JPS5740524A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS5740524A JPS5740524A JP11593980A JP11593980A JPS5740524A JP S5740524 A JPS5740524 A JP S5740524A JP 11593980 A JP11593980 A JP 11593980A JP 11593980 A JP11593980 A JP 11593980A JP S5740524 A JPS5740524 A JP S5740524A
- Authority
- JP
- Japan
- Prior art keywords
- pref
- curing agent
- component
- epoxy resin
- esp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Epoxy Resins (AREA)
Abstract
PURPOSE: To prepare the titled composition having excellent high-temperature electrical properties, humidity resistance, latent curability and marking characteristics, by compounding an epoxy resin with a mixture of phenolic resin curing agent and acid anhydride curing agent, and an organic phosphine compound.
CONSTITUTION: The objective composition is prepared by compounding (A) an epoxy resin (esp. pref. a novolak epoxy resin having an epoxy equivalent of 170W 300), with (B) a mixture of (i) a phenolic resin curing agent (esp. pref. a novolak phenolic resin) and (ii) 0.1W50wt%, based on the component (a), of an acid anhydride curing agent (e.g. phthalic anhydride), and (C) a cure accelerator comprising an organic phosphine compound (esp. pref. triphenylphosphine, etc.), and if necessary, (D) an inorganic filler (pref. quartz glass powder, etc.). The amount of the component (i) as adjusted to give the ratio of the phenolic hydroxy group to the epoxy group of 0.5W1.5, and the amount of the component (C) is pref. 0.01W5wt%, based on the component (A).
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11593980A JPS5740524A (en) | 1980-08-25 | 1980-08-25 | Epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11593980A JPS5740524A (en) | 1980-08-25 | 1980-08-25 | Epoxy resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5740524A true JPS5740524A (en) | 1982-03-06 |
Family
ID=14674914
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11593980A Pending JPS5740524A (en) | 1980-08-25 | 1980-08-25 | Epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5740524A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60190418A (en) * | 1984-03-12 | 1985-09-27 | Mitsubishi Electric Corp | Liquid epoxy resin composition for sealing semiconductors |
JPS6357630A (en) * | 1986-08-29 | 1988-03-12 | New Japan Chem Co Ltd | Epoxy resin curing agent composition |
US5310826A (en) * | 1989-04-26 | 1994-05-10 | Akzo N.V. | Thiolic compound polymerization cocatalysts |
US5418265A (en) * | 1991-01-25 | 1995-05-23 | Somar Corporation | Powder epoxy resin coating composition |
-
1980
- 1980-08-25 JP JP11593980A patent/JPS5740524A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60190418A (en) * | 1984-03-12 | 1985-09-27 | Mitsubishi Electric Corp | Liquid epoxy resin composition for sealing semiconductors |
JPS6357630A (en) * | 1986-08-29 | 1988-03-12 | New Japan Chem Co Ltd | Epoxy resin curing agent composition |
JPH0523283B2 (en) * | 1986-08-29 | 1993-04-02 | Shin Nippon Rika Kk | |
US5310826A (en) * | 1989-04-26 | 1994-05-10 | Akzo N.V. | Thiolic compound polymerization cocatalysts |
US5418265A (en) * | 1991-01-25 | 1995-05-23 | Somar Corporation | Powder epoxy resin coating composition |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS56136816A (en) | Epoxy resin composition | |
JPS57125212A (en) | Photo-polymerizable composition | |
JPS5740524A (en) | Epoxy resin composition | |
JPS572329A (en) | Epoxy resin type composition and semiconductor device of resin sealing type | |
JPS5723625A (en) | Epoxy resin composition and resin-sealed semiconductor device | |
JPS5529532A (en) | Epoxy resin composition | |
JPS5569616A (en) | Epoxy resin composition for carbon fiber-reinforcement | |
JPS5742724A (en) | Curable composition | |
JPS56120726A (en) | Epoxy resin composition having improved adhesiveness and cracking resistance | |
JPS5356294A (en) | Thermosetting resin composition | |
JPS5682817A (en) | Epoxy resin composition | |
JPS5655422A (en) | Curable resin composition | |
JPS5751720A (en) | Curable resin composition | |
JPS5710255A (en) | Epoxy resin composition and resin sealed type semiconductor device | |
JPS57121028A (en) | Epoxy resin composition | |
JPS57190018A (en) | Epoxy resin composition | |
JPS5740523A (en) | Epoxy resin composition | |
JPS57119947A (en) | Epoxy resin composition | |
JPS5749613A (en) | Thermosetting resin composition | |
JPS5767628A (en) | Curable composition containing spiro-orthoester compound | |
JPS5414499A (en) | Heat resistant resin composition | |
JPS5723624A (en) | Epoxy resin composition | |
JPS544994A (en) | Epoxy resin composition | |
JPS57133122A (en) | Curable resin composition | |
JPS5718752A (en) | Epoxy resin composition |