JPS56136816A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS56136816A JPS56136816A JP4185980A JP4185980A JPS56136816A JP S56136816 A JPS56136816 A JP S56136816A JP 4185980 A JP4185980 A JP 4185980A JP 4185980 A JP4185980 A JP 4185980A JP S56136816 A JPS56136816 A JP S56136816A
- Authority
- JP
- Japan
- Prior art keywords
- ingredient
- amount
- group
- epoxy
- give
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:A novel composition suitable for sealing up a device of a semiconductor, having improved humidity resistance, obtained by adding a silicone resin having an epoxy group-containing organic group, etc. and a hydroxyl group, etc., a curing agent, and an inorganic filler to an epoxy resin. CONSTITUTION:(A) An epoxy resin is blended with (B) a silicone resin (e.g., resins shown by the formulas I and II, etc.) having one or more epoxy or amino group-containing organic groups and one or more hydroxyl group or hydrolyzable groups, (C) a curing agent, e.g., a phenol compound, e.g., (D) an inorganic filler, e.g., molten silica powder, etc. to give the desired composition. Preferably, the amount of the ingredient B is 0.1-3wt%, the amount of ingredient C is an amount to give a ratio of number of epoxy group in ingredient A to number of functional group in ingredient C in a range 0.5-2, and the amount of ingredient D is an amount to give a weight ratio of A/C 100:33. EFFECT:Improved electrical properties and dimensional stability.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4185980A JPS56136816A (en) | 1980-03-31 | 1980-03-31 | Epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4185980A JPS56136816A (en) | 1980-03-31 | 1980-03-31 | Epoxy resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56136816A true JPS56136816A (en) | 1981-10-26 |
JPS6227095B2 JPS6227095B2 (en) | 1987-06-12 |
Family
ID=12619968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4185980A Granted JPS56136816A (en) | 1980-03-31 | 1980-03-31 | Epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56136816A (en) |
Cited By (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5876455A (en) * | 1981-11-02 | 1983-05-09 | Matsushita Electric Works Ltd | Thermosetting resin molding material for sealing and molded electronic parts using the same |
JPS598715A (en) * | 1982-07-07 | 1984-01-18 | Mitsubishi Electric Corp | Epoxy resin composition for sealing semiconductor |
JPS5933319A (en) * | 1982-08-20 | 1984-02-23 | Shin Etsu Chem Co Ltd | Flame-retarding epoxy resin composition |
JPS59129252A (en) * | 1983-01-14 | 1984-07-25 | Matsushita Electric Works Ltd | Epoxy resin molding material |
JPS59197421A (en) * | 1983-04-26 | 1984-11-09 | Shin Etsu Chem Co Ltd | Curable epoxy resin composition |
JPS6030157A (en) * | 1983-07-29 | 1985-02-15 | Toshiba Chem Corp | Resin seal type semiconductor device |
JPS6036527A (en) * | 1983-08-09 | 1985-02-25 | Toshiba Chem Corp | Sealing resin composition |
US4518631A (en) * | 1983-11-14 | 1985-05-21 | Dow Corning Corporation | Thixotropic curable coating compositions |
JPS6118158A (en) * | 1984-07-04 | 1986-01-27 | Sumitomo Bakelite Co Ltd | Manufacture of semiconductor device |
JPS6166712A (en) * | 1984-09-11 | 1986-04-05 | Mitsubishi Electric Corp | Epoxy resin composition for sealing semiconductor |
JPS61101520A (en) * | 1984-10-23 | 1986-05-20 | Toshiba Chem Corp | Sealing resin composition |
JPS61166823A (en) * | 1985-01-19 | 1986-07-28 | Toshiba Chem Corp | Resin composition for sealing |
JPS62116654A (en) * | 1985-10-07 | 1987-05-28 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
JPS62184017A (en) * | 1986-02-08 | 1987-08-12 | Matsushita Electric Works Ltd | Epoxy resin molding material |
JPS62187721A (en) * | 1986-02-14 | 1987-08-17 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
JPS63275624A (en) * | 1987-05-08 | 1988-11-14 | Hitachi Ltd | Epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device |
JPH01215820A (en) * | 1988-02-24 | 1989-08-29 | Hitachi Ltd | Epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device |
US5041474A (en) * | 1988-02-15 | 1991-08-20 | Lucky Ltd. | Epoxy resin compositions for sealing semiconductor devices |
US5516858A (en) * | 1993-04-15 | 1996-05-14 | Dow Corning Toray Silicone Co., Ltd. | Epoxy group-containing silicone resin and compositions based thereon |
US5530075A (en) * | 1992-04-21 | 1996-06-25 | Dow Corning Toray Silicone Co., Ltd. | Curable resin composition |
JPH1054979A (en) * | 1996-08-12 | 1998-02-24 | Nitto Denko Corp | Liquid crystal display element substrate |
US5952439A (en) * | 1993-04-15 | 1999-09-14 | Dow Corning Toray Silicone Co., Ltd. | Epoxy group-containing silicone resin and compositions based thereon |
JP2006176595A (en) * | 2004-12-21 | 2006-07-06 | Matsushita Electric Works Ltd | Epoxy resin composition for sealing semiconductor and semiconductor apparatus |
EP1736500A1 (en) * | 2004-04-16 | 2006-12-27 | JSR Corporation | Composition for sealing optical semiconductor, optical semiconductor sealing material, and method for producing composition for sealing optical semiconductor |
WO2009090867A1 (en) * | 2008-01-15 | 2009-07-23 | Sekisui Chemical Co., Ltd. | Resist material and laminate |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013227446A (en) | 2012-04-26 | 2013-11-07 | Dow Corning Toray Co Ltd | Novel organopolysiloxane, thermosetting resin additive comprising the same, and thermosetting resin composition comprising the same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4828543A (en) * | 1971-08-19 | 1973-04-16 | ||
JPS52112698A (en) * | 1976-03-19 | 1977-09-21 | Toray Ind Inc | Curable resin compositions |
-
1980
- 1980-03-31 JP JP4185980A patent/JPS56136816A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4828543A (en) * | 1971-08-19 | 1973-04-16 | ||
JPS52112698A (en) * | 1976-03-19 | 1977-09-21 | Toray Ind Inc | Curable resin compositions |
Cited By (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5876455A (en) * | 1981-11-02 | 1983-05-09 | Matsushita Electric Works Ltd | Thermosetting resin molding material for sealing and molded electronic parts using the same |
JPS598715A (en) * | 1982-07-07 | 1984-01-18 | Mitsubishi Electric Corp | Epoxy resin composition for sealing semiconductor |
JPS6218565B2 (en) * | 1982-07-07 | 1987-04-23 | Mitsubishi Electric Corp | |
JPS5933319A (en) * | 1982-08-20 | 1984-02-23 | Shin Etsu Chem Co Ltd | Flame-retarding epoxy resin composition |
JPS6242927B2 (en) * | 1982-08-20 | 1987-09-10 | Shinetsu Chem Ind Co | |
JPS59129252A (en) * | 1983-01-14 | 1984-07-25 | Matsushita Electric Works Ltd | Epoxy resin molding material |
JPS6315295B2 (en) * | 1983-01-14 | 1988-04-04 | Matsushita Electric Works Ltd | |
JPS59197421A (en) * | 1983-04-26 | 1984-11-09 | Shin Etsu Chem Co Ltd | Curable epoxy resin composition |
JPS6248968B2 (en) * | 1983-04-26 | 1987-10-16 | Shinetsu Chem Ind Co | |
JPS6030157A (en) * | 1983-07-29 | 1985-02-15 | Toshiba Chem Corp | Resin seal type semiconductor device |
JPS6036527A (en) * | 1983-08-09 | 1985-02-25 | Toshiba Chem Corp | Sealing resin composition |
JPH0330615B2 (en) * | 1983-08-09 | 1991-05-01 | Toshiba Chem Prod | |
US4518631A (en) * | 1983-11-14 | 1985-05-21 | Dow Corning Corporation | Thixotropic curable coating compositions |
JPS6118158A (en) * | 1984-07-04 | 1986-01-27 | Sumitomo Bakelite Co Ltd | Manufacture of semiconductor device |
JPH0564181B2 (en) * | 1984-09-11 | 1993-09-14 | Mitsubishi Electric Corp | |
JPS6166712A (en) * | 1984-09-11 | 1986-04-05 | Mitsubishi Electric Corp | Epoxy resin composition for sealing semiconductor |
JPS6261215B2 (en) * | 1984-10-23 | 1987-12-21 | Toshiba Chem Prod | |
JPS61101520A (en) * | 1984-10-23 | 1986-05-20 | Toshiba Chem Corp | Sealing resin composition |
JPS61166823A (en) * | 1985-01-19 | 1986-07-28 | Toshiba Chem Corp | Resin composition for sealing |
JPS62116654A (en) * | 1985-10-07 | 1987-05-28 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
JPS6360070B2 (en) * | 1985-10-07 | 1988-11-22 | ||
JPS62184017A (en) * | 1986-02-08 | 1987-08-12 | Matsushita Electric Works Ltd | Epoxy resin molding material |
JPH0321576B2 (en) * | 1986-02-08 | 1991-03-25 | Matsushita Electric Works Ltd | |
JPH0346486B2 (en) * | 1986-02-14 | 1991-07-16 | Shinetsu Chem Ind Co | |
JPS62187721A (en) * | 1986-02-14 | 1987-08-17 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
JPS63275624A (en) * | 1987-05-08 | 1988-11-14 | Hitachi Ltd | Epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device |
US5041474A (en) * | 1988-02-15 | 1991-08-20 | Lucky Ltd. | Epoxy resin compositions for sealing semiconductor devices |
JPH01215820A (en) * | 1988-02-24 | 1989-08-29 | Hitachi Ltd | Epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device |
US5530075A (en) * | 1992-04-21 | 1996-06-25 | Dow Corning Toray Silicone Co., Ltd. | Curable resin composition |
US5516858A (en) * | 1993-04-15 | 1996-05-14 | Dow Corning Toray Silicone Co., Ltd. | Epoxy group-containing silicone resin and compositions based thereon |
US5952439A (en) * | 1993-04-15 | 1999-09-14 | Dow Corning Toray Silicone Co., Ltd. | Epoxy group-containing silicone resin and compositions based thereon |
JPH1054979A (en) * | 1996-08-12 | 1998-02-24 | Nitto Denko Corp | Liquid crystal display element substrate |
EP1736500A1 (en) * | 2004-04-16 | 2006-12-27 | JSR Corporation | Composition for sealing optical semiconductor, optical semiconductor sealing material, and method for producing composition for sealing optical semiconductor |
EP1736500A4 (en) * | 2004-04-16 | 2010-03-24 | Jsr Corp | Composition for sealing optical semiconductor, optical semiconductor sealing material, and method for producing composition for sealing optical semiconductor |
JP2006176595A (en) * | 2004-12-21 | 2006-07-06 | Matsushita Electric Works Ltd | Epoxy resin composition for sealing semiconductor and semiconductor apparatus |
WO2009090867A1 (en) * | 2008-01-15 | 2009-07-23 | Sekisui Chemical Co., Ltd. | Resist material and laminate |
Also Published As
Publication number | Publication date |
---|---|
JPS6227095B2 (en) | 1987-06-12 |
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