JPS578220A - Epoxy resin composition and resin-sealed semiconductor device - Google Patents

Epoxy resin composition and resin-sealed semiconductor device

Info

Publication number
JPS578220A
JPS578220A JP8134480A JP8134480A JPS578220A JP S578220 A JPS578220 A JP S578220A JP 8134480 A JP8134480 A JP 8134480A JP 8134480 A JP8134480 A JP 8134480A JP S578220 A JPS578220 A JP S578220A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin
epoxy
curing agent
phenolic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8134480A
Other languages
Japanese (ja)
Inventor
Hirotoshi Iketani
Akiko Hatanaka
Shiyuichi Suzuki
Moriyasu Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8134480A priority Critical patent/JPS578220A/en
Priority to DE8181104126T priority patent/DE3163054D1/en
Priority to EP19810104126 priority patent/EP0041662B1/en
Publication of JPS578220A publication Critical patent/JPS578220A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: Titled resin composition for sealing semiconductor devices which has excellent moisture resistance and hightemperature electrical properties, prepared by mixing a specified phenolic-hydroxyl group-containing curing agent and a specified phosphine type cure accelerator.
CONSTITUTION: The following components are mixed together: (A) an epoxy resin, e.g, novolak epoxy resin, chloride ion content ≤ about 10ppm, hydrolyzable chlorine content ≤ about 0.1wt%, epoxy eq. weight about 170W300, (B) an epoxy resin curing agent containing at least two phenolic-hydroxyl groups, e.g., novolak phenol resin, softening point about 60W100°C, (C) an organic prim. or sec. phosphine compound, as a cure accelerator, represented by the formula, wherein R1, R2 and R3 are each H or an organic group, e.g., phenylphosphine, dioctylphosphine, and, if necessary, (D) an inorganic filler, e.g., quartz glass powder.
COPYRIGHT: (C)1982,JPO&Japio
JP8134480A 1980-06-05 1980-06-18 Epoxy resin composition and resin-sealed semiconductor device Pending JPS578220A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP8134480A JPS578220A (en) 1980-06-18 1980-06-18 Epoxy resin composition and resin-sealed semiconductor device
DE8181104126T DE3163054D1 (en) 1980-06-05 1981-05-29 Resin encapsulation type semiconductor device
EP19810104126 EP0041662B1 (en) 1980-06-05 1981-05-29 Resin encapsulation type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8134480A JPS578220A (en) 1980-06-18 1980-06-18 Epoxy resin composition and resin-sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS578220A true JPS578220A (en) 1982-01-16

Family

ID=13743744

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8134480A Pending JPS578220A (en) 1980-06-05 1980-06-18 Epoxy resin composition and resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS578220A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58194916A (en) * 1982-05-10 1983-11-14 Sumitomo Bakelite Co Ltd Epoxy resin composition
JPS59227146A (en) * 1983-06-07 1984-12-20 Sharp Corp Resin-molded semiconductor device
JPS63179920A (en) * 1987-01-21 1988-07-23 Toshiba Corp Epoxy resin composition and resin-sealed type semiconductor device using said composition

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58194916A (en) * 1982-05-10 1983-11-14 Sumitomo Bakelite Co Ltd Epoxy resin composition
JPS6244767B2 (en) * 1982-05-10 1987-09-22 Sumitomo Bakelite Co
JPS59227146A (en) * 1983-06-07 1984-12-20 Sharp Corp Resin-molded semiconductor device
JPH0136984B2 (en) * 1983-06-07 1989-08-03 Sharp Kk
JPS63179920A (en) * 1987-01-21 1988-07-23 Toshiba Corp Epoxy resin composition and resin-sealed type semiconductor device using said composition

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