JPS5723624A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS5723624A
JPS5723624A JP9623580A JP9623580A JPS5723624A JP S5723624 A JPS5723624 A JP S5723624A JP 9623580 A JP9623580 A JP 9623580A JP 9623580 A JP9623580 A JP 9623580A JP S5723624 A JPS5723624 A JP S5723624A
Authority
JP
Japan
Prior art keywords
compound
formimidate
group
epoxy
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9623580A
Other languages
Japanese (ja)
Inventor
Shiyuichi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP9623580A priority Critical patent/JPS5723624A/en
Publication of JPS5723624A publication Critical patent/JPS5723624A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prepare the titled composition having excellent affinity and adhesivity to metals, organic materials, etc., curable easily at a low temperature, and giving a cured product having good electrical and mechanical properties, by compounding a formimidate compound and an epoxy compound.
CONSTITUTION: The objective composition can be obtained by compoundimg (A) a compound having a formimidate group (e.g. N, N'-methylene-di-p-phenylene- bisformimidate) with an epoxy compound (e.g. bisphenol A epoxy resin). The amount of the formimidate group of the component (A) is selected to be pref. 0.1W1 equivalent per 1 equivalent of the epoxy group of the component (B).
COPYRIGHT: (C)1982,JPO&Japio
JP9623580A 1980-07-16 1980-07-16 Epoxy resin composition Pending JPS5723624A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9623580A JPS5723624A (en) 1980-07-16 1980-07-16 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9623580A JPS5723624A (en) 1980-07-16 1980-07-16 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS5723624A true JPS5723624A (en) 1982-02-06

Family

ID=14159559

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9623580A Pending JPS5723624A (en) 1980-07-16 1980-07-16 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS5723624A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03240639A (en) * 1990-02-15 1991-10-28 Jun Yanagimachi Attaching method of identification tape and its apparatus
JP2008078995A (en) * 2006-09-21 2008-04-03 Nec Electronics Corp Phase shifting circuit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03240639A (en) * 1990-02-15 1991-10-28 Jun Yanagimachi Attaching method of identification tape and its apparatus
JP2008078995A (en) * 2006-09-21 2008-04-03 Nec Electronics Corp Phase shifting circuit

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