of a polymaleimide with an aminophenol, an epoxy resin, and a poly-p-vinylphenol.
CONSTITUTION: A resin composition comprising (A) 20W80 wt.% of an adduct of (a) a polymaleimide, e.g. 4,4'-dephenylmethanebismaleimide, of formula I: (R1 is n-functional organic group; X1 and X2 are H, halogen, or organic groups; n is an integer ≥2), with (b) an aminophenol of formula II: (R2 is H, halogen, or organic group, m is an integer 1W5), (B) an epoxy resin, and (C) a poly-p-vinylphenol at an equivalent ratio of hydroxyl group to epoxy group of 0.8W1.2:1.
USE: Prepreg tapes, copper-clad laminates, coating powder, and impregnating varnishes.
COPYRIGHT: (C)1980,JPO&Japio
JP8076078A 1978-07-03 1978-07-03 Thermosetting resin composition Pending JPS557861A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8076078A JPS557861A (en) 1978-07-03 1978-07-03 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8076078A JPS557861A (en) 1978-07-03 1978-07-03 Thermosetting resin composition

Publications (1)

Publication Number Publication Date
JPS557861A true JPS557861A (en) 1980-01-21

Family

ID=13727362

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8076078A Pending JPS557861A (en) 1978-07-03 1978-07-03 Thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS557861A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56151725A (en) * 1980-04-26 1981-11-24 Matsushita Electric Works Ltd Curing agent for epoxy resin
US4415688A (en) * 1981-11-27 1983-11-15 Adeka Argus Chemical Co., Ltd. Poly(piperidylamine) alkanes and synthetic resin compositions stabilized thereby
JPS63267758A (en) * 1987-04-27 1988-11-04 Adeka Argus Chem Co Ltd Piperidine compound
JP2009024146A (en) * 2006-09-29 2009-02-05 Hitachi Chem Co Ltd Thermosetting resin composition and prepreg and laminate using the same
US9603244B2 (en) 2006-09-29 2017-03-21 Hitachi Chemical Company, Ltd Thermosetting resin composition and prepreg and laminate obtained with the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5177698A (en) * 1974-12-28 1976-07-06 Sumitomo Bakelite Co TAINETSUSEIJUSHISOSEIBUTSU
JPS5251499A (en) * 1975-10-23 1977-04-25 Toshiba Chem Corp Theremosetting resin compositions
JPS5254798A (en) * 1975-10-31 1977-05-04 Hitachi Ltd Thermosetting resin compositions
JPS5341397A (en) * 1976-09-28 1978-04-14 Toshiba Corp Thermosetting resin composition

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5177698A (en) * 1974-12-28 1976-07-06 Sumitomo Bakelite Co TAINETSUSEIJUSHISOSEIBUTSU
JPS5251499A (en) * 1975-10-23 1977-04-25 Toshiba Chem Corp Theremosetting resin compositions
JPS5254798A (en) * 1975-10-31 1977-05-04 Hitachi Ltd Thermosetting resin compositions
JPS5341397A (en) * 1976-09-28 1978-04-14 Toshiba Corp Thermosetting resin composition

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56151725A (en) * 1980-04-26 1981-11-24 Matsushita Electric Works Ltd Curing agent for epoxy resin
US4415688A (en) * 1981-11-27 1983-11-15 Adeka Argus Chemical Co., Ltd. Poly(piperidylamine) alkanes and synthetic resin compositions stabilized thereby
JPS63267758A (en) * 1987-04-27 1988-11-04 Adeka Argus Chem Co Ltd Piperidine compound
JP2009024146A (en) * 2006-09-29 2009-02-05 Hitachi Chem Co Ltd Thermosetting resin composition and prepreg and laminate using the same
US9603244B2 (en) 2006-09-29 2017-03-21 Hitachi Chemical Company, Ltd Thermosetting resin composition and prepreg and laminate obtained with the same

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