JPS5740524A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS5740524A
JPS5740524A JP11593980A JP11593980A JPS5740524A JP S5740524 A JPS5740524 A JP S5740524A JP 11593980 A JP11593980 A JP 11593980A JP 11593980 A JP11593980 A JP 11593980A JP S5740524 A JPS5740524 A JP S5740524A
Authority
JP
Japan
Prior art keywords
pref
curing agent
component
epoxy resin
esp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11593980A
Other languages
Japanese (ja)
Inventor
Hirotoshi Iketani
Akiko Hatanaka
Shiyuichi Suzuki
Moriyasu Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11593980A priority Critical patent/JPS5740524A/en
Publication of JPS5740524A publication Critical patent/JPS5740524A/en
Pending legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)

Abstract

PURPOSE: To prepare the titled composition having excellent high-temperature electrical properties, humidity resistance, latent curability and marking characteristics, by compounding an epoxy resin with a mixture of phenolic resin curing agent and acid anhydride curing agent, and an organic phosphine compound.
CONSTITUTION: The objective composition is prepared by compounding (A) an epoxy resin (esp. pref. a novolak epoxy resin having an epoxy equivalent of 170W 300), with (B) a mixture of (i) a phenolic resin curing agent (esp. pref. a novolak phenolic resin) and (ii) 0.1W50wt%, based on the component (a), of an acid anhydride curing agent (e.g. phthalic anhydride), and (C) a cure accelerator comprising an organic phosphine compound (esp. pref. triphenylphosphine, etc.), and if necessary, (D) an inorganic filler (pref. quartz glass powder, etc.). The amount of the component (i) as adjusted to give the ratio of the phenolic hydroxy group to the epoxy group of 0.5W1.5, and the amount of the component (C) is pref. 0.01W5wt%, based on the component (A).
COPYRIGHT: (C)1982,JPO&Japio
JP11593980A 1980-08-25 1980-08-25 Epoxy resin composition Pending JPS5740524A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11593980A JPS5740524A (en) 1980-08-25 1980-08-25 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11593980A JPS5740524A (en) 1980-08-25 1980-08-25 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS5740524A true JPS5740524A (en) 1982-03-06

Family

ID=14674914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11593980A Pending JPS5740524A (en) 1980-08-25 1980-08-25 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS5740524A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60190418A (en) * 1984-03-12 1985-09-27 Mitsubishi Electric Corp Liquid epoxy resin composition for sealing semiconductors
JPS6357630A (en) * 1986-08-29 1988-03-12 New Japan Chem Co Ltd Epoxy resin curing agent composition
US5310826A (en) * 1989-04-26 1994-05-10 Akzo N.V. Thiolic compound polymerization cocatalysts
US5418265A (en) * 1991-01-25 1995-05-23 Somar Corporation Powder epoxy resin coating composition

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60190418A (en) * 1984-03-12 1985-09-27 Mitsubishi Electric Corp Liquid epoxy resin composition for sealing semiconductors
JPS6357630A (en) * 1986-08-29 1988-03-12 New Japan Chem Co Ltd Epoxy resin curing agent composition
JPH0523283B2 (en) * 1986-08-29 1993-04-02 Shin Nippon Rika Kk
US5310826A (en) * 1989-04-26 1994-05-10 Akzo N.V. Thiolic compound polymerization cocatalysts
US5418265A (en) * 1991-01-25 1995-05-23 Somar Corporation Powder epoxy resin coating composition

Similar Documents

Publication Publication Date Title
JPS56136816A (en) Epoxy resin composition
JPS57125212A (en) Photo-polymerizable composition
JPS5740524A (en) Epoxy resin composition
JPS572329A (en) Epoxy resin type composition and semiconductor device of resin sealing type
JPS5723625A (en) Epoxy resin composition and resin-sealed semiconductor device
JPS5529532A (en) Epoxy resin composition
JPS5569616A (en) Epoxy resin composition for carbon fiber-reinforcement
JPS5742724A (en) Curable composition
JPS56120726A (en) Epoxy resin composition having improved adhesiveness and cracking resistance
JPS5356294A (en) Thermosetting resin composition
JPS5682817A (en) Epoxy resin composition
JPS5655422A (en) Curable resin composition
JPS5751720A (en) Curable resin composition
JPS5710255A (en) Epoxy resin composition and resin sealed type semiconductor device
JPS57121028A (en) Epoxy resin composition
JPS57190018A (en) Epoxy resin composition
JPS5740523A (en) Epoxy resin composition
JPS57119947A (en) Epoxy resin composition
JPS5749613A (en) Thermosetting resin composition
JPS5767628A (en) Curable composition containing spiro-orthoester compound
JPS5414499A (en) Heat resistant resin composition
JPS5723624A (en) Epoxy resin composition
JPS544994A (en) Epoxy resin composition
JPS57133122A (en) Curable resin composition
JPS5718752A (en) Epoxy resin composition