JPS56136816A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS56136816A
JPS56136816A JP4185980A JP4185980A JPS56136816A JP S56136816 A JPS56136816 A JP S56136816A JP 4185980 A JP4185980 A JP 4185980A JP 4185980 A JP4185980 A JP 4185980A JP S56136816 A JPS56136816 A JP S56136816A
Authority
JP
Japan
Prior art keywords
ingredient
amount
group
epoxy
give
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4185980A
Other languages
Japanese (ja)
Other versions
JPS6227095B2 (en
Inventor
Kunio Ito
Kiyohiro Kondo
Yoshio Fujimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP4185980A priority Critical patent/JPS56136816A/en
Publication of JPS56136816A publication Critical patent/JPS56136816A/en
Publication of JPS6227095B2 publication Critical patent/JPS6227095B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:A novel composition suitable for sealing up a device of a semiconductor, having improved humidity resistance, obtained by adding a silicone resin having an epoxy group-containing organic group, etc. and a hydroxyl group, etc., a curing agent, and an inorganic filler to an epoxy resin. CONSTITUTION:(A) An epoxy resin is blended with (B) a silicone resin (e.g., resins shown by the formulas I and II, etc.) having one or more epoxy or amino group-containing organic groups and one or more hydroxyl group or hydrolyzable groups, (C) a curing agent, e.g., a phenol compound, e.g., (D) an inorganic filler, e.g., molten silica powder, etc. to give the desired composition. Preferably, the amount of the ingredient B is 0.1-3wt%, the amount of ingredient C is an amount to give a ratio of number of epoxy group in ingredient A to number of functional group in ingredient C in a range 0.5-2, and the amount of ingredient D is an amount to give a weight ratio of A/C 100:33. EFFECT:Improved electrical properties and dimensional stability.
JP4185980A 1980-03-31 1980-03-31 Epoxy resin composition Granted JPS56136816A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4185980A JPS56136816A (en) 1980-03-31 1980-03-31 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4185980A JPS56136816A (en) 1980-03-31 1980-03-31 Epoxy resin composition

Publications (2)

Publication Number Publication Date
JPS56136816A true JPS56136816A (en) 1981-10-26
JPS6227095B2 JPS6227095B2 (en) 1987-06-12

Family

ID=12619968

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4185980A Granted JPS56136816A (en) 1980-03-31 1980-03-31 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS56136816A (en)

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5876455A (en) * 1981-11-02 1983-05-09 Matsushita Electric Works Ltd Thermosetting resin molding material for sealing and molded electronic parts using the same
JPS598715A (en) * 1982-07-07 1984-01-18 Mitsubishi Electric Corp Epoxy resin composition for sealing semiconductor
JPS5933319A (en) * 1982-08-20 1984-02-23 Shin Etsu Chem Co Ltd Flame-retarding epoxy resin composition
JPS59129252A (en) * 1983-01-14 1984-07-25 Matsushita Electric Works Ltd Epoxy resin molding material
JPS59197421A (en) * 1983-04-26 1984-11-09 Shin Etsu Chem Co Ltd Curable epoxy resin composition
JPS6030157A (en) * 1983-07-29 1985-02-15 Toshiba Chem Corp Resin seal type semiconductor device
JPS6036527A (en) * 1983-08-09 1985-02-25 Toshiba Chem Corp Sealing resin composition
US4518631A (en) * 1983-11-14 1985-05-21 Dow Corning Corporation Thixotropic curable coating compositions
JPS6118158A (en) * 1984-07-04 1986-01-27 Sumitomo Bakelite Co Ltd Manufacture of semiconductor device
JPS6166712A (en) * 1984-09-11 1986-04-05 Mitsubishi Electric Corp Epoxy resin composition for sealing semiconductor
JPS61101520A (en) * 1984-10-23 1986-05-20 Toshiba Chem Corp Sealing resin composition
JPS61166823A (en) * 1985-01-19 1986-07-28 Toshiba Chem Corp Resin composition for sealing
JPS62116654A (en) * 1985-10-07 1987-05-28 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS62184017A (en) * 1986-02-08 1987-08-12 Matsushita Electric Works Ltd Epoxy resin molding material
JPS62187721A (en) * 1986-02-14 1987-08-17 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS63275624A (en) * 1987-05-08 1988-11-14 Hitachi Ltd Epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device
JPH01215820A (en) * 1988-02-24 1989-08-29 Hitachi Ltd Epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device
US5041474A (en) * 1988-02-15 1991-08-20 Lucky Ltd. Epoxy resin compositions for sealing semiconductor devices
US5516858A (en) * 1993-04-15 1996-05-14 Dow Corning Toray Silicone Co., Ltd. Epoxy group-containing silicone resin and compositions based thereon
US5530075A (en) * 1992-04-21 1996-06-25 Dow Corning Toray Silicone Co., Ltd. Curable resin composition
JPH1054979A (en) * 1996-08-12 1998-02-24 Nitto Denko Corp Liquid crystal display element substrate
US5952439A (en) * 1993-04-15 1999-09-14 Dow Corning Toray Silicone Co., Ltd. Epoxy group-containing silicone resin and compositions based thereon
JP2006176595A (en) * 2004-12-21 2006-07-06 Matsushita Electric Works Ltd Epoxy resin composition for sealing semiconductor and semiconductor apparatus
EP1736500A1 (en) * 2004-04-16 2006-12-27 JSR Corporation Composition for sealing optical semiconductor, optical semiconductor sealing material, and method for producing composition for sealing optical semiconductor
WO2009090867A1 (en) * 2008-01-15 2009-07-23 Sekisui Chemical Co., Ltd. Resist material and laminate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013227446A (en) 2012-04-26 2013-11-07 Dow Corning Toray Co Ltd Novel organopolysiloxane, thermosetting resin additive comprising the same, and thermosetting resin composition comprising the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4828543A (en) * 1971-08-19 1973-04-16
JPS52112698A (en) * 1976-03-19 1977-09-21 Toray Ind Inc Curable resin compositions

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4828543A (en) * 1971-08-19 1973-04-16
JPS52112698A (en) * 1976-03-19 1977-09-21 Toray Ind Inc Curable resin compositions

Cited By (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5876455A (en) * 1981-11-02 1983-05-09 Matsushita Electric Works Ltd Thermosetting resin molding material for sealing and molded electronic parts using the same
JPS598715A (en) * 1982-07-07 1984-01-18 Mitsubishi Electric Corp Epoxy resin composition for sealing semiconductor
JPS6218565B2 (en) * 1982-07-07 1987-04-23 Mitsubishi Electric Corp
JPS5933319A (en) * 1982-08-20 1984-02-23 Shin Etsu Chem Co Ltd Flame-retarding epoxy resin composition
JPS6242927B2 (en) * 1982-08-20 1987-09-10 Shinetsu Chem Ind Co
JPS59129252A (en) * 1983-01-14 1984-07-25 Matsushita Electric Works Ltd Epoxy resin molding material
JPS6315295B2 (en) * 1983-01-14 1988-04-04 Matsushita Electric Works Ltd
JPS59197421A (en) * 1983-04-26 1984-11-09 Shin Etsu Chem Co Ltd Curable epoxy resin composition
JPS6248968B2 (en) * 1983-04-26 1987-10-16 Shinetsu Chem Ind Co
JPS6030157A (en) * 1983-07-29 1985-02-15 Toshiba Chem Corp Resin seal type semiconductor device
JPS6036527A (en) * 1983-08-09 1985-02-25 Toshiba Chem Corp Sealing resin composition
JPH0330615B2 (en) * 1983-08-09 1991-05-01 Toshiba Chem Prod
US4518631A (en) * 1983-11-14 1985-05-21 Dow Corning Corporation Thixotropic curable coating compositions
JPS6118158A (en) * 1984-07-04 1986-01-27 Sumitomo Bakelite Co Ltd Manufacture of semiconductor device
JPH0564181B2 (en) * 1984-09-11 1993-09-14 Mitsubishi Electric Corp
JPS6166712A (en) * 1984-09-11 1986-04-05 Mitsubishi Electric Corp Epoxy resin composition for sealing semiconductor
JPS6261215B2 (en) * 1984-10-23 1987-12-21 Toshiba Chem Prod
JPS61101520A (en) * 1984-10-23 1986-05-20 Toshiba Chem Corp Sealing resin composition
JPS61166823A (en) * 1985-01-19 1986-07-28 Toshiba Chem Corp Resin composition for sealing
JPS62116654A (en) * 1985-10-07 1987-05-28 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS6360070B2 (en) * 1985-10-07 1988-11-22
JPS62184017A (en) * 1986-02-08 1987-08-12 Matsushita Electric Works Ltd Epoxy resin molding material
JPH0321576B2 (en) * 1986-02-08 1991-03-25 Matsushita Electric Works Ltd
JPH0346486B2 (en) * 1986-02-14 1991-07-16 Shinetsu Chem Ind Co
JPS62187721A (en) * 1986-02-14 1987-08-17 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS63275624A (en) * 1987-05-08 1988-11-14 Hitachi Ltd Epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device
US5041474A (en) * 1988-02-15 1991-08-20 Lucky Ltd. Epoxy resin compositions for sealing semiconductor devices
JPH01215820A (en) * 1988-02-24 1989-08-29 Hitachi Ltd Epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device
US5530075A (en) * 1992-04-21 1996-06-25 Dow Corning Toray Silicone Co., Ltd. Curable resin composition
US5516858A (en) * 1993-04-15 1996-05-14 Dow Corning Toray Silicone Co., Ltd. Epoxy group-containing silicone resin and compositions based thereon
US5952439A (en) * 1993-04-15 1999-09-14 Dow Corning Toray Silicone Co., Ltd. Epoxy group-containing silicone resin and compositions based thereon
JPH1054979A (en) * 1996-08-12 1998-02-24 Nitto Denko Corp Liquid crystal display element substrate
EP1736500A1 (en) * 2004-04-16 2006-12-27 JSR Corporation Composition for sealing optical semiconductor, optical semiconductor sealing material, and method for producing composition for sealing optical semiconductor
EP1736500A4 (en) * 2004-04-16 2010-03-24 Jsr Corp Composition for sealing optical semiconductor, optical semiconductor sealing material, and method for producing composition for sealing optical semiconductor
JP2006176595A (en) * 2004-12-21 2006-07-06 Matsushita Electric Works Ltd Epoxy resin composition for sealing semiconductor and semiconductor apparatus
WO2009090867A1 (en) * 2008-01-15 2009-07-23 Sekisui Chemical Co., Ltd. Resist material and laminate

Also Published As

Publication number Publication date
JPS6227095B2 (en) 1987-06-12

Similar Documents

Publication Publication Date Title
JPS56136816A (en) Epoxy resin composition
JPS56129246A (en) Epoxy resin composition
JPS56130953A (en) Epoxy resin composition for sealing semiconductor device
KR870002198A (en) Epoxy Resin Compositions for Sealing Semiconductor Devices
JPS57125212A (en) Photo-polymerizable composition
JPS572329A (en) Epoxy resin type composition and semiconductor device of resin sealing type
JPS5723625A (en) Epoxy resin composition and resin-sealed semiconductor device
JPS5359798A (en) Epoxy resin composition of excellent warm-water resistance
JPS5681333A (en) Epoxy resin composition
JPS649214A (en) Epoxy resin composition for sealing semiconductor
JPS5679161A (en) Epoxy resin composition for powder coating compound
JPS5740963A (en) Resin-sealed semiconductor device
JPS5356294A (en) Thermosetting resin composition
JPS5467000A (en) Transparent thermosetting resin composition
KR930006070A (en) Novel Imide Epoxy Resin and Its Manufacturing Method
JPS52135673A (en) Resin composition for semiconductor sealing
JPS5755921A (en) Water-resistant epoxy resin composition
JPS5710255A (en) Epoxy resin composition and resin sealed type semiconductor device
JPS5659834A (en) Thermosetting resin composition
JPS5747323A (en) Epoxy resin composition having improved resistance to hot water at high temperature
JPS578220A (en) Epoxy resin composition and resin-sealed semiconductor device
JPS5740524A (en) Epoxy resin composition
JPS6465120A (en) Liquid epoxy resin composition
JPS5647445A (en) Epoxy resin composition
JPS5753523A (en) Epoxy resin composition